www.coxoc.com.tw

CFexpressCFast

About Chant Sincere

Quality System

Competencies & Technology

CFexpress Series

CFexpress Type A

CFexpress Type B (Push Push)

CFexpress Type C & D Connector

CFast Series

CFast with Ejector

ContentsP.1

P.3

P.5

P.7

P.17

Over 34 Years Manufacture Experience

ODM/OEM Capability

Vertical Integration (Design, Tooling, Manufacturing, Test)

Automation Capability

Precise Tooling Center

Wide Range of Product Line

Systematic Testing Process

Customized Capability

Quality System (ISO,IATF)

National Awards Rising Sun Awards/Best Supplier Awards

About Chant SincereAbout Chant Sincere

Chant Sincere Co.,Ltd. was set up in 1985., With the management concept of "Honest, Innovative, Quality, Longterm" to design and manufacture connector and cable.Keep developing new innovative products and integrating vertically from R&D, tooling, assembly and quality control to meet the demands (quality/cost/delivery) from customers.Chant Sincere Co.,Ltd. Has been constructing various of product families to provide a total solution to customers.The connector and cable products are widely used in many different application, such as Computing, Industrial & Automation, Telecommunication, Automotive,Waterproof, Consumer and Medical Industry.

Chant Sincere won the "National Bedrock Award" & "Small Giant Award" from Taiwan Connector maker competition and got many "Best Supplier awards" from Global customers.We are focusing on improving our design and manufacture technology, and we have been applying for a lot of international patents for our products including I/O connector, Board to Board connector, Waterproof connector, Industrial Connector, Automotive connector, Memory Card connector and adaptor, High Speed connector and cable (USB3.1), Audio & Vidio connector and cable (HDMI, Display Port)…etc.Chant Sincere Co.,Ltd. Has been growing up as a global professional manufacturer for connector and cable.

The Core Competence of Chant Sincere Co.,Ltd. including.

1 2

Over 34 Years Manufacture Experience

ODM/OEM Capability

Vertical Integration (Design, Tooling, Manufacturing, Test)

Automation Capability

Precise Tooling Center

Wide Range of Product Line

Systematic Testing Process

Customized Capability

Quality System (ISO,IATF)

National Awards Rising Sun Awards/Best Supplier Awards

About Chant SincereAbout Chant Sincere

Chant Sincere Co.,Ltd. was set up in 1985., With the management concept of "Honest, Innovative, Quality, Longterm" to design and manufacture connector and cable.Keep developing new innovative products and integrating vertically from R&D, tooling, assembly and quality control to meet the demands (quality/cost/delivery) from customers.Chant Sincere Co.,Ltd. Has been constructing various of product families to provide a total solution to customers.The connector and cable products are widely used in many different application, such as Computing, Industrial & Automation, Telecommunication, Automotive,Waterproof, Consumer and Medical Industry.

Chant Sincere won the "National Bedrock Award" & "Small Giant Award" from Taiwan Connector maker competition and got many "Best Supplier awards" from Global customers.We are focusing on improving our design and manufacture technology, and we have been applying for a lot of international patents for our products including I/O connector, Board to Board connector, Waterproof connector, Industrial Connector, Automotive connector, Memory Card connector and adaptor, High Speed connector and cable (USB3.1), Audio & Vidio connector and cable (HDMI, Display Port)…etc.Chant Sincere Co.,Ltd. Has been growing up as a global professional manufacturer for connector and cable.

The Core Competence of Chant Sincere Co.,Ltd. including.

1 2

COXOC Quality Assurance department meets our customers’ quality requirements by

practicing continual improvement in our quality assurance processes and increasing customers’

satisfaction in the quality of our products.

The effectiveness of COXOC QA operation is certified by well-known organizations such as

ISO9001 Quality Assurance Management System, ISO 14001 Environmental Management

System, ISO/IATF 16949 for Automobile Industry Quality Management System, and ISO13485

Medical Devices Quality Management System, COXOC integrated supply chain and devoted

staff has enabled us to build a solid foundation and core capability to better serve our

customers. It is COXOC principal to always meet and exceed customer expectation by

providing superior products and services. COXOC ultimate goal is to create value for our

customers by building collaborative and mutually beneficial relationships.

3 4

Quality systems

ISO13485

ISO9001ISO 14001IATF 16949

COXOC Quality Assurance department meets our customers’ quality requirements by

practicing continual improvement in our quality assurance processes and increasing customers’

satisfaction in the quality of our products.

The effectiveness of COXOC QA operation is certified by well-known organizations such as

ISO9001 Quality Assurance Management System, ISO 14001 Environmental Management

System, ISO/IATF 16949 for Automobile Industry Quality Management System, and ISO13485

Medical Devices Quality Management System, COXOC integrated supply chain and devoted

staff has enabled us to build a solid foundation and core capability to better serve our

customers. It is COXOC principal to always meet and exceed customer expectation by

providing superior products and services. COXOC ultimate goal is to create value for our

customers by building collaborative and mutually beneficial relationships.

3 4

Quality systems

ISO13485

ISO9001ISO 14001IATF 16949

The R&D Center at Chant Sincere leads the industry in research, design, and manufacturing of numerous key parts. This center has successfully developed for both wired and wireless solutions for computer peripherals, communication systems, and automobiles / industrial / medical equipment. Our solid R&D team formed a strong foundation in advance manufacturing technology and superior quality control that also enabled high value adding service for customers.

USB type C connectors is an example of the fruits of our research. This miniature and unidirectional interface provides many useful functions such as lighting data transfer rate up to 10 Gbits/s, DP ALT Mode high-definition video signal support, and brilliant 100W charging capability. Chant Sincere advanced the research further into higher specs such as USB 3.2 and USB 4.0 and offers customized solution for various of industrial applications. We delivered comprehensive solutions in bridging the diverse need for new interface and solve on-going product design issues for customers.

QSFP -DD is an ultra-fast interface that transmit data at 400Gbps speed. At this speed, stringent requirement for signal integrity and operating temperature is inviable which imposed huge challenges for the industry. At Chant Sincere, we implemented comprehensive computational software, state of art measuring equipment and eminent R&D capability to aid the solution delivering process. The analysis process includes simulation under CST MSW (Time Domain Simulation), ANSYS HFSS (Frequency Domain Simulation) for signal integrity as well as real-time measurement using test boards and PNA (up to 43.5GHz) to deliver quality reports for signal integrity (S-parameter, Gain compression, conversion gain/loss, noise level). We further performed simulation of its operating temperature using Icepak (Heat transfer and fluid flow simulator). This enabled the performance optimization for heat dissipation solution. With the above R&D skills we successfully delivered the desired professional service within the shortest time frame for our customers.

5 6

Competencies & Technology

The R&D Center at Chant Sincere leads the industry in research, design, and manufacturing of numerous key parts. This center has successfully developed for both wired and wireless solutions for computer peripherals, communication systems, and automobiles / industrial / medical equipment. Our solid R&D team formed a strong foundation in advance manufacturing technology and superior quality control that also enabled high value adding service for customers.

USB type C connectors is an example of the fruits of our research. This miniature and unidirectional interface provides many useful functions such as lighting data transfer rate up to 10 Gbits/s, DP ALT Mode high-definition video signal support, and brilliant 100W charging capability. Chant Sincere advanced the research further into higher specs such as USB 3.2 and USB 4.0 and offers customized solution for various of industrial applications. We delivered comprehensive solutions in bridging the diverse need for new interface and solve on-going product design issues for customers.

QSFP -DD is an ultra-fast interface that transmit data at 400Gbps speed. At this speed, stringent requirement for signal integrity and operating temperature is inviable which imposed huge challenges for the industry. At Chant Sincere, we implemented comprehensive computational software, state of art measuring equipment and eminent R&D capability to aid the solution delivering process. The analysis process includes simulation under CST MSW (Time Domain Simulation), ANSYS HFSS (Frequency Domain Simulation) for signal integrity as well as real-time measurement using test boards and PNA (up to 43.5GHz) to deliver quality reports for signal integrity (S-parameter, Gain compression, conversion gain/loss, noise level). We further performed simulation of its operating temperature using Icepak (Heat transfer and fluid flow simulator). This enabled the performance optimization for heat dissipation solution. With the above R&D skills we successfully delivered the desired professional service within the shortest time frame for our customers.

5 6

Competencies & Technology

7 8

CFexpress

Professional video features are growing more powerful, with 4K video enjoying widespread use and 8K video already gaining adoption in high-end production environments. Ultra-High Definition TV production environments need more advanced digital formats, such as RAW 4K @ 60 frames per second, which requires reliable and sustainable performance of 700MB/sec and higher. In addition, next generation video applications, such as 8K and even professional 360/VR productions, produce video with incredibly high throughput that exceed legacy CFA cards’ data recording of ~600MB/sec, and can benefit from such new spec which supports up to 3.2GB/sec. ( Type C )

CFexpress Type A Host Connector ( 1 Channel PCIe ) CFexpress Type B Lids ( 2 Channel PCIe ) CFexpress Type B Host Connector ( 2 Channel PCIe ) CFexpress Type C & D Host Connector ( 4 Channel PCIe )

SSD 8K HD-entertainment DSC Drone Storage

PASS PCIe Gen3 and Gen4 Speed High data bit rate up to 16 Gbits/s Excellent resistance against cross-talk and RF EMC Mechanical robustness according to automotive requirements THR and THT capable for automated assemblies

CFexpress Application

Application

Product Characteristics

7 8

CFexpress

Professional video features are growing more powerful, with 4K video enjoying widespread use and 8K video already gaining adoption in high-end production environments. Ultra-High Definition TV production environments need more advanced digital formats, such as RAW 4K @ 60 frames per second, which requires reliable and sustainable performance of 700MB/sec and higher. In addition, next generation video applications, such as 8K and even professional 360/VR productions, produce video with incredibly high throughput that exceed legacy CFA cards’ data recording of ~600MB/sec, and can benefit from such new spec which supports up to 3.2GB/sec. ( Type C )

CFexpress Type A Host Connector ( 1 Channel PCIe ) CFexpress Type B Lids ( 2 Channel PCIe ) CFexpress Type B Host Connector ( 2 Channel PCIe ) CFexpress Type C & D Host Connector ( 4 Channel PCIe )

SSD 8K HD-entertainment DSC Drone Storage

PASS PCIe Gen3 and Gen4 Speed High data bit rate up to 16 Gbits/s Excellent resistance against cross-talk and RF EMC Mechanical robustness according to automotive requirements THR and THT capable for automated assemblies

CFexpress Application

Application

Product Characteristics

Specification

Drawing

CFexpress Type A

Description

Part no.

Material

Contact Plating

Electrical

9 10

Insulator

Contacts

Shell

Spring

Cam Rod

Underplate

Contact Area

Solder Tails Area

Rated Voltage

Insulation Resistance

Temperature Range

Mating Cycles

Contact Resistance

LCP

YCUT-FX-EH/C17200

SUS304 3/4H

SWP-B

SUS304H

50 u”~120u” Nickel

5u” Selective Gold

80u”~200u” Tin (Lead Free)

500 Vrms AC for 1 min

1.0 A min for Signal Pin

3.0 A min for Power Pin

Initial：55m ohm max

Final：40m ohm max.

1000M ohm min. at 500 VDC/minute

-25°C to +85°C

12000 insertions

Current Rating

PIN DESIGN

13 GND Ground

12 PETp0 PCIe Gen3 Tx singal

11 PETn0 PCIe Gen3 Tx singal

10 GND Ground

9 PERp0 PCIe Gen3 Rx singal

8 PERn0 PCIe Gen3 Rx singal

7 GND Ground

6 REFCLK+ Reference Clock input

5 REFCLK- Reference Clock input

4 INS# Media detection and power control

3 CLKREQ# Indication of REFCLK to Host

2 +3.3V 3.3V Power Supply

1 PERST# PCle Express function reset

10-1.1013-0.30ā0.05

24.0

0±0.

10

15.6

04.

703.

20

4-1.60ā0.10

19.00ā0.10

2-1.50ā0.10

3.75±0.10

26.9324.93±0.10

3.00

20.16±0.10

17.76±0.101.45

2.95

1.10

+0.2

5-0

.00

5.98

1.66

2-1.00

13.40

1.20

1.208.035

10.00

8.80

(LO

CK

POSI

TIO

N)

13.8

0 (P

USH

OU

T PO

SITI

ON

)

2.80

8.00

(PU

SH IN

PO

SITI

ON

)

XXXX

2.08±0.10

ST

Date Code

CFexpress Type A with Shell Ground

Part No. 752DH13BCTF3J2CC

CFexpress Type A

Part No. 752DH13BCTF3J1CC

CFexpress Type A with Shell Ground

Part No. 752DH13BCTF3J2CC

CFexpress Type A

Part No. 752DH13BCTF3J1CC

Specification

Drawing

CFexpress Type A

Description

Part no.

Material

Contact Plating

Electrical

9 10

Insulator

Contacts

Shell

Spring

Cam Rod

Underplate

Contact Area

Solder Tails Area

Rated Voltage

Insulation Resistance

Temperature Range

Mating Cycles

Contact Resistance

LCP

YCUT-FX-EH/C17200

SUS304 3/4H

SWP-B

SUS304H

50 u”~120u” Nickel

5u” Selective Gold

80u”~200u” Tin (Lead Free)

500 Vrms AC for 1 min

1.0 A min for Signal Pin

3.0 A min for Power Pin

Initial：55m ohm max

Final：40m ohm max.

1000M ohm min. at 500 VDC/minute

-25°C to +85°C

12000 insertions

Current Rating

PIN DESIGN

13 GND Ground

12 PETp0 PCIe Gen3 Tx singal

11 PETn0 PCIe Gen3 Tx singal

10 GND Ground

9 PERp0 PCIe Gen3 Rx singal

8 PERn0 PCIe Gen3 Rx singal

7 GND Ground

6 REFCLK+ Reference Clock input

5 REFCLK- Reference Clock input

4 INS# Media detection and power control

3 CLKREQ# Indication of REFCLK to Host

2 +3.3V 3.3V Power Supply

1 PERST# PCle Express function reset

10-1.1013-0.30ā0.05

24.0

0±0.

10

15.6

04.

703.

20

4-1.60ā0.10

19.00ā0.10

2-1.50ā0.10

3.75±0.10

26.9324.93±0.10

3.00

20.16±0.10

17.76±0.101.45

2.95

1.10

+0.2

5-0

.00

5.98

1.66

2-1.00

13.40

1.20

1.208.035

10.00

8.80

(LO

CK

POSI

TIO

N)

13.8

0 (P

USH

OU

T PO

SITI

ON

)

2.80

8.00

(PU

SH IN

PO

SITI

ON

)

XXXX

2.08±0.10

ST

Date Code

CFexpress Type A with Shell Ground

Part No. 752DH13BCTF3J2CC

CFexpress Type A

Part No. 752DH13BCTF3J1CC

CFexpress Type A with Shell Ground

Part No. 752DH13BCTF3J2CC

CFexpress Type A

Part No. 752DH13BCTF3J1CC

Specification

Drawing

Description

Part no.

CFexpress Type B (Push Push)

CFexpress Type B (Push Push)

11 12

Stainless

Non

SWP-B

Underplate: Nickel

Underplate：50 u " Nickel

Contact Area：1u"~30u" Selective Gold

Solder Tails Area：80u” Min. Tin/Lead Free (Matte Tin)

Insulator

Spring

Metal

Contact

Material

Material

MATERIAL /FINISHS

752DH21BCTF281C3

Plating

Material

Plating

Material

Plating

Rated Current(Max.)

Rated Voltage(Max.)

Insulation Resistance

Contact Resistance

Dielectric Strength

Temperature Range

Storage Temperature

1.0 AMP ( DC ) MAX.

100V

Initial：1000MΩ Min.

Final：100MΩ Max.

Final：55mΩ MAX.

No Breakdown

EIA-364-23B

Insertion Force (max.)

Extraction Force

(min./max.)

Retention Force (min.)

Durability

50 N

4.9N/55N

9.8N

10,000 cycle Operations using memory card at the rate of 400-600 cycles within 1 hours

Mate Connector measure by dry circuit.

EIA-364-70 Method 2

Apply 500V DC between adjacent terminals or ground.

EIA-364-21

Apply 500V AC for 1 minute between

adjacent terminals or ground

EIA-364-20

95% R.H. MAX.

Insert connectors at the speed rateof 25±3 mm/min.

Retention connectors at the speed rateof 25±3 mm/min.

Apply axial pull out force at 25±3 mm/min. on the assembly in the housing.

Thermal Plastic UL94V-0

Copper Alloy

Initial：40mΩ MAX.at initial state.ELECTRICAL

MECHANICAL

4.700.75

27.15

13.582-1.40ā0.05

29.76

14.88

(1.35)

2.30

CAR

D.C

L

(HO

LD P

OSI

TIO

N)

33.70

34.1

518

.40

9.60

36.60ā0.30

4-3.00ā0.05

CO

NN

.CL

CAR

D.C

L

D/C:Year/Week

XXXX

Specification

Drawing

Description

Part no.

CFexpress Type B (Push Push)

CFexpress Type B (Push Push)

11 12

Stainless

Non

SWP-B

Underplate: Nickel

Underplate：50 u " Nickel

Contact Area：1u"~30u" Selective Gold

Solder Tails Area：80u” Min. Tin/Lead Free (Matte Tin)

Insulator

Spring

Metal

Contact

Material

Material

MATERIAL /FINISHS

752DH21BCTF281C3

Plating

Material

Plating

Material

Plating

Rated Current(Max.)

Rated Voltage(Max.)

Insulation Resistance

Contact Resistance

Dielectric Strength

Temperature Range

Storage Temperature

1.0 AMP ( DC ) MAX.

100V

Initial：1000MΩ Min.

Final：100MΩ Max.

Final：55mΩ MAX.

No Breakdown

EIA-364-23B

Insertion Force (max.)

Extraction Force

(min./max.)

Retention Force (min.)

Durability

50 N

4.9N/55N

9.8N

10,000 cycle Operations using memory card at the rate of 400-600 cycles within 1 hours

Mate Connector measure by dry circuit.

EIA-364-70 Method 2

Apply 500V DC between adjacent terminals or ground.

EIA-364-21

Apply 500V AC for 1 minute between

adjacent terminals or ground

EIA-364-20

95% R.H. MAX.

Insert connectors at the speed rateof 25±3 mm/min.

Retention connectors at the speed rateof 25±3 mm/min.

Apply axial pull out force at 25±3 mm/min. on the assembly in the housing.

Thermal Plastic UL94V-0

Copper Alloy

Initial：40mΩ MAX.at initial state.ELECTRICAL

MECHANICAL

4.700.75

27.15

13.582-1.40ā0.05

29.76

14.88

(1.35)

2.30

CAR

D.C

L

(HO

LD P

OSI

TIO

N)

33.70

34.1

518

.40

9.60

36.60ā0.30

4-3.00ā0.05

CO

NN

.CL

CAR

D.C

L

D/C:Year/Week

XXXX

Photo

Application type

DescriptionPart no.

Type B

13 14

752DH21BCTF2X0C3

752DH21BCTF2X1C3

752DH21BCTF272C3

S752SG21P00F41A3

S752SG21P00F42A3

CFexpress Type B Non Push

CFexpress Type B Push Push

CFexpress Type B Push with Lock

CFexpress Type B Top Lid

CFexpress Type B Bottom Lid

Photo

Application type

DescriptionPart no.

Type B

13 14

752DH21BCTF2X0C3

752DH21BCTF2X1C3

752DH21BCTF272C3

S752SG21P00F41A3

S752SG21P00F42A3

CFexpress Type B Non Push

CFexpress Type B Push Push

CFexpress Type B Push with Lock

CFexpress Type B Top Lid

CFexpress Type B Bottom Lid

Specification

Drawing

Description

Part no.

CFexpress Type C & D Bracket

CFexpress Type C & D Connector

15 16

Stainless

Non

Copper Alloy

Underplate：50 u " Nickel

Underplate：50 u " Nickel

Contact Area：1u"~30u" Selective Gold

Solder Tails Area：100u "~200u" Tin/Lead Free (Matte Tin)

Insulator

Spring

Metal

Contact

Material

Material

MATERIAL /FINISHS

S752JH64BDTF11A3

Plating

Material

Plating

Material

Plating

Rated Current(Max.)

Rated Voltage(Max.)

Insulation Resistance

Contact Resistance

Dielectric Strength

Temperature Range

Storage Temperature

3.0 AMP ( DC ) MAX.

100V

1000MΩ Min.

No Breakdown

Mate Dummy Card measure by dry circuit,

20mV max, 10m A.

Insertion Force (max.)

Extraction Force

(min./max.)

Retention Force (min.)

Durability

50 N

4.9N/55N

9.8N

10,000 cycle Operations using memory card at the rate of 400-600 cycles within 1 hours

Mate Connector measure by dry circuit.

Apply 500V DC between adjacent terminals or ground.

Apply 500V AC for 1 minute between adjacent

terminals or ground

95% R.H. MAX.

Insert connectors at the speed rateof 25±3 mm/min.

Retention connectors at the speed rateof 25±3 mm/min.

Apply axial pull out force at 25±3 mm/min. on the assembly in the housing.

Thermal Plastic UL94V-0

Copper Alloy

40mΩ MAX. at initial state.60mΩ MAX. afterendurance test.

ELECTRICAL

MECHANICAL

CFexpress Type C & D Connector

C-S752JHXXBDTF10A3

CFexpress Type C & D ConnectorPart No. C-S752JHXXBDTF10A3

CFexpress Type C & D BracketPart No. S752JH64BDTF11A3

Specification

Drawing

Description

Part no.

CFexpress Type C & D Bracket

CFexpress Type C & D Connector

15 16

Stainless

Non

Copper Alloy

Underplate：50 u " Nickel

Underplate：50 u " Nickel

Contact Area：1u"~30u" Selective Gold

Solder Tails Area：100u "~200u" Tin/Lead Free (Matte Tin)

Insulator

Spring

Metal

Contact

Material

Material

MATERIAL /FINISHS

S752JH64BDTF11A3

Plating

Material

Plating

Material

Plating

Rated Current(Max.)

Rated Voltage(Max.)

Insulation Resistance

Contact Resistance

Dielectric Strength

Temperature Range

Storage Temperature

3.0 AMP ( DC ) MAX.

100V

1000MΩ Min.

No Breakdown

Mate Dummy Card measure by dry circuit,

20mV max, 10m A.

Insertion Force (max.)

Extraction Force

(min./max.)

Retention Force (min.)

Durability

50 N

4.9N/55N

9.8N

10,000 cycle Operations using memory card at the rate of 400-600 cycles within 1 hours

Mate Connector measure by dry circuit.

Apply 500V DC between adjacent terminals or ground.

Apply 500V AC for 1 minute between adjacent

terminals or ground

95% R.H. MAX.

Insert connectors at the speed rateof 25±3 mm/min.

Retention connectors at the speed rateof 25±3 mm/min.

Apply axial pull out force at 25±3 mm/min. on the assembly in the housing.

Thermal Plastic UL94V-0

Copper Alloy

40mΩ MAX. at initial state.60mΩ MAX. afterendurance test.

ELECTRICAL

MECHANICAL

CFexpress Type C & D Connector

C-S752JHXXBDTF10A3

CFexpress Type C & D ConnectorPart No. C-S752JHXXBDTF10A3

CFexpress Type C & D BracketPart No. S752JH64BDTF11A3

CFast

17 18

CFast ApplicationA variant of CompactFlash known as CFast is based on the Serial ATA bus, rather than the Parallel ATA/IDE bus for which all previous versions of CompactFlash are designed. CFast is also known as CompactFast.CFast 1.0/1.1 supports a higher maximum transfer rate than current CompactFlash cards, using SATA 2.0 (300 MByte/s) interface, while PATA is limited to 167 MByte/s using UDMA 7.The CFast 2.0 specification was released in the second quarter of 2012, updating the electrical interface to SATA 3.0 (600 MByte/s). As of 2014, the only product employing CFast 2.0 cards was the Arri Amira digital production camera, allowing frame rates of up to 200 fps; a CFast 2.0 adapter for the Arri Alexa/XT camera was also released.

ApplicationDigital CameraReaders for various other Flash mediaMicrodriveRFIDBarcode scannerGPSWi-FiEthernetBluetooth

Product CharacteristicsSATA Revision 3.1 compilance with 6.0 Gbps interface speedBackward compatible with SATA 1.5 and 3.0 Gbps interfaces7+17 pin Female connectorSupply 3.3 VoltageSustained Read: Up to 285 MB/sec ; Write: 260 MB/sec

CFast

17 18

CFast ApplicationA variant of CompactFlash known as CFast is based on the Serial ATA bus, rather than the Parallel ATA/IDE bus for which all previous versions of CompactFlash are designed. CFast is also known as CompactFast.CFast 1.0/1.1 supports a higher maximum transfer rate than current CompactFlash cards, using SATA 2.0 (300 MByte/s) interface, while PATA is limited to 167 MByte/s using UDMA 7.The CFast 2.0 specification was released in the second quarter of 2012, updating the electrical interface to SATA 3.0 (600 MByte/s). As of 2014, the only product employing CFast 2.0 cards was the Arri Amira digital production camera, allowing frame rates of up to 200 fps; a CFast 2.0 adapter for the Arri Alexa/XT camera was also released.

ApplicationDigital CameraReaders for various other Flash mediaMicrodriveRFIDBarcode scannerGPSWi-FiEthernetBluetooth

Product CharacteristicsSATA Revision 3.1 compilance with 6.0 Gbps interface speedBackward compatible with SATA 1.5 and 3.0 Gbps interfaces7+17 pin Female connectorSupply 3.3 VoltageSustained Read: Up to 285 MB/sec ; Write: 260 MB/sec

Specification

Drawing

CFast with Ejector

Description

Part no.

Material

Contact Plating

Electrical

752DH24MCTS32XXX

Thermal Plastic ,UL94V-0

Copper Alloy

Steel

50u"~100u" Nickel

15u" Selective gold

100u"~200u" Tin (Lead Free)

1.5 Amps Max.

30 mohms Max.

1000 Mohms min. @ 500 VDC

500 VAC / minute

-55°C DC to +85°C DC

Insulator

Contact

Shell

Underplate

Contact Area

Solder tails area

Current Rating

Contact Resistance

Insulation Resistance

Dielectric Withstanding Voltage

Temperature Range

CFast with Ejector

19 20

Recommended P.C.B LAYOUTTolerance : +/-0.05mm

CL

CL

CL

CL

(Car

d Ej

ect P

otsi

tion)

(Car

d In

sert

Pots

ition

)

5.55

40.16

1.27

31.45

45.40

21.8

025

.10

46.60

2-Ø1.75

2.500.80

3.00

4.00 CL

CL

6.20

(EJE

CTO

R S

TRO

KE)48.10

52.55

39.0

1

46.80

11.0

0

4.1

6

DIM

-X

1.306.35

33.66±0.08

0.40

43.03±0.0840.16±0.10

45.4±0.10

20.32

4.595

7.62

1.27

2.50

+0.1

0-0

.05

3.54

j 0.20 AA

0.05

+0.1

5 0

.00

S1S7PC1PC17

d 0.10 BB

21.8

56.

10

25.1

0

DIM-Y

Ø1.

25Ø

1.65

46.0

0

Center Height DIM-X

Stand-off 0 2.45mmStand-off 2.0 4.45mm

DIM-Y

5.7mm7.7mm

14 3

0 D

5

3.72

3.198.53

52.95

DIM-Z

52.3

1.27*6=7.621.27*16=20.32

DIM-Z

6.55mm8.55mm

19.0

0

Ø1.45

2-Ø2.30 3.00

LOGO

15.725

Support Card

Specification

Drawing

CFast with Ejector

Description

Part no.

Material

Contact Plating

Electrical

752DH24MCTS32XXX

Thermal Plastic ,UL94V-0

Copper Alloy

Steel

50u"~100u" Nickel

15u" Selective gold

100u"~200u" Tin (Lead Free)

1.5 Amps Max.

30 mohms Max.

1000 Mohms min. @ 500 VDC

500 VAC / minute

-55°C DC to +85°C DC

Insulator

Contact

Shell

Underplate

Contact Area

Solder tails area

Current Rating

Contact Resistance

Insulation Resistance

Dielectric Withstanding Voltage

Temperature Range

CFast with Ejector

19 20

Recommended P.C.B LAYOUTTolerance : +/-0.05mm

CL

CL

CL

CL

(Car

d Ej

ect P

otsi

tion)

(Car

d In

sert

Pots

ition

)

5.55

40.16

1.27

31.45

45.40

21.8

025

.10

46.60

2-Ø1.75

2.500.80

3.00

4.00 CL

CL

6.20

(EJE

CTO

R S

TRO

KE)48.10

52.55

39.0

1

46.80

11.0

0

4.1

6

DIM

-X

1.306.35

33.66±0.08

0.40

43.03±0.0840.16±0.10

45.4±0.10

20.32

4.595

7.62

1.27

2.50

+0.1

0-0

.05

3.54

j 0.20 AA

0.05

+0.1

5 0

.00

S1S7PC1PC17

d 0.10 BB

21.8

56.

10

25.1

0

DIM-Y

Ø1.

25Ø

1.65

46.0

0

Center Height DIM-X

Stand-off 0 2.45mmStand-off 2.0 4.45mm

DIM-Y

5.7mm7.7mm

14 3

0 D

5

3.72

3.198.53

52.95

DIM-Z

52.3

1.27*6=7.621.27*16=20.32

DIM-Z

6.55mm8.55mm

19.0

0

Ø1.45

2-Ø2.30 3.00

LOGO

15.725

Support Card

PhotoDescriptionPart no.

CFast

21 22

752DH24MCTS320XX

752DH24MCTS321XX

752DH24MCTS310AX

752DH24MCTS311AX

752DX24FCTS2S2A3

CFast Socket with Ejector

2.0mm Stand-off Height

CFast Socket with Ejector

CFast Socket without Ejector

CFast Socket without Ejector

2.0mm Stand-off Height

CFast Card 7+17 Pin Type II

PhotoDescriptionPart no.

Type B

21 22

752DH24MCTS320XX

752DH24MCTS321XX

752DH24MCTS310AX

752DH24MCTS311AX

752DX24FCTS2S2A3

CFast Socket with Ejector

2.0mm Stand-off Height

CFast Socket with Ejector

CFast Socket without Ejector

CFast Socket without Ejector

2.0mm Stand-off Height

CFast Card 7+17 Pin Type II

7F-2, No.188, SEC.3, Ta Tung Rood, Hsi Chih City, Taipei Hsien, Taiwan, R.O.C. TEL：886-2-8647-1251 FAX：886-2-8647-1842Mail：service@coxoc.com.tw

2019 04 rev.1