communication ic design and ic application electronicchina 2004, shanghai, march 2004 ivo rutten...

45
Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater China Communications Semiconductor Division

Upload: faith-wagner

Post on 26-Mar-2015

220 views

Category:

Documents


2 download

TRANSCRIPT

Page 1: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Communication IC Designand IC ApplicationelectronicChina 2004, Shanghai, March 2004

Ivo RuttenVice President and General Manager Business Segment Greater China CommunicationsSemiconductor Division

Page 2: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 2

• The Philips approach• Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones• Mobile multimedia solutions• Portable DTV/GPRS solution• Software solutions• Summary

Communication IC Design and IC Application

- Agenda -

Page 3: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 3

Differentiating technology

• Leadership in Systems and Platforms– Leveraging Philips’ core competencies in

R&D and CE heritage– Nexperia: The Solution for Video and Mobile applications– Shipping now in GSM handsets, digital televisions and

DVD recorders– Rich IP portfolio with fully integrated re-use concept

• Excellence in RF– RF is crucial for wireless applications– QUBiC4 low cost, high performance RF

• And now, best-in-class CMOS – 120 nm now, 90 nm first full lots now, 65 nm first silicon

in Q4 2003– Ramp-up of 300 mm wafers pilot line in Crolles on target– 0.18 µm non-volatile EE/Flash for encryption technology

in smart cards

Page 4: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 4

• Nexperia solutions build on comprehensive collective expertise in the Philips Group, particularly Philips’ consumer AV IP

• At the heart of all of our future system products across the markets we serve

• Modular hardware and software

• Support for industry standard operating systems

• Two application areas: – Nexperia Home for Connected Home / Digital Home applications

including digital television, home entertainment hubs, media servers, DVD recorders, PVRs, wireless displays and media adapters

– Nexperia Mobile for mobile multimedia handsets, wireless PDAs, other portable wireless devices

Nexperia™

Page 5: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 5

• The Philips approach• Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones• Mobile multimedia solutions• Portable DTV/GPRS solution• Software solutions• Summary

Communication IC Design and IC Application

- Agenda -

Page 6: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 6

Nexperia Cellular System Solutions

Everything but the plastic:

• Complete reference designs for GSM/GPRS/EDGE mobile handhelds

• Full IOT validated system including Nexperia Cellular Multimedia Baseband, power management unit, RF, power amplifier and software

• Tailored for target applications• Add multimedia with minimal cost, risk and time-

to-market

… All you need for multimedia handsets

Well on our way to 1 out of 10 GSM/GPRS phones based on Nexperia Cellular System Solution

Page 7: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 7

Power management

Services & software

Connectivity

Security/ identification

Pipeline

Imaging

Mobile displays

Multimediasolutions

Scope of Philips mobile applications

Voice/audio

Video

Page 8: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 8

2003 2004 2005 2006/7 2008/9

Memory

Baseband

PMU/Charge

Transceiver

ASW/PA FEM/GSM module

Analog ICRFCMOS

Single dieCMOS

Step 1Step 1 Step 2Step 2 Step 3Step 3

RF-CMOS Development

AudioSySol

Baseband ICCMOS

SySolAnalog ICBiCMOS

System solutions: from sysol ME3 to ME4

Page 9: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 9

Step 1: 2 dies in 2 technologies

Analog Digital

HighPower

LowPower

RF poweramplifier

Batt chargeswitch

Analog pwrsupply

RF powersupply

Dig pwrsupply

Ref.Oscillator

AuxiliarADCs

Transmitter+ Synth

MemoriesRam/ROM/Flash

DSP +CPU

JTAG +Peripherals

GMSK mod,Pre-dist.

BAI Audiosign. proc.

32 kHzclock unit

RTC +alarm

On/offcontrol CMOS 090

QUBIC4+

AuxiliaryDACs

AnalogueAudio

Micbias+Audio det

RF powercontrol

Receiverchain

RxADC

Page 10: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 10

Step 2: 2 dies in 1 technology

Analog Digital

HighPower

LowPower

RF poweramplifier

Batt chargeswitch

Analog pwrsupply

RF powersupply

Dig pwrsupply

Ref.Oscillator

AuxiliarADC’s

Transmitter+ Synth

MemoriesRam/ROM/Flash

DSP +CPU

JTAG +Peripherals

GMSK mod,Pre-dist.

BAI Audiosign. proc.

32 kHzclock unit

RTC +alarm

On/offcontrol CMOS090

RFCMOS090

AuxiliaryDAC’s

AnalogAudio

Micbias+Audio det

RF powercontrol

Receiverchain

RxADC

Page 11: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 11

Analog Digital

HighPower

LowPower

RF poweramplifier

Batt chargeswitch

Analog pwrsupply

RF powersupply

Dig pwrsupply

Ref.Oscillator

AuxiliarADC’s

Transmitter+ Synth

MemoriesRam/ROM/Flash

DSP +CPU

JTAG +Peripherals

GMSK mod,Pre-dist.

BAI Audiosign. proc.

32 kHzclock unit

RTC +alarm

On/offcontrol

CMOS090 with RF option

Step 3: 1 die in 1 technology ME4

AuxiliaryDAC’s

AnalogueAudio

Micbias+Audio det

RF powercontrol

Receiverchain

RxADC

Page 12: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 12

High-level requirements for ME3

• Low to mid tier phone with EDGE capability• Main technologies CMOS090 and QUBiC4+• Target 1 package, maximum 2 packages• Enabling the path to1 die in CMOS for ME4• Main focus on size, component count and

process diversity reduction, reaching BOM reduction at the same time

Page 13: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 13

Baseband - one page guideline• System target: GSM/EGPRS modem with integrated MRAM

Integrated MRAM, which satisfies the mainstream

• Architecture: SC ARM9xx, DSP RD16025

DSP and SC memory concept to be revisited in the light of MRAM concept

• Technology: CMOS090• Typical

implementation: Package option for external bus interface (EBI) forhigher tier(s)

On-chip integrated voltage regulators Stereo Audio and AUX ADCs on dieDigital RF interface, USB OTGDigital interface options for GPS (GIU), camera, etc.

Page 14: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 14

Transceiver - one page guideline• System target: GMSK and 8PSK modulation• Architecture: TX: Polar modulation concept

RX: Near Zero IF receiver• Technology: QUBiC4+ 4.5 mm² target die size

• Typicalimplementation: SD FracN PLL for PM and AM by PA-control DAC

High dynamic RX ADC to relax analog requirements (filtering and # of AGC-steps)

Digital RF interfacePassive integration (PICS)Integrated power supply

Page 15: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 15

PA/antenna switch - one page guideline

• System target: GPRS/ EGPRS, MSC 12, QB• Architecture: Polar modulation; feed forward AM

AM and AM/PM pre-distortion may be needed

• Technology: CMOS control + GaAs RF + Passi Si alternative: QUBiC4+ and Passi Si (passive integration)

– cost/performance trade-off

• Typicalimplementation:Saturated QB PA for GPRS and EGPRS

Integrated QB, low-loss antenna switchWide dynamic, high accurate AM control via

analog AM control signalPhase pre-distortion via look-up tablesDigital RF; control interface part (only) – tbdIntegrated power supply regulator

Page 16: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 16

Power management - one page guideline

• Distributed power supplies (RF and BB)• Bulk of the power management on QUBiC4+ die• Adaptive Voltage Scaling for BB part

– PowerWise– Tube (post regulation LDOs on CMOS090)

• Partitioning for extra functionality has to be studied:– Charging driver transistor (up to 20 V, including charge via USB)– Backlight management (fun lighting, flash light, 20 V)– USB OTG transceiver– Battery connected supplies (voltage limitation or pre-regulation for

RF and BB needed)

Page 17: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 17

Sysol software – one page guideline

Page 18: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 18

• The Philips approach• Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones• Mobile multimedia solutions• Portable DTV/GPRS solution• Software solutions• Summary

Communication IC Design and IC Application

- Agenda -

Page 19: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 19

2.5/3G Nexperia PNX5220 MM baseband IC

• Contains– ARM926 system controller (SC) with rich set of peripherals– Telecom DSP– Speech/Audio DSP– Several intercore and and top-level blocks– analog baseband and audio interface (BAI)

• Process– 0.09 µm CMOS process for digital– 0.25 µm CMOS process for analog

• Packages– Production: TFBGA, 320 balls, 4 rows, 0.5 mm pitch– Development: BGA376, 1mm for digital; LQFP80 for analog

Page 20: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 20

I&Q

Burst FLASH,SRAM/PSRAM

Front end

hands free

MMCMemory Stick

PC, Mouse,USB Stick,Camera, ...

SensorOM6802

Charger

Charge ICUBA2008

Ba

tte

ry

LCDPCF8880/90

PNX5220

RF DAC

ARM926

UARTUSIM IIC

EBI

NFI

SDI

Stereo ADC

Stereo DAC

RFCU

GIUSPI3

UART

FCIMSI

SIM card

USB-OTG

BT-BBPCF87752

BT-RadioUAA3559

PNX5220 application diagram

IOM

2

UMTS ModemPCF0501

UAA3537

GMSKMod.

RF ADC

UAA3580UAA3581

PMUPCF50603PCF50606

GPS RadioUAF1572

Serial Flash

Nand FLASH

mobile SDRAM ImagingSubsystem

ATX

Keyboard 6x6 matrix

KBD

Saturn DSP2 (audio)

Saturn DSP1 (telecom)

JDIjog dial

SPI2

SPI1

new block

Page 21: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 21

PNX5220 MM features

• Increased processing power– effective MIPS x 2-2.5

• high-performance memory interface

– accelerators for multimedia

• Reduction of system cost– integration of multimedia features : MPEG4, camera i/f

• no need for additional IC

– possibility to use cheaper memories• Nand Flash + SDRAMs

Page 22: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 22

• The Philips approach• Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones• Mobile multimedia solutions• Portable DTV/GPRS solution• Software solutions• Summary

Communication IC Design and IC Application

- Agenda -

Page 23: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 23

Nexperia mobile multimedia application ICs

• Image processor PNX4000– Targets cost sensitive camera phones– Real-time image capture + graphics features

• A/V coprocessor PNX4004– Targets entertainment phone segment– Enhancing visual user-experience by unique smart imaging &

Display features

• Application engine PNX4008– Targets smart phone and gaming segment– High-end open-OS multimedia processor

optimized for Symbian v8

Page 24: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 24

• Key features– Preview, capture, store JPEG images / MJPEG video clips– Streaming JPEG encode with variable compression ratio– Picture edition with transparency, icons animation– Scaling and Digital zoom (16x)– Sensor Interface with up to 1.3 Mpixels (30 fps in VGA)– Dual LCD support (max width=176, color depth = 65k)– Dedicated power management (10 mW preview, 10 µA

stand-by)– Small footprint (7x7 mm TFBGA112)

• Value proposition– Cost-effective solution for camera phones combining small footprint

and low power consumption

PNX4000 image processor

Page 25: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 25

PNX4000 system architecture

PNX4000PNX4000 BBBBParallel IF

I²C

YUV IF

LCD2 selectLCD1 select

Parallel IF

CS

IT

Driver ex : Driver ex : - PCF8880- PCF8880 - PCF8833- PCF8833

Driver ex : Driver ex : - PCF8881- PCF8881 - PCF8835- PCF8835

Ex : Ex : - Sysol (ARM7)- Sysol (ARM7)

Ex : Ex : - OM6802- OM6802

Sensor Interface up to 1.3 Mpixels, 30fps in VGA

Flexible Host Interface SPI or parallel (8080x or 68xx)

Support for 2 LCD (SPI or parallel interface)

Page 26: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 26

PNX4000 – product support

• Standard Development Kit– IC + development boards – Application notes– Public API

• Specification (function description)• Source code• Validation on Sysol mobile platform (ARM7 + Philips OS)

• Optional– Public API customization

• sensor, LCD display driver, on-site platform support

– Customer applications support• JPEG decoder, MJPEG/MPEG4 transcoder

Page 27: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 27

PNX4004 AV coprocessor

• Targets entertainment phone segment– Low latency viewfinder, still image capture and playback, – Picture editing– Audio / video clips capture and playback– Audio / video streaming

• Enhancing visual user-experience by smart imaging & display features– Core audio / video engine– System peripherals– Imaging / display features

• Based on ARM926EJ CPU, 208 MHz + SiHiveTM ERC• Flexible host interface, compliant to TS27.010 protocol• Embedded RTOS

Page 28: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 28

PNX4004 system configuration

StereoAudio DAC

2 MpixCMOS sensor

VoiceCODEC

Cellular Baseband RF

Main QVGA LCD256k colours

MMC/SDCard

SDRAM NAND flash

DigitalTV encoder

(DENC)

PNX4004

Mobile MultimediaCo-processor

TV

sub-display

UART UART

Cam I/F

PCM/IOM-2 I2S

SPI

LCD-out

TV-out

SD I/FNAND I/FSDRAM I/F

8 YUV or10 RGB

I2C Optional

Version 0.3Jan.29 ‘04

YC or CVBS

E.g. for wirelessconnectivity devices

Page 29: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 29

PNX4004 Video/Audio engine

• Camera I/F supporting up to 2 Megapixel sensor– supports both YUV and RGB Bayer sensors

• Real-time MPEG4 / H.263 HW accelerators– encoding / decoding up to 30 frames/sec CIF– adaptive deblocking post-processing filter for decoding

• Fast JPEG image HW encoder / decoder– encoding / decoding of multiple stills/sec of 2Mpix

• Audio support for video applications and MP3 player– AMR audio SW encoder / decoder– MP3 + AAC SW decoder– No advanced audio features > Baseband

Page 30: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 30

PNX4004 system peripherals• Memory interface

– 32/16 bit SDRAM, max 128 MB ext. memory space, 104 MHz– NAND flash I/F, max 2 GByte, 8/16 bit devices– SD / MMC

• Host interfaces– High-speed UART (900kbps) with flow control– Parallel I80/M68 (8 and 16 bit, supports muxed Addr/Data)

• 2 audio interfaces– PCM/IOM-2 and I2S

• General– 4 UARTs, 2 high & 2 low-speed UARTS - one supports IrDA– Fast I2C– JTAG debug, ETM9/ETB with 1k x 24 bits trace store

Page 31: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 31

PNX4004 imaging / display feature set

• Enhanced Camera Signal Processor (eCSP)– Optimized for Mpix digital still performance– Auto Exposure, Auto White Balance and Auto Focus– Sketch, solarization, negative, sepia, B&W, embossing modes

• Camcorder functionality– True continuous digital linear zoom– adaptive deblocking post-processing filter for decoding– Image stabilization– Video GFX renderer for capture overlays

• Embedded main LCD controller– Drive RAM-less TFT or C-STN display, 16/18-bit RGB

• TV output– Digital YUV I/F to external DENC IC

Page 32: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 32

PNX4004 imaging / display feature set

• Graphics / Rendering– Overlay of several objects, stills, video,

graphics, text– Programmable attributes per object:

• Geometric transformations– Translation– Scaling– Rotation– Slant

• Depth• Transparency level

zoom

GFX rendering

Image stabilization

Page 33: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 33

PNX4004 imaging / display feature set

• SiHiveTM Embedded Reconfigurable Computing core– Application-Specific-Instruction DSP– VLIW / Space Time Computing based

• Benefits– Si efficiency ~ dedicated HW accelerators– Allowing low cost solution to

Customization of Imaging / display feature set

Page 34: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 34

PNX4008 application engine

• Targets high-end smart phone and gaming segment– performance + power consumption optimized

• Dedicated audio system based on XpertTeak DSP• ARM926EJS floating point RISC processor, 208 MHz

– includes Jazelle JAVA accelerator• High-performance 3D graphics processor / open-GL ES • HW accelerated JPEG/MPEG4/H263 video engine• HW accelerated security core• Host and OS independent

– optimized for Symbian OS V8.0B with UIQ V2.1• CMOS090, LFBGA320

Page 35: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 35

PNX4008 system configuration

2 - 4 MpixCMOS sensor

VoiceCODEC

Bluetooth Cellular Baseband RFRF

Main QVGA LCD256k colours

MemoryStick

SDRAM NAND flash

Keypad

Touchscreen

PNX4008

Mobile MultimediaApplications Engine

UART UART

Cam I/F

PCM/IOM-2Stereo

Audio out

LCD-out

MS I/FNAND I/FSDRAM I/FKBD I/F

TS I/F

8 YUV

I2C

USBOn-The-Go

USB-OTG I/F

Version 0.2

Page 36: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 36

PNX4008 feature set (1)

• Audio: – MP3, ATRAC3, dynamic compression and equalization,

integrated Stereo Audio DACs• Video

– JPEG HW decode, MPEG4/H263 codec, SP L0 to L3, Up to CIF 30fr/s, Video conference mode

• Graphics– MBX 3D Graphics Accelerator, OpenGL ES1.0 compliant

Performance @80MHz: 160Mpix/s, 1Mpolygons/s• Camera

– max 4Megapixel input, YUV 4:2:2 format• LCD

– Dual display support, max QVGA RGB 256K colors / 60fr/s

Page 37: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 37

PNX4008 feature set (2)• Security:

– Discretix CryptoCell™; 5-15x HW acceleration:– PKI key exchange (RSA, ECC, DSS, DH), Symmetrical encryption

(DES, 3DES, AES), HASH core (SHA-1, MD5), Random nr generator, Secret Crypto key

• External Memory– 64MByte SDRAM supported– Direct NAND Flash support– Memory stick– SD / MMC

• TouchScreen, Keypad• USB OTG (12Mbit/s)• I²C, SPI, UARTS (960 kbaud)

Page 38: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 38

PNX4008 development kit

• PNX4008 Applications Engine IC• Development and Integration board• Open-OS

– Base port of Symbian V8B and UIQ, including components, middleware and sample applications

• Software Development Kit– Compilers and IDE for system integration and application

development

• Supported by partners Metroworks, Teleca, Symbian

SDK

Page 39: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 39

• The Philips approach• Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones• Mobile multimedia solutions• Portable DTV/GPRS solution• Software solutions• Conclusion

Communication IC Design and IC Application

- Agenda -

Page 40: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 40

• LCD (LB064V02) + backlight• Touch screen• Speakers 8 ohm / 2 Watt a piece• IO module with buttons and small LCD display• Battery (3 hours instead of 4)• Small PCB with USB plug, AC adaptor plug, on/off switch, rotary

knob

PCMCIAVodaphone

GPRS modem

USB-1.1 port

Internal CF Slotfor Flash or HDD

Build-in DVB-TAntenna and MPCI receiver

VGA LCD +Touch Screen +Stylus pen

Built-inLion battery

Built-inSpeakers

LocalButtons

Hotman DVB-T/GPRS portable devicePrototype @ CeBit 2004

Page 41: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 41

DisplayDisplayBasebandBaseband

TV-Companion: 3-chip concept building on the programmable TV front-end

RFRF

Multi-standard Channel decoderMulti-standard

Channel decoderSiliconTunerSiliconTuner

Add-on

Source decoderPNX0105

Source decoderPNX0105

De-mux partitioni

ng

Page 42: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 42

ApplicationEngine

ApplicationEngineBase-BandBase-Band

Programmable TV front-end add-on:for advanced phone using the available application engine

RFRF DisplayDisplay

Source decoding in the

AESiliconTunerSiliconTuner

Add-on Programmable Multi-standard Channel decoder and De-mux

Programmable Multi-standard Channel decoder and De-mux

MSPMSPOFDMOFDM

PES/IP

Page 43: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 43

• The Philips approach• Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones• Mobile multimedia solutions• Portable DTV/GPRS solution• Software solutions• Summary

Communication IC Design and IC Application

- Agenda -

Page 44: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater

Semiconductors 44

Summary

Our IC and software technologies enable the Our IC and software technologies enable the world of the Connected Consumerworld of the Connected Consumer

Leading-edge process technologies, AV software, system expertise, roadmaps

Leveraging our Nexperia™ platforms: Capable of providing affordable full system

solutions Putting emphasis on multimedia functionality

Page 45: Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater