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2007 Roadmap- Process, Trends
and Results/ 2009 Roadmap
Preview
Chuck RichardsonSMTAI, OrlandoAugust 19, 2008
11
TopicsTopics• iNEMI Overview• 2007 iNEMI Roadmap
– Process Overview– Emerging Trends– Technical Plan– Research Priorities
• Key Gaps– By Roadmap Areas– By Research Areas
• Conclusions & Summary
• Projects to address iNEMI Strategic Thrusts• Pb-free Conversion: Current Situation
– Conclusions
• 2009 iNEMI Roadmap Preview
22
Technology
Supply Infrastructure
TheThe iNEMI Mission:iNEMI Mission:
Build toOrder
Materials
Components
Equipment
MaterialsTransformation
Collaborative Design
Lifecycle Solutions
Software Solutions
iNEMI PROCESS FUNNELIdentify and close technology gaps, which includes the development and integration of the electronics industry supply infrastructure.
Development of industry
infrastructure
Accelerated deployment of
new technologies
Dissemination of efficient business
practices
Stimulation of standards
Manufacturing
Marketing
Order Fulfillment
Customer Deliverables
Information TechnologyLogistics
CommunicationsBusiness Practices
Advancing Manufacturing Technology
33
What Does iNEMI Do?What Does iNEMI Do?
Leverage the combined Power of Member Companies to Provide Industry Leadership
• iNEMI Roadmaps the Global Needs of the Electronics Industry– Evolution of existing technologies– Predictions on emerging/innovative technologies
• iNEMI Identifies Gaps (both business & technical) in the electronics Infrastructure
• iNEMI Stimulates R&D Projects to fill these Gaps• iNEMI Establishes Regional Implementation Projects to Eliminate
these Gaps• iNEMI Stimulates World-wide Standards to speed the Introduction
of New Technology & Business Practices• iNEMI works with other organizations to insure that government
policy recommendations are aligned with iNEMI mission.
44
Global OperationsGlobal Operations• iNEMI is headquartered in Herndon, Virginia,
USA
• Started iNEMI China Collaboration in 2003
• Opened an office in Shanghai and added a team member in Europe in 2007.
• Dr. Haley Fu is leading operations in Asia, based in Shanghai, China.
• Grace O’Malley is representing iNEMI in Europe from her base in Ireland.
55
OEM/EMS MembersOEM/EMS Members
66
Supplier MembersSupplier Members
77
Association/Consortium, Association/Consortium, Government, Consultant Government, Consultant & University Members& University Members
88
Some DefinitionsSome Definitions……
• PEG – Product Emulator Group– “Virtual Product”: future product attributes plus key cost and density drivers
• Portable / Consumer• Office Systems / Large Business / Communication Systems• Medical Products• Automotive• Defense and Aerospace
• TWG - Technology Working Group– Develops the roadmaps– Presently 19 groups of “content experts”
• TIG - Technology Integration Group– Develops technical Plan
• Based on roadmap findings and gap analysis meetings– iNEMI Projects are formed under TIGs
99
OrganizationOrganization
TechnologyTechnologyRoadmappingRoadmapping
19+ IndustryTWGs
ImplementationImplementation
7 iNEMITIGs
iNEMI Staff
Secretary to BoDCommunications
Membership DevelopmentTechnical Facilitation
iNEMI StaffiNEMI Staff
Secretary to BoDCommunications
Membership DevelopmentTechnical Facilitation
iNEMI Boardof Directors
Elected by iNEMI CouncilRepresentativesEMS DirectorsOEM Directors
Supplier DirectorsStrategic Objectives
Operational Responsibility
iNEMI BoardiNEMI Boardof Directorsof Directors
Elected by iNEMI CouncilRepresentativesEMS DirectorsOEM Directors
Supplier DirectorsStrategic Objectives
Operational Responsibility
Environmentally Conscious
Electronics TIG
Board & Systems Manufacturing Test
TIG
SubstratesTIG
Medical Electronics
TIG
TechnologyWorkingGroup
TechnologyWorkingGroup
TechnologyWorkingGroup
TechnologyWorkingGroup
Research Committee
EMS, OEM, Supplier & Academia/Government
Representatives
Research CommitteeResearch Committee
EMS, OEM, Supplier & Academia/Government
Representatives
Technical Committee
EMS, OEM, Supplier & Academia/Government
Representatives
Technical CommitteeTechnical Committee
EMS, OEM, Supplier & Academia/Government
Representatives
Product Emulator
Group
Product Emulator
Group
•••
Product NeedProduct NeedRoadmappingRoadmapping
5 IndustryPEGs
OptoelectronicsTIG
Thermal Management
TIG
Board AssemblyTechnology
Integration Group (TIG)
1010
Value PropositionValue Proposition
• iNEMI offers the opportunity to collaborate with the entire supply chain in an efficient manner
– To understand and accelerate strategic directions– To define future needs and opportunities– To jointly create industry standard technology solutions.
• Today’s increasingly distributed supply chain makes this more important than ever.
• iNEMI is a member driven organization that adapts to industry changes quickly and provides timely leadership.
• iNEMI provides important deliverables:– Technology roadmaps– Research priorities– Forums on key industry issues– Technology Deployment projects– Position papers to focus industry direction
“Advancing Manufacturing Technology”
2007 iNEMI Roadmap
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Statistics for the 2007 RoadmapStatistics for the 2007 Roadmap
• > 560 Participants• > 265 Companies/organizations• 17 Countries from 4 Continents• 19 Technology Working Groups (TWGs) (added
Organic & Printed Electronics)• 5 Product Emulator Groups (PEGs)• Over 1300 Pages of Information• Roadmaps the needs for 2007-2017• > 100 Research Needs Identified• >150 Technical Gaps Identified
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iNEMIOptoelectronics
TWG
iNEMIOptoelectronics
TWG
Optoelectronics and Optical Storage
Interconnect Substrates—Ceramic
Interconnect Substrates—Organic
Magnetic and Optical Storage
Supply ChainManagement
Semiconductors
iNEMI Roadmap
iNEMIProduct Lifecycle
Information Management
TWG
iNEMIProduct Lifecycle
Information Management
TWG
iNEMIMass Data
Storage TWG
iNEMIMass Data
Storage TWG
iNEMI / IPC/JIEP
InterconnectTWG
iNEMI / IPC/JIEP
InterconnectTWG
iNEMI / ITRSPackaging
TWG
iNEMI / ITRSPackaging
TWG
iNEMIBoard Assy
TWG
iNEMIBoard Assy
TWG
9 Contributing Organizations9 Contributing Organizations
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International Roadmap WorkshopsInternational Roadmap Workshops
• Gain Additional Participation by holding regional workshops in Asia, Europe, and North America.
– Asian Workshop held in conjunction with HDP ’06 Conference at Shanghai University.
– European Workshop held in conjunction with Semicon Europa at Messe Munchen.
– North American Workshop held at iNEMI Headquarters in Virginia.
• Goal of increased participation achieved!
• Laying foundation for further participation on future cycles.
1515
Why do Companies Participate in iNEMI Roadmap? Why do Companies Participate in iNEMI Roadmap?
• Leads to a better understanding of the “state of the art” in those areas of participation.
• Early access to the roadmap chapter’s information.• Opportunity to shape the industry’s future priorities concerning
R&D.• Opportunity to impact iNEMI’s future direction through
“technology gap” identification and solutions most important to your company.
• Those who participate in the Roadmap creation get a broad view of the supply chain landscape from customers, competitors, and suppliers.
• Roadmaps can become “self fulfilling prophecies” as many within Industry focus on the identified challenges.
• As General Dwight D. Eisenhower was fond of saying, “It’s not the Plan (that is created) but the Planning (process) that provides maximum insight”.
1616
2007 Product Emulator Groups2007 Product Emulator Groups (PEGs)(PEGs)
Emulators Characteristics
Portable / Consumer High volume Consumer Products for which cost is the primary driver including Hand held, battery-powered products driven by size and weight reduction
Office Systems / Large Business / Communication Systems
Products which seek maximum performance from a few thousand dollar cost limit to literally no cost limit
Medical Products Products which must operate within a highly reliable environment
Automotive Products which must operate in an automotive environment
Defense and Aerospace Products which must operate in extreme environments
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2007 Technology Working Groups (TWGs)2007 Technology Working Groups (TWGs)
Organic Substrates BoardAssembly Customer
RF Components & Subsystems
OptoelectronicsOrganic & Printed Electronics
Energy Storage Systems
Modeling, Simulation, and Design
Modeling, Simulation, and Design
PackagingSemiconductorTechnology
Final Assembly
Mass Storage (Magnetic & Optical)
Passive Components
Product Lifecycle Information
Management (PLIM)
Product Lifecycle Information
Management (PLIM)
Test, Inspection & Measurement
Test, Inspection & Measurement
Environmentally Conscious Electronics
Environmentally Conscious Electronics
Ceramic Substrates
Thermal Management Thermal
Management
Connectors
Sensors
Red=Business Green=Engineering Blue=Manufacturing Blue=Component & Subsystem
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Roadmap Development Roadmap Development
Product Emulator GroupsTWGs
Med
ical
Pro
duct
s
Aut
omot
ive
Def
ense
and
Aer
ospa
ce
Semiconductor Technology
Design Technologies
Manufacturing Technologies
Comp./Subsyst. Technologies
Modeling, Thermal, etc.
Board Assy, Test, etc.
Packaging, Substrates, Displays, etc.
Product Sector Needs Vs. Technology Evolution
Business Processes Prod Lifecycle Information Mgmt.
Port
able
/ C
onsu
mer
Offi
ce /
Larg
eSy
stem
s
1919
The Changing IndustryThe Changing Industry
• Consumers are concerned about the impacts that electronics products may exert regarding safety, energy usage, and environmental impact.
• There has been a dramatic movement of manufacturing and manufacturing support to China from North America, Europe, and other Asian countries because of: – A low-cost, highly skilled workforce– A massive market opportunity.
• The increasing scope of outsourced operations requires loosely coupled business processes spanning multiple companies and continents.
• Business models in the electronics industry have changed - leading to significant shifts in roles and responsibilities across the supply chain.
2020
Electronic Materials
$81Bn
ActiveComponents
$228Bn
IC AssemblyServices$8.8Bn
PassiveComponents
$197Bn
EMSAssembly$127Bn
2005Finished
Equipment$1,126Bn
Typical Companies
Sumitomo Bakelite,DuPont, Ablestik
Intel, STMicro,LSI Logic
Amkor, ASE, SPIL
Tyco, Molex,AVX, Sharp
Solectron, Sanmina-SCI,
Flextronics
Dell, HP, Cisco,Nokia, Teradyne,Visteon, Siemens
Gross Margin
30% 45% 17% 25% 6% 30%
Operating Margin
10% 15% 8% 8% 2% 8%
R&D 7% 15% 2% 5% <1% 8%
Margin Value
$8B n $34Bn $0.7Bn $16Bn $3Bn $90Bn
R&D Value $6Bn $34Bn $0.2Bn $10Bn $1Bn $90Bn
ls17.034bes-chain
%Total R&D 4% 24% 64%
Strategic ConcernsStrategic Concerns Value Creation in the Supply ChainValue Creation in the Supply Chain
Source: Prismark Partners
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Changing RegulationsChanging Regulations
• Environmental legislation in various product segments requires the electronics industry to share detailed material content data of their products and components.
• To meet regional legislative requirements, manufacturers must remove environmental “Materials of Concern,” such as lead.
• A number of “High Reliability” product manufacturers are taking Pb exemptions under the EU RoHS, and requesting a dual supply chain for components.
• The electronics industry is facing end-of-life or producer responsibility legislation.
2222
Market GrowthMarket Growth
• Worldwide production of computers and office equipment is expected to reach $431Bn in 2006, and grow at an average rate of 5.4% per year to reach $532Bn in 2010.
• Global production of communications equipment is expected to reach $176Bn in 2006, representing about 15% of the electronics industry.
• Portable and consumer electronics production will reach $267Bn in 2006, following several years of exceptional growth.
• Medical electronics equipment production will be $53Bn in 2006, accounting for about 4% of the global electronics industry.
• In 2006, over 3Bn SiPs were assembled. By 2010, this number is expected to reach 6.65Bn, growing at an average rate of about 17% per year.
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Converging MarketsConverging Markets
• Medical-Consumer
• Automotive-Entertainment
• Communication-Entertainment
• Computing-Entertainment
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Emerging TechnologyEmerging Technology
• The end of traditional semiconductor scaling. • Reduction of emphasis on the microprocessor frequency
metric, and the corresponding increase in importance of the system’s throughput metric.
• Higher bandwidth to and from the microprocessor. • Increased need for improved cooling & reduced power.• Minaturization including 3D Packaging.• Disruptive technology offers opportunity for innovation. In
order to ensure success, the supply chain must be willing to invest with a long-term perspective in mind.
• The 2007 roadmap did not identify a major need for optical transmission within high performance printed wiring boards during the next decade.
• Growth in silicon device size is slowing.
2525
2007 iNEMI Roadmap -Highlights & Trends
State of the ArtSituation Examples Implications
Market / product sector convergence:
Medical-consumer Home diagnostics User-friendly interface, higher volume / lower cost
Automotive-entertainment DVD in the car Harsher environment for consumer products
Communication-entertainment Transmission of music & pictures
Increased integration & greater miniaturization
Computing-entertainment Integration of PC with media centers
Harmonization of interface standards
Miniaturization and thinner Ultra-thin cell phones, low- profile packaging, stacked thin die
Ongoing technology and manufacturing investments in package and HDI.
NPI limited by environmental requirements
Growing list of requirements: China RoHS, EU REACH, etc.
Adds complexity and uncertainty to design and start-up. Global harmonization is needed.
Outsourcing of manufacturing continues to grow faster than overall industry
Migration to India and Vietnam
Integration of design & mfg. functions is more challenging than ever. More impetus for industry standard DFX methodology.
R&D moving to lower-cost regions / emerging markets
Technology centers in China & India
More responsive to local needs. Moving away from “one size fits all.” Changing role for developed regions.
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Anticipated Paradigm ShiftsShift Examples Implications
Electronic packaging materials will change over the next decade to meet reliability requirements
As density increases, today’s material properties present barriers: TCE mismatch, dimensional stability, etc.
Investments in new materials systems. May require rethinking traditional reliability validation methodology.
Optical interconnect by 2017? No!
Work remains at exploratory level.
Competing technologies can meet needs at lower cost.
Low-frequency (printed) electronics for data input
Alternative technology for RFID item-level tags
Facilitates low cost point required by some applications.
New forms of data Input: displays, cameras, sensors, speech
Collision avoidance, smart RFID tags (e.g., sensors).
Drives new growth areas for electronics. Simplifies or enhances user experience.
2727
• Gap analysis completed
• 5 year plans created
• Basis for future projects
• Published in July 2007
• Distribution limited to members
2007 Technical Plan2007 Technical Plan
2007 Technical Plan
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System In Package Gap AnalysisSystem In Package Gap Analysis
2005 2006 2007 2008 Need
X = Not Req'dR = ResearchD = DevelopmentI = Implementation
Technology Sufficient Technology—More Dev. needed Critical Need for R&D
Reliability Standard reliability test vehiclesEmbedded component test methodsMaterial characteristics under reflow Short solder joint integrity Thin Organic film propertiesThin die mechanical propertiesConductive epoxy (nanomaterial)Design rule impact on reliability MEMS structure reliability
Manufacturing Productivity High speed singulation and sawing Fast, high precision placement Process flow models Format Standards
Substrates Lower Cost Patterning TechniquesFilled high aspect ratio viasHigher temperature laminates
D I
RDI
RDI
RDI
RDI
RDI
RDI
RDI
RIDI
RDI
DI
RDI
DI
RDI
DI
RDI
2929
10-Year ChallengesChallenge Description
Closing technology gaps:
Active device technology New CMOS structures; “beyond CMOS” topologies.
Thermal management New materials and active cooling techniques.
Communications bandwidth Growing requirements for moving data across the environment (from hand-held devices through the network).
Design and simulation tools Ability to do concurrent design for circuit, thermal, mechanical, etc.
Science-based environmental improvements
Current regulations may not consider full “cradle to grave” impact.
Creating new product markets with social value:
Energy Higher efficiency power supplies, new energy sources for portable products.
Healthcare Home diagnostics connected to healthcare professionals.
Security Tamper-proof recognition / validation.
3030
Research PrioritiesResearch Priorities
• 2007 gap analysis just completed• 10 year R&D priorities identified• Available at www.inemi.org • Contents:
– Technology Research Needs by Product Sector
– Priorities Summarized by Research Area • Manufacturing Processes• System Integration• Materials & Reliability • Energy and the Environment• Design
– Significant Gaps and Issues from Roadmap
– Options for Innovation
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• A research vision with three major thrusts:
– Energy & the Environment– Miniaturization– Medical Electronics
Leadership through InnovationLeadership through Innovation
3232
Key Gaps by Roadmap AreaKey Gaps by Roadmap Area
• Board Assembly– Low cost fine line/via PCB Technology– Inspection and test capability– Board flex standards– Design for Manufacturing standards
• Environmentally Conscious Electronics– Alternatives to Cd, Hg, CrVI, PBB, and PBDEs – Industry involvement in policy making on material restrictions – Scientific methodologies to assess environmental impact of materials – Effective basic energy efficiency metrics
• Substrates– Low cost, fine line/via PCB Technology– Moisture reliability– High Tg– Low cost, low loss tangent materials
3333
Key Gaps by Roadmap AreaKey Gaps by Roadmap Area• Medical
– Component reliability standards and standard test methods – Standardized characterization process for RoHS-compliant
components – Development of advanced printed circuit board and flexible printed
circuit technologies – Safety study of clinical and home-health wireless environment.
• Thermal Management – Closed Loop, Liquid Cooling Solutions– Cooling of 3-D Stacked Dies– Data Center cooling strategies– Reliable low-cost pumps
• Board & System Test– Test access for miniaturized products– Increased adoption of boundary scan in digital and analog devices – Tools to determine defect coverage. – Standards for board flexure of lead-free BGAs– Test solutions for High Density Interconnect
3434
Key Gaps by Research AreaKey Gaps by Research Area• Manufacturing Processes
– There is a need for a new methodology/strategy for R&D to be conducted in the global outsourcing environment
– The infrastructure to produce high volume, low cost, high density interconnect substrates for portable electronic products
– Inspection/test technologies need to keep up with density of board designs and component packages.
• Energy and the Environment– Accepted and sound scientific methods to evaluate environmental impact of
materials that are also accepted by regulators, NGOs and industry – New innovative energy sources – R&D to develop a sustainable infrastructure and viable recycled materials
market for use in new products and other applications • Materials and Reliability
– Improved Pb-free alloys for better area array shock, lower cost, lower temperature and reduced copper dissolution issues
– Halogen free material for substrates and PCBs – Second level underfill solution needed that is reliable / reworkable and cost
effective– Need for sensor specific material standards - especially thin films
3535
Key Gaps by Research AreaKey Gaps by Research Area
• System Integration– 3D interconnect structures with associated thermal management– Standardized test methods / figures of merit for printed electronics – The capability to do system level comparisons (performance,
power, and cost) between optical and RF technology from the device level to the system level.
• Design– Improved, integrated and standardized DfX tools for compatibility
across supply chains – Low cost solutions for carrying >10Gb/s signal rates between
components on a PCB – Better tools for concurrent design of packages and PCB for better
system optimization. • Includes metrology and • Methodologies for:
– Materials characterization and – performance validation
3636
Standards and Roadmap Efforts to Establish Standards and Roadmap Efforts to Establish the Printed Electronics Infrastructurethe Printed Electronics Infrastructure
Standards
Roadmaps
Presentations & Publications
Printed Organic and Molecular Printed Organic and Molecular ElectronicsElectronics (ISBN 1(ISBN 1--40204020--77077707--6)6)
http://grouper.ieee.org/groups/1620/http://grouper.ieee.org/groups/1620/1/http://grouper.ieee.org/groups/1620/2/
Released at APEX 2007http://www.inemi.org
IEEE 1620™, IEEE 1620.1™, IEEE P1620.2
3737
Standards AlliancesStandards Alliances
• IPC
• IEEE
• EIA/JEDEC
• RosettaNet
Currently we have standards alliances with the following organizations:
3838
ConclusionsConclusions
• Consumer Electronics has become the major driving force for our industry:– New Technology to enable miniaturization
– Relentless cost reduction
– Volume manufacturing capability
• Disruptive technology offers opportunity for innovation. To ensure success, the supply chain must invest with a long-term perspective in mind.
3939
SummarySummary
• The 2007 iNEMI Research Priorities identifies R&D needs that must be met.
• Given the limited resources that industry, academia, and governments can apply, it is crucial that we focus our R&D efforts on these high priority knowledge gaps.
iNEMI Projects to
address Strategic
Thrusts
4141
Tactics Impact• Develop modeling tools to understand RF traffic issues in the
wireless clinical and home-health environment. • Develop advanced PWB technologies that address the
performance & I/O density requirements of medical devices. • Develop component reliability standards & test methods that
address the unique performance requirements and use environments that characterize the medical products sector
• Create & disseminate industry roadmaps to drive technology development
• Reduce paperwork and recording errors between patient and care-giver
• Enable new cost effective device designs, products and treatments
• Reduce time investment for medical approvals by governmental agencies
• Establish efficient supply chains to meet industry growth rates
Medical Electronics Thrust AreaMedical Electronics Thrust AreaGoal: Provide the patient and medical community with seamless end-to-end solutions
for improved health management Goal: Provide the patient and medical community with seamless end-to-end solutions
for improved health management
Strategy:• Wirelessly connect implantable devices, portable devices and
diagnostic imaging tools for clinical and home-health monitoring.
• Increase substrate and component packing density for producing small, easy to use, cost effective medical devices
• Increase device reliability for long term product life cycles
4242
Tactics Impact• Develop advanced PWB and assembly technologies that
increase substrate and component packing density • Develop new materials systems & assembly processes • Introduce smart technology & software into component
type products• Create methodology that enables reliable comparison of
test coverage between test environments, revisions, & assessors
• Create & disseminate industry roadmaps• Manage increased heat densities to enhance reliability
• Increased product throughput while minimizing capital investment
• Increase manufacturing margins• Enable new value added product applications with
increased margins• Enables more informed decision making on issues
pertaining to test.• Establish efficient supply chains to meet industry
growth rates
Miniaturization Thrust AreaMiniaturization Thrust AreaGoal: Provide the customer maximum product value in the smallest possible form factorGoal: Provide the customer maximum product value in the smallest possible form factor
Strategy:• Minimize product size by converting substrate from a
space transformer to a circuit element• Minimize substrate & assembly conversion costs to
shrink product costs
• Expand product capabilities by adding intelligence to component type products yielding new applications
• Enhance global testing and manufacturing processesSiP with radio functions for a
GSM mobile phone radio
4343
Tactics Impact• Conduct R&D to create a sustainable infrastructure and viable
recycled materials market for use in new products and other applications
• Develop Product Lifecycle Integration Management (PLIM) standards to expected energy reporting requirements
• Develop solutions to compliance requirements that are transparent, implementable, and not unnecessarily burdensome
• Create & disseminate industry roadmaps to drive technology development
• New revenue streams to support recycling efforts• Provides assessment methodology to support decision
making• Reduce energy usage• Minimize risk of both negative environmental
performance and business disruption• Establish efficient supply chains to meet industry growth
rates
Energy and the Environment Thrust AreaEnergy and the Environment Thrust AreaGoal: Provide low cost electronic assembly processes that encompass environmental
attributes, meet current and future regulations, are sustainable & energy efficient Goal: Provide low cost electronic assembly processes that encompass environmental
attributes, meet current and future regulations, are sustainable & energy efficient
Strategy:• Create a proactive stance in the electronics industry to
evaluate environmental impact with stakeholders
• Increase global communication and cooperation within industry regarding recycling challenges
• Promote basic principles for effective energy efficiency requirements
• Increase technology input to government policy making on material & energy restrictions
Industry Readiness for
Environmental Regulations
Varies by Segment
4545
Consumer ElectronicsConsumer ElectronicsSituation analysis:• Practically 100% compliant to EU RoHS• Working to meet RoHS requirements from other regions• OEMs driving “Green Electronics” programs to differentiate
– Voluntary restrictions– Touting use of recycled materials– Take-back programs, etc.
• Consumer electronics has become the 800 lb. Gorilla – 85+% of Component volume– Driving component innovation/investments
Challenges:• Mechanical shock performance leading to new alloys.• OEM Green competition driving up cost of supply base.• Lack of harmonization of global requirements.
4646
Mission Critical ElectronicsMission Critical Electronics
Situation analysis:• Many took Pb exemption based on reliability gaps• Supply base has converted to Pb-free (driven by volume)• Some components are not backward compatible for SnPb assy
– BGAs– CSPs
• Work progressing on closing remaining Pb-free knowledge gapsChallenges:• Pb-free alloy innovations happening faster than knowledge can be
gained (driven by mechanical shock performance)• Availability of SnPb compatible components is becoming a real
problem– All mission critical segments combined do not have enough clout to
drive supply base– Last time buys and shortages will only increase.
4747
Emerging Scenario for iNEMI ProjectsEmerging Scenario for iNEMI Projects
• Meet needs of members (both users & suppliers) in key segments:– High volume/portable
• Expand & strengthen miniaturization projects
– Medical electronics• Complete initial Medical Electronics Project & build
momentum for this segment
– High reliability (Telecom, Computing)• Establish “End Game” for High Reliability segments for Pb-
free conversion:– Close remaining knowledge gaps– Work source of supply issues (BGAs) in the interim
• Advanced Thermal Management Technologies
4848
Current iNEMI ProjectsCurrent iNEMI ProjectsBoard Assembly Technology Integration Group (TIG)• Pb-Free BGAs in SnPb Assemblies (writing final report)• Pb-Free Component & Board Finish Reliability (joint with Substrates TIG) • Pb-Free Nano-Solder • Warm Assembly — Nano-Attach• Board Coplanarity in SMT• Pb-Free Alloy Alternatives• Pb-Free Early Failure • Solder Paste DepositionBoard and Systems Manufacturing Test TIG• Functional Test Coverage Assessment
Board Flexure Standardization• Boundary Scan AdoptionThermal Management TIG
New initiative:• Liquid Cooling
4949
Current iNEMI ProjectsCurrent iNEMI ProjectsEnvironmentally Conscious Electronics TIG• High-Reliability RoHS Task Force• Pb-Free Rework Optimization• Pb-Free Wave Soldering • BFR-Free, Phase II (joint with Substrates TIG)
New initiatives:• Tin Whisker, Phase II• BFR-Free High Reliability PCBMedical TIG • Medical Components Reliability Specifications, Phase II New initiatives:• Medical Substrates• Medical Reliability for MLCCOptoelectronics TIG • Fiber Connector End-Face Inspection, Phase IISubstrates TIG• BFR-Free, Phase II (joint with ECE TIG)• Pb-Free Component & Board Finish Reliability (joint with Board
Assembly TIG) • IPC-2581 Industry Adoption Initiative
5050
Tactics Milestones & Issues• Phase 1: Publish position statements:
- “Recommendations to Electronics Industry Component Supply Base”.
- “Pb-Free Manufacturing Requirements for High- Complexity, Thermally Challenging Electronic Assemblies”
-“RoHS5 & RoHS6 Subassembly Modules”• Phase 2: Influence supply base for SnPb BGAs
- Hold workshop and publish results • Phase 3: Prioritize knowledge gaps and spawn projects
as needed.
• Phase 1…………………………................... Complete• Phase 2 …………………...……………….… Complete• Phase 3………………………………………. On going
Goal: Safeguard the dependability of high reliability RoHS-exempt products as the supply chain converts to Pb-free components and materials.
Goal: Safeguard the dependability of high reliability RoHS-exempt products as the supply chain converts to Pb-free components and materials.
Strategy:• Develop recommendations and guidelines that
communicate the needs of the High Reliability manufacturers to this segment of the supply chain and relevant standards groups that address these needs.
• Understand and close remaining knowledge gaps that must be closed to allow Pb-free conversion for High Reliability manufacturers.
• Project Lead: Mike Davisson (Agilent Technologies), Thilo Sack (Celestica), Joe Smetana (Alcatel-Lucent)
Thrust Area:Thrust Area: Energy & EnvironmentEnergy & Environment High Reliability RoHS Task Force High Reliability RoHS Task Force
ProjectProjectTIG:TIG: Environmentally Environmentally
Conscious ElectronicsConscious Electronics
PagePage 1 of 21 of 2
Start: Start: TBDTBD
5151
Tactics Milestones• Phase 1: Investigate the impact of various materials and
process parameters on developing a reliable, robust lead free wave soldering process. (Completed 3Q07)
• Phase 2: Design, build and test an appropriate test vehicle that allows for the investigation of joint performance as characterized by various failure analysis techniques. The result will have an impact on board design, standards development, and material selection.
• Phase 1 Build and Test……………............Q2 05-Q4 06• Phase 1 Publications……...……………..…Q1 07 & Q3 07• Phase 2 Design and Build………………….Q4 07• Phase 2 Test…………………….......……...Q1 08-Q3 08
Phase 2 Publications……………...………..Q3 08 & Q1 09
Energy & Energy & Environment Environment Thrust AreaThrust Area
Goal: Characterize the impact of materials on developing the optimum wave or selective soldering process required to achieve IPC class 3 through hole solder joints.
Goal: Identify lead free solder joint performance for through hole joints.
Goal: Characterize the impact of materials on developing the optimum wave or selective soldering process required to achieve IPC class 3 through hole solder joints.
Goal: Identify lead free solder joint performance for through hole joints.
Strategy:• Extend the work of the iNEMI Lead-Free Assembly & Rework
Project to Pb-Free wave soldering • Characterize the impact of Pb-free alloys on wave and/or
selective soldering processes.• Communicate results to the relevant industry segments.• Project Lead: Denis Barbini (Vitronics Soltec); Co-chair: Paul
Wang (Microsoft)
PbPb--Free Wave Soldering ProjectFree Wave Soldering Project
525252
Tactics Milestones & Issues• Phase 1: Develop Pb-free rework process in terms of
improved rework equipment tolerances and repeatability• Phase 2: Optimize/reduce heat transfer into boards to
minimize component and board temperatures• Phase 3: Rework test boards and perform ATC.
• Phase 1…………………………........................Q407• Phase 2 …………………...……………………..Q208• Phase 3…………………………………………..Q308
Goal: Evaluate and recommend best practices, rework equipment requirements, and procedures for best-of-breed Pb-free rework processing in a manufacturing environment.
Goal: Evaluate and recommend best practices, rework equipment requirements, and procedures for best-of-breed Pb-free rework processing in a manufacturing environment.
Strategy:• Extend iNEMI’s completed Lead-Free Assembly & Rework
Project • Focus on Pb-free area array rework capabilities and mini-
pot rework processes • Project Lead: Chair: Jasbir Bath (Solectron Corporation),
Craig Hamilton, Celestica. Adjacent component sub- group lead: Holly Rubin (Alcatel-Lucent); Mini-pot rework lead: Jenny Porter (Solectron)/ Denis Jean (Plexus); BGA socket group lead: Alan Donaldson (Intel)
IPC Printed Circuits Expo/APEX/Designers Summit 2006 February 6-9, 2006 Anaheim, California
Thrust Area:Thrust Area: Energy & EnvironmentEnergy & Environment PbPb--Free Rework Optimization Free Rework Optimization
ProjectProjectTIG:TIG: Environmentally Environmentally
Conscious ElectronicsConscious Electronics
PagePage 1 of 21 of 2
Start: Start: 0404--2727--20062006
5353
Tactics Milestones & IssuesPhase 1:• Conduct experiments to prove out the in line flex beam
“tool” for manufacturing• Use the flex beam tool to correlate stress states in Sn
films to whisker formation. • Finalize and issue “Endorsed Experiments” document.• Develop an anonymous “whisker incident” database for
OEMs to report problems.Phase 2: • Simplify or accelerate tin whisker testing supported with
data
• Project start…………………………………..June 2007• Phase 1 …………………...……………………… Q208• Phase 2……………………………………………. Q408
Goals: Evaluate and modify theories developed in Phase I, validate flex beam as in- process control and continue to explore ways to accelerate tin whisker testing.
Goals: Evaluate and modify theories developed in Phase I, validate flex beam as in- process control and continue to explore ways to accelerate tin whisker testing.
Strategy:• Combine teams and extend results from “Tin Whisker
Modeling Project” and “Tin Whisker Accelerated Test Project”
• Issue “Endorsed Experiments” document to focus research efforts.
• Develop “flexure beam” as an in-process control “tool• Conduct experiments to evaluate the various theories
proposed to explain tin whisker formation• Project Chair: Richard Parker, Delphi (Electronics &
Safety) Co-Chairs: Mark Kwoka (Intersil), John Osenbach (Agere), Jack McCullen (Intel)
Thrust Area:Thrust Area: Energy & EnvironmentEnergy & Environment
Tin Whisker, Phase II ProjectTin Whisker, Phase II ProjectTIG:TIG: Environmentally Environmentally
Conscious ElectronicsConscious Electronics
PagePage 1 of 21 of 2
Start: Start: 6/20076/2007
5454
Tactics Milestones & Issues• Phase 1: Research, develop and demonstrate a nano-
solder paste
• Phase 2: Demonstrate manufacturability with paste
• Phase 3: Demonstrate joint reliability
• Phase 4: Develop/demonstrate manufacturing equipment
• Phase 1………………………………..…...COMPLETED• Phase 2 …………………...…………………………Q407• Phase 3……………………………………………….Q208• Phase 4……………………………………………….Q408
Goal: Investigate the application of nanotechnology material systems to suppress Pb- free solder reflow temperature.
Goal: Investigate the application of nanotechnology material systems to suppress Pb- free solder reflow temperature.
Strategy:• Research and develop nano-solder materials and paste
systems that can effectively suppress the melting point temperature of Pb-free solders
• Project Lead: Andrew Skipor (Motorola)
Two copper plates joined with MMP- nanosolder paste at 180°C
Thrust Area:Thrust Area: MiniaturizationMiniaturization
PbPb--Free NanoFree Nano--solder Projectsolder ProjectTIG:TIG: Board AssemblyBoard Assembly
PagePage 1 of 21 of 2
Start:Start: 0505--1010--20072007
5555
A New Reflow TechnologyA New Reflow Technology
Richard Parker, IEEE, iNEMI Pb-Free Solder, “Impact of Elevated Reflow Temperatures on Component Performance,”
Wiley Press, Editors, Jasbir Bath, Edwin Bradley, Carol Handwerker, 2006 (in press)
• High reflow temperatures can lead to microelectronic component damage during production
• Lower reflow temperatures make other technologies possible:
• More fragile, ultra low-K dielectrics• Higher performance, less temperature
tolerant materials
• The Sn/Ag/Cu based solders have higher bulk melting points than traditionally used Sn/Pb solders
So how can Pb-free solders be processed such that their melting point is lowered without
undermining solder joint properties?
5656
A New Reflow TechnologyA New Reflow Technology
• Use melting point depression due to the thermodynamic size effect observed for nanoparticles.
• Melting point decreases with decreasing particle size.
• A melting point near or below 183 ºC is desired. In pure tin this corresponds to a particle size of ~15 nm.
Tin melting point data from S Lai, et al. Physical Review Letters, 77 (1), 99 (1996).
“Pb-free nanosolder” made up of solder alloy nanoparticles may be a viable solution and will offer other phenomenal manufacturing advantages.
Bulk Sn melting point is 232 ºC
5757
Next Initiatives on PbNext Initiatives on Pb--Free/BFRFree/BFR--Free at iNEMIFree at iNEMI
• Driven by the needs of the High Reliability Community
• New Projects and Initiatives
–– iNEMI PbiNEMI Pb--free Alloy Alternativesfree Alloy Alternatives
–– iNEMI PbiNEMI Pb--free Early Failuresfree Early Failures
–– BFR Free High Reliability ProjectBFR Free High Reliability Project
5858
Goal: Provide guidance for industry on management of Pb-free alloy proliferationGoal: Provide guidance for industry on management of Pb-free alloy proliferation
Thrust Area:Thrust Area: Energy & EnvironmentEnergy & Environment
PbPb--Free Alloy Alternatives ProjectFree Alloy Alternatives ProjectTIG:TIG: Board AssemblyBoard Assembly
Tactics Milestones & Issues• Phase 1: Determine existing knowledge & critical gaps.
Raise awareness through publication of findings. Use to drive further investigation.
• Phase 2: TBD. A number of potential objectives & tasks have been identified and prioritized.
• Perform tasks in parallel to the extent that we can. Some activities are low effort, though perhaps long term (e.g. engaging standards bodies).
• Phase 1: Virtual “workshop” 1 Feb ’08. Complete. Face-to-face meeting 2 Apr ’08. Complete. SMTA presentation May ’08. On track. SMTAI paper, etc. Aug ’08. On track.
• Phase 2: Planning begins April/May timeframe Influencing of standards begun.
• ISSUES: Need to wrap up literature review and begin planning Phase 2
• Paper for SMTAI will be presented on 8/21• Drive updates to key standards
Strategy:• Address proliferation of Pb-free alloy alternatives through
management of the situation, not (at least initially) through technical investigations.
• Project Leaders: Greg Henshall (HP), Steve Tisdale (Intel)
Unacceptable low Ag SAC solder joints reflowed at 230°C.
CSP Package
PCB
5959
Tactics Milestones & Issues• Phase 1: Complete Project Plan• Phase 2: Procure components and design boards• Phase 3: Fabricate bare board and assemble boards with
test components• Phase 4: Conduct thermal cycle testing• Phase 5: Conduct failure analysis (FA)- start as failures
occur• Phase 6: Issue Final Report
• Phase 1:…………………………………………Done• Phase 2:…………………………………………Done• Phase 3………………………………………….07/31/08• Phase 4………………………….…………….....11/28/08• Phase 5…………………………………………..01/30/09• Phase 6………………………………………..APEX2009
• ISSUES • Team Members will share costs for Phase 2 & 3• FA could be shorter if samples fail early
Goal: Determine if a large sample size exposes early solder failures in accelerated thermal fatigue testing of Pb free solder joints.
Goal: Determine if a large sample size exposes early solder failures in accelerated thermal fatigue testing of Pb free solder joints.
Strategy:• Use large sample size for greater statistical significance.• Develop unique, simple test vehicle to minimize variables
and keep cost/ schedule reasonable.• Test design to encourage Early Failures & Late Failures.• “Real Time” analysis so that results are better
understood: 1) At regular intervals & 2) At failure event.• Project Leader: Joe Smetana, Alcatel-Lucent
Thrust Area:Thrust Area: Energy & EnvironmentEnergy & Environment
PbPb--Free Early Failure Study ProjectFree Early Failure Study ProjectTIG:TIG: Board AssemblyBoard Assembly
PagePage 1 of 21 of 2
Start: Start: New New
InitiativeInitiative
6060
Strategy Issues Graphics•Design - Review prior work and make recommendations
for testing neededTest - Develop, manage, and execute performance
testingResults - Compile results, assess significance, make
recommendations
• Validate electrical and mechanical properties
• Validate Board Level Reliability Capability
Project Lead:: Stephen Tisdale, IntelProject Co-Lead:
Tactics - Phase 1 Milestones and/or Deliverables Plan Actual• Build on industry knowledge and capability• Consider unique market segment requirements• Identify technology readiness and gaps• Stimulate supply capability• Determine HF board level reliability for various
components
• Initiative Launch Date: 1Q-08 1Q-08
• Project Inauguration - Two PS Signers 3Q-08
• Project Final Report 3Q-09
Thrust Area:Medical Electronics BFR-Free High Reliability Project June 08
TIG: Medical
Goal: Technical evaluation of key electrical and mechanical properties of PCB materials and solder joint reliability
A Changing Landscape
Industry Rethinking
Environmental Strategy
6262
Global Environmental Regulatory Landscape: 2000Global Environmental Regulatory Landscape: 2000
Mercury Ban
Batteries
WEEE
RoHS
Batteries
Battery law
6363
Global Environmental Regulatory Landscape: 2007Global Environmental Regulatory Landscape: 2007
Lead ban, e- waste, and packaging law
27 states draft e-waste bills
E-waste & packaging laws
E-waste
Battery law
E-waste , Dfe product &Packaging
E-waste
EuP
REACH
E-waste & Energy
E-waste
China RoHS
Energy law
Energy E-waste, RoHS
Packaging
21 Mercury bans
IPP25 EU States –
WEEE & RoHS
RoHS study
E-waste, RoHS
E-waste, RoHSDraft Dfe, Take-back,
Packaging
Draft RoHS, Battery
6464Other names and brands may be claimed as the property of others
Changing ExpectationsChanging Expectations
Consumers increasingly judge products and companies on their environmental performance
6565
EcoEco--System Alignment is CriticalSystem Alignment is Critical
iNEMI works to align the supply chain and ensure smooth industry transitions
Raw Material Suppliers
ComponentSuppliers
ODMs
OEMsNon-Gov’tOrgs - Activism
Government Legislation
Supply Chain
iNEMI & Other Industry Standards
Sustainability Summit:
A Call to ActionPreparing
Industry for Future
Requirements
6767
Sustainability WorkshopSustainability Workshop
• iNEMI Board of Directors has called for a Sustainability Workshop to evaluate opportunities for industry collaboration
• Invite industry and academic representatives to speak
• Establish breakout groups to brainstorm options and priorities
• Establish action groups on selected topics based on outcome of meeting
• All are welcome to participate in this event
• For more details visit: (http://www.inemi.org/cms/calendar/Sustainability_Summit_Sep t08.html)
6868
Sustainability SummitSustainability Summit
• Planning effort for upcoming workshop• Leadership team
– Bob Pfahl, iNEMI– Carol Handwerker, Purdue– Martin Rausch, Intel– Grace O’Malley, iNEMI– Marc Benowitz, Alcatel Lucent– Mike Toben, Rohm & Haas– Markus Stutz, Dell
• Hold two-day US workshop at Motorola in Schaumburg IL on September 22-23
– Invite Industry and academic representatives to present– Establish break-out groups to brainstorm options and priorities– Establish action groups on selected topics based on outcome of meeting
6969
Possible Outcomes from the SummitPossible Outcomes from the Summit
• Additional proactive programs to convert to bromine free material alternatives.
• R&D to develop a sustainable infrastructure.
• Technology and market for recycled materials.
• Developing additive processes to eliminate waste.
• Reduce energy use while increasing performance.
7070
SummarySummary
• Industry was not well prepared for the initial RoHS/WEEE regulations.
• New environmental requirements continue to multiply.• Industry needs to be more proactive in developing
solutions that:– Are based on science and engineering– Are available in advance of new regulations– Can influence future regulations for a better environmental
impact• iNEMI plans to play a major role in preparing industry for
these future needs.• Sustainability will be a major undertaking for industry as
well as society.
2009 iNEMI Roadmap
Preview
7272
20082008--9 iNEMI Roadmap Goals9 iNEMI Roadmap Goals• Maintain/expand strong linkages with other technology roadmaps • Strengthen Product Emulator value:
– Utilize TWG Chair input on Key Attribute Spreadsheet formats and make needed changes as required
– Expand PEG participation utilizing T.C. input – Initiate PEG Kickoff at SMTAI in October with 5 PEG Chairs – Present Updated Emulator Spreadsheets by N.A. TWG kickoff
• Establish/Strengthen linkages with European and Asian organizations • Expand emphasis on disruptive events (business and technical)• Expand emphasis on prioritizing technical and market gaps and needs throughout
roadmap• Improve the “Executive Summaries” in individual chapters by highlighting the key
points from the chapter• New Roadmap on Solid State Illumination • Investigate Need For New Chapter on Solar Energy Generation • Incorporate ILT Roadmap Into 2009 Roadmap
7373
2009 Technology Working Groups (TWGs)2009 Technology Working Groups (TWGs)
Organic PCB BoardAssembly Customer
RF Components & Subsystems
OptoelectronicsLarge Area, Flexible Electronics
Energy Storage Systems
Modeling, Simulation, and Design
Modeling, Simulation, and Design
PackagingSemiconductorTechnology
Final Assembly
Mass Storage (Magnetic & Optical)
Passive Components
Information Management Information
Management
Test, Inspection & Measurement
Test, Inspection & Measurement
Environmentally Conscious Electronics
Environmentally Conscious Electronics
Ceramic Substrates
Thermal Management Thermal
Management
Connectors
Sensors
Red=Business Green=Engineering Blue=Manufacturing Blue=Component & Subsystem
Solid State Illumination
Photovoltaics
RF Identification/Item Level Tag
7474
2007/9 Product Emulator Groups2007/9 Product Emulator Groups
Product Emulator Chair(s) 2007 Chair(s) 2009
Automotive Products Jim Spall, Delphi Jim Spall
Medical Products Anthony Primavera, Boston Scientific
Anthony Primavera, Boston Scientific Bill Burdick, GE Research
Consumer / Portable Products Susan Noe, 3M Susan Noe, 3M
Office/Large Business System Products
Tom Pearson, Intel Erik Klink, IBM
David Lober, Intel David Copeland, Sun
Network, Data, Telecom Rolled Into Large Business John Duffy, Cisco
7575
2009 TWG Leadership Status2009 TWG Leadership Status
Business Processes / Technologies Chair(s) Co-Chair(s) Information Management Eric Simmon, NIST Jeff Pettinato, Intel Design Technologies Modeling, Simulation & Design Tools Yishao Lai, ASE S.B. Park, Binghamton U. Environmentally Conscious Electronics Bob Pfahl, iNEMI Thermal Management Ravi Prasher, Intel Azmat Malik, Consultant
Manufacturing Technologies Final Assembly John Allen, Celestica Reijo Tuokko, Tampere U. Board Assembly Dongkai Shangguan,
Flextronics Aaron Unterborn, Flextronics Ravi Bhatkal, Cookson
Test, Inspection & Measurement Mike Reagin, Delphi Michael J. Smith, Teradyne
7676
2009 TWG Leadership (cont.)2009 TWG Leadership (cont.)Component / Subsystem Technologies
Chair(s) Co-Chair(s)
Semiconductor Technology Paolo Gargini, Intel Alan K. Allan, Intel
Optoelectronics Dick Otte, Promex William Ring, WSR
Photovoltaics Alain Harrus, Cross Link Capital
Packaging Bill Bottoms, NanoNexus William Chen, ASE
Passive Components Philip Lessner, Kemet John Galvagni, AVX
Connectors John MacWilliams, Consultant
RF Components Ken Harvey, Teradyne Eric Strid, Cascade MicroTech
Sensors Need Chair Need Co-chair
Large Area, Flexible Electronics Dan Gamota, Motorola Jan Obrzut, NIST Jie Zhang, Motorola
Energy Storage & Conversion Systems
Need Chair Need Co-chair
Interconnect Substrates (Ceramic) Howard Imhof, Metalor Ton Schless, Sibco
Interconnect PCB (Organic) John T. Fisher, IPC Henry Utsunomiya, Consultant
Mass Data Storage Roger F. Hoyt, Consultant Tom Coughlin, Coughlin Associates
Solid State Illumination Marc Chason, Consultant
7777
Format for TWG Chapters Format for TWG Chapters • Executive Summary (1page)• Introduction• Situation (Infrastructure) Analysis
– Manufacturing Equipment– Manufacturing Processes– Materials– Quality/Reliability– Environmental Technology– Test, Inspection, Measurement (TIM)
• Roadmap of Quantified Key Attribute Needs• Critical (Infrastructure) Issues• Technology Needs:
- Prioritized Research, Development - Grouped into Categories: Mfg. Processes, Environment & Energy, Enterprise Systems, Materials and Design. Category Subheadings; Areas For Innovation, Implementation Tools and Cross Cutting System Issues.
- Implementation• Gaps and Showstoppers• Recommendations on Potential Alternative Technologies• Contributors
7878
2009 Roadmap Schedule2009 Roadmap Schedule
• 3Q2007: Recruit Product Sector Champions, teams and refine data charts/Begin 2009 Roadmap Newsletter & send 2007 PEG chapters 8/1/07
• 3/4Q07: Product Sector Champions Develop Emulators – September 6, 2007 – Teleconference with P.E. Group Chairs– September 25, 2007 at IPC Midwest for TWG/PEG Chairs (key attributes)– October 11,12, 2007 - Roadmap PEG Kick-off with PEG/TWG/TC at SMTAI– November 14, 2007 – Roadmap kick-off Europe at Productronica– January 9, 2008 - Teleconference with TC on PEG Emulator review
• 2007 “Word”chapter, format, Exec. Summary emailed to each TWG chair (Word) 1/4/2008
• Organizing Teleconference with TWG Chairs 1/11/2008: • February 20,21, 2008 PEG Workshop/TWG Kick-off at Agilent Technologies,
Santa Clara, CA:– Product Sector Tables Complete – PEG Chapter drafts written– Cross cut issues are initially addressed
7979
2009 Roadmap Schedule 2009 Roadmap Schedule -- ContinuedContinued
• April 4, 2008 TC/PEG/TWG face to face chapter status review meeting at APEX
• May 7, 2008 Telecon With TWG Chairs, Preliminary PEG Chapters Due• May 14, 2008 – Open Roadmap Presentation in Herndon, VA• June 18, 2008 European Roadmap Workshop – IMEC, Leuven, Belgium• July 28, 2008 – Asian Roadmap Workshop – ICEPT, Shanghai, China • July 1, 2008 – TWG Drafts Due for TC Review• August 6-7, 2008 – TC Face-to-Face Review with TWG Chairs at Tyco
Electronics, Harrisburg, PA (Wed-Thur)• September 22, 2008 Final Chapters of Roadmap Due• September 23 - 26, 2008 IPC Midwest Conference Schaumburg, • October 31, 2008 – Edit, Prepare Appendix A-D, Executive Summary • November 20, 2008 – Go To “Press”• December 5, 2008 – Ship to Members • April, 2009 – Industry presentation at APEX
