chisel: chip industry refactoring for ai · 2020. 1. 3. · outline •call for broad...

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CHISEL: CHIP INDUSTRY REFACTORING FOR AI [email protected] Sifive China 0

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Page 1: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

CHISEL: CHIP INDUSTRY REFACTORING FOR AI

[email protected]

Sifive China

0

Page 2: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Outline

• Call for broad collaborations to address new challenges • Collaboration across entities

• Contribution to new technologies

• An AI revolution for chip industry • A gap between IoT AI market and chip industry

• Hardware agile design across full industry chain

• Sifive solutions for technology democratization • Chisel and diplomacy for agile hardware design

• Wit/Wake for agile SoC integration

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Page 3: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Collaboration across Industry Chain

• Sifive China ALL IN RISC-V vector for AI

• Engage with customers for fast feedback loop

• Hardware agile design

• Focus on technologies that matter

• AI inference

• Encryption

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Reconfigurable RISC-V Vector Engine

AI Inference Applications

Cryptography Applications

Page 4: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Contribution to New Technologies

• Sifive China ALL IN Chisel/Wake agile development technologies

• Origin from Berkeley and spirit of Sifive

• Engage with Tech Geeks • Rebuild tech aesthetics

• Focus on problems • What design, verification and

integration truly are

3

RISC-V Core by Composable Pipeline

Fast SoC Integration

Fast PPA

Wit Wake

Page 5: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Outline

• Call for broad collaboration to address new challenges • Collaboration across entities

• Contribution to new technologies

• An AI revolution for chip industry • A gap between IoT AI market and chip industry

• Hardware agile design across full industry chain

• Sifive solutions for technology democratization • Chisel and diplomacy for agile hardware design

• Wit/Wake for agile SoC integration

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Page 6: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Three Pillars and Steps of AI

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Programming by experts

Programming by everyman

Programming by machine

Symbolism Connectionism Behaviorism

Page 7: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Three Waves of General Purpose Computing

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PC era

Discrete device

CPU+ASIC

Mobile internet

Chip is a system

SoC

Internet of things

System defines chip

Integrated service

Symbolism Connectionism Symbolism

Page 8: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

The End of Moore’s Law

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Power density constant Dennard scaling law

Die size ≈ electronic wave length

Linear pin number VS quadric area

Feature size reaching physical limits

Page 9: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Fast Industry Chain at IoT AI

Before Now

Generation 18 months 9-12 months

Product form Discrete devices Integrated service

Software/hardware boundary

Clear Hardware is soft Software as a service

Value chain One-way from upstream to downstream

Two-way between upstream and downstream

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Agile design is critical for chip industry

Page 10: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Fast SoC Integration with Standard IPs

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IP Package Library SoC Integration Canvas (Web GUI or Scala Script)

Sifive App Core

Sifive RV V

Sifive RV V

Sifive RV V SFC RV V

Sifive AON MCU

IP

IP

IP

IP

IP

IP

IP

IP

IP IP IP

DSP GPU…

Port, PCRI,

Mode, Test case,

BSP, Driver,

Algorithm, Applications

Page 11: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Fast Core Design as DSA

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CPU

GPU

DSP

ASIP

FPGA

CGRA DSA

Fine-grained Sequential Fine-grained Spatial Coarse-grained both

ASIC

Mo

re g

ener

al

More application specific and energy efficient

time time

Page 12: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Outline

• Call for broad collaboration to address new challenges • Collaboration across entities

• Contribution to new technologies

• An AI revolution for chip industry • A gap between IoT AI market and chip industry

• Hardware agile design across full industry chain

• Sifive solutions for technology democratization • Chisel and diplomacy for agile hardware design

• Wit/Wake for agile SoC integration

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Page 13: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

To Present Design Options by Chisels

• Chisel • Constructing Hardware In

Scala Embedded Language.

• Not High-Level Synthesis

• Domain-Specific Language for digital hardware design

• Chisel is metaprogramming

• Describe circuit architecture • Chisel

• Describe circuit behavior: • Verilog, VHDL

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Chisels

Chips

Page 14: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Optimize SoC Chip with Options (Chisel)

13 Chisel Chip

Page 15: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Learn More about Chisel 3

• https://chisel.eecs.berkeley.edu/chisel-getting-started-chinese.pdf

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Page 16: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Sifive China Focus: Sand River

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CPU

Function IP

Accelerator

Interface IP

NoC

Sand Rock

Spring Stream

Mountain

River

Products

Products

Products

Products

Products

Products

Page 17: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Chisel Capabilities

• Chisel for library developers • Chisel provides hardware components (Reg, Wire, Mem, Mux, IO, etc…)

• Chisel provides constructs ( Vec, Bundle, Module, “:=“, “<>”, functionals

• Chisel for circuit designers • Diplomacy for two phase parameter negotiation and construction

• Traits for easy RocketSystem expansion

• Chisel for product users • Easy configuration system for DSA exploration

• Web-based GUI for end-user selection and integration

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Page 18: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

An Rocket-Chip System Example

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Library developer

Circuit developer

Product developer

Page 19: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Technology Democracy Driven by Sifive

• Each chip player has its own IT/EDA flow

• Sifive drives an open flow for everyone

• Enables small talented team

• Boosts productivity by open, executable and exchangeable standards

• Creates a highly convergent community

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Wit

Wake

IP onboarding and SoC template

Mange a unified workspace and version control

Mange a unified workflow through different

language/tools/envs

Mange composable IPs and SoC templates

Page 20: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

One Trend of Chip Industry

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Talk at Sifive Tech Workshop, March, 2019, Liwei Ma

Page 21: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

Chip Industry Refactoring

• Open and interoperable IP • Small talented teams win

• AI-based SoC PPA exploration • Design automation to intelligence

• Serve industry 4.0 in an industry 4.0 way • Internal industrial process externalization

Page 22: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

谢谢!

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Page 23: Chisel: Chip Industry Refactoring for AI · 2020. 1. 3. · Outline •Call for broad collaborations to address new challenges •Collaboration across entities •Contribution to

The Begin of Super Moore’s Law

• Moore’s law focuses on the doubled content

• Frequency, transistor #, memory size, etc.

• Super Moore’s law focuses on the doubling cadence

• Every 9-12 months for one generation

• Deep integration of industrial chain and ecosystem

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