ch01 - materials for engineering
TRANSCRIPT
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CHAPTER 1Materials forEngineeringThe modern automobile is a case study in the
selection of a wide range of traditional and ad-
vanced materials. For example the large air
scoops that extend from the front of this vehicleto the doors are an integral part of the fenders,
which are made of a sophisticated, moldable
polymer. (Courtesy of Dow Automotive Divi-
sion of Dow Chemical Corporation)
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Figure 1-1 The material possessions of a family matching the statistical average for the UnitedStates. (From Peter Menzel, Material WorldA Global Family Portrait, Sierra Club Books,San Francisco, 1994.)
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Figure 1-2 These examples of common metal parts, including various springs andclips, are characteristic of their wide range of engineering applications. (Cour-tesy of Elgiloy Company)
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1H
3Li
4Be
I A
II A III A IV A V A VI A VII A
VIII
III B IV B V B VI B VII B I B II B11Na
12Mg
13Al
14Si
15P
16S
17Cl
18Ar
5B
6C
7N
8O
9F
10Ne
2He
O
19K
20Ca
21Sc
22Ti
23V
24Cr
25Mn
26Fe
27Co
28Ni
29Cu
30Zn
31Ga
32Ge
33As
34Se
35Br
36Kr
37
Rb
38
Sr
39
Y
40
Zr
41
Nb
42
Mo
43
Tc
44
Ru
45
Rh
46
Pd
47
Ag
48
Cd
49
In
50
Sn
51
Sb
52
Te
53
I
54
Xe55Cs
56Ba
57La
87Fr
88Ra
89Ac
72Hf
73Ta
74W
75Re
76Os
77Ir
78Pt
79Au
80Hg
81Tl
82Pb
83Bi
84Po
58Ce
59Pr
60Nd
61Pm
62Sm
63Eu
64Gd
65Tb
66Dy
67Ho
68Er
69Tm
70Yb
71Lu
90Th
91Pa
92U
93Np
94Pu
95Am
96Cm
97Bk
98Cf
99Es
100Fm
101Md
102No
103Lw
85At
86Rn
Figure 1-3 Periodic table of the elements with those elements that are inherently metallic in nature in color.
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Figure 1-4 Various aluminum parts fabricatedby superplastic deformation. The unusuallyhigh degree of deformability for these alloysis possible with a carefully controlled, fine-
grained microstructure. Superplastic form-ing uses air pressure to stretch a bubble ofmetal sheet over a metal preform. (Courtesyof Superform USA)
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1H
3Li
4Be
I A
II A III A IV A V A VI A VII A
VIII
III B IV B V B VI B VII B I B II B
11
Na
12
Mg
13
Al
14
Si
15
P
16
S
17
Cl
18
Ar
5B
6C
7N
8O
9F
10Ne
2He
O
19K
20Ca
21Sc
22Ti
23V
24Cr
25Mn
26Fe
27Co
28Ni
29Cu
30Zn
31Ga
32Ge
33As
34Se
35Br
36Kr
37Rb
38Sr
39Y
40Zr
41Nb
42Mo
43Tc
44Ru
45Rh
46Pd
47Ag
48Cd
49In
50Sn
51Sb
52Te
53I
54Xe
55Cs
56Ba
57La
87Fr
88Ra
89Ac
72Hf
73Ta
74W
75Re
76Os
77Ir
78Pt
79Au
80Hg
81Tl
82Pb
83Bi
84Po
58Ce
59Pr
60Nd
61Pm
62Sm
63Eu
64Gd
65Tb
66Dy
67Ho
68Er
69Tm
70Yb
71Lu
90Th
91Pa
92U
93Np
94Pu
95Am
96Cm
97Bk
98Cf
99Es
100Fm
101Md
102No
103Lw
85At
86Rn
Figure 1-5 Periodic table with ceramic compounds indicated by a combination of one or more metallic elements(in light color) with one or more nonmetallic elements (in dark color). Note that elements silicon (Si) and ger-manium (Ge) are included with the metals in this figure, but were not in Figure 13. This is because, in elemen-
tal form, Si and Ge behave as semiconductors (Figure 116). Elemental tin (Sn) can be either a metal or a semi-conductor, depending on its crystalline structure.
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Figure 1-6 Some common ceramics for tradi-tional engineering applications. These mis-cellaneous parts with characteristic resistanceto damage by high temperatures and corro-
sive environments are used in a variety offurnaces and chemical processing systems.(Courtesy of Duramic Products, Inc.)
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Figure 1-7 Cutaway view of an advanced gasturbine design incorporating various ceramiccomponents, for example, silicon carbide forturbine rotors, vanes, and flow path walls, sil-icon nitride for turbine rotors, and aluminum
silicate for regenerator disks. (Courtesy ofAllison Gas Turbine Operations, GeneralMotors Corporation)
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(a) (b)
Figure 1-8 Schematic comparison of the atomic-scale structure of (a) a ce-ramic (crystalline) and (b) a glass (noncrystalline). The open circlesrepresent a nonmetallic atom, and the solid black circles represent ametal atom.
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Figure 1-9 Some common silicate glasses for engineering applications.These materials combine the important qualities of transmitting clear
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Figure 1-10 Cookware made of a glass-ceramicprovides good mechanical and thermal prop-erties. The casserole dish can withstand the
thermal shock of simultaneous high temper-ature (the torch flame) and low temperature(the block of ice). (Courtesy of Corning GlassWorks)
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Figure 1-11 Miscellaneous internal parts of acontemporary parking meter are made ofan acetal polymer. Engineered polymers are
typically inexpensive and characterized byease of formation and adequate structuralproperties. (Courtesy of the Du Pont Com-pany, Engineering Polymers Division)
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1H
3Li
4Be
I A
II A III A IV A V A VI A VII A
VIII
III B IV B V B VI B VII B I B II B11Na
12Mg
13Al
14Si
15P
16S
17Cl
18Ar
5B
6C
7N
8O
9F
10Ne
2He
O
19K
20Ca
21Sc
22Ti
23V
24Cr
25Mn
26Fe
27Co
28Ni
29Cu
30Zn
31Ga
32Ge
33As
34Se
35Br
36Kr
37
Rb
38
Sr
39
Y
40
Zr
41
Nb
42
Mo
43
Tc
44
Ru
45
Rh
46
Pd
47
Ag
48
Cd
49
In
50
Sn
51
Sb
52
Te
53
I
54
Xe55Cs
56Ba
57La
87Fr
88Ra
89Ac
72Hf
73Ta
74W
75Re
76Os
77Ir
78Pt
79Au
80Hg
81Tl
82Pb
83Bi
84Po
58Ce
59Pr
60Nd
61Pm
62Sm
63Eu
64Gd
65Tb
66Dy
67Ho
68Er
69Tm
70Yb
71Lu
90Th
91Pa
92U
93Np
94Pu
95Am
96Cm
97Bk
98Cf
99Es
100Fm
101Md
102No
103Lw
85At
86Rn
Figure 1-12 Periodic table with the elements associated with commercial polymers in color.
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Figure 1-13 The rear quarter-panel on this sports car was a pioneering applicationof an engineering polymer in a traditional structural metal application. The poly-mer is an injection-molded nylon. (Courtesy of the Du Pont Company, Engi-
neering Polymers Division)
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Figure 1-14 Example of a fiberglass composite composed of microscopic-scale reinforcing glass fibers in a polymer matrix. The tremen-dous depth of field in this microscopic image is characteristic ofthe scanning electron microscope (SEM) to be discussed in Sec-
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Figure 1-15 Golf club head and
shaft molded of a graphitefiber-reinforced epoxy com-posite. Golf clubs made ofthis advanced composite sys-tem are stronger, stiffer, andlighter than conventional equip-ment, allowing the golfer to
drive the ball farther with greatercontrol. (Courtesy of FiberiteCorporation)
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1H
3Li
4Be
I A
II A III A IV A V A VI A VII A
VIII
III B IV B V B VI B VII B I B II B11Na 12Mg 13Al 14Si 15P 16S 17Cl 18Ar
5B
6C
7N
8O
9F
10Ne
2He
O
19K
20Ca
21Sc
22Ti
23V
24Cr
25Mn
26Fe
27Co
28Ni
29Cu
30Zn
31Ga
32Ge
33As
34Se
35Br
36Kr
37Rb
38Sr
39Y
40Zr
41Nb
42Mo
43Tc
44Ru
45Rh
46Pd
47Ag
48Cd
49In
50Sn
51Sb
52Te
53I
54Xe
55Cs
56Ba
57La
87Fr
88Ra
89Ac
72Hf
73Ta
74W
75Re
76Os
77Ir
78Pt
79Au
80Hg
81Tl
82Pb
83Bi
84Po
58
Ce
59
Pr
60
Nd
61
Pm
62
Sm
63
Eu
64
Gd
65
Tb
66
Dy
67
Ho
68
Er
69
Tm
70
Yb
71
Lu90Th
91Pa
92U
93Np
94Pu
95Am
96Cm
97Bk
98Cf
99Es
100Fm
101Md
102No
103Lw
85At
86Rn
Figure 1-16 Periodic table with the elemental semiconductors in dark color and those elements that form semicon-ducting compounds in light color. The semiconducting compounds are composed of pairs of elements from
columns III and V (e.g., GaAs) or from columns II and VI (e.g., CdS).
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(a) (b)
Figure 1-17 (a) Typical microcircuit containing a complex array of semiconducting regions. (Photograph courtesy ofIntel Corporation). (b) A microcircuit viewed with a scanning electron microscope. (From Metals Handbook, 9thed., Vol. 10: Materials Characterization, American Society for Metals, Metals Park, Ohio, 1986.)
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(a) Aluminum (b) Magnesium
Figure 1-18 Comparison of crystal structures for (a) aluminum and (b) magne-sium.
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Figure 1-19 Contrast in mechanical behaviorof (a) aluminum (relatively ductile) and(b) magnesium (relatively brittle) resulting
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(a)
(b)
50 m
(c)
(d)
50 m
Figure 1-20 Porous microstructure in polycrystallineAl2O3(a) leads to an opaque material (b). Nearly pore-free microstructure in poly crystalline Al2O3(c) leads to a translucent material (d). (Courtesy of C. E.Scott, General Electric Company)
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Figure 1-21 High-temperature sodium vapor lamp made possible by use of a translu-centAl2O3cylinder for containing the sodium vapor. (Note that the Al2O3cylin-der is inside the exterior glass envelope.) (Courtesy of General Electric Com-
pany)
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Figure 1-22 Pouring molten iron into molds for casting. Even this traditional form of materialsprocessing is becoming increasingly sophisticated. This pour occurred at the Foundry of
the Future discussed in the Feature Box in Chapter 11. (Courtesy of the Casting EmissionReduction Program [CERP].)
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Figure 1-23 The modern integrated circuit fab-rication laboratory represents the state ofthe art in materials processing. (Courtesyof the College of Engineering, University ofCalifornia, Davis)
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Metals
Strength Ductility Cost
Ceramics
Polymers
Semiconductors
Composites
(a) (b)
Final selection
Figure 1-24 (a) Sequence of choices leading to selection of metal as the appropriate type of ma-terial for construction of a commercial gas cylinder. (b) Commercial gas cylinders. (Cour-tesy of Matheson Division of Searle Medical Products)