cleaning underneath bgas under bgas 8-20-12 .pdf · cleaning bgas • to clean under component gaps...
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Cleaning Underneath BGAs BEST Electronics Soldering Technologies
August 21, 2012
Cleaning Underneath BGAs BEST Electronics Soldering Technologies
August 21, 2012
Kyzen Copyright 2011 1
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Agenda
• Introduction• BGA Cleaning Considerations • Designing the Cleaning Process• Factors that Affect Cleaning• Conclusions
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Ball Grid Assemblies Ball Grid Assemblies
• How clean is clean enough?– More challenging to answer as conductors and circuit traces are increasingly narrower
– What is acceptably clean for one segment of the industry may be unacceptable for more demanding segments
Kyzen Copyright 2011 3
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Residues on BGAsResidues on BGAs
• May increase the risk of Premature failureImproper function
Kyzen Copyright 2011 4
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BGA CLEANING CONSIDERATIONS
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Technology Evolution
• Jobs needed to be done by products – Technology powered devices continue to miniaturize– More interconnects result in
• Tighter pitch• Lower standoff (Z‐Axis)
• Narrow distances between conductors requires– Higher levels of cleanliness
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Z‐Axis
• As the standoff height gap reduces– Flux residue capillary forces underfill device– Flux residues now bridge conductors – May create the potential for
• Electro‐chemical migration• Electro‐migration
µBGA with 0.40 mm pitch
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Factors to Consider
• BGA circuit trace width • BGA standoff gap • Solder Paste / Paste Flux Selection • Package Placement• Solder Paste Reflow (Heat Exposure)• Solder mask definition • Cleaning Agent • Mechanical effects
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DESIGNING THE CLEANING PROCESS
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Bottom Termination Components
• Layout influence the clearance gaps• Component selection• Solder mask definition• Placement
Plexus/Kyzen Clean Test Vehicle
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Solder Mask Defined Pads
• Very little preclearance on – Each side of the connection– 2‐4 mils preclearance per side– Solder mask is present between pads
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Solder Mask Defined
Wide Pitch
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Solder Mask Defined
Narrow Pitch
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Non‐Solder Mask Defined Pads
• Non‐solder mask defined pads – Removes solder mask in the pad areas
• Flux pools around component
– Solder mask between pads
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Non Solder Mask Defined
Wide Pitch
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Non Solder Mask Defined
Narrow Pitch
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No Solder Mask on Pads
• Removes the solder mask in both – Pad area– Under the component – Increases the standoff gap
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No Solder Mask
Wide Pitch
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No Solder Mask
Narrow Pitch
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SM Comparison
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Cleaning Comparison Data
5210
80
70
60
50
40
30
20
10
0
Wash Time (min.)
Mea
n
NoSMNSMDSMD
DefinitionSolder Mask
Interaction Plot for Z Axis BTC Cleaning for all Solder Pastes Data Means
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FACTORS AFFECTING CLEANING
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Cleaning BGAs
• To clean under component gaps with tight Z‐Axis– Understand the nature of the soil– Optimize the soldering step – Increase gap height if possible – Select cleaning agent that matches up to the soil – Mechanical system to deliver cleaning agent to soil– Rinse step to remove soil and ionic contamination– Cleaning process that does not damage the part
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Factors Affecting Cleaning
Solder Flux / Residues
Heat Exposure
Gap Height Cleaning Agent
Cleaning Equipment
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Soil
Alloys• Eutectic tin/lead• Lead free• High lead
Flux Vehicles• RA (rosin activated)• RMA (rosin mildly activated)• WS (water soluble)• NC (No clean)
Each of these impact the nature of the residueAnd what is required to clean it
Flux technology can impact alloy appearance
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Soil Characterization
• What is the nature of the soil?– No Clean, Pb‐free, Water Soluble, etc.
• What processing conditions can change the soil’s cleaning properties? – Reflow, time before cleaning, etc.
• What tests are available to predict cleaning properties? – Solubility Parameters – Matching Cleaning Agent to Soil
8/21/2012 Kyzen Copyright 2011 26
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Cleaning Rate
Static Cleaning Rate
+
Dynamic Cleaning Rate
=Actual Cleaning Rate
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Static Cleaning Rate Comparisons
8/21/2012 Kyzen Copyright 2011 28
Neutr
al 2
Neutr
al 1
MSMR3
MSMR2
MSMR1
Low V
OCHS
LR1
4.0
3.5
3.0
2.5
2.0
1.5
1.0
Product
Mea
n
Lead-Free No CleanLead-Free Water Soluble Tin-Lead No Clean
Soil 3
Interaction Plot for All Solder Paste Types Data Means
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Factors Affecting Cleaning
Solder Flux / Residues
Heat Exposure
Gap Height Cleaning Agent
Cleaning Equipment
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Soil
• Critical to manage thermal exposure– Hard to remove flux residues result from
• Long soak reflow profiles • Multiple reflow exposures • Bake cycles
Optimized Reflow Overheating Reflow
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Heat per AlloyFlux Alloy Melting Temp
(°C)Peak Reflow
(°C)CleaningInfluence
RA Sn 63.5/Ag 3.5 ~180 ~210 Easy
RA SAC 305 221 ~251 Typical
RA Sn 5 / Pb 85 / Sb10 245 ‐ 255 ~275 – 285 Difficult
RMA Sn 63 / Pb 37 183 ~213 Easy
WS Sn 63 / Pb 37 183 ~213 Easy
“HMP” RA Sn 5 / 93.5 / 1.5 305 – 306 ~335 – 336 Very Difficult
NC Sn 96.5 / Ag 3.5 221 ~251 Difficult
“HMP” = High Melting Point
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Elevated Reflow Temperatures
• Fluxes with higher molecular weight oxygen barrier– Withstand hotter temperatures– More difficult to clean
• Reduced Volatiles– Minimize voiding– Greater amount of residue
• More Oxidation Resistant– Reduce charring / burn off– Requires greater solvency & activity
Kyzen Copyright 2011
µBGA with 0.40 mm pitch
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Char / Oxidize Residue
Burnt Flux Residue
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Factors Affecting Cleaning
Solder Flux / Residues
Heat Exposure
Gap Height Cleaning Agent
Cleaning Equipment
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Chip Caps
• Gap Heights under 2 mils • Flux bridges conductors
8/21/2012 Kyzen Copyright 2011 35
Low Gaps Require More Cleaning Time High Gaps Require Less Cleaning Time
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Flux Bridging / Underfill
8/21/2012 Kyzen Copyright 2011 36
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QFN / MLF Components
• Trapped flux under QFNs– No‐clean flux residues are a risk due to
• Non‐activated weak organic acids• Partial cleaning exposes ionic residues
– Water soluble flux residues • High levels of ionic residues
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Advanced Packages
• BGAs, CSPs, WLPs and Flip Chip are under – Constant pressure to miniaturize – Lower cost – Put more packages or modules on the device
Package on Package
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Z‐Axis Comparison
• BGA Components – 7‐15 mil – good for cleaning
• Leadless Components– 1‐5 mil – bad for cleaning
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Z‐Axis Concerns
• Electric Field = Voltage/Distance– Electric field increases
• Digital technology as high as 0.5 volts/mil• Analog/power technology as high as 1.6 volt/mil• QFN as high as 3.5 volts/mil
Trapped Residue Between Leads and Ground Pad
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Gap Heights Magnify Cleaning Issues
• Flux underfills bottom termination devices• To clean
1. Wet soil +2. Dissolve soil +3. Break through soil +4. Create a flow channel =5. Clean
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Wash Concentration
8/21/2012 Kyzen Copyright 2011 42
4-7 mils1-2 mils
90
85
80
75
70
65
60
55
Component Gap
Mea
n
10.00%15.00%
Wash Conc.
Interaction Plot for % CleanData Means
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Wash Temperatures
8/21/2012 Kyzen Copyright 2011 43
4-7 mils1-2 mils
90
80
70
60
50
Component Gap
Mea
n
130F150F
Temp.Wash
Interaction Plot for % CleanData Means
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Wash Exposure Time
8/21/2012 Kyzen Copyright 2011 44
4-7 mils1-2 mils
100
90
80
70
60
50
40
30
Component Gap
Mea
n
0.5 FPM1.0 FPM2.0 FPM
Wash Time
Interaction Plot for % CleanData Means
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Solder Pastes
8/21/2012 Kyzen Copyright 2011 45
4-7 mils1-2 mils
90
80
70
60
50
Component Gap
Mea
n
EU1LF5LF6
Soil ID
Interaction Plot for % CleanData Means
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Factors Affecting Cleaning
8/21/2012 Kyzen Copyright 2011 46
Solder Flux / Residues
Heat Exposure
Gap Height Cleaning Agent
Cleaning Equipment
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Cleaning Agent
• Must be matched to the flux residue/ soil• Functional cleaning agents are
– Engineered to the soil and cleaning equipment– Hydrophobic in nature to clean resinous soils – Hydrophilic in nature to clean polar soils
Before Cleaning After Cleaning
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Cleaning Agent Matched to Soil
Which will clean better?
8/21/2012 Kyzen Copyright 2011 48
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Maximizing Static Rate
• Cleaning agent that dissolve the soil will be – Miscible / Dissolve in the cleaning agent– The basic principle ~ Like Seeks Like
• Key cleaning factors– Cleaning agent affinities (polar / ionic, covalent / non‐ionic)– Kinetic surface energies
8/21/2012 Kyzen Copyright 2011 49
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Cleaning No‐Clean Flux
• Soils are made up of covalent resin structures – Polar covalent– Non‐polar bond dipole
• Activators induce a dipole on flux resin– Improves dissolution – Removes harden residues
50
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Significant Factors
• Process parameters– Cleaning agent– Wash concentration– Wash temperature– Wash time– Impingement energy
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Wash Concentration
• Aqueous cleaning agents – Run at different dilution rates– Soil make‐up influences concentration– Two phase cleaning fluids
• Improves Hydrophobic /Hydrophilic balance• Lower concentration levels • Effective on covalent no‐clean flux residues
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Wash Temperature
• Rosin and resin flux residues – Soften at higher wash temperatures– As a general rule
• The rate doubles for each 10°C (18°F) rise in temperature
• On some residues, solubility is inverse to temperature• The chemical characteristics of the soil determine the actual wash temperature process window
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Wash Time
• Wash time dependent on – Density of the assembly
• BTC’s require longer time to penetrate and clean• Gap Height ~ Lower takes longer time to clean• Flux residues ~ Harder residues increase cleaning time• Cleaning agent ~ Closer match reduces cleaning time• Impingement energy ~ Targeted energy reduces time
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Impingement Energy
• Cleaning Agent + Impingement Energy = Clean– Low energy machines require longer cleaning time– Low energy may be insufficient to penetrate gaps– Strong impingement energy reduces cleaning time
• Spray‐in‐air using tighter spray patters • Ultrasonic cleaning energy
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Numerous Cleaning Agents
• Cleaning agent #1– Cleans fast, impacted sensitive high‐lead alloys
• Cleaning agent #2– Didn’t clean as well, but solder joints were better
• Cleaning agent #3– Cleaned better than #2, still affected solder after longer / multiple exposures
• Cleaning agent #4– Best looking solder, slowest to clean– Especially on the high temp alloys
8/21/2012 Kyzen Copyright 2011 56
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Poorly Match Cleaning Agent
• A poorly matched cleaning agent will not – Remove the residue– Even in the presence of mechanical energy– Remove partials levels of the flux residue
• White residue• Expose activators and metallic salts
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Factors Affecting Cleaning
8/21/2012 Kyzen Copyright 2011 58
Solder Flux / Residues
Heat Exposure
Gap Height Cleaning Agent
Cleaning Equipment
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Low Pressure
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Soft Residue
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Hard Residue
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Observed Cleaning Propagation
• Cleaning Channels develop in “solvent rich” out gassing channels
Bottom glassJet
Flux Residue
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Fluid Delivery
• Flow Rate – Direct effect on droplet size– Increased flow rate increases droplet rate
• Pressure – Has an inverse effect on droplet size– An increase in pressure will reduce droplet size
• Spray Angle– Has an inverse effect on droplet size– An increase in spray angle reduces droplet size
Kyzen Copyright 2011
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Spray Type Typical pressure @ 2”,50psi man. /Pressure loss/in
Indicated use
Fan/Delta 2 psi / ~50% drop/inch
Wide coverage, overlap for high impingement or close work distance
Conical 0.4 psi / ~75% drop/inch
Widest coverage area, lowest kinetic energy, flooding applications
Coherent 10 psi / ~10% drop/inch
Smallest coverage, highest energy density over longest distance
Spray System Nozzle Design
Four variables determine Impact pressure Nozzle type Distance Manifold pressure Fluid Density
8/21/2012 Kyzen Copyright 2011 64
Source: Stach & Bixenman (2005). SMTAI.
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Spray Nozzle Pressure Measured at Board Surface
ManifoldPressure
Flow: (gpm) Impingement (psi) @ Coverage width (in)@
0.075”Coherent Jet 1” 2” 4” 1.5” 4.0”
30 psig 0.69 15 10 6.5 0.6 0.7
40 psig 0.82 17 12 8 0.6 0.7
50 psig 0.89 19 13 9.5 0.6 0.8
60 psig 0.97 20 15 11 0.6 0.8
F40-1.0 Fan Nozzle
30 psig 0.89 3.2 1.6 0.2 1.5 3.25
40 psig 1.06 4.4 1.8 0.3 1.7 3.60
50 psig 1.20 6.0 2.3 0.5 1.7 4.0
60 psig 1.30 7.2 2.5 0.5 1.8 4.0
8/21/2012 Kyzen Copyright 2011 65
Source: Stach & Bixenman (2005). SMTAI.
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F40‐1.0 Fan Nozzle
60 PSI 100 PSI
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0.75 Coherent Jet
60 PSI 100 PSI
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CONCLUSIONS
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Cleaning BGAs
• Pose new challenges • Requires
– Tighter process controls– More rigorous attention to process design– Developing process control windows– Implement the process using proper test methods
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Inadequate Cleaning Practices
• Can cause severe failures – Products that fail in the field
• Lead‐free soldering is– More challenging to clean– Fluxes are more difficult to remove
• Higher molecular weight • Polymers • Increased temperature • Miniaturization
• Plan for these changes during process design
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Circuit Board Design
• Plays an important role for cleaning• Key considerations
– Density of components– Component layout– Thermal heat requirements
• From a cleanability perspective– Bottom termination component selection– Solder mask definition– Placement and layout influence the clearance gaps– Higher standoff gaps improve cleaning and reduce time
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Thank You!Thank You!