collectively intelligent material systems · 2 a. whiten, r. byrne (eds.) machiavellian...

Collectively Intelligent Material SystemsCompositing Digital Systems within Architectural

Smart Material Applications

By

Matthew Lerch

A thesis submitted to the Faculty of Graduate and Postdoctoral Affairs in partial fulfillment of the requirements for the degree of

Master of Architecture

Carleton University Ottawa, Ontario

© 2017Matthew Lerch

Developedthroughthefieldof materialscienceinthelate

90’s,‘smartmaterials’havebeenemployedbythefieldsof science

andengineeringtominiaturize,expandandreflectaphysicalworld

saturatedwithinformationrichenvironments.However,these‘smart-

materials’areinfrequentlyemployedbyarchitectstoaddressboth

technical,aestheticandspatialarchitecturalissues.Thisthesisaims

touncoverthishesitationbydesignprofessionals,critiquingthe

referenceof ‘smart’andproposesaCollectivelyIntelligentMaterial

system(CIMsystem).Thisdesignproposalsetsforthapractical

responsetotrulyintelligentarchitecturethroughspecificmodels

of CollectivelyIntelligentMaterial(CIM)applicationsbyproducing

‘smartcomposite’facadeexperimentations.Theworkseeksto

combinetheprocessof opticallithographyandArduinobased

digitalprocessingtodevelopaCIMsystem.Thiscanbeemployed

bythearchitectoverneworexistingfaçadestofacilitateintelligent

buildingsurfaces.

iii

Abstract |

Preliminaries | iii

Mysincerestthanksmustfirstgoouttomyfamilywho

haveencouragedmethroughoutallmyacademicendeavorsand

havefosteredaloveof learningwhichhasguidedmetohave

suchcapacitytocompletethisthesis.Anotherthanksmustgoout

tomyfriendsJeanOlivierLarocqueandPaolaVega;Iholdyour

adviceandexpressionsinthehighestregardandwholeheartedly

appreciateyourunwaveringsupport.

Further,wouldliketoexpressmygratitudetoallmy

undergraduatestudioprofessorswhomrousedmyinsatiable

curiosityof fabricationtechniquesandmaterialapplications.A

specialthankstoJohanVoordouw,mythesisadvisor,forhisgracious

advisementanddedicatedreview.Aswell,Iwouldliketothank

SherylBoyle,whograntedessentialsiteinformationandfacilitated

indispensablecrossdisciplinaryconsultation.Iwouldalsoliketo

thankJeanLarocqueandRuthElderforfacilitatingtheworkshop

spacethroughwhichIhavebeenabletoproduceallthefollowing

physicalmodelsandequipment.

Lastly,thefollowingtechnicalandphysicalprototypes

wouldnothavebeenpossiblewithouttheearnestconsultationof

dedicatedgraduatestudentsandfacultymembersof theCarleton

GraduateEngineeringProgram.Iwouldliketothankinspecific,

IanBeausoleil-Morrisonwhoprovidedthereferencedrawings

necessarytoconstructaworkingprototype.

Acknowledgements |

Preliminaries | iv

00 | Preliminaries:

Abstract

Acknowledgements

Listof Tables

Listof Illustrations

Listof Appendices

01 | Introduction

Identifyingwithmaterials

Methodology

Scope

02 | Part 1

SmartMaterials

Approachingourenvironments

Notsosmart

03 | Part 2

Collectivelyintelligentmaterialsystems

Makingsubstrates

Opticallithography

Micro-controllers

iii

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048

Table of Contents |

04 | Conclusion

ApplyingCIMsystemmethodology

Beyondthesurface

05 | Appendices

TBdatasheets

Componentdatasheets

Arduinocode

Rawdatafrompaneltest

07 | Works Cited

Bibliography

ImageCitation

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Table1.Smartmaterialcharacterization

Table2.Currentsmartenvironmentapproaches

Table3.Currentintelligentenvironmentapproaches

Table4.Futureintelligentenvironmentapproaches

Figure01.NewCaledonianCrow

Figure02.Elemententries

Figure03.Solarhouseaxonometric

Figure04.Solarhousesiteplan

Figure05.SpidermiteonMEMs

Figure06.Ceramics

Figure07.Thermostaticdiagram

Figure08.Thermostaticcoil

Figure09.Thermostaticstrips

Figure10.Biophysicalenvironment

Figure11.Bloom

Figure12.BreezingBlocks

Figure13.ProjectBlackBox

Figure14.DeepBlue

Figure15.ConceptPhoto

Figure16.CIMsystempaneldiagram

Figure17.CIMsystempanel

Figure18.CIMsingleleaf

Figure19.CIMsystempanelgroup

Figure20.CIMsystemmountingorientation

// List of Tables

// List of Illustrations

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Preliminaries | vi

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Figure21.CIMsystemarray

Figure22.CIMsystemarraysketch

Figure23.Sensortest

Figure24.SolarHouseCIMsystemconcept

Figure25.CircuityTest

Figure26.Conductivepaint

Figure27.Sensoriterations

Figure28.220Meshmacro

Figure29.100Meshmacro

Figure30.Iteration1.sensors1/3



Figure33.Printingprocedure

Figure34.ArduinoUnoR3graphic

Figure35.Transmitterperspectiveopen

Figure36.Transmitterperspectiveclose

Figure37.Transmitterelevationlong

Figure38.Transmitterelevationshort

Figure39.Transmitterplan

Figure40.Transmitterdiagram

Figure41.Receiverperspectiveopen

Figure42.Receiverperspectiveclose

Figure43.Receiverelevationlong

Figure44.Receiverelevationshort

Figure45.Receiverplan

Figure46.Receiverdiagram

Preliminaries | vii

List of Appendicies |

AppendixA-ThermostaticBimetalDataSheets

AppendixB-ComponentDataSheets

AppendixC-ArduinoCode

AppendixD-RawDatafromPanelTest

AppendixE-FinalPrintFrames

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Preliminaries | viii

Figure47.Wiringschematicdrawing

Figure48.NetworkDiagram

Figure49.InterfaceDiagram

Figure50.CodeExample

Figure51.OutputFileDiagram

Figure52.PhysicalPrototypeMock-up

Figure53.Southfacadelocation

Figure54.Conceptualsketchdiagram

Figure55.FinalPrintFrame1/4




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Whileourlivingenvironmentsareconceivedthrough

architecture,theylimitedbythematerialswhichareavailableto

thearchitect.1Thisdistinctionhasalwaysbeenprojectedthrough

myprocessandconceptionof designandisapartialmotiveto

pursueamaterialbasedthesis.Thisapproachhasgrownmy

abilitytoeffectivelydesignspaceandhascodifiedanappreciation

fortheuniqueawarenesswhicharchitectshaveof materials.

Therefore,Ifinditof greatinteresttoexplorearchitecturethrough

unconventionalmaterialapplications,undoubtedlyreturning

unconventionalarchitecture.Indoingso,thisthesisfocuses

specificallyuponexploringunconventionalmaterialproperties,

proposingadvancedmanufacturingmethodsandalternativesmart

materialapplicationswithinarchitecture.Thenecessitytoalter

1 Marx,Karl,andFriedrichEngels,TheGermanIdeology,4.

Introduction 01 |

Identifying with

materials

“The things to be prepared are these, l ime, t imber, sand, stone, as also iron, brass, lead, glass and the l ike. But the thing of greatest consequence is to choose skil l ful workmen.” - LeonBatt istaAlber t i 1485

Introduction | 1

natureisoneof themanycharacteristics,whichdefineintelligent

beings.TakeforexamplethetoolwieldingCrowsof theFrench

Territoryof NewCaledonia.Thisparticularspeciesof crowhave

beenobservedtouseproto-toolssuchassticksandgrasses

tocompletetasksthatwouldrequireanalogicalreasoning.In

particular,thesecondaryactof usingtoolstoretrieveormakenew

toolshavebeenobserved;themeta-tool.2

2 A.Whiten,R.Byrne(Eds.)MachiavellianIntelligenceVolII:EvaluationsandExtensions.Cam-bridgeUniversityPress,Cambridge;1997:289–311

Introduction | 2

Right//

NewCaledoniaCrowholding

fashionedimpliment.

fig.1

proto-tool//

Earliestformof animplement

usedasameansof

accomplishingataskorpurpose

analogicalreasoning//

anytypeof thinkingthatcites

acceptedsimilaritiesbetween

twosystemstosupportthe

conclusionthatsomefurther

similarityexists.

meta-tool//

Conceptof toolsinwhichthree

traitsmustbesatisfied-1.

individualmustrecognizethat

toolscanbeusedonnonfood

objects2.individualmustinitially

inhibitadirectresponsetoward

themaingoalof obtainingfood

3.anindividualmustbecapable

of hierarchicallyorganized

behavior;theymustbeable

toflexiblyintegratenewly

innovatedbehavior(tool>tool)

withestablishedbehaviorsas

asubgoalinachievingamain

goal(tool>tool>food).

Whileitisarguedwithinbehaviouralsciencethattheuse

of meta-toolsistheartifactthatfacilitatedhominidtechnological

evolutionandtheharnessingof nature,3itwouldoverlookthe

fundamentalpropertywhichallowsthetooltophysicallyrevealits

usefulness;asthemediumthroughwhichhumanitycanaltertheir

environments.Thehuman(justasthecrow)musthavethephysical

presenceof materialtomake,asthetoolsrequiresmateriality

tobemadeinthefirstplace.4Thisendowmentof physicalityas

MartinHeideggerdefinesisbetterknownas,“causamaterialis,

thematerial,thematteroutof which[ourtools]aremade”.5Inhis

descriptioncausamaterialismakesuponeof fouressentialcauses

forinstrumentality,akindof physicalmanifestationof technology.As

technologyisameanstoanend,theshapingandcontrollingof our

environments,itisnotthetoolswhichhumanityusestoshapethe

environment.Rather,itisourcapabilitytoidentifywhatismaterial;

whatwecanusetoalterourlandscapes.Humanscanalsodefine

themselvesasacollectionof beingsandconsequentially,beings

madefrommaterials.Wearenotseparatefromourmaterialbodies,

ratherourphysicalpresenceenablesustomakeourenvironments.

Wereigninasortof earthyparadiseof material,6intrinsictonotonly

ourbeing,butfurthertowhatourbeingthencreates.7

3 Taylor,AlexH.,GavinR.Hunt,andJenniferC.Holzhaider.“SpontaneousMetatoolUsebyNewCaledonianCrows.”CurrentBiology17,no.17(September4,2007):1504-507.doi:http://dx.doi.org/10.1016/j.cub.2007.07.057showArticleInfo.

4 Heidegger,Martin.2008.MartinHeidegger-BasicWritings:fromBeingandTimetotheTaskof Thinking.ModernThoughtEdition.EditedbyDavidFarrellKrell.NewYork,NY:HarperPerennial,313.

5 Ibid.

6 Bachelard,Gaston.1994.ThePoeticsof Space.TranslatedbyMariaJolas.Boston,MA:BeaconPress,7.

7 Marx,Karl,andFriedrichEngels.1932.TheGermanIdeology:IdealismandMaterialism.Moscow:Marx-EngelsInstitute,3.

Introduction | 3

reveal//

AsdefinedbyHeidegger,

technologyisafundamental

modeof revealing,tomake

knownthetruthandframing

previouslyconcealedprocesses.

Whenreferringtounconventionalmaterialproperties,the

phrasedoesnotsimplydenoteunusualorunexpectedpropertiesof

materials.Itisinfacttheopposite;wehaveadetailedunderstanding

of materialbehaviour.Sincetheconceptionof theperiodictableby

Mendeleevcirca.1869,8matterhasbeenorganizedcategorically

andelementbehaviourshavebecomerelativelypredictable.

Instead,unconventionalmaterialpropertiesof ourrecentgeneration,

datingbacktotheearly90’s,refertomaterialswhichhavethe

unexpectedcapabilitytorespondtotheirenvironments.9These

‘smartmaterials’,astermedin1992bytheNationalAeronautics

andSpaceAdministration10(NASA),areincreasinglyusedby

engineerstominiaturize,simplifyandadaptexistingengineered

systems(mechanical,electrical,chemical,etc.).Throughaseriesof

tangentialdevelopedinterestsinbothdigitaldesignandadvanced

fabricationtechniques,architectshavenotonlybecomeawareof

smartmaterialsapplicationsbuthavebegunpreliminarydesign

trials,incorporatingselecttypologiesof smartmaterialswithinhighly

specializedarchitecturalapplications.Smartmaterialshavealso

gainedpopularitywitharchitects,inpartduetoopportunitiesof

economizationandoptimization.

Thetoolswhicharchitectsareofferedareindeedmore

flexible(parametricallyconceived),11andthereforematerial

propertiesoughttobeasflexibleastheenvironmentsinwhich

8 Rittner,Don,andRonaldA.Bailey.2005.Encyclopediaof Chemistry.NewYork,NY:FactsOnFileInc.s.v.‘periodictable’

9 Ritter,Axel.2007.Smartmaterialsinarchitecture,interiorarchitecture,anddesign.EnglishEdition.EditedbyAndreasMüller.TranslatedbyRaymondPeat.Basel:Birkhäuser,7.

10 Addington,Michelle,andDanielSchodek.2005.SmartMaterialsandTechnologies:forthearchitectureanddesignprofessions.Oxford:ArchitecturalPress,1.

11 Jabi,Wassim.Parametricdesignforarchitecture.2013London:LaurenceKingPublishing,15.

Introduction | 4

FeIron

26 55.85

Ni

Cu

Nickle

Copper

28

29

65.38

63.55

Above//

Elementsentriesastakenfrom

theperiodtable.

fig.2

smartmaterials//

Materialsandproductsthatare

abletoreversiblychangetheir

shapeand/orpropertiesin

responsetooneormorestimuli

throughexternalinfluences.

parametric//

Relatingtoor

expressedintermsof a

parameterthroughalgorithmic

thinking.

theyareconceptualized.Thecurrentopportunities,however,of

smartmaterialsshouldbeaddressedcriticality.Architectsshould

considerthelimitationsof smartmaterialsandthereforebekeento

refusetheirapplicationwhere‘dumbmaterial’12wouldbepreferable.

Thequestionthenfollows;howcansmartmaterialsbeused

intelligentlywithinarchitecturetocreatethebespokearchitectural

environmentsdesiredbyaneraof informationrichenvironments?

Throughansweringthisquestionanunderlyinginquiryintohowsuch

intelligencemightbeaddressedcriticallywillrespondtotheirclaim

asaunilateralsolutionforcomplexarchitecturalproblems.13smart

materialandtechnologies.

Itwillbethefirsttaskof thisthesistoconveythe

misunderstandingof thetermsmartmaterials,notonlybecause

‘smart’improperlydefinestheircapabilitiesbutalsobecausesmart

materialsareoversimplifiedasasolutiontoarchitecturalproblems

involvingthemaintainingandmonitoringof buildingdesignand

systems.Throughprobingaseriesof casestudiesbyDorisSung

andNickPackett,thedistinctionbetweenmaterialintelligenceand

highperformancematerialswillbeaddressed.Digitalsystems,

whichusesmartmaterialsasactuators,sensorsandtransducers

applythemselvesinasimilarfashionbuthavebeenusedby

engineerssincetheearly60’supontheadventof thetransistor.

Machinebasedlogicintheformof proprietaryArduino

basedhardwarewillbethemechanismthroughwhichsensors,

actuatorsandtransducerswillbeexplored,toapplyanexisting

12 Addington,Michelle,andDanielSchodek.2005.SmartMaterialsandTechnologies:forthearchitectureanddesignprofessions.Oxford:ArchitecturalPress,9.

13 Ibid.216.

Introduction | 5

Methodology

dumbmaterial//

Anantheticdefinitionof smart

materialsascoinedbyAxel

Ritter.Amaterialwhichdoes

notactivelychangestatein

responsetoenvironmental

stimuli.

digitalsystem//

Acomputational

systemwhichhandlesdiscrete

signals.

transistor//

asemiconductordevicewhich

regulateselectricalsignals

Arduino//

Abrandof opensource

microcontrollerswhichis

aimedatenthusiastslevel

programmingapplications.

sensor//

Adevicewhichdetectsinput

(usuallyenvironmental)and

convertsinputintoanelectrical

signal.

actuator//

Adevicewhichconverts

electricalsignalsinto

mechanicalactiontoactupon

anenvironment.

transducer//

Adevicewhichconvertsone

typeof electricalsignalinto

anothertypeof electricalsignal.

hardwareunderstandingtoanexistingcategoryof smartmaterials.

Theseexistingmaterialsknownasthermostaticbimetalsarechosen

asanoptimalsubstrateforexperimentationbecausetheyreact

withtheprimaryenvironmentalstimuliwithwhicharchitectureis

concerned(i.e.sunlight,heatgain,andclimate.14Abrief critiqueof

whatdefinesintelligencefromamachinemind(machinelearning)

perspectivewillbeusedasacatalysttoredefinesmartmaterials.

Indoingso,thisredefinitionwillproposeasystembasedapproach

tomaterials,integratingthedigitallogicof theArduinointoa

thermostaticbimetalfaçadesystem.ItermaCollectivelyIntelligent

Materialsystem(CIMsystems),expandinguponboththetraditional

modeof materialsandproposingamediumbywhichtrue‘smart

material’canbeachieved.AsthethesiswillproposeaCIMSystem

tobetested,Part2of thisthesisexploresthemanufacturing

principles,commentsontestedprototypes,andproposesafinal

CIMsystemdesign.

Thefuturedesignproposalsandmethodswillbeginto

explorethesoftwareof CIMsystemcomponents.UsingtheArduino

microcontrollerandtheCprogramminglanguageacomprehensive

designandphysicalprototypewillbecreatedandtested.Thegoal

of thephysicalprototypewillbetotestthefinalCIMsystemiteration

uponarealexteriorfaçadesystem.Thiswouldbeaccomplished

throughdevelopingasmallworkingCIMsystemarraythatcouldbe

installeduponasouthfacingbuildingfaçade.Thechosensitetobe

consideredistheUrbandaleSolarReseachcenterlocatedonthe

14 Banham,Reyner.1984.TheArchitectureof theWellTemperedEnviorment.London:Architec-turalPress,18.

Scope

Introduction | 6

thermostaticbimetals//

Acompositesmartmaterial

comprisedof twometalswith

differentcoefficientsof thermal

expansionthatarebonded

together.Thematerialcanbend

basedonthermalinput(ie.

changeintemperature).

Cprogramminglanguage//

Aprogramming

languagethatisidealfor

developingfirmwareorportable

applicationsondevicessuchas

microcontrollers.

northcampusof CarletonUniversity.Testingwouldbeconducted

overmultiplesolarcyclesandundervaryingconditionsasoverseen

bytheCarletonGraduateSchoolof EngineeringandDesign.

Introduction | 7

Right//

UrbandaleCenterforHome

EnergyResearchAxonometricfig.3

fig.4

UrbandaleSolarResearch

Center//

Introduction | 8

Itwillnotbewithinthescopeof thisthesistoexploreastrategy

todeveloptheartificialintelligence(AI)ormachinelearning

componentsof theCIMsystem.Areaswithinneuroscienceand

computerscience/engineeringhavedevelopedsuitablestrategies

toaccompanythephysicalcomponentsof theproposedsystem.

However,furtherresearchwillbeconductedintheareaof AIso

thatasuitablestrategycanbechosenfortheparticularCIMsystem

whichthisthesissubmits.

artificalintelligence//

Abranchof computerscience

dealingwiththesimulationof

humanbehavioursuchasvisual

perception,speechrecognition

anddecisionmaking.

Introduction | 9

Whilethearchitect,developedfromthemasterbuilderof

the14thcentury,hasanintimateunderstandingof thematerials

usedtofabricateanddesign,thisintimacyhasmovedtothe

technicalspecificationof theengineeroverthecourseof the

lasttwodecades.Thisoffloadingof specificbuildingmaterial

knowledgetothearchitecturalconsultantcanbetracedbacktothe

industrialrevolutionyetthespecificalienationof smartmaterials

feltbyarchitectsisprimarilyexpeditedbythedigitalrevolutionof

the1960’s.Specifically,whenmethodstominiaturizeandquantify

materialcharacteristicswererequiredtomakeearlycomputer

hardwarecomponents,engineersbegantodevelopmaterialsthat

requiredgreaterspecificityof response.Miniaturizationrequired

componentsthatcouldpassivelyact,therebyrequiringmaterials

thatcoulddothesame.Thisnewworldof semiconductorsand

digitalmachinesbecamethetoolsthroughwhichactioncouldbe

programmed,aidedbythesenewsmartmaterialabilitiestoswitch

statebasedonadefinedinput(eithermechanicalorelectricalinthe

caseof thedigitalmachine).15

15 Addington,Michelle,andDanielSchodek.SmartMaterialsandTechnologies,8.

Part 1 02 |

The Smart Material

Part 1 | 10

“Some material innovations are unlike plastics, metals or ceramics, invisible: the infromatioin you re-cive from materials wil l change the physical interaction you have with them, rather than change the way they look” - Chris Lefteri 2013

Micro-electro-mechanical-systems(MEMS)exemplifytheshifttominiaturize

andoptimizeelectroniccomponents.MEMSwerefirstproducedcommercially

in1958intheformof straingaugesusingsiliconasabasematerial.16Silicon,

discoveredtohavesmart-materialproperties(piezo-resistiveeffect:whendeformed

resistselectricalcurrent)only4yearsbefore,wasalreadybeingusedtoproduce

semiconductorswithinthefirstcomputers.17AscorrelatedbyAddington,“smart

materialsandmicrotechnologyhadadheredtoparallel,albeitclose,researchand

developmenttracks”,andassuchtheycanbefoundinasymbioticrelationship

withindigitalmachinestoday.18MEMSarecommonlyusedassensorstodetect

environmentalconditions,transducerstorelaydigitalinformation(electricalsignals),

andactuatorstointeractwiththephysicalenvironment.Thesignificantarchitectural

applicationsof MEMSderivefromtheverythingwhichhistoricallyalienatesthem

fromarchitects;theypresenttheopportunitytominiaturizebuildingmaterialsand

programfunctionalitynotperceivedthroughsightratherbybeingexperienced.19

16 Cressler,JohnD.Siliconearth:introductiontomicroelectronicsandnanotechnology.2016,BocaRaton:CRCPress,Taylor&FrancisGroup,332.

17 Ibid.

18 Addington,Michelle,andDanielSchodek.SmartMaterialsandTechnologies,viii.

19 Spiller,N.,&Armstrong,R.(2011,Mar/Apr).ProtocellArchitecture.(H.Castle,Ed.)Architec-turalDesign,81(2),27.

Part 1 | 11

Micro electro-

mechnical systems

fig.5

right//

Twoviewsof aspidermite

crawilingacrossthesurfaceof

amircoelectro-mechnicalgear

chain.

Sincematerialsatamicroscaleactdifferentlyfromthe

samematerialatthemacro(buildingscale),theengineerandthe

architecthaveafundamentallydifferentunderstandingof thesame

materials.Anexampleof thisdisjoinedawarenessisillustrated

byceramics.20Commonlyceramicsareusedbyengineersas

insulatorsof eitherelectricalorthermalenergy.Atthemicro-scale

ceramicsactasresistors,allowingonlysmallamountsof electricity/

heattoflowthroughthem.Thispropertyisessentialtoproducing

computercomponentsthatcanregulateandinterpretelectrical

current.However,architectsselecttheverysameceramicsnotfor

thetaskof regulationbutasafinish.Thepropertiesof durability

andresistancetochemical,thermal,andelectricalresistanceare

alsoexploitedbyarchitectsbutnotwithasimilarintention,nor

understanding.Thearchitecthasdifferentperformancecriteria

whicharemetbyceramicsatthemacroscaleof abuildingmaterial,

whiletheengineerusesceramicsatthemicroscaletosatisfya

differenttask.Smartmaterialsingeneralpresentthemselveswith

thesameunifyingchallenges.Therefore,smartmaterialswhichare

usedinarchitecturetodaymustnotonlybesmart,theyshouldbe

conventionallybuildable.

20 Lefteri,Chris.2014.MaterialsforDesign.London:LaurenceKingPublishing,202.

Part 1 | 12

<>

right//

Acomparisonbetweenceramic

inelectroniccomponents

(resistors)andarchitectural

components(roof tile).

fig.6

Tomakeaconventional‘thing’buildableonemust

understandhowitismanufactured,andunderstandingsmart

materialmanufacturingrequiresacharacterizationof whatmakes

asmartmaterial.Thefirstcharacteristicof anysmartmaterial

isimmediacy.Smartmaterialsmustrespondinrealtime,as

suchtheyaretemporal,changingfrequentlybetweenstatesor

convertingenergyinanimmediatemanner.Asmartmaterialmust

alsohavetransiency,meaningitmustchangebasedondiffering

environmentalstates.21Environmentalstateswhenreferringto

smartmaterialsarenotspecificallyfromthenaturalenvironment,

ratherdifferingstatesof environmentshouldbethoughtof moreas

stimulationorinputviaenergytransfer(e.g.changesintemperature

(thermalenergy)convertedtomovement(mechanicalenergy)).

Smartmaterialsmustbebi-directional,meaningthatthechanges

incurredbydifferentenvironmentalstatesmustberepeatableand

reversible.22Asmart-materialisself-actuatingthroughitsinternal

programmingof molecularstructure,composition,assembly,and

chemicalproperties.Asmart-materialdoesnotrequireanexternal

intelligentsystemtofunction,suchasanelectronicactuatoror

sensorstoprovideinput.Buildingonprogramming,smart-materials

musthaveselectivity.Theymustresponddiscreetlytoenvironmental

conditionsandbepredictabletocontroltheirvariability.Lastly,the

characteristicof “directness[which]posesthegreatestchallenge

toarchitects”23,describestheabilityforasmartmaterialtorespond


22 Ritter,Axel.Smartmaterialsinarchitecture,9.


Part 1 | 13

immediacy//

thequalityof bringingoneinto

directandinstantinvolvement

withsomething,givingrisetoa

senseof urgencyorexcitement.

transiency//

passingespeciallyquicklyinto

andoutof aparticularstate.

self-actuating//

theachievementof full

potentialthroughcreativity,

independence,spontaneity,and

agraspof therealworld

selectivity//

theabilityof adevicetorespond

toaparticularfrequencywithout

interferencefromothers

directness//

havingtheablitytodesceetly

manageorinteractwithothersin

anauthoratiativemanner

.

locallytoenvironmentalstatechange.Asbuildingservicesystems

(HVAC,lighting,etc.)withincurrentarchitectureisneitherdiscrete

norresponddirectlytoenvironmentalchanges,thecharacteristics

of smartmaterialsystemsoffersanopportunitytorethinkbuilding

environmentsatthesmallscale;thehumanscale.24

24 Ibid.

Part 1 | 14

Type of Smart Material

Type1PropertyChanging

ThermomochronicsPhotochronicsMechanochronicsChemochronicsElectrochromicsLiquidcrystalSuspendedparticleElectricaleologicalMagnetorheological

Type2EnergyExchanging

ElectroluminecentsPhotoluminecentsChemoluminecentsThermoluminecentsLight-emittingdiodesPhotovoltaics

Type2EnergyExchangingreversible

PiezoelectricPyroelectricThermoelectricElectrorestrictiveMegnetorestrictiveThermostatic

Input

TemperaturedifferenceRadiation(light)DeformationChemicalconcentrationElectricalpotentialdifferenceElectricalpotentialdifferenceElectricalpotentialdifferenceElectricalpotentialdifferenceElectricalpotentialdifference

ElectricalpotentialdifferenceRadiationChemicalconcentrationTemperaturedifferenceElectricalpotentialdifferenceRadiation(light)

DeformationTemperaturedifferenceTemperaturedifferenceElectricalpotentialdifferenceMagneticfeildTemperaturedifference

Output

ColourchangeColourchangeColourchangeColourchangeColourchangeColourchangeColourchangeStiffness/viscositychangeStiffness/viscositychange

LightLightLightLightLightElectricpotentialdifference

ElectricpotentialdifferenceElectricpotentialdifferenceElectricpotentialdifferenceDeformationDeformationDeformation

right//

SmartMaterialCharacterization

Table.Highlightedtermsintable

1.denotesmartmaterialswhich

areexploredinthisthesis

table1.

ThermostaticBi-metals(TB)arelaminatedcompositematerialsthatconsistof

atleasttwocomponents,usuallybandsorstrips,madeof metalswithdifferent

thermalexpansioncoefficients,whicharepermanentlybondedtooneanother.25The

componentwiththelowercoefficientof thermalexpansioniscalledpassive,theone

withthehighercoefficientactive.26Dependingonthewaythetemperaturechanges

overtime,thecomponentsusedandtheirgeometries,thecompositetakesupa

curvedshapeandcanbeusedasanactuatorinmechanicalapplications(seefig.

7).Architecturally,thermostaticbi-metalshavebeenusedprimarilyinexperimental

façadesystemstocontrolnaturallightandsensetemperaturechangewithinbuilding

servicesystems(viaservicesystemcomponentssuchasthermostats).

25 Ritter,A.(2007).Smartmaterialsinarchitecture,interiorarchitecture,anddesign(EnglishEditioned.).(A.Müller,Ed.,&R.Peat,Trans.)Basel,Switzerland:Birkhäuser.53.

26 Ibid,54.

Part 1 | 15

Thermostaic

Bi-metals

top//

Digramshowingtooperative

qualitiesof abimetalicstrip.

left//



right//



1 2

Active

Passive

fig.7

fig.9fig.8

Architecturewhichincorporatessmart-materialsengage

thelocalphysicalenvironment.Itdoesthisfunctionallythrough

itsfaçadesystem,whichresiststhechangesof thenatural

environmentandallowsanaugmentedinteriorenvironmenttoexist

(referredtoasbiophysicalenvironmentbyHensel,seefig.10).27

Thisaugmentedinteriorenvironmentisfacilitatedthroughbuilding

managementsystems,includingHVAC,lightingcontrols,passive

systemsandothers.Consequentially,thefaçadesystemisthe

componentwhichseparatesthisboundary;asurface.Thesurface

ontheinterior,beingthatof finishedandpleasanttacticallyforthe

occupants,contrastedbytheexteriorsurfacewhichoperatesto

resiststhenaturalelements.InSmartMaterialsandTechnologies,it

isunderstoodbyAddingtonthat,“architects[donot]designspace,

therealityisthatarchitectsmake(draw)surfaces”.28Therefore,since

architecture’sphysicalityisderivedfromsurface,itwouldfollowthat

thissurface’smaterialisprofoundlyessentialindefininghowthat

surfacewillbehave(whatrelationshipitwillhavewiththeinteriorand

exteriorenvironments).

27 Hensel,M.(2013).Perfromance-OrientedArchitecture:RethikingArchitecturalDesignandtheBuiltEnviorment.(M.Swift,Ed.)Chichester,WS,UK:JohnWiley&SonsLtd,56.


Approaching our

Environments

Part 1 | 16

“Architectural surfaces are derived first through the visual qualit ies of the material and second by under-standing materials as a barrier” - Micheal Hensel 2013

below//

Thediagramillustratesthe

relationshipbetweenelements

withinafacadesystemand

thereinteractionwithinthebiotic

enviorment(interior)andthe

abioticenvioremnt(exterior)

Part 1 | 17

fig.10

DOSUStudioArchitectureisLosAngelesbasedmaterialresearchstudio

thatisprimarilyfocusedonproducingphysicalprototypesusingthermostatic

bimetals.Commentingonhermostrecentinstallation(2012)entitled‘Bloom’,Doris

KimSungsuggests,“challengingthetraditionalpresumptionthatbuildingskinsare

staticandinanimate”.29Theprojectexaminesthereplacementof thestaticbuilding

facadebyproposingaprostheticlayerbetweenpeopleandtheirenvironmentasa

responsiveandactiveskin.Usingsmartmaterialsastheactivecomponentwhich

facilitatesanimationof herfacades,Sungdemonstratestheefficacyof thermostatic

bimetalsasanexteriorbuildingsurfacewithtwofunctions.Thefirstistheuseof

thermostaticbimetalsasasunshadingmechanismthatcontrolslightexposureof

anexteriorcourtyardasthetemperatureincreasesthroughouttheday.30Thesecond

functionof theskinistoventilatehotairthroughthesameperforationwhichexpose

thebimetalflaps.31Theprojectillustratesthepracticaluseof smartmaterialsthrough

aunifiedsurfacemethod.

29 Sung,Doris.2014.“DigitalandParameticArchitecture.”EditedbyCarloAiello.(EVOLO,Inc)(6):117.

30 Fox,Michael.2016.Interactivearchitecture:adaptiveworld.NewYork:PrincetonArchitecturalPress,132.

31 Sung,Doris.2014.“DigitalandParameticArchitecture.”EditedbyCarloAiello.(EVOLO,Inc)(6):117.

Part 1 | 18

Doris Sung

Case Study

fig.11

Bloom

right//

Exteriorarchitecturalinstallation

utilizingthematerialproperties

of thermostaticbimetals.

Incontrastherapproachtowindowshuttersystemsutilizes‘breezingblocks’.32

Thesesmartmaterialcomponentsaresynthesizedusingthermostaticbimetalsand

traditionalglassfacadesaimedatdevelopingbuildingcomponentsforindustry.

Basedontheprincipalof solarheatgain,Sungexploresaseriesof patternswhich

utilizeprogrammedbimetallicstrips.Thesestripswithinthewallcomponentsbend

basedupontheamountof thermalgain,shadingtheinteriorenvironments.Sung

speculates“thispanelsystemcanhelpreduceheatgain,reducetheneedfor

artificialair-conditioning,andconserveenergy”.33

32 Ibid.

33 Ibid,118.

Part 1 | 19

Breezing Blocks

right//

facadeconstructionutilizingTB

flapstoregulatesolarexposure

withinwallcavity.

fig.12

ProjectBlackBoxisaresearchinitiativeauthoredbyNickPuckett,founding

directorof AltNResearch+Design.Begunin2012,ProjectBlackBoxexploresthe

applicationof shapememorypolymers(SMPs)intwodistinctmethods.34Thefirst

methodappliesopensourcemethodologiesof softwareandhardwaredevelopment

totherealmof materialsscience.Developedin1980,SMPsareclassifiedas

temperatureresponsivematerials(thermostatic),butunlikebimetalstheycanbe

programmedtoshapetoaspecificcurvature.35Thisisdonethroughheatingthe

materialtotheGlassTransitionTemperature;thespecifictemperatureregionwhere

thepolymertransitionsfromahard,glassymaterialtoasoft,rubberymaterial.36

Essentiallythematerialcanbeprogrammed,inthesamemannerbywhichwe

programopensourcehardware(i.e.Arduino).Inthiswaythedesigncommunityis

beginningtoclaimmaterialasthenewsoftware.37

34 Puckett,N.(2014).If materialisthenewsoftware,thenhowdoIwriteit?InD.D.Gerber,ParadigmsinComputing(pp.288-297).LosAngeles:eVoloPress,289.

35 Ibid,290.

36 Ibid,293.

37 Nicholas,P.(2013).DesigningMaterialMaterialisingDesign.(R.Roke,Ed.)Waterloo,ON,Canada:RiversideArchitecturalPress.12.

Part 1 | 20

Nick Puckett

Case Study

Project Black Box

fig.13

Inhissecondbookof theTenBooksonArchitecture,

Vitruviuswritesabout“MaterialsSuitedfortheConstructionof

Buildings”.38Thesematerialsfortraditionalconstruction,suchas

wood,stoneandtimber,havebeenusedfortheiruniquematerial

properties,exhibitingstableandpredicablebehavioursforspecific

architecturalpurposes.AsdescribedbyAddington,traditional

materialswouldseemdumbincomparisontosmartmaterials

exhibitingtransientbehaviours.39Whiletraditional‘dumb’materials

seemmoreakintotherawmaterialsfoundwithinnature,“dumb

materialsandstructurescontrastsharplywiththenaturalworld”.40

Naturedisplaystheabilitytoadapttotheenvironmentinrealtime.41

Therefore,throughthecultivationof materialsweproducedumb

materials;theyareessentiallyzombiesof theirnaturalbeing,defined

asadeadbodygiventhesemblanceof lifebutmuteandwill-less.42

Thisapproachof identifyingdumbmaterialsyieldsananthropic

perspective,onewhere‘smartness’and‘dumbness’havebeen

appropriatedtovaguelydefinecharacteristicswhichdistinguish

materialepochs.

Thisphenomenoniscorrelatedwiththemarketingapproach

of smartmaterialtechnology.Initsinfancy,thetermsmartmaterial

developedinaneradesignatedbytheGeorgeBushadministration

as‘thedecadeof thebrain’.43Itwasadecadeoccurringbetween

38 Vitruvius.(1914).TheTenBooksonArchitecture.London:HarvardUniversityPress,41.


40 Friend,C.(1996).Smartmaterials:theemergingtechnology.MaterialsWorld,4,16.

41 Ibid.

42 PenguinReference.(2004).ConciseEnglishDictonary.(R.Allen,Ed.)Oxford,UK:Pengin Group,s.v.zombie.

43 George,J.D.(2001).TheDecadeof theBrain-Adecadeof Scholarship.Journalof theHistoryof theNurosciences,10(1),113.

Part 1 | 21

Not so smart

1990-2000,whichsensationalizedcutting-edgeresearchon

cognitionandneuroscientificresearch,encouragingpublicdialogue

throughinteragencyinitiatives.44Heavilyfunded,theseinitiatives

notonlyspurredoriginalresearch,italsomarketedthebrainand

subsequentlyitsfunctionasthezeitgeistof the90’s.Therefore,the

term‘smart’beingthatof quickwittedintelligence,45isnotsomuch

definingthefunctionalityof thematerialasitisretailingmaterial

research.

Moreover,theterm‘smart’insmartmaterialscanbe

critiquedfromanetymologicalperspective.If smartinfersquick

wittedintelligence,thenitwouldfollowthatsmartmaterialsnotonly

havetobeintelligentbutarequickwittedaswell.Quickwitted,

superficiallyreferencestheabilitytorespondwithwit.46Again,the

anthropictraitsuggeststhatsmartmaterialsassomethingderived

fromcultivationbyhumansisfalse.Infact,natureusesmaterialsina

muchmoreintelligentfashion(eg.DNAwithinacellwhichencodes

biologicaldatathroughmaterialproperties).Thelattertermof

intelligenceisevenmoreproblematicasitinsinuatesthatmaterials

canlearn,understandordealwithnewortryingsituations.47

Throughthecasestudiespresented,byDorisKimSungandNick

Puckett,smartmaterialsareusednottoprocessenvironmentaldata,

likethatof abrain(referringtoartificialintelligencewhenreferencing

machinebasedminds),rathertheyarereactionaryelements.This

isillustratedbytheactof programmingmaterialstodocyclical

44 Ibid.

45 PenguinReference.(2004).ConciseEnglishDictonary.(R.Allen,Ed.)Oxford,UK:PenguinGroup,s.v.smart.

46 Ibid,s.v.wit.

47 Ibid,s.v.intellegnce.

Part 1 | 22

tasks.Inthecaseof thethermostaticbi-metalskinusedinthe

BloomprojectbyDorisSung(seefig.10),thefaçadesystemis

programmedtoreactbasedonthedailyexposureof directsunlight.

Itisnotcapableof reactingbeyondwhatitsprogrammedsurface

featuresandmaterialpropertiesallow.Therefore,itsresponse

ismorelikethatof atransducer,thanabrain.Thecapabilityof

NickPuckett’sshapememorypolymersismoreintelligent,asthe

substratecanbereprogramedatwillwithinthesamethermalinput.

Thisenablesactuationyetthematerialisstilldirectlychangingin

responsetoitsenvironmentalstimuli.

Lookingbacktothefieldwhichisdirectlyimplicatedin

understandingintelligence,cognitiveneurosciencedefinesnon-

biologicalcognitionasartificialintelligence(AI).48Developedby

GeorgeMiller,EugeneGalanter,andKarlPribramin1959,thefirst

theoryforanAIwasdevelopedbasedontheconceptof feedback

loops,whichtheycalledTOTEunits(TOTEstandsforTest-Operate-

Test-Exit).49Thebasicconceptwasthat,withinthebrain,aninitial

testevaluatesagivencurrentstate(thestatecouldbederivedfrom

environmentalstimuli)againstagivengoal.If thestatesdonot

correlate,instructionsaregiventocarryoutanoperationtoreduce

thedifferencesuntilamatchoccursthroughaseriesof repeating

tests.50

48 Kolak,D.,Willkiam,H.,Mandik,P.,&Waskan,J.(2006).CognityiveScience:AnIntroductiontoMindandBrain.London:Routledge,24.

49 Ibid.

50 Ibid,25.

Part 1 | 23

Tolinkartificialintelligencewithsmartmaterialsthefollowing

questionmustbeasked.If allformsof traditionalmaterialscome

fromnaturebutloosetheirnaturalistictraitsuponcultivation,arethey

thenconsideredartificial?AstheOxfordEnglishdictionarydefines,

artificialis:“somethingproducedbyhumanbeingsratherthan

occurringnaturally,typicallyasacopyof somethingnatural”.51This

wouldimplythatif amaterialhasbeenprocessedinafashionthat

replicatessomethingfromnature,itwouldbeartificial.Therefore,

if smartmaterialsaimtoreplicatecognitiveprocessesfoundwithin

nature,theymustthenbeconsideredartificialyetasalreadyproven

throughthepreviouslymentionedcasestudiesbyDorisSungand

NickPuckett,smartmaterialsarenotintelligent,theyareresponsive.

If so,itthenfollowsthattheword‘smart’,insmartmaterials,seems

tobeanill-fittingadjective.

51 PenguinReference.(2004).ConciseEnglishDictonary.(R.Allen,Ed.)Oxford,UK:PenguinGroup,s.v.artificial.

Part 1 | 24

fig.14

right//

CreatedbyIBMin1989,Deep

Blueexmeplifedthepushto

createartificalintellegence

throughtheTOTEmethod.Its

taskwastodefeatworldclass

chesschampions,whichit

suceededatin1997against

GarryKasparov

Thefollowingchapterselaborateuponanapproachof material

designcalledCollectivelyIntelligentMaterialsystems(CIM

system).Thisapproachwillbeusedtofabricateatestmaterial

systemusingsmartmaterialsasasubstrate,opticallithographyto

producesensorsandArduinobasedmicrocontrollerstoconnect

thefunctionalityof boththesubstrateandthesensorstogether.A

finaldesignislaterproposedthroughwhichintelligentarchitectural

façadesystemscanbecomerealizedusingCIMsystem.

Smartmaterialsofferimbeddedcapabilitiesof acting

inresponsetoenvironmentalinput.Focusinguponthermostatic

bi-metals,theseactionsareactuated(movement),particularly

whenanenvironmentalchangeof radiation(light)orheatoccurs.

Whilenotsatisfyingthetraditionaldefinitionof intelligenceas

discussedearlier,thesematerialsdopossestheabilitytointerpret

theirenvironmentandactwithinit;similartoanactuatororsensor.

If smartmaterialsdonotprovidethefullsolutiontointelligent

architectureorevenanapproachtoasystemthatcouldbeapplied

architecturally;whatisthisparticularsmartsystemandwhat

“There are also apparatuses that inform dynamically . . . these ‘smar t tools’ replace human work and l ib-erate human beings from the obli-gation to work: from then on they are free to play” - Vilém Flusser

Collectively

Intelligent Material

Systems

Part 2 | 25

Part 2 03 |

materialsmakeitup?

Therearethreemajorapproachestocharacterizeintelligent

architecturalsystems(environments)basedupontheirfunctionality:

environmentcharacterizations,cognitioncharacterizations,and

implementationcharacterizations.52Thefirststream,environmental

characterizations,encompassestheadvancementof human

occupationanduseof spatialenvironments.53Specifically

processesthatembedsensingandcomputingtomakeourhomes

andworkplacescontextuallyaware.54Cognitioncharacterizations

includeapproachesthatengagehumanemotionsthoughtsand

cognitionsoccurringintheenvironments.Finally,implementation

characterizations,focusonstrategieswhichenhancements

areinvoked,operatedandcontrolled.55Manyattemptsto

make‘intelligentspatialenvironments’focusspecificallyupon

oneapproach,potentiallyignoringthebenefitsof combining

approacheswhichexpresssimultaneityandcongruency,while

relinquishingtheideaof auniversalsystem.56

TheapproachwhichtheproposedCollectivelyIntelligent

Materialsystemtakesistooperatewithinallthreecharacterizations.

Futureintelligentenvironments,asAddingtionsuggestswill


53 Ibid,206.

54 Glynn,R.(2014,0101).AnimatingArchitecture.(B.Sheil,Ed.)HighDefinition:ZeroToleranceinDesignandProduction,102.


56 Ibid,216.

Part 2 | 26

incorporatecombinedapproacheswhichnotonlyenhancethe

physicalenvironmentsurroundinghumanusers,butalsomaintains

approachesthataidinworkprocesses(seetable3,4and5).57 Due

tothecollectiveapproachof CIMSystems,functionalcategorization

isnotanidealapproachtodefiningitsspatialandmaterial

organizationimplications.Therefore,MichaelHensel’sconceptof

activeagencydomainsisabetterstrategy.Agencyasdescribedby

Hensel,definesthecapacityof aCIMtoactwithinfourarchitectural

domains(refertotable2.):58

1. localcommunities

2. bioticfactorsandinteractions

3. thelocalphysicalenvironments:abioticprocesses

4. thespatialandmaterialorganizationcomplex.

Thefirsttwodomains,spatialandmaterialorganization

complexarecombinedtomakeupthephysicalmanifestationof

theCIMsystemmodel.Assuch,allcomponentswhichmakeup

collectivelyintelligentmaterialsystemsincludinghardwareand

softwaredelineatethemselvesasactuators-intelligentbuilding

system,transducers-Arduinomicrocontrollers,andsensors–CIM

systemfaçademodules(seefig.13).Thephysicalcomponentsof

thesystemallowthespatialandmaterialcomplextointeractwiththe

thirddomain–thelocalenvironment.59

57 Ibid.

58 Hensel,M.(2013).Perfromance-OrientedArchitecture:RethikingArchitecturalDesignandtheBuiltEnviorment.(M.Swift,Ed.)Chichester,WS,UK:JohnWiley&SonsLtd,55.

59 Ibid.

Part 2 | 27

ThelocalenvironmentswhichtheCIMsystemconcerns

itself with,wasexplainedearlierinthe‘approachingour

environments’chapter.Localenvironments,of theproposedCIM

system,facilitatethemajorenvironmentalinputsof thesolaractivity

whichmodulatetemperateandlightexposure.Thegoalof theCIM

systemistoactivelymediatetheeffectsof thelocalenvironment

uponthebuildingbeforetheycandirectlyinteractwiththespatialor

materialcomplexandsimultaneouslycommunicatethestateof the

localenvironmenttoanintelligentbuildingsystem.

Lastly,thedomainof localcommunitiesiseffectedbythe

localenvironmentcontrolledbytheCIMsystem.Henseldescribes

thisprocessaseithersupportingordiminishinglocalecosystems

andculturalpatterns.60Ultimatelythegoalof creatingsucha

complexarchitecturalmaterialsystemistobenefitthisdomain,

thereforeasRuairiGlynnaffirms,“thekeyroleinthescenariowillbe

to‘closetheloop’–designingtheformsof actuationthatfeedback

intothebuiltenvironment”.61

60 Ibid.


Part 2 | 28

“Holist ic approaches are good at dealing with well-defined domains such as room temperature and l ight levels but not so good at dealing with unpredictable domains l ike human behaviour” - Ruairi Glynn

right//

Conceptualimagepresenting

the‘self’maskedbythe

complexyof informationand

lodgic.

fig.15

Part 2 | 29

Part 2 | 30

top//

Currentapproachestousing

smartmaterialsinmakingsmark

enviromentsviaenhanced

mechatronic,constitutiveIand

IImodels.

middle//

Currentapprochestomaking

intellegntenviormentsusing

mico-controllers,actuators,

sensorsandtransducers.

bottom//

Furture(proposed)approach

usingacombinationof smart

materialsandcurrentintellegent

enviormentapproaches.Atifical

intellegenceusescontextto

defineresultingenviorment

table.3

table.4

table.5

Collectivelyintelligentmaterialsystemsrequirecomponents

whichcanconvertenergyfromonetypeof energytoanother.Like

smartmaterials,conversionisfacilitatedthroughaninputof stimuli

whichisnotnecessarilyenvironmental.Alternatively,inputcould

beproducedthroughdirectlyconnectingmaterialstogether(one

materialaugmentinganother).InCIMsystem,environmentalinputs

arefirstreceivedbyeithertransducercomponentsorsensorsand

thensent,receivedandconvertedbyactuators.

Part 2 | 31

Sensors, Actuators

and Transducers

right//

DiagramsummarizingCIM

systempanelcomponents

fig.16

Producersof micro-controllers,suchasScottFitzgerald

of Arduinodefinethefirstsetof components(i.e.transducers)

as,“devicesthatconvertvariationsinphysicalquantity,suchas

pressureorbrightness,intoanelectricalsignal,orviceversa”.62The

initialiterationsof theproposedCIMSfaçadeusestheArduinoitself

asakindof complextransducer;convertinganalogueinputfrom

theCIMsystemmodulestoaformwhichcanbeinterpretedbyan

intelligentbuildingsystem.Sensors,definedascomponentswhich

convertotherformsof energyintoelectricalenergyareusedbythe

Arduinotogainanunderstandingof theenvironmentalconditions.63

Thesensorsusedintheinitialiterationsfocusonconverting

environmentalconditionsof movementandheatintoananalogue

signal;intheinitialiteration,thisanaloguesignalisaconsistentDC

currentwhichisaugmentedbasedonthenumberof stimulated

CIMsystemmodules.Finally,theactuators,definedascomponents

whichconvertelectricalenergyintootherformsof energy,usethe

digitalinformationconvertedbytheArduinotoaugmentarchitectural

environmentsintelligently.64Theactuatorinintelligentarchitectural

environmentsmightbeasGlynndescribesas,“machinelearning

algorithmsrunningonremoteserverscollectingandmakingsense

of thesecomplexinterconnections”.65Ultimately,theinformation

providedbytheCIMSmodules(effectivelytheexteriorfaçade

system),encompassesallthreetypesof components.

62 Fitzgerald,S.,&Shiloh,M.(2015).ArduionoProjectsBook(3ed.).(T.Igoe,Ed.)Torino,Italy:ArduinoSrl,21.

63 Ibid.

64 Ibid.


Part 2 | 32

CIM system

design concept

TBSubstrate//

Preliminarydesignincorporates

ironnickelalloyontopactive

surface(facingtoexterior).

Resistivesilkscreenedcircuit//

Identifiespanelinmoduleas

havingauniqueresistance

ratingthroughalteringthelength

of printedwire.

ConductiveSub-Structure//

Contactsarelocatedbelow

eachbimetallicsubstrate.

Whenstripbendstotheclosed

positioncoppertheresistive

circuitscontactinparallelwith

theconductivesub-structure.

Thisinturn,increasesthe

overallresistanceinthesystem

whichisrelayedbacktothe

microcontroller.

Adhesivelayer//

BondstheCIMScomponents

together.ThisAdhesivelayeris

halftonedtoallowforexpansion

of substrate.

Fasteners//

SingleCIMsystemcomponents

areboltedtotheconductivesub

structuretomakeCIMsystem

modules.

Part 2 | 33

fig.17

fig.18

1.

2.

3.

4.

5.

bottom//

CIMsystemcompositepanels

Iteration2.

CIMsystemmodule//

CIMsystemcomponentsbend

basedonheatgenerated

throughsolarintensity.Modules

aremadeupof severalCIM

systemcomponentswhichare

thencoupledtoformlarger

arrays.

Part 2 | 34

fig.19

fig.20

CIMsystemarray:

Arraysareconceivedtomake

upthesensorcomponent

of aCIMsystem.These

sensingarrayarefastenedto

facadesusingtheconductive

substructure.Asthesun

exposure(environmental

conditions)changesthearrayis

abletoactuate,senseandrelay

itsprogrammedinterpretationof

theenvironmentalconditions.

Part 2 | 35

fig.22

fig.21

Smartmaterialpropertiesof thermostaticbi-metals,are

usedinthemakingof thesubstratesastheactivecomponentwithin

theCIMsystemmodules.Theactivecomponentservesasthe

elementswhichdirectlyinteractwiththelocalenvironment.Using

thebendingactuationof thebimetallicmaterials,alogiciscreated

intwoways.Thefirstisthebendingindicatingthatthematerialis

receivingthermalsimulation.

IntheCIMsystemproposedthiswouldoccurduetothe

varianceinsolaractivitythroughouttheday.Secondlythebending

Part 2 | 36

Making substrates

right//

Firstsensoriterationwithcircuit

layeringmethod

fig.23

isusedtoelectricallycontactthesubgridstructureasproposed

inthefirstdesigniteration(seefig.13,14and15).Additionally,the

thermostaticbi-metallayerisconceivedtopassivelyactasasun

shadingdeviceregardlessif thesystemisengaged.Thisstrategy

byitself isexemplaryof currentsmartenvironmentalapproaches

(seetable5.).

Printedcopperconductivecircuits,makeupthesensors/

communicationstrategyof thesubstrates.Thesubstraterequires

Part 2 | 37

right//

Conceptrenderingof CIM

systempanelonUrbandale

SolarResearchCenter

fig.24

thesecircuitstosensethebendingactuationof thethermostatic

bi-metalliccomponent.Theproposedsensorsusethedetection

strategyof resistancecircuitstogaugetheproximityanddegreeof

actuationof eachCIMsystemmodule.Theinitialsensoriterations

weremodeledoff of beatfrequencyoscillationsensors(see.fig.

17),acommontechnologyusedinconsumermetaldetectors.This

methodhadtheadditionalbenefitof notonlycommunicatingif the

moduleisopenorclosed(binary)butalsocommunicatingarange

of actuation(analogue).66Whilethisstrategywasthefirsttobe

explored,itwasimpracticaltoproducethistypeof sensorwiththe

toolsathand.ThereforethefinalCIMsystemprototypewillnotuse

thisparticularmethod.

66 Kroschwitz,J.(1992).Encylopediaof ChemicalTechnology.NewYork,NY,USA:JohnWiely&Sons.

Part 2 | 38 Part 2 | 38

right//

Usingadigitalmultimetertotake

resistancemeasuremntof athe

firstbeatfrequecnyocillation

sensoriteration.

fig.25

TheCIMsystemwhichthisthesisproposes,employsthe

processof opticallithographytocreatetwointegralcomponents

Part 2 | 39

right//

Waterbasedcoatingcontaining

tarnishreistantcopperparticles

forsuperiorcondiuctivity.

SeeAppendixBforproduct

specifications

. fig.26

.

of theCIMsystem.Thefirstaretheconductivetraceswhichallow

electricalsignalstobetransferredfromthesensorstothemicro-

controller;thesecondarethesensorsthemselves.

AsdefinedbytheSocietyof Photo-opticalInstrumentation

Engineers,“opticallithographyisaphotographicprocessby

whichalightsensitivepolymercalledaphoto-resist,isexposed

anddevelopedtoform3drelief imagesonthesubstrate”.67This

developedsubstrate(seefig.13-15)canthenbeusedtoprintthe

intendeddesignorpattern.Boththesensorsandtheelectrical

tracesarerequiredtobeelectricallyconductiveonceprintedand

cured,thereforeconductiveinksmustbeusedastheprinting

medium.Sincethesmartmaterial,whichthepatternisbeingprinted

ontoisaconductivesubstrate(thermostatic-bimetal),patternsfor

insulationmasksmustalsobemanufacturedtoprintinsulation

layers.Theinsulationlayersareprintedusingawaterbasedink,

whichprovidesnotonlyasurfacethatpreventsshortcircuiting

betweenelectricalcomponentsbutalsoallowsthedesignof the

sensorsandtracestobelayered.Thismethodof opticallithography,

developedin1940byOscarSuB68,alsofacilitatesanefficient

printedcircuitdesignandisintegraltothesensorsfunctionality.The

inksarealsobothwaterbasedsoproperadhesionbetweenlayers

mayoccur.

Thefollowingmanufacturingprocessoutlinesageneral

overviewof thespecificmethodof opticallithographyusedin

67 Mack,C.A.(2006).Feildguidetoopticallithography(Vol.FG06).Bellingham,WA,USA:Spie,2.

68 Wilson,C.G.,Dammel,R.R.,&Reiser,A.(1997).Photoresistmaterials:ahistoricalperspec-tive.AdvancesinResistTechnologyandProcessingXIV.3049.SantaClara:SPIE,32.

Part 2 | 40

Optical lithography

thisthesis.Althoughthefunctionallyof theconductivetraces

andsensorswithintheCIMsystemsaredifferent,theprocess

formanufacturingeitherareessentiallythesame.Therefore,the

followingdescribesthemanufacturingof thesensorcomponent,

asitistechnicallymorecomplicatedandisoneof thefunctional

componentswithinthefinalCIMsystemdesign.

Thefirststepinmanufacturingthesensingcomponents

withintheCIMsystemisbuildingthesilkscreenframetoactasthe

Part 2 | 41

right//

Screenprintframewithsensors

designsmadewithlight

sensitiveemulsion.

.

fig.27

.

photo-resistsubstrate.Thisisdonebyfirstselectinganappropriate

mesh;coarseforprintingthickerinsulationlayers,fineforprinting

detailedelectricalcomponents.Themeshmustthenbestretched

overtheframeandalayerof sensitizedphotoresistapplied.The

photoresististhenlefttodryinlowlightconditions(approx.3

hours).Oncedrythepreppedframeismovedtoanexposuretable

whereafilmpositiveof theintendeddesign(i.e.electricaltraces

andsensors)isplacedovertheareatobedeveloped.Ahigh

intensityUVlamp(approx.800W)isusedtoexposetheframefor

twelveandahalf (12.5)minutes.Thiscurestheexposedphoto-

resist(notcoveredbythefilmpositive).Theframeisthensoaked

inawaterbathandthenahigh-pressurejetof waterisusedto

expungeanyremainingunexposedphotoresist.Thefinalframe,

alsoknownasasilkscreen,isthenlefttocompletelydryunderthe

exposurelamp,inastepcalledpostbaking.Postbakinghardens

theremainingphotoresistandreadiestheframeforitsfirstuse.

Thenextstepalignsthevariousscreenprintframeswithone

another.Ajigisbuiltusingproprietaryclampinghinges,whichnot

onlyalignallthelayerstobeprintedbutalsoallowsthesilkscreens

tobeswappedoutefficiently.Thejig,whichisbuiltinthisthesis,

utilizesasetof slotswhicharepre-milledoutof theplywoodframes

usingaCNCmill.Boltsarethreadedthroughtheseslotsand

tightenedoncethedesiredalignmentisachieved.

Thefinalstepbeforeprintingcanoccuristheloadingof

thescreen.Thisiskeytoproducingprintswhichhaveaneven

thicknessandcrisptransfer.Inkisplacedwithinthesilkscreen

framebutoutsideof theprintingarea.Alight,evenpasswitha

Part 2 | 42

silkscreensqueegeeloadstheprintareawithink.Theprintisthen

alignedontothebimetallicsubstrate,andtheinkisforcedthrough

theuncoveredscenebyasinglefirmpass.Thisappliedsensor

designisthencuredontothesubstratethroughdryingandthen

subsequentbakingat170˚C.Thislaststepiscrucial,especiallyfor

theconductiveink,asthespacebetweencopperparticlesshrinks

asheatisapplied.Thusreducingtheoverallelectricalresistanceof

thecureddesignandvulcanizesthebindertoincreaselong-term

durability.

Part 2 | 43

fig.28

.

fig.29

.

top//

220threadper-inchmesh

(curcuitdetails)

bottom//

100threadper-inchmesh

(masking)

.

Adhesivelayerappearsasafiftypercenthalftone,patternfill,(top

of fig.xx).Thebaseshieldinglayer,appliedasabaseoverthe

bimetallicsubstratebeforethecoillayerisapplied.(bottomof fig.

xx).

Part 2 | 44

Sensor iteration 1.

fig.30

.

Masksnecessaryforthefirst

sensoriteration.

Refertofig.28fig.29andfig.30

Thecoillayersweredesignedsothatthepointsof contactwould

overlaptoallowconsecutivelayering.Bothlayerswinedinthe

samedirectiontoincreasethesensorsstrengthasmorelayersare

applied.

Part 2 | 45

fig.31

.

Thecoilshielinglayerisappliedbetweenalternatingcoillayers.

Appearingontherighttemplateisaminiaturearrayof coils,its

purposewastotestthelimitationsof scaleandprintingresolution.

1.UnexposedSilkscreenFrame13”x19”–220threadperinchpolyesterfabric

screenstretchedoverCNCmilledplywoodframecompletewithdriedsensitized

Part 2 | 46

fig.32

.

emulsion.

2.VacuumUnit16”x24”bedsize-vacuumpumpfacilitatesevenclampingpressureusing1/8”acrylicsheet.

3.AcrylicSheet16”x24”–appliespressuretopositivefilm,flatteningthedesigntounexposedsilkscreenframe.

(requiredtomakepositivecontact)

4.FilmPositiveCircuitDesign–Printedusingtwo(2)8.5”x11”inkjettransparencyfilm.

5.SafetyUVglasses–UVglassesfilterhighintensitylightfromhalogenlampduringexposure.

6.HalogenExposureLamp800w–Exposurelampisplacedapproximately30”fromfilmsurface.Exposurelampis

controlledbyenlarginglamptimer.

7.EnlargingLampTimer–Usedtocontrolexposuretime(approximately12.5minutes).Timerisconnectedtohousehold

powerandthenoutputstoexposinglamp.

8.AlternativeFilmPositiveDesigns–includeselectricalshieldinglayers(insulation),wiringleaddesigns,adhesivelayer

andsmallscalesensorarraytest.

9.EmulsionApplicator–usedtoevenlyapplysensitizedemulsiontostretchedsilkscreenframe.

Micro-controllerssuchastheArduinoplatformarecommonlyassociatedtotheInternet

Part 2 | 47

fig.33

.

Exposure Process

of Things(IoT)movementwhichwasfirstestablishedbytheGlobal

StandardsInitiativeinJulyof 2012.69DefinedbytheEncyclopedia

of ElectronicEngineeringasasingleintegratedcircuitwhichis

dedicatedtoperformonetaskandexecuteonespecificapplication,

theycontainmemory,programmableinput/outputperipheralsaswell

aprocessor.70

IntheproposedCIMsystem,theArduinomicro-controllerisused

asatransducertoreceiveandtransmitanaloguesignalsfromthe

CIMsystemmodules.Thedesignof theArduinoisconceivedintwo

parts;oneasthetransmittingmodule(fig.34,fig.35,fig.36,fig.37)

andtheotherasthereceivermodule(fig.38,fig.39,fig.40,fig.41,

fig.42).

69 ITUT.(2012,July04).NEWITUSTANDARDSDEFINETHEINTERNETOFTHINGSANDPROVIDETHEBLUEPRINTSFORITSDEVELOPMENT.Retrievedfromitunewslog:http://newslog.itu.int/archives/245

70 Webster,J.G.(1999).WileyEncyclopediaof electricalandelectronicengineering.NewYork:JohnWileyandSons.

Part 2 | 48

Micro-controllers

“Through the coupling of high definit ion sensing and actuation, space wil l become ever more animate, perceptively processing a l i fe of i ts own, populated with agency, in constant conversation with its sur roundings” - Ruairi Glynn

above//

ArduinoUnoR3MicroController

PlanView

fig.34

Thetransmittingmoduleistaskedwithconvertingthe

analoguesignalof theCIMsystemmodulesintoadigitalsignal

whichisthentransmittedoveraproprietaryradiofrequency

transmitter.ThistransmitterallowstheArduinotocommunicate

wirelessly,limitingtheneedtopenetratethebuildingenvelopeand

allowingforexpandability.

Part 2 | 49

fig.35

.

fig.36

.

top//

Finaltransmittingmoduleinside

waterproof housing.Basemicro-

controllerisanArduinoUnoR3

withMicrobread-boardand9v

powersupply.

bottom//

Transmittingmoduleinsidewhen

housingisclosed

Part 2 | 50

top//

Finalreceivingmoduleinside


controllerisanArduinoMega

2556R3withbread-board.

RFreceiverenableswireless

communicationbetween

devices.SDcardmodule

enablesdatatobewrittento

file.LCDScreenbuttonsand

switchesaremountedtothe

exteriorof thecaseforeaseof

use.

bottom//

Receivingmoduleinsidewhen

housingisclosed

fig.37

.

fig.38

.

Part 2 | 51

right//












use.

fig.39

.

Part 2 | 52

fig.40

.

1500mAhrechargeablebatterypack-Batterylifeof

approximately60hourswhencontinuouslyactive.

ArduinoUnoR3-Estimatedbatterylifeisbaseduponan

activestateandthereforedoesnotreflectdurationof sleep

modebetweenloggingintervals.If sleepmodeisenabled,

expectedbatterylifeincreasestoapproximately7500

stand-byhours.If loggingintervalsaresettoevery10mins

@a1minutetransmittingperiodthistranslatesintothe

moduletransmitting6timesin1hourorabouta1:9active

tostandbyratio.TheArduinoUnoR3hasanactivemA

drawof around25mAandastandbymAdrawof around

0.2mA.Conservatively,theestimationof batterylifewould

bearound47days.

MaletoFemaleDCadapter-Usedtorerouteandcompact

powercablemanagment.

CIMPanelInputconnector-Constructedfromamodified

femaleDCconnector.Weatherproofsconnectionbetween

panelandtransmitter.Environmentalseparationisessential

toensuredurabilityof electroniccomponents.

Radiofrequencytransmitter433mHz-usedtosendRF

signalstoCIMreceivermodule.Rangeislimitedtowithin

thehousehoweverthelackdirectwiringpreventbuilding

envelopepenetrations.Thisistheessentialcomponent

whichallowsthesystemtooperatewirelessly.

InsulatingFoam-Insulationisprovidedaroundall

electroniccomponentstoprovidecushioningaroundall

sensitivecomponents.Thisinsulationalsoprovidessome

thermalprotectionwheninoperation.

MaletoMaleDCadaptercable-connectsCIMSystem

paneltoTransmittingModule

USBTypeBtoTypeAconnector-Allowstransmittercode

tobeupdated/modified.

1

2

3

4

5

6

7

8

right//

TransmittingModuleSchematic

Diagram

CIM System Transmitting Module

Thereceivermoduleisusedtorelaythedigitalsignalto

astoragedevicewhichlogstheinformationinaformwhichcan

bereadbyanintelligentbuildingsystem.Throughthisdesign,

informationisorganizedbaseduponmodulelocation,degreeof

smartmaterialsubstrateresponseandtime/date

einwhichthedataisassociated,unifyingtheembeddedlogicin

theCIMsystemmoduleswiththeintelligentbuildingsystem.

Part 2 | 53

fig.42

.

fig.41

.

top//












use.

bottom//


housingisclosed

Part 2 | 54 Part 2 | 54

top//


waterproof housing.Base

microcontrollerisanArduino

Mega2556R3withbread-

board.RFreceiverenavbles

wirelesscommunication

betweendevices.SDcard

moduleenablesdatatobe

writtentofile.LCDSceen

buttonsandswitchesare

mountedtotheexteriorof the

caseforeaseof use.

bottom//


housingisclosed

fig.43

.

fig.44

.

Part 2 | 55 Part 2 | 55

right//


waterproof housing.Base

microcontrollerisanArduino

Mega2556R3withbread-

board.RFreceiverenavbles

wirelesscommunication

betweendevices.SDcard

moduleenablesdatatobe

writtentofile.LCDSceen

buttonsandswitchesare

mountedtotheexteriorof the

caseforeaseof use.

fig.45

.

fig.46

.

Radiofrequencyreceiver433mHz-usedtoreceiveRF

signalsfromCIMsystemtransmittingmodule.Thisisthe

essentialcomponentwhichallowsthesystemtooperate

wirelessly.

SDCardShield-devicewhichpermitsdatastoragevia

SDcards.Arduinostorespaneldataviathiscomponent.

SDCard-storesloggedpaneldatatobeusedby

intelligentsystemwithinSolarResearchCenter

InsulatingFoam

Toggleon/off switchandexternalbuttons-allowsuser

tooperateCIMSystemReceiverModulewhileunitis

closedwithincase.

ACtoDCpowerconverter-convertshouseholdAC

powertoDC.ArduinoMegarequireshouseholdpowerto

belimitedto7-12VDC@1Amperesmax.

1

2

3

4

5

6

7

8

9

10

11

12

right//

ReceivingModuleSchematic

Diagram

9vDCmalejack-powersmodulewhileseparatinginput

plugfrommoduleitself incaseof servicing.

9vDCfemalejack-routesDCpowertoexternalon/off

toggleswitch

ArduinoMega2560-TheMega2560isamicrocontroller

boardbasedontheATmega2560.Ithas54digital

input/outputpins,16analoginputs,aUSBconnection,

apowerjack,andaresetbutton.Thisversionof the

ArduinoMegawasrequiredtoholdamoreextensive

codeasthememorycapacityof theArduinoUnoR3

wasnosufficient.

PushbuttonswitchesandLCDShield-Usedtocontrol

functionsof CIMSystemReceiverModule.LCDdisplays

2linesof 16characters.

USBTypeBtoTypeAconnector-Allowsreceivercode

tobeupdated/modified.

USBTypeBtoTypeAconnector

MaletoFemaleDCadapter-Usedtorerouteand

compactpowercablemanagmentfromtoggleon/off

switchtoArduinoMegaDCin.

CIM System Receiving Module

Part 2 | 56

Thisgraphicviewof theproposedArduinoUNObasedschematicdiagram,illustrates

thehardwarecomponentsof theradiofrequencytransmitterandreceiver.Theupper

ArduinomoduleismadeusinganArduinoUNOR3fittedtoabreadboard(used

toprototypecircuits)andaradiofrequencytransmitterwithsomeaccompanying

passivecomponents.Whilebothmodulesarepoweredinthisfirstiterationbya

9vbattery,thefinaliterationswillpushtomakeafullysolarpowereddesign.The

lowerreceivermoduleusesanArduinoMegawithmoreperipheralpins.Thisisto

accommodatetheliquidcrystaldisplay(LCD),aradiofrequencyreceiverandan

assortmentof passivecomponents.

doubleThermistor(intRawADC){doubleThermistor(intRawADC){doubleTemp;Temp=log(((10240000/RawADC)-10000));Temp=1/(0.001129148+(0.000234125*Temp)+(0.0000000876741*Temp*Temp*Temp));

Part 2 | 57

Wiring Schematic

Design

Receiver and

Transmitter

right//

ThedesignfortheTransmitter

andReceivermodulehas

beenadaptedfromseveral

opensourceprojectsbyAlex

StrandburgandScottFitzgerald.fig.47

.

fig.48

.

Userinterfaceof computer-usedtomanipulatecode,

connectcomponentsandconnectuserwiththedevice.

ComputerDisplay

Variousdatastreams-inthecaseof theArduinoinformation

issentviaUSBconnections.SincebothAtmegachipsonthe

ArduinotakeserialinputstheUSBsignalisconvertedbythe

proprietaryArduinoprogrammer.

USBdataoutputtointerface

SDcardinput/output-datafromSDcardisloadedonto

computertothenbesenttointelligentbuildingmanagement

software.ProprietarysoftwareforintelligentHVACwithinSolar

ResearchCentermodifiesHVACfunctionality.

1

2

3

4

5

below//

CIMSystemNetworkDiagram

Part 2 | 58

CIM System Network

fig.49

.

USBdatainputtointerface

Interface-CodinghappenswithintheCprogramming

language.Thislanguagecanbeinterpretedbythe

Arduino,andmorespecificallybytheAtmegachips,

intofunctionswhichthemodulesthenperform.

ArduinoCodingEnvironment-Codecontrolsall

functionalityandtellsArduinohowtotakeinandsend

informationtoothercomponents.Thisisessential

whatthesoftwarelookslike.

Compiler/WarningMessageList-Thisareaof the

interfacedisplaysanyerrormessagesorconflicts

withinthecodeonceverifiedbythecompiler.The

Arduinocompilerautomaticallychecksthatthe

programrunsandif notitwillsendbackanerror

messageinstructingthecoderhowtoaddressany

conflict.

ConnectionType-identifieswhichArduinoispluggedin

and/orassociatedwiththecode.Thisareaalsoshows

whichCOMchannelissendingthedata(thisisavirtual

serialoutputcreatedtosendcodeviaUSB)

LineNumber-indicateswhichlineyouarecurrently

editingwithinthecode

1

2

3

4

5

6

7

below//

CIMSystemInterfaceDiagram

Part 2 | 59

CIM System Interface

Temp=Temp-273.15; returnTemp;}

voidprintTemp(void){ doublefT; doublet=Thermistor(analogRead(15));fT=(t*1.8)+32.0;lcd.setCursor(0,1); if(unit==CELSIUS){lcd.print(t);lcd.write((char)223);lcd.print(“C“); } elseif (unit==FAHRENHEIT){lcd.print(fT);lcd.write((char)223);lcd.print(“F“); } elseif (unit==BOTHUNITS){lcd.print(fT);lcd.write((char)223);lcd.print(“F“);lcd.print(t);lcd.write((char)223);lcd.print(“C“); } elseif (unit==BOTHUNITS2){lcd.print(t);lcd.write((char)223);lcd.print(“C“);lcd.print(fT);lcd.write((char)223);lcd.print(“F“); }

Part 2 | 60

Code Sample

Calculating and

writing temperature

from sensor data

TheabovecodeistakenfromtheprogramwrittenintheCprogramming

languageforthereceivermodule.Thispartof thecodeisessentialinconvertingthe

electricalsignalfromthesensorsinthepaneltoatemperaturevaluewhichcanbe

printedtotheLCDorloggedtotheSDcardmodule.Thestepsareasfollows.

Step1.Calculatetemperaturefromanalogueinputpin53

Step2.ConverttemperatrurefromKelvintoCelcius

Step3.Printthecalculatedtemperatureif inCelciustoLCD

Step4.Orprintcalculatedtemperatureif inFahrenheittoLCD

Step5.Orprintcalculatedtemperatureif inbothunits(Fahrenheitfirst)

Step6.Orprintcalculatedtemperatureif inbothunits(Celciusfirst)

Step1.

Step2.Structure//

anargumentwhcihisdefinedby

astatment.

Variables//

aplaceholderforavalue.

Functions//

agroupof statementsthat

togetherperformatask

Step3.

Step4.

Step5.

Step6.

fig.50

.

fig.51

.

USBConnectiontoComputer-DatafromSDcardis

displayedbycomputerforviewingpurposes.Note

thattheinformationwouldnotrequireviewingtobe

readbyanintelligentbuildingmanagementsystem

CSVFile-CommaSeparatedValuesFileisa

standardfiletypewhichcanbereadbyprograms

suchasMicrosoftExcelandtheCprogramming

language.

Values-Valuesareseparatedbydateandthenpanel

number

1

2

3

right//

OutputfileDiagram

Part 2 | 61

CIM System Interface

Conclusion | 62

“Today, the design of material al lows performance and negotiation to be located directly in the organization of a material substructure, rather than through the interface of discreet elements in component assemblies” - Paul Nicholas

Applying CIM system

methodology

Conclusion 04 |

Theproposalof aCIMsystemchallengestheconventional

wayinwhicharchitectsandsmartmaterialsrelatetoconventional

architecture.Theinitialquestionposedbythisthesisasks,howcan

smartmaterialsbeusedbyarchitectswithinarchitecturetocreate

thebespokearchitecturalenvironmentsdesiredbyanerawhich

lookstobecomemoreinterconnected,adaptiveandinformation

rich?Inaddressingthisquestionthethesisalsotoucheduponthe

natureof smartmaterialsandtheirimplicationsintermsof truly

intelligentarchitecturalfaçadesystems.Smartmaterials,asthis

thesisconcludes,arepositionedbetweentheworldof optimization

–characteristicof theprofessions;scienceandengineering–

andderivingexperienceandengagementwiththeenvironment

–wheretheprofessionof architecturespecializes.Assuch,a

multidisciplinaryapproachisnecessarytofacilitatebothnecessary

facetsof aCIMsystem,thetechnicalandtheexperiential.Further,

thetermsmartmaterialaspresentlyusedprovidesnorealsolutions

toaddressthisdisparity.Althoughthetermitself suggestsa

physicalmaterialwhichcouldbeideallymanipulatedbythe

architect,itsformisdirectlyrelatedtothefinalfunctionally-andan

Conclusion | 63

intentiontobeintelligent.Thislimitstheintricacyandcomplexity

necessarytoprovideamaterialwhichistrulyintelligent.Theonly

courseof actionasreiteratedbyAddingtonandHenselisforthe

architecttousesmartmaterialsasacomponentwithinagreater

system.ThissystemasthisthesisproposesistermedaCollectively

IntelligentMaterialsystem,whichincorporatesthebenefitof the

smartmaterial’sabilitytoengagewiththespecificlocalenvironment.

fig.52

.

right//

CIMsystemmock-upactuating

toheatgain.Imageontheleft

illustratesclosed,coldcondition

incontrasttoopen,warming

condition.Panelswereexcited

usingheatgunattypical

operatingtemperature.

Conclusion | 64

While,theaimistoprovideasinglesolutiontoaddress

thequestionposed,thecourseof researchrequiresexpertisein

multiplefields.Inparticular,thesolutionrequiresthedevelopment

of skillsandknowledgeof computersciencewhichaidein

developingCprogrammingcodeandbuildingafunctioningCIM

systemprototype.Furtherknowledgeinthefieldsof mechanical

engineeringandchemicalengineeringarerequiredtofullygrasp

thepropertiesof multiplematerialtypologiesincludingthermostatic

bimetals,materialcompositesandconventionalbuildingmaterials.

Allthreetypologiesarerequiredduetotheapplicationof theCIM

systemuponanexistingstructure,therebyrequiringaprecise

understandingof conventionalmaterialuses(walldetails,etc.).

Facadeswhichusethermostaticbimetalsasthesensingcomponent

alsorequireafullunderstandingof solarorientationandmaterial

heatgainproperties.Thisisrequiredbeforeasystemcanbe

designedasitsfunctionalitywilldependonwhichenvironmental

factorisbeingexploited(heatgain,radiation,weather).

fig.53

.

right//

CIMsystemproposedlocation

onsouthfacadeof Urbandale

CenterforHomeEnergy

Research

Throughcombiningapproachesthefutureapplicationof

CIMsystemsisexponentiallydiverse.Alternativeenvironmental

factorsinwhichmaterialscanrespondwillundoubtedlydevelop

thisdiversity.Aswell,thewayinwhichdataprocessingdevelops

infutureiterationsof aCIMsystemwillallowinterior(controlled)

environmentstorespondathigherlevelsof accuracyandfulfilla

moreaccuratedefinitionof intelligence.Onesuchmethodof data

processingknownasneuralnetworking,developedbythefieldof

cognitivescience,proposesdataprocessingwhichmimicsthat

of thehumanbrain.Asdefinedearliertheanthropicperspective

of smartlendsthatif CIMsystemsweretoincludeaprofession

whichweretospecializeinthehumanmind,onecouldtheoretically

produceanidealintelligentmaterial;onethatmightblurtheline

betweenbioticandinanimate.

Further,theprojectproposedaCIMsystemprimarily

appliedtothebuildingfacadeandenvelopecomponents.Such,

anapproachlimitsthescopeof applicationtothatof surfaces.As

discussedearlierinthethesis,AddintonbelievesthatArchitecture

Beyond the Surface(Post Script)

fig.54

.

Conclusion | 65

Conclusion | 66

isdescribedprimarilythroughsurface.While,thispointprompted

thethesistofocusonredefiningsurface,CIMsystemsinthis

thesisdidnotcovertheirapplicationinareasof architecturewhich

cannotbedescribedbysurface.Itcouldbefurtherarguedthat

architecturehasspatialcomponents,solids,voidsandotherartifacts

whichdidnotfallunderthescopeof thisthesis.Itwouldtherefore

beinterestingtofurtherresearchthewaysinwhichCollectively

IntelligentMaterialscouldbeappliedtotheseothercomponents

whichmakeuparchitecture.Questionssuchas,howdoesa

CollectivelyIntelligentMaterialsystemdifferwhenvoidsarethe

objectof application?

Suchquestionswoulddrivetowardsamore

thoroughinquiryonthenatureof whatconstitutesarchitectural

materials.Vitruviusmentionedtheuseof physicalmaterialsinhis

treatisewhichadoptsadefinitionof materialsastactileandreal.

However,whenmaterial,andcomponentsinmaterialsminiaturize

itisespeciallylimitingtousesuchasdefinitionasourperceptions

withinhumanbodiescanonlydiscernmaterialfromnomaterial

whenweexhaustwhatoursenseswillallow.Forexample,applying

materialswithinvoidswouldrequireimperceptibility-visual,tactile

andauditory.Thereforeamaterialwouldeitherhavetobemadeas

aconglomerateof micromaterialormaterialswouldberequiredto

actuateandtransduceenvironmentalstimulifromadistance(solid

space).

Thefurthereffectsof integratingprogrammedand

intelligentlyresponsivematerialwithinvoidsconstitutesarchitecture

whichisnotobviouslyintelligent.Spaceswithinarchitecturewould

Conclusion | 67

thenbecomeawareof occupantswithouttheoccupantsbeing

awareof thearchitecture(if voidasarchitecturalcomponentwas

tobecomeaCIM).Thisisnotovertlyabsurdasdatafromonline

usageistrackeddailyandusedbyInternetServiceProvides

(ISPs)tointelligently“watch”theuser.Thissamestrategycouldbe

employedbydesignersof intelligentenvironments.Ratherthan

simplywatchingtheuser,architecturecoulduseCIMtoaugment

itsphysicalaspectsandadjustparameterssuchasbuildingform,

spatialconstructs,environmentalsystemsandoccupantwork-flows.

Additionallytheembeddedsensors,transducersandactuators

withinmaterialscouldbeseamlesslyusedbyoccupantstodirect

architecturalfunctionality.

Incontrasttothetechnicaladvantagesof futureCIM

speculation,thevisualimplicationof actuationanddependencyis

alsoafruitfulexploration.UsingtheproposedCIMsystempanel

constructionasanexample,facadesmadewiththisproposed

systemwould“blush”(revealunderlyingredrainscreen).This

blushingactionwouldproposearchitecturewhichpassively

communicatesabuilding’sresponsetooccupantsandenvironment.

Futureiterationsof CollectivelyIntelligentMaterialsystems

implyafundamentalshiftfromeffectinglocalizedenvironments

(singularstructures)toinfluencingglobal(multi-structures).Partially,

thisisspeculatedbecauseateveryiterationproposedwithinthis

thesismodularitywasessentialinfacilitatingaworkingsystem.

Throughaggregatinginformationfromdifferentsensornodes,much

likeif datawasgainedfrommultiplestructures,amoreaccurate

andsubsequentlyintelligentresponsecouldbeformulated.Inthe

Conclusion | 68

caseof theCIMsystempanel,installingsuchasystemuponmulti-

storystructuresyieldsamoreusefulsystemthanoneonasmaller

structuresuchastheUrbandaleCenterforHomeEnergyResearch.

Themainbenefitderivesfromthegreaterdiversityof functions

andprogrammingof spaceswithinlargermulti-storystructures.

Asanexamplethesystemcouldprovideheatgainanalyticsto

bestschedulemeetingsforidealoccupantcomfortandlighting

withinspecificworkspacesatspecifictimes.Algorithmsandfuture

artificialintelligenceswouldusetheseanalyticstopredictoccupant

usagewithinbuildingsandultimatelyprovideuserswithoptimized

environmentstoconductthemselveswithinarchitecture.

Appendices | 69

Appendices 05 |

Appendix A

Appendices | 70

Appendix B / C

Arduino Code for

receiver

//Librariesused#include<VirtualWire.h>#include<LiquidCrystal.h>#include<math.h>#include<stdlib.h>#include<TimeLib.h>#include<SD.h>

#include<TimerThree.h>

//UsedtowritesymbolstotheLCDmoreeasily#defineNO_SYMBOL-1#defineDEGREE_SYMBOL0#defineRIGHT_ARROW_SYMBOL1#defineUP_ARROW_SYMBOL2#defineDOWN_ARROW_SYMBOL3

//CustomsymbolsfortheLCDbytedegree[8]={B110,B1001,B1001,B110,B0,B0,B0,};byterightArrow[8]={B0,B1000,B1100,B1110,B1100,B1000,B0};byteupArrow[8]={B0,B0,B100,B1110,B11111,B0,B0,};bytedownArrow[8]={B0,B0,B11111,B1110,B100,B0,B0,};

#defineHELPTEXTSIZE29

//TextforinstructionsmenuStringhelpText[HELPTEXTSIZE]={“UPandDOWN:to”,“scroll,RT:Exit”,“ONMAINSCREEN:”,“LFT:Disp.temp”,“RT:Logging*SD”,“UP:Logging*PC”,“DWN:Log*Both”,“WHENDISP.TEMP”,“HOLD+RELEASE:”,“SEL:ChangeUnit”,“LFT:ToggleLight”,“RST:ChangeMode”,“WHENLOGGING:”,“HOLD+RELEASE:”,“SEL:ChangeUnit”,“LFT:ToggleLight”,“UP:*LOGRATE”,“DWN:*LOGRATE”,“RT:LogON/OFF”,“RST:ChangeMode”,“Usetransmitter”,“w/sensoror”,“connectsensor”,“toreceiver”,“Usearrowkeys”,“toenterdata,”,“pressRIGHT”,“whendone”,};

//WhetherornotsymbolsareusedlinebylineforthehelpsectioninthelpTextSpecialChars[HELPTEXTSIZE]={NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,RIGHT_ARROW_SYMBOL,RIGHT_ARROW_SYMBOL,RIGHT_ARROW_SYMBOL,NO_SYMBOL,

Appendices | 71

NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,UP_ARROW_SYMBOL,DOWN_ARROW_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,NO_SYMBOL,};inthelpPos=0;

//Whichmodeistheloggerin?#defineNOTSET0#defineDISPTEMP1#defineLOGSD2#defineLOGPC3#defineLOGBOTH4

intmode=NOTSET;booleansetupDone=false;

Stringtemp=“”;StringfTemp=“”;booleancheckingCelsius=true;

LiquidCrystallcd(8,9,4,5,6,7);intbackLight=10;

constintchipSelect=53;

#defineFAHRENHEIT0#defineCELSIUS1#defineBOTHUNITS2#defineBOTHUNITS23intunit=FAHRENHEIT;

unsignedlongreceiveFail=0;

unsignedlonganalogReadDelay=0;

//Loginterval#defineLOG1SEC0#defineLOG5SEC1#defineLOG10SEC2#defineLOG30SEC3#defineLOG1MIN4#defineLOG10MIN5#defineLOG30MIN6#defineLOG1HOUR7intlogInterval=-1;

//Logtimeinmillisecondform#defineTIME1SEC1000

#defineTIME5SEC5000#defineTIME10SEC10000#defineTIME30SEC30000#defineTIME1MIN60000#defineTIME10MIN600000#defineTIME30MIN1800000#defineTIME1HOUR3600000unsignedlonglogWait=TIME1SEC;unsignedlonglastLogged=0;

booleanlogOn=false;

booleansdInserted=false;

booleantimeIsSet=false;

intbackLightLevel=255;

//definesomevaluesusedbythepanelandbuttonsintlcd_key=0;intadc_key_in=0;#definebtnRIGHT0#definebtnUP1#definebtnDOWN2#definebtnLEFT3#definebtnSELECT4#definebtnNONE5

//readthebuttonsintread_LCD_buttons(){adc_key_in=analogRead(0);//readthevaluefromthesensor//mybuttonswhenreadarecenteredatthesevalies:0,144,329,504,741//weaddapprox50tothosevaluesandchecktoseeif wearecloseif (adc_key_in>1000)returnbtnNONE;//Wemakethisthe1stoptionforspeed

reasonssinceitwillbethemostlikelyresultif (adc_key_in<50)returnbtnRIGHT;if (adc_key_in<195)returnbtnUP;if (adc_key_in<380)returnbtnDOWN;if (adc_key_in<555)returnbtnLEFT;if (adc_key_in<790)returnbtnSELECT;returnbtnNONE;//whenallothersfail,returnthis...}

voidwaitUntilNoButtonPressed(){while(read_LCD_buttons()!=btnNONE);}

//Roundsdown(viaintermediaryintegerconversiontruncation)StringdoubleToString(doubleinput,intdecimalPlaces){if(decimalPlaces!=0){Stringstring=String((int)(input*pow(10,decimalPlaces)));if(abs(input)<1){if(input>0)string=“0”+string;elseif(input<0)string=string.substring(0,1)+”0”+string.substring(1); }returnstring.substring(0,string.length()-decimalPlaces)+”.”+string.sub-

string(string.length()-decimalPlaces); }else{returnString((int)input); }}

doubleThermistor(intRawADC){

Appendices | 72

doubleTemp;//Seehttp://en.wikipedia.org/wiki/Thermistorforexplanationof formulaTemp=log(((10240000/RawADC)-10000));Temp=1/(0.001129148+(0.000234125*Temp)+(0.0000000876741*Temp

*Temp*Temp));Temp=Temp-273.15;//ConvertKelvintoCelciusreturnTemp;}

voidprintTemp(void){doublefT;doublet=Thermistor(analogRead(15));//ReadsensorfT=(t*1.8)+32.0;//ConverttoUSAlcd.setCursor(0,1);if(unit==CELSIUS){lcd.print(t);lcd.write((char)223);lcd.print(“C“); }elseif (unit==FAHRENHEIT){lcd.print(fT);lcd.write((char)223);lcd.print(“F“); }elseif (unit==BOTHUNITS){lcd.print(fT);lcd.write((char)223);lcd.print(“F“);lcd.print(t);lcd.write((char)223);lcd.print(“C“); }elseif (unit==BOTHUNITS2){lcd.print(t);lcd.write((char)223);lcd.print(“C“);lcd.print(fT);lcd.write((char)223);lcd.print(“F“); }temp=doubleToString(t,2);fTemp=doubleToString(fT,2);}

//Checksif anybuttonsarepressedandactsaccordinglyvoidbackgroundButtonPressCheck(){intbutton=btnNONE;if (read_LCD_buttons()!=btnNONE)button=read_LCD_buttons();if (button!=btnNONE){if (button==btnSELECT&&millis()<(receiveFail+10000)&&mode!=NO-

TSET&&setupDone){//Changeunitsunit++;if(unit>BOTHUNITS2)unit=FAHRENHEIT;lcd.clear();waitUntilNoButtonPressed();if (sdInserted){FiledataFile=SD.open(“settings.txt”,FILE_WRITE);dataFile.seek(0);dataFile.print(unit);dataFile.close(); }lcd.setCursor(0,0);if (mode==DISPTEMP)lcd.print(“Temperatureis:”);else{lcd.print(“Log”);lcd.write(RIGHT_ARROW_SYMBOL);

if (mode==LOGPC)lcd.print(“PC:“);elseif (mode==LOGSD)lcd.print(“SD:“);elseif (mode==LOGBOTH)lcd.print(“Both:“);if (logOn){if (logInterval==LOG1SEC)lcd.print(“1sec”);elseif (logInterval==LOG5SEC)lcd.print(“5sec”);elseif (logInterval==LOG10SEC)lcd.print(“10sec”);elseif (logInterval==LOG30SEC)lcd.print(“30sec”);elseif (logInterval==LOG1MIN)lcd.print(“1min”);elseif (logInterval==LOG10MIN)lcd.print(“10min”);elseif (logInterval==LOG30MIN)lcd.print(“30min”);elseif (logInterval==LOG1HOUR)lcd.print(“1hr”); }else{if (mode==LOGBOTH)lcd.setCursor(9,0);lcd.print(“STOPPED”); } } }elseif (button==btnRIGHT&&mode!=NOTSET&&mode!=DISPTEMP&&mil-

lis()<(receiveFail+10000)&&setupDone){//Stop/Startlogginglcd.clear();waitUntilNoButtonPressed();lcd.print(“Log”);lcd.write(RIGHT_ARROW_SYMBOL);if (mode==LOGPC)lcd.print(“PC:“);elseif (mode==LOGSD)lcd.print(“SD:“);elseif (mode==LOGBOTH)lcd.print(“Both:“);if (logOn==false){if (logInterval==LOG1SEC)lcd.print(“1sec”);elseif (logInterval==LOG5SEC)lcd.print(“5sec”);elseif (logInterval==LOG10SEC)lcd.print(“10sec”);elseif (logInterval==LOG30SEC)lcd.print(“30sec”);elseif (logInterval==LOG1MIN)lcd.print(“1min”);elseif (logInterval==LOG10MIN)lcd.print(“10min”);elseif (logInterval==LOG30MIN)lcd.print(“30min”);elseif (logInterval==LOG1HOUR)lcd.print(“1hr”);logOn=true;lastLogged=millis(); }else{if (mode==LOGBOTH)lcd.setCursor(9,0);lcd.print(“STOPPED”);logOn=false; } }elseif (button!=btnSELECT&&button!=btnLEFT&&button!=btnRIGHT&&-

mode!=NOTSET&&mode!=DISPTEMP&&millis()<(receiveFail+10000)&&logOn){

//Increase/DecreaseLogRateintbutton=read_LCD_buttons();if (button==btnUP)if (logInterval!=LOG1HOUR)logInterval++;if (button==btnDOWN)if (logInterval!=LOG1SEC)logInterval--;if (logInterval==LOG1SEC)logWait=TIME1SEC;elseif (logInterval==LOG5SEC)logWait=TIME5SEC;elseif (logInterval==LOG10SEC)logWait=TIME10SEC;elseif (logInterval==LOG30SEC)logWait=TIME30SEC;elseif (logInterval==LOG1MIN)logWait=TIME1MIN;elseif (logInterval==LOG10MIN)logWait=TIME10MIN;elseif (logInterval==LOG30MIN)logWait=TIME30MIN;elseif (logInterval==LOG1HOUR)logWait=TIME1HOUR;if (sdInserted){FilesettingsFile=SD.open(“settings.txt”,FILE_WRITE);//if thefileisavailable,readit:if (settingsFile){settingsFile.seek(1);

Appendices | 73

settingsFile.print(logInterval);settingsFile.close(); } }lcd.clear();waitUntilNoButtonPressed();lcd.print(“Log”);lcd.write(RIGHT_ARROW_SYMBOL);if (mode==LOGPC)lcd.print(“PC:“);elseif (mode==LOGSD)lcd.print(“SD:“);elseif (mode==LOGBOTH)lcd.print(“Both:“);if (logInterval==LOG1SEC)lcd.print(“1sec”);elseif (logInterval==LOG5SEC)lcd.print(“5sec”);elseif (logInterval==LOG10SEC)lcd.print(“10sec”);elseif (logInterval==LOG30SEC)lcd.print(“30sec”);elseif (logInterval==LOG1MIN)lcd.print(“1min”);elseif (logInterval==LOG10MIN)lcd.print(“10min”);elseif (logInterval==LOG30MIN)lcd.print(“30min”);elseif (logInterval==LOG1HOUR)lcd.print(“1hr”);lastLogged=millis(); }elseif (button==btnLEFT&&mode!=NOTSET&&setupDone){//BacklightcontrolbackLightLevel-=51;if (backLightLevel<0)backLightLevel=255;analogWrite(backLight,backLightLevel);waitUntilNoButtonPressed(); } }}

voidsetup(){Serial.begin(9600);pinMode(13,OUTPUT);pinMode(backLight,OUTPUT);analogWrite(backLight,backLightLevel);//turnbacklighton.Replace‘HIGH’with

‘LOW’toturnitoff. lcd.begin(16,2);//rows,columns.use16,2fora16x2LCD,etc.lcd.clear();//startwithablankscreenlcd.setCursor(0,0);//setcursortocolumn0,row0 lcd.createChar((char)223,degree);lcd.createChar(RIGHT_ARROW_SYMBOL,rightArrow);lcd.createChar(UP_ARROW_SYMBOL,upArrow);lcd.createChar(DOWN_ARROW_SYMBOL,downArrow); lcd.setCursor(0,0);lcd.print(“WirelessTemp.”);lcd.setCursor(0,1);lcd.print(“Logger”);

//InitialisetheIOandISRvw_set_ptt_inverted(true);//RequiredforRXLinkModulevw_setup(1200);//Bitspersecvw_set_rx_pin(30);//Wewillbereceivingonpin3()ietheRXpinfromthe

moduleconnectstothispin.vw_set_tx_pin(31);vw_rx_start();//Startthereceiver Timer3.initialize(200000);Timer3.attachInterrupt(backgroundButtonPressCheck); delay(1000);}

voidloop()

{if(mode==NOTSET){lcd.clear();lcd.setCursor(0,0);lcd.print(“SEL:Instructions”);lcd.setCursor(0,1);lcd.print(“orchoosemode”);intbutton=btnNONE;while(button==btnNONE){button=read_LCD_buttons(); }if (button==btnSELECT){//Printshelptextaccordingtopositioninarrayof textwaitUntilNoButtonPressed();while(helpPos!=-1){lcd.clear();lcd.setCursor(0,0);if(helpTextSpecialChars[helpPos]==-1){lcd.print(helpText[helpPos]);}else{lcd.print(helpText[helpPos].substring(0,helpText[helpPos].indexOf(“*”)));lcd.write(helpTextSpecialChars[helpPos]);lcd.print(helpText[helpPos].substring(helpText[helpPos].indexOf(“*”)+1)); }lcd.setCursor(15,0);lcd.write(UP_ARROW_SYMBOL);lcd.setCursor(0,1);if(helpTextSpecialChars[helpPos+1]==-1){lcd.print(helpText[helpPos+1]);}else{lcd.print(helpText[helpPos+1].substring(0,helpText[helpPos+1].index-

Of(“*”)));lcd.write(helpTextSpecialChars[helpPos+1]);lcd.print(helpText[helpPos+1].substring(helpText[helpPos+1].index-

Of(“*”)+1)); }lcd.setCursor(15,1);lcd.write(DOWN_ARROW_SYMBOL); button=btnNONE;while(button!=btnUP&&button!=btnDOWN&&button!=btnRIGHT){button=read_LCD_buttons(); }if(button==btnUP&&helpPos!=0){helpPos-=2;lcd.setCursor(15,0);lcd.print(““); }elseif (button==btnDOWN&&helpPos<HELPTEXTSIZE-3){helpPos+=2;lcd.setCursor(15,1);lcd.print(““); }elseif (button==btnRIGHT)helpPos=-1;waitUntilNoButtonPressed(); }helpPos=0; }elseif (button==btnLEFT||button==btnUP||button==btnDOWN||button==bt-

nRIGHT){//ReadssettingsonSDcardwaitUntilNoButtonPressed();if (button==btnLEFT)mode=DISPTEMP;elseif (button==btnUP)mode=LOGPC;elseif (button==btnDOWN)mode=LOGBOTH;elseif (button==btnRIGHT)mode=LOGSD;

Appendices | 74

if (mode==DISPTEMP||mode==LOGPC){lcd.clear();lcd.setCursor(0,0);lcd.print(“Readingsettings”);if (mode==LOGPC)delay(500); } if (mode==LOGBOTH||mode==LOGSD){lcd.clear();lcd.setCursor(0,0);lcd.print(“InsertSDcard”);while(!SD.begin(chipSelect)){delay(5000); }sdInserted=true;}else{if (SD.begin(chipSelect))sdInserted=true; } if (mode!=DISPTEMP&&mode!=LOGPC){lcd.clear();lcd.setCursor(0,0);lcd.print(“Readingsettings”);delay(500); } if (sdInserted){FilesettingsFile=SD.open(“settings.txt”);//if thefileisavailable,readit:if (settingsFile){unit=settingsFile.read()-‘0’;logInterval=settingsFile.read()-’0’;if (mode!=DISPTEMP){lcd.setCursor(0,1);lcd.print(“Every“);if (logInterval==LOG1SEC)lcd.print(“1second“);elseif (logInterval==LOG5SEC)lcd.print(“5seconds“);elseif (logInterval==LOG10SEC)lcd.print(“10seconds“);elseif (logInterval==LOG30SEC)lcd.print(“30seconds“);elseif (logInterval==LOG1MIN)lcd.print(“1minute“);elseif (logInterval==LOG10MIN)lcd.print(“10minutes“);elseif (logInterval==LOG30MIN)lcd.print(“30minutes“);elseif (logInterval==LOG1HOUR)lcd.print(“1hour“);if (logInterval==LOG1SEC)logWait=TIME1SEC;elseif (logInterval==LOG5SEC)logWait=TIME5SEC;elseif (logInterval==LOG10SEC)logWait=TIME10SEC;elseif (logInterval==LOG30SEC)logWait=TIME30SEC;elseif (logInterval==LOG1MIN)logWait=TIME1MIN;elseif (logInterval==LOG10MIN)logWait=TIME10MIN;elseif (logInterval==LOG30MIN)logWait=TIME30MIN;elseif (logInterval==LOG1HOUR)logWait=TIME1HOUR;delay(2000); }settingsFile.close(); } else{settingsFile.close();FilenewSettingsFile=SD.open(“settings.txt”,FILE_WRITE);newSettingsFile.print(FAHRENHEIT);newSettingsFile.print(LOG1SEC);newSettingsFile.close();delay(500);lcd.setCursor(0,1);lcd.print(“Noneoncard”);delay(2000); }

}else{delay(500);lcd.clear();lcd.setCursor(0,0);lcd.print(“Failed,using”);lcd.setCursor(0,1);lcd.print(“defaultsettings”);delay(3000); } lcd.clear();lcd.setCursor(0,0);lcd.print(“TurnonTransm./”);lcd.setCursor(0,1);lcd.print(“Insertsensor”); uint8_tbuf[VW_MAX_MESSAGE_LEN];uint8_tbuflen=VW_MAX_MESSAGE_LEN;while(analogRead(15)<20&&!vw_get_message(buf,&buflen)){delay(1000); }lcd.clear();lcd.setCursor(0,0);if (mode==DISPTEMP){lcd.print(“Temperatureis:”);setupDone=true;}else{if (sdInserted){FilelogFile=SD.open(“log.csv”);if (!logFile){FilenewLogFile=SD.open(“log.csv”,FILE_WRITE);newLogFile.println(“Date/Time,Fahrenheit,Celsius”);newLogFile.close(); } }lcd.print(“Setloginterval”);lcd.setCursor(0,1); inttempChoice=LOG1SEC;lcd.print(“1second“);lcd.write(UP_ARROW_SYMBOL);lcd.print(“/”);lcd.write(DOWN_ARROW_SYMBOL); while(logInterval==-1){intbutton=read_LCD_buttons();if (button!=btnNONE){if (button==btnUP)if (tempChoice!=LOG1HOUR)tempChoice++;if (button==btnDOWN)if (tempChoice!=LOG1SEC)tempChoice--;if (button==btnSELECT){logInterval=tempChoice;if (logInterval==LOG1SEC)logWait=TIME1SEC;elseif (logInterval==LOG5SEC)logWait=TIME5SEC;elseif (logInterval==LOG10SEC)logWait=TIME10SEC;elseif (logInterval==LOG30SEC)logWait=TIME30SEC;elseif (logInterval==LOG1MIN)logWait=TIME1MIN;elseif (logInterval==LOG10MIN)logWait=TIME10MIN;elseif (logInterval==LOG30MIN)logWait=TIME30MIN;elseif (logInterval==LOG1HOUR)logWait=TIME1HOUR;if (sdInserted){FilesettingsFile=SD.open(“settings.txt”,FILE_WRITE);//if thefileisavailable,readit:if (settingsFile){settingsFile.seek(1);settingsFile.print(logInterval);settingsFile.close(); }

Appendices | 75

} }lcd.clear();lcd.setCursor(0,0);lcd.print(“Setloginterval”);lcd.setCursor(0,1);if (tempChoice==LOG1SEC)lcd.print(“1second“);elseif (tempChoice==LOG5SEC)lcd.print(“5seconds“);elseif (tempChoice==LOG10SEC)lcd.print(“10seconds“);elseif (tempChoice==LOG30SEC)lcd.print(“30seconds“);elseif (tempChoice==LOG1MIN)lcd.print(“1minute“);elseif (tempChoice==LOG10MIN)lcd.print(“10minutes“);elseif (tempChoice==LOG30MIN)lcd.print(“30minutes“);elseif (tempChoice==LOG1HOUR)lcd.print(“1hour“);lcd.write(UP_ARROW_SYMBOL);lcd.print(“/”);lcd.write(DOWN_ARROW_SYMBOL); waitUntilNoButtonPressed(); } }if (mode==LOGBOTH||mode==LOGSD){//Asksusertosetdate/timelcd.clear();lcd.setCursor(0,0);lcd.print(“Set”);lcd.setCursor(0,1);lcd.print(“Date:”);lcd.setCursor(7,0);lcd.print(“1/1/00”);lcd.setCursor(7,1);lcd.write(UP_ARROW_SYMBOL); intsetPos=0;intdata[7]={1,1,2000,12,00,0};while(!timeIsSet){intbutton=read_LCD_buttons();if (button!=btnNONE){if (button==btnUP){if (setPos==0&&data[0]!=12)data[0]++;elseif (setPos==1&&data[1]!=31)data[1]++;elseif (setPos==2)data[2]++;elseif (setPos==3){if (data[3]<11){data[3]++;}elseif (data[3]==12)data[3]=1;elseif (data[3]==11){data[5]++;if (data[5]==2)data[5]=0;data[3]=12; } }elseif (setPos==4){if (data[4]<59)data[4]++;elsedata[4]=0; } }elseif (button==btnDOWN){ if (setPos==0&&data[0]!=1)data[0]--;elseif (setPos==1&&data[1]!=1)data[1]--;elseif (setPos==2&&data[2]!=2000)data[2]--;elseif (setPos==3){if (data[3]>1&&data[3]!=12){data[3]--;}elseif (data[3]==1)data[3]=12;elseif (data[3]==12){

data[5]--;if (data[5]==-1)data[5]=1;data[3]=11; } }elseif (setPos==4){if (data[4]>0)data[4]--;elsedata[4]=59; } }elseif (button==btnRIGHT&&setPos!=4)setPos++;elseif (button==btnRIGHT&&setPos==4){timeIsSet=true;if (data[5]==1)data[3]+=12;setTime(data[3],data[4],0,data[1],data[0],data[2]); }elseif (button==btnLEFT&&setPos!=0)setPos--; }delay(300); if (setPos<3){lcd.clear();lcd.setCursor(0,0);lcd.print(“Set”);lcd.setCursor(0,1);lcd.print(“Date:”);lcd.setCursor(7,0);lcd.print(data[0]);lcd.print(“/”);lcd.print(data[1]);lcd.print(“/”);lcd.print(String(data[2]).substring(2,4));}else{lcd.clear();lcd.setCursor(0,0);lcd.print(“Set”);lcd.setCursor(0,1);lcd.print(“Time:”);lcd.setCursor(7,0);lcd.print(data[3]);lcd.print(“:”);if (data[4]<10)lcd.print(“0”);lcd.print(data[4]);if (data[5]==0)lcd.print(“AM”);elselcd.print(“PM”); } if (setPos==0){lcd.setCursor(7,1);lcd.write(UP_ARROW_SYMBOL);if (data[0]>9)lcd.write(UP_ARROW_SYMBOL);}elseif (setPos==1){lcd.setCursor(9,1);if (data[0]>9)lcd.print(““);lcd.write(UP_ARROW_SYMBOL);if (data[1]>9)lcd.write(UP_ARROW_SYMBOL);}elseif (setPos==2){lcd.setCursor(11,1);if (data[0]>9)lcd.print(““);if (data[1]>9)lcd.print(““);lcd.write(UP_ARROW_SYMBOL);lcd.write(UP_ARROW_SYMBOL);}elseif (setPos==3){lcd.setCursor(7,1);lcd.write(UP_ARROW_SYMBOL);if (data[3]>9)lcd.write(UP_ARROW_SYMBOL);lcd.print(“--”);

Appendices | 76

}elseif (setPos==4){lcd.setCursor(9,1);if (data[3]>9)lcd.print(““);lcd.write(UP_ARROW_SYMBOL);lcd.write(UP_ARROW_SYMBOL); } } }lcd.clear();lcd.setCursor(0,0);lcd.print(“Log”);lcd.write(RIGHT_ARROW_SYMBOL);if (mode==LOGPC)lcd.print(“PC:“);elseif (mode==LOGBOTH)lcd.print(“Both:”);elseif (mode==LOGSD)lcd.print(“SD:“);lcd.print(“STOPPED”);setupDone=true; } }}else{uint8_tbuf[VW_MAX_MESSAGE_LEN];uint8_tbuflen=VW_MAX_MESSAGE_LEN;if (vw_get_message(buf,&buflen))//checktoseeif anythinghasbeen

received{if (backLightLevel>0)digitalWrite(13,HIGH);if (millis()>(receiveFail+10000)){lcd.clear();lcd.setCursor(0,0);if (mode==DISPTEMP)lcd.print(“Temperatureis:”);else{lcd.print(“Log”);lcd.write(RIGHT_ARROW_SYMBOL);if (mode==LOGPC)lcd.print(“PC:“);elseif (mode==LOGBOTH)lcd.print(“Both:“);elseif (mode==LOGSD)lcd.print(“SD:“);if (logOn){if (logInterval==LOG1SEC)lcd.print(“1sec”);elseif (logInterval==LOG5SEC)lcd.print(“5sec”);elseif (logInterval==LOG10SEC)lcd.print(“10sec”);elseif (logInterval==LOG30SEC)lcd.print(“30sec”);elseif (logInterval==LOG1MIN)lcd.print(“1min”);elseif (logInterval==LOG10MIN)lcd.print(“10min”);elseif (logInterval==LOG30MIN)lcd.print(“30min”);elseif (logInterval==LOG1HOUR)lcd.print(“1hr”); }else{if (mode==LOGBOTH)lcd.setCursor(9,0);lcd.print(“STOPPED”); } } }receiveFail=0;inti;//Messagewithagoodchecksumreceived.temp=””;fTemp=””;for(i=0;i<buflen;i++){if (checkingCelsius){if (buf[i]!=’C’)temp+=buf[i];//thereceiveddataisstoredinbufferelsecheckingCelsius=false; }else{if (buf[i]!=’F’)fTemp+=buf[i];elsecheckingCelsius=true; }

} lcd.setCursor(0,1);if(unit==CELSIUS){lcd.print(temp);lcd.write((char)223);lcd.print(“C“); }elseif (unit==FAHRENHEIT){lcd.print(fTemp);lcd.write((char)223);lcd.print(“F“); }elseif (unit==BOTHUNITS){lcd.print(fTemp);lcd.write((char)223);lcd.print(“F“);lcd.print(temp);lcd.write((char)223);lcd.print(“C“); }elseif (unit==BOTHUNITS2){lcd.print(temp);lcd.write((char)223);lcd.print(“C“);lcd.print(fTemp);lcd.write((char)223);lcd.print(“F“); }digitalWrite(13,LOW); }elseif (analogRead(15)>20){delay(100);if (analogRead(15)>20&&millis()>(analogReadDelay+500)){if (backLightLevel>0)digitalWrite(13,HIGH);if (millis()>(receiveFail+10000)){lcd.clear();lcd.setCursor(0,0);if (mode==DISPTEMP)lcd.print(“Temperatureis:”);else{lcd.print(“Log”);lcd.write(RIGHT_ARROW_SYMBOL);if (mode==LOGPC)lcd.print(“PC:“);elseif (mode==LOGBOTH)lcd.print(“Both:“);elseif (mode==LOGSD)lcd.print(“SD:“);if (logOn){if (logInterval==LOG1SEC)lcd.print(“1sec”);elseif (logInterval==LOG5SEC)lcd.print(“5sec”);elseif (logInterval==LOG10SEC)lcd.print(“10sec”);elseif (logInterval==LOG30SEC)lcd.print(“30sec”);elseif (logInterval==LOG1MIN)lcd.print(“1min”);elseif (logInterval==LOG10MIN)lcd.print(“10min”);elseif (logInterval==LOG30MIN)lcd.print(“30min”);elseif (logInterval==LOG1HOUR)lcd.print(“1hr”); }else{if (mode==LOGBOTH)lcd.setCursor(9,0);lcd.print(“STOPPED”); } } }receiveFail=millis();;analogReadDelay=millis();printTemp();digitalWrite(13,LOW); } }

Appendices | 77

else{if (receiveFail==0)receiveFail=millis();if (millis()>(receiveFail+10000)){lcd.clear();lcd.setCursor(0,0);lcd.print(“TurnonTransm./”);lcd.setCursor(0,1);lcd.print(“Insertsensor”);delay(2000); } } unsignedlongcurrent=millis();if (current>(receiveFail+10000)&&((current-lastLogged)>=logWait)){lastLogged=current;}elseif ((current-lastLogged)>=logWait){if (logOn)delay(100);if (logOn){if (mode==LOGPC||mode==LOGBOTH){//LogstoserialSerial.print(fTemp);Serial.print(“F_”);Serial.print(temp);Serial.println(“C|”); }if (mode==LOGSD||mode==LOGBOTH){//LogstoSDcardFilelogFile=SD.open(“log.csv”,FILE_WRITE);if (logFile){logFile.print(month());logFile.print(“/”);logFile.print(day());logFile.print(“/”);logFile.print(String(year()).substring(2,4));logFile.print(““);logFile.print(hourFormat12());logFile.print(“:”);if (minute()<10)logFile.print(“0”);logFile.print(minute());logFile.print(“:”);if (second()<10)logFile.print(“0”);logFile.print(second());if (isAM()&&hourFormat12()!=12)logFile.print(“AM”);elseif (isAM()&&hourFormat12()==12)logFile.print(“PM”);elseif (isPM()&&hourFormat12()==12)logFile.print(“AM”);elselogFile.print(“PM”);logFile.print(“,”);logFile.print(fTemp);logFile.print(“,”);logFile.println(temp); }logFile.close(); }lastLogged=current;delay(100); } } } }

Appendices | 78

Arduino Code for

transmitter

#include<VirtualWire.h>//youmustdownloadandinstalltheVirtualWire.htoyourhardware/librariesfolder#include<math.h>

#undef int#undef abs#undef double#undef float#undef round

StringtextToSend="";

voidsetup(){pinMode(13,OUTPUT);//InitialisetheIOandISRvw_set_ptt_inverted(true);//RequiredforRFLinkmodulevw_setup(1200);//Bitspersecvw_set_tx_pin(3);//pin3isusedasthetransmitdataoutintotheTXLinkmodule,changethistosuit

yourneeds.pinMode(10,INPUT);pinMode(9,OUTPUT);pinMode(11,OUTPUT);digitalWrite(9,LOW);digitalWrite(11,HIGH);}

doubleThermistor(intRawADC){doubleTemp;//Seehttp://en.wikipedia.org/wiki/Thermistorforexplanationof formulaTemp=log(((10240000/RawADC)-10000));Temp=1/(0.001129148+(0.000234125*Temp)+(0.0000000876741*Temp*Temp*Temp));Temp=Temp-273.15;//ConvertKelvintoCelciusreturnTemp;}

voidprintTemp(){doublefTemp;doubletemp=Thermistor(analogRead(0));//ReadsensortextToSend=doubleToString(temp,2);textToSend+="C";fTemp=(temp*1.8)+32.0;//ConverttoUSAtextToSend+=doubleToString(fTemp,2);textToSend+="F";}

//Roundsdown(viaintermediaryintegerconversiontruncation)StringdoubleToString(doubleinput,intdecimalPlaces){if(decimalPlaces!=0){Stringstring=String((int)(input*pow(10,decimalPlaces)));if(abs(input)<1){if(input>0)string="0"+string;elseif(input<0)string=string.substring(0,1)+"0"+string.substring(1); }returnstring.substring(0,string.length()-decimalPlaces)+"."+string.substring(string.length()-decimalPlaces); }else{returnString((int)input); }}

voidloop(){while(analogRead(0)!=0){if (digitalRead(10)==HIGH)digitalWrite(13,HIGH);printTemp();chartemp[50];textToSend.toCharArray(temp,50);constchar*msg=temp;//thisisyourmessagetosendvw_send((uint8_t*)msg,strlen(msg));vw_wait_tx();//WaitformessagetofinishdigitalWrite(13,LOW);delay(500); }}

Appendices | 79

Appendix D

2017/04/2012:49:30PM,Panel8,Panel9,Pane10,Panel11,Panel122017/04/2012:59:30PM,Panel8,Panel9,Pane10,Panel11,Panel12,Panel132017/04/2001:09:30PM,Panle5,Panel8,Panel9,Pane10,Panel11,Panel12,Panel132017/04/2001:19:30PM,Panel8,Panel9,Pane10,Panel11,Panel122017/04/2001:29:30PM,Panel5,Panel8,Panel9,Pane10,Panel11,Panel122017/04/2001:39:30PM,Panel8,Panel9,Pane10,Panel11,Panel12,Panel132017/04/2001:49:30PM,Panel4,Panel8,Panel9,Pane10,Panel11,Panel12,Panel132017/04/2001:59:30PM,Panel8,Panel9,Pane10,Panel11,Panel12,Panel132017/04/2002:09:30PM,Panel8,Panel9,Pane10,Panel11,Panel122017/04/2002:19:30PM,Panel8,Panel9,Pane10,Panel11,Panel122017/04/2002:29:30PM,Panel8,Panel9,Pane10,Panel11,Panel122017/04/2002:39:30PM,Panel8,Panel9,Pane10,Panel11,Panel122017/04/2002:49:30PM,Panel8,Panel9,Pane10,Panel11,Panel12,Panel132017/04/2002:59:30PM,Panel8,Panel9,Pane10,Panel11,Panel12,Panel132017/04/2003:09:30PM,Panel8,Panel9,Pane10,Panel11,Panel12,Panel132017/04/2003:19:30PM,Panel8,Panel9,Pane10,Panel11,Panel12,PAnel13close2017/04/2006:49:30PM,Panel8,Panel9,Pane10,Panel11,Panel122017/04/2006:59:30PM,Panel8,Panel9,Pane10,Panel11,Panel122017/04/2007:09:30PM,Panel8,Panel9,Pane10,Panel11,Panel122017/04/2007:19:30PM,Panel8,Panel9,Pane10,Panel11,Panel122017/04/2007:29:30PM,Panel8,Panel9,Pane10,Panel11,2017/04/2007:39:30PM,Panel8,Panel9,Pane10,2017/04/2007:49:30PM,Panel8,Panel9,2017/04/2007:59:30PM,2017/04/2008:09:30PM,2017/04/2008:19:30PM,2017/04/2008:29:30PM,2017/04/2008:39:30PM,2017/04/2008:49:30PM,2017/04/2008:59:30PM,2017/04/2009:09:30PM,2017/04/2009:19:30PM,2017/04/2009:29:30PM,close2017/04/2106:49:30AM,Panel1,Panel2,Panel32017/04/2106:59:30AM,Panel1,Panel2,Panel32017/04/2107:09:30AM,Panel1,Panel2,Panel3close2017/04/2109:09:30AM,Panel1,Panel2,Panel3,Panel4,Panel5,Panel6,Panel7,Panel8,Panle9,Panel10,

Panel11,Panel12,Panel132017/04/2109:19:30AM,Panel1,Panel2,Panel3,Panel4,Panel5,Panel6,Panel7,Panel8,Panle9,Panel10,



Panel11,Panel12,Panel13close2017/04/2110:09:30AM,Panel1,Panel2,Panel3,Panel4,Panel5,Panel6,Panel7,Panel8,Panle9,Panel10,





Panel11,Panel12,Panel13close2017/04/2112:49:30PM,Panel8,Panel9,Pane10,Panel11,Panel122017/04/2112:59:30PM,Panel8,Panel9,Pane10,Panel11,Panel122017/04/2101:09:30PM,Panel8,Panel9,Pane10,Panel11,Panel12

Panel Test Output

CSV File

Appendix E

Appendices | 80

Final Print Frames

fig.55

.

Appendices | 81

fig.56

.

Appendices | 82

fig.57

.

Appendices | 83

fig.58

.

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Figure13.https://cdn0.vox-cdn.com/thumbor/83oCJk-sX-HJi6BHPY1B919KMbQ=/0x25:680x408/1600x900/cdn0.vox-cdn.com/uploads/chorus_image/image/42598430/deep-blue-kasparov.0.jpeg

Table03.Addington,Michelle,andDanielSchodek.SmartMaterialsandTechnologies,216.



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