cicor group · second-largest medtec market . apac - medtec market 2020 by 2020, asia-pacific is...
TRANSCRIPT
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Challenges along the value chain Cicor Group
Alexander Hagemann, CEO
Innovation for success 23.09.2016
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Growing need for medical devices
Asia
Innovation for success 23.09.2016
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second-largest MedTec market APAC - MedTec market 2020
By 2020, Asia-Pacific is expected to pass the European Union as the world’s second-largest MedTech market
80% of emerging APAC population cannot afford MedTech solutions designed for developed markets
Innovation for success 23.09.2016
Source: McKinsey&Company, December 2015
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market-appropriate products and services Business opportunities Asia
More than 3.7 billion people live in Asia-Pacific The region is underserved Developing markets demand solutions on a
different price-performance level: high-tech solutions with low costs and «good enough» quality
Huge potential for smart wearables and self-medication
Innovation for success 23.09.2016
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Finding the right outsourcing partner
Focus on core competences
Innovation for success 23.09.2016
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market drivers and challenges Need for outsourcing
Growing complexity in product design Engineering resources Innovation and technologies Specialized manufacturing skills and process
know-how Lacking in-house production infrastructure and
capabilities Experts and experienced teams
Innovation for success 23.09.2016
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help to accelerate innovation and time to market Contract manufacturing partners
Installed facilities and staff State-of-the-art equipment Know-how pool and expertise Engineers and experts
Innovation for success 23.09.2016
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Innovation is necessary for success
Asia
Innovation for success 23.09.2016
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an unprecedented need…
Market-appropriate products & services
Innovation for success 23.09.2016
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for example with DenciTec Enabling innovation
Swiss engineered technology Miniaturization significantly higher level of integration: for
example for more volume for energy supply, batteries etc.
Higher packaging densities more design options
More functionality smarter products with more features
Significantly lower costs compared to thin-film technology economic
Innovation for success 23.09.2016
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Human hair and DenciTec Comparison
Innovation for success 23.09.2016
human hair = 100 µm
DenciTec: line width = 25 µm spacing = 25 µm
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Solutions provider Cicor Group
Innovation for success 23.09.2016
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Solutions provider The Cicor Group
Innovation for success 23.09.2016
Customized solutions
Sophisticated technologies
Design and development skills
Engineering know-how
Production flexibility with 10 sites in Europe, Eastern Europe and in Asia
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Global footprint
Global and local presence
23.09.2016 Innovation for success
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a broad range of production capabilities Electronic Solutions
Printed circuit board assembly
System assembly Box building Control cabinet
construction Cable assembly Toolmaking Plastic injection
molding
Innovation for success 23.09.2016
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complete outsourcing solutions Electronic Solutions
Development and manufacturing of electronic equipment
Complete devices and systems
Innovation for success 23.09.2016
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technological leadership through innovation Advanced Microelectronics & Substrates
Microelectronics Packaging Assembly Interconnection
techniques
Substrate manufacturing and processing Highly complex rigid,
rigid-flexible and flexible printed circuit boards
Substrates using thin- and thick-film technology
DenciTec
Innovation for success 23.09.2016
enabling customers to take the next technological steps
supporting manufacturing of prototypes, qualification parts and volume production of Microelectronics and Substrates
guaranteeing long term supply of circuits along the product life cycle
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Solutions provider Cicor Value chain
Innovation for success 23.09.2016
Consulting Design
Project management
Hardware development
Software development
Mechanic design
Mold design
PCB layout
Test engineering
Design optimization
Preferred components list
Process development/ optimization
Yield/product optimization
Logistic concept
Process quality check
SMT production
THT production
Coating/potting
Box Building
Testing
Plastic injection molding
Material supply
Microassembly
Packaging
Testing
Customer services
Traceability
Obsolescence management
Certifications
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Solutions provider Cicor Value chain
Innovation for success 23.09.2016
DenciTec Flex, Rigid and Rigid/Flex PCB Reel-to-Reel PCB Thin film ceramic, glass, silicon, ferrites Thin film polymer / multilayer Thick film on ceramics / ferrites Microassembly Packaging 3D-MID
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challenges and opportunities Summary
To design, develop and manufacture products effectively in Asia for the Asian markets can be difficult, particularly for small and medium-sized companies
Understanding the market and choosing the right partner is extremely important
Outsourcing partners can help Solution providers can help to develop products and to localize
manufacturing supply chains and be co-partners to innovate for the Asian market
Innovation for success 23.09.2016
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Thank you www.cicor.com
23.09.2016 Innovation for success