compactpci & advanctedtca systems - volume 12 issue...
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4 y August 2008 y CompactPCI and AdvancedTCA Systems
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Volu m e 12 • N u m be r 6
AuGuST 20 08CompactPCI ®
AdvancedTCA ®and Systems
The Magazine for Developers of Open Communication, Industrial, and Rugged Systems
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g COVER:Suitable for wireless baseband and other processing-intensive applications such as WiMAX and Long Term Evolutionof 3GPP (LTE), the AMC-6487C from CommAgility is based on theTexas Instruments (TI) multicore TMS320TCI6487 DSP. AdditionalAdvancedMC solutions can be found beginning on page 26.
F E A T U R E S
18 Small is beautiful By Tony Romero, Performance Technologies
21 AdvancedMCs are finding their place By Venkataraman Prasannan, RadiSys
PRODUCT GUIDE
26 AdvAnCed MezzAnine CArdS advancedmc-systems.com From Host Board Adapters (HBAs) to card edge connectors to modules for high-density WAn to the latest content-aware, wirespeed solutions, this issue’s AdvancedMC Guide presents a comprehesive set of recently introduced AdvancedMCs and related offerings, with an expanded guide online at advancedmc-systems.com.
C O L U M N S 8 Editor’s Foreword AdvancedTCA: Living large By Joe Pavlat
10 Global Technology Hearing you loud and clear By Hermann Strass
13 Software Corner Switching at the speed of light By Curt Schwaderer
E - L E T T E Rwww.compactpci-systems/eletter
AUGUST:Leveraging the communicationsserver ecosystem By Hermann Berg and Larry Terry, Emerson Network Power Embedded Computing
E - C A S T Swww.opensystems-publishing.com/ecast
AUGUST:The hottest DSP trends, from algorithmsto Zulu, powering today’s military systemsAugust 27 • Moderator: Chris CiufoPresented by: Annapolis Micro Systems, Inc. and
Jacyl Technology, Inc.
Member since 1998
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31 ADLINK Technology, Inc. – Dual Quad-/Dual Core23 Advantech Corporation – Advanced Blade Solutions7 Annapolis Micro Systems, Inc. – WILDSTAR 511 Concurrent Technologies, Inc. – Dual-Core Processors20 CorEdge Networks, Inc. – FPGA platforms for demanding applications17 ELMA – Climb Above with Bustronic 25 ELMA – Cutting it close doesn’t cut it 15 Excalibur Systems, Inc. – Ready for the unexpected?5 GE Fanuc Intelligent Platforms, Inc. – Looking for AdvancedMCs?24 Harting Technology Group – A new standard in reliability14 Hybricon Corp. – Thermal Management Solutions44 Linear Technology – Reliable Power for AdvancedTCA9 National Instruments – Green Engineering38 One Stop Systems Inc. – PCIe Over Cable12 Performance Technologies – Your path to AdvancedMC success11 Radian Heatsinks – This may keep you cool...22 Schroff a Brand of Pentair Electronic Packaging – PERFORMANCE2 Simclar Group – TurboFabric Scalable16 Technobox, Inc. – Your Source for PMC Solutions43 Vector Electronics & Technology, Inc. – Packaging Solution of Choice36 Winchester Electronics – Power Connector Solutions16 Xalyo Systems – XS-AMC23 XTech – The XTech Files
A n O p e n S y S t e m S p u b l i c A t i O n
Communications Group n CompactPCi and AdvancedTCA Systems n C m ac P a d Ad an e T A r s u e Gu e n C m a tP i nd A a cedT A lett
Editorial Director Joe P lat jp vl @ pensy t ms-publishing com
Ma aging Edito Ann Fis e [email protected]
Senior Editor (columns) Terri Thorson [email protected]
Technology Editor Curt Schwaderer [email protected]
Senior Associate Editor Jennifer Hesse [email protected]
European Representative Hermann Strass [email protected]
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EDITOR’SFOREWORD
CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems
By Joe Pavlat
AdvancedTCA: Living large
The annual NXTcomm telecom trade show was held June 17-19 this year at the Las Vegas Convention Center. The show will alternate between Las Vegas and its regular Chicago venue every other year going forward. Attendance topped 13,000, down a bit from last year. Folks I talked to weren’t all that happy with Las Vegas as a trade show location, in part due to its distance from East Coast cities and its triple-digit
temperatures, but there was a lot of excitement about the products being shown. Several of the keynotes from industry heavies drew large crowds, too.
Of course this observer was interested in seeing AdvancedTCA equipment, and NXTcomm did not disappoint. Indeed, AdvancedTCA was almost impossible to miss, especially given the “sizable” inter-est in it, as evidenced at the Spirent Communications booth (Figure 1). Spirent created a 3D billboard presentation of its flagship product Spirent TestCenter featuring an AdvancedTCA board. “Tradeshow exposure and visibility always present a challenge, so we took a page from the outdoor advertising playbook,” said Scott Gregory, Corporate Communications Manager at Spirent Communications.
Interestingly, many of the systems I saw were not from AdvancedTCA vendors but from applica ion providers that in some cases did not even know that their product was running on an AdvancedTCA platform or even what AdvancedTCA was. That’s a very important step in the maturation and wide-spread acceptance of AdvancedTCA as a platform that is the basis for many new products and applications. Most, as is the nature of things these days, are IP based and are pieces of the emerging All-IP network.
As in prior years, PICMG sponsored a pavilion-style booth with 35 member companies displaying their products and technologies (Figure 2). Booth traffic was fairly good, although a number of companies that were farthest from the main aisle did not see as many prospective customers as those nearer the main aisle. A redesign for next year might be in order. In addition to AdvancedTCA products, including racks, shelves, boards, and fully functioning systems, many Advanced Mezzanine Card and MicroTCA products were on display.
CompactPCI and AdvancedTCA Systems team members Rosemary Kristoff, Ernest Godsey, Pat Hopper, and Anne Fisher were on hand to conduct interviews with PICMG members. The interviews
will be included in a series of CompactPCI and AdvancedTCA Systems E-letters (www.compactpci-systems.com/eletter). A drawing for a Chumby (yes, I checked www.chumby.com, too) encouraged both attendeees already familiar with PICMG, as well as those just becoming familiar with the AdvancedTCA/MicroTCA/CompactPCI ecosystem, to visit the PICMG Pavilion. A brochure that included a map locating booths within the Pavilion and featuring product news was popular with Pavilion visitors.
Versatile MicroTCAHaving noticed the impressive number of MicroTCA products displayed at NXTcomm, it was interesting to return from the show and preview Tony Romero’s article on MicroTCA, “Small is beautiful.” The article is in this issue and Tony, Senior Product Manager at Performance Technologies, says, as others have, that the military is very interested in the MicroTCA platform for a wide range of applications. It is worth noting that several prime military suppliers are actively participating in the two PICMG technical committees developing standards for rugged air-cooled and conduction-cooled MicroTCA systems.
A related topic is the Advanced Mezzanine Cards that are the basis of MicroTCA. Venkataraman Prasannan, Senior Director AdvancedTCA Product Line Management from RadiSys, digs into when and how to use AdvancedMCs, the thermal issues associated with their use, connectivity and I/O constraints, and usage models. As the AdvancedMC market continues to grow and products proliferate, designers need to understand the many variables when making cost/performance tradeoffs.
In his Global Technology column, Hermann Strass updates us on activities and shows in Europe. Meanwhile, in the Software Corner Curt Schwaderer tells about a new optical switching interconnect technology designed to help large storage arrays and data warehouses manage information flow. Using lasers and lenses, this unique technology is a departure from traditional fiber optic point-to-point systems, and requires some very sophisticated software to make it all work.
Joe Pavlat, Editorial Director
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GLOBALTECHNOLOGY
CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems
By Hermann StraSS
Classical telephone communication has developed over a long time. It has transformed from analog to digital. Because of this digital nature there is a tendency to merge telephone communication with data communication, which these days is almost exclusively based on Ethernet/IP/TCP.
Even though both are digital, there are fundamental architectural differences. A telephone connection is direct and in real time. Data communication (TCP/IP) is indirect and comes in pieces (packets). Since the convergence is on TCP/IP rather than on tele-phony, there is a big problem getting clear and reliable real-time communication via a packet network. It is therefore mandatory that at least the technical quality of a packet network for Voice over IP (VoIP) is as high quality as possible. Making it real time is a matter of packet priorities and congestion avoidance.
Testing the interoperability of VoIP interfacesIn order to guarantee a properly working network for VoIP traffic a continuous analysis of the quality of contents and services is neces-sary. In this application a Single Board Computer (SBC) based on a PowerQUICC II CompactPCI board from MEN Micro (Germany), is used to test interoperability of VoIP interfaces (Figure 1, courtesy MEN Micro). The system emulates multiple IP telephones or gate-ways. It generates the call signaling and delivers the signaling and traffic to a system under test. Perceptual Speech Quality Measure (PSQM) and Perceptual Evaluation of Speech Quality (PESQ) measurements are made in real time for voice quality analysis. The system executes Domain Name System (DNS) and network element registration. It requests and measures the capacity of ser-vers to perform these actions.
(TDMs), four Serial Communications Controllers (SCCs) for High Level Data Link Control/System Network Architecture (SNA) Data Link Control (HDLC/SDLC) or Universal Asynchronous Receiver/Transmitter (UART) applications, and two Serial Management Controllers (SMCs) for low-speed operations. On this card the channels of the MCCs, FCCs, and SCCs are routed to a COM extension connector for implementation of ATM, E1/T1, Fast Ethernet, or HDLC interfaces. The remaining ports are used for Fast Ethernet and UART operation. Different physi-cal interface configurations such as RS-232, RS-422/RS485, or 10BASE-T are available for two SCCs.
Some features of the VoIP test system are:
n F6 SBC: 6U, 64-bit CompactPCIn PowerPC MPC8260 (PowerQUICC II)n Two Fast Ethernet channelsn Four SCCs, two multichannel interfacesn One FCC for telecom interfaces, like Asynchronous
Transfer Mode (ATM), T1/E1, and HDLCn Hot-plug functionalityn Linux
The original single Eurocard (3U) has been modified to 6U height to become the F6 card. The modular CompactPCI architecture allows the configuration of optimized systems based on individual requirements. In addition, the test set can expand as the net-work grows or new offices come online. The system scales from 1 to 3,328 two-party simultaneous calls. It accommodates from 1 to 13 10/10/1000BASE-T autosens-ing Ethernet ports.
European eventsThe Automatica 2008 exhibition and con-ference in Munich also hosted the largest German robotics confer-ence. About 30,000 visitors from 90 countries came to Munich between June 10 and June 13 to see what more than 870 exhibitors from 41 countries had to show.
Highlights were the Titan KR1000 robot from KUKA, Germany (Figure 2, courtesy KUKA), which is the
Hearing you loud and clear
Figure 1
Figure 2
The main element of the system is an SBC based on the highly communication-oriented PowerPC MPC8260 processor. The inte-grated Communication Processor Module (CPM) of the MPC8260 comes with three Fast Communications Controllers (FCCs), two Multichannel Controllers (MCCs) for Time Division Multiplexers
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world’s strongest robot. It is listed in the Guinness Book of World Records and it also got the “Red Dot” award for excellent industrial design, like several KUKA robots before. It lifts one ton at the end of a 3-meter arm, made up of six joints (axes) with a repeatability of 0.2 mm. The KR1000 is controlled by a ruggedized PC using a patented fail-safe combination of Windows (for display only) and a real-time operating system. The Titan was already shown at the Hannover Industrial Fair (see VME and Critical Systems, August 2008, (www.vmecritical.com).
SMErobot is the name of a European project, started in 2005, to design and produce robots for Small and Medium-sized Enterprises (SMEs). First results were shown at Automatica in Munich. These robots, some just a third hand for the factory worker, are innova-tive, low cost, and easy to use. Established robot makers including KUKA, research institutes, universities, and small system inte- grators from all over Europe participate under the coordina-tion of the Fraunhofer Institute IPA in Stuttgart, Germany. The Mechatronics Airport in hall B1 was using all kinds of experimental approaches to explain mechatronic thinking in an exciting way.
For more information, contact Hermann [email protected].
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SOFTWARECORNER
By Curt SCHwaderer
Switching at the speed of light
Multiprocessor, multinode, and multicore systems and the applications that drive them are at a tech-nical crossroads. Increas-
ing processor performance by riding Moore’s law isn’t yielding nearly what it was. Now the path to increased computing performance appears to lie with multi-core processor technology and distributed computing. At the same time, services and data access through networks continues to increase at an alarming rate. For example, a recent IDC study reports that 40 percent of organizations see data warehouses growing at 50 percent annually. And 18 percent of organizations report their data warehouse size doubles annually. The key to moving past this crossroads lies in making the interconnect in multiproces-sor or multinode systems more efficient and higher performing. This will enable multiple compute nodes to work together to achieve higher overall performance.
In this month’s Software Corner column we’ll look at a new interconnect tech-nology from Lightfleet Corporation called Corowave. Corowave uses a unique laser technology with special broadcast pro-perties that promises to be the foun-dation for the interconnect of the future, enabling systems to achieve next-level performance through more efficient, scal-able distribution of computations between nodes.
Today’s interconnect issuesThe slower performance gains in proces-sing power and doubling of data warehouse growth aren’t the only issues putting increased pressure on today’s point-to-point interconnect. Varying latency and bandwidth expansion problems arise when running broadcast-oriented appli-cations. Traditional interconnects add latency between participating nodes that make multimedia applications such as video meetings difficult to use. And the large latencies are not the only issue. Differences in latency between nodes working on a common application can also lead to problems and inefficiencies for that application.
Bandwidth expansion is another big concern regarding capacity problems within the interconnect itself. When a videoconferencing application between multiple sites is run, each endpoint sends out a packet stream that then must be copied and sent to each of the other endpoints in the conference. These point-to-multipoint data streams are transmitted in the form of multicast packets. From the source endpoint’s perspective this is a single packet going to a single multicast address. The interconnect is responsible for expanding a multicast address packet into multiple packets that go out multiple ports to multiple destinations that make up the multicast group. This results in a one-packet-in, many-packets-out problem that can congest traditional methods of connecting multiple processors or nodes.
What does all this mean? In a nutshell, we’re using a fundamentally point-to-point inter-connect for complex applications that are becoming increasingly point-to-multipoint and perhaps should be multipoint-to-multipoint (or all-to-all).
The Corowave switching interconnect solution provides the foundation for the develop-ment of a broadcast switching interconnect. The fundamental concept behind the tech-nology is the use of la ers to send packets from a single source to multiple destinations simultaneously This eliminates the latency problems discussed previously.
How it worksFigure 1 illustrates how the laser technology component works. A single transmitter beam is sent through a spreading lens. The broadcast light bounces off a mirror into a focusing lens destined for multiple receivers. So each node receives the data from a single source simultaneously using spreading and focusing lenses. The resulting transmission affords a flat and constant latency to each receiving node in the system.
It’s also important to note that this laser broadcast technology is different from fiber initia-tives being employed today. Fiber is a point-to-point transmission medium that uses laser light for data transmission. The Corowave technology uses light and lenses to achieve simultaneous broadcast interconnect.
Software impactAs with most disruptive technologies, it’s not enough to have the physical layer solution by itself. Disruptive technology requires a software architecture that takes advantage of
Figure 1
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new capabilities yet can seamlessly interface to legacy software applications for graceful transition. Geoff Smith, Director of Software at Lightfleet, is chartered with that task.
Geoff described the new software architecture as creating a distributed shared memory environment without the shared memory overhead. Nodes can subscribe to the shared memory groups (called wavegroups) they are interested in and ignore the rest. Each node is allocated a single wavegroup for transmitting its information to the other nodes in the system. The rest of the wavegroups are used as the receive areas from the other transmitting nodes in the system. This kind of software architecture nicely parallels the broadcast architecture of the hardware interconnect component.
You’ll notice in Figure 2 that there are three paths to the hardware. The first is through the block called “cwnet.” The “cwnet” driver acts just like an Ethernet driver that lives below a TCP/IP stack. This way, socket applications can operate over the Lightfleet interconnect without any changes.
The “cwblk” component implements the block I/O path, the second path shown in Figure 2. This way, standard block I/O and/or file system applications have a standard way of communi-cating through the Lightfleet interconnect.
Finally there is a direct path through the hardware. The applica-tion programming interface exposes the wavegroup concept to the application. This enables applications to be written that take full advantage of the highly parallel reader/writer environment provided by the hardware.
The Figure 2 block labeled “cwfm” stands for “Corowave Fabric Manager.” This component performs the initialization, assign-ment, and shared memory initialization of all the wavegroups between the nodes in the system. Figure 2
Geoff Smith Chris KruellLightfleet Corporation
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Chris also spoke of other natural parallel processing applications like manufacturing and design simulations. “There are many types of simulations, such as computational fluid dynamics, that are natural parallel processing applications that have historically been limited by the interconnect,” he said. “By leveraging the Lightfleet Corowave technology into systems used for such simulations, the technology can enable all-to-all computa-tional capability with fewer nodes, or more nodes can be added in the same amount of physical space.”
Financial services applications such as those that drive stock and commodity trading are very much publish and subscribe model applications. These applications take in all kinds of data feeds, and the amount of computation they are doing on a specific node is quite complex. Financial trading applications are also extremely sensitive to latency. These applications need to distribute hundreds of thousands, if not millions, of messages per
Geoff described the fabric manager as per-forming the following functions:
n Fabric mastership and allocation – The fabric manager of one node is designated the “master” and coordi-nates the assignment of nodes to wavegroups. From there, the fabric manager arbitrates allocation of nodes to wavegroups.
n Maintaining coherency – Locking wavegroups and updating the comings and goings of nodes in wavegroups.
n Scheduling updates
Now you might remember some previous columns where I described Data Delivery Service (DDS), which employs a publish/subscribe model for software applications. If you do, you’ll notice the nice parallels between DDS and the Corowave software architecture described here. The software architecture not only supports the technical benefits of the hardware interconnect, but also dovetails nicely with application programming initiatives like DDS. So companies leveraging DDS for their new applications will find a natural distributed programming and hardware interconnect environment within this new laser-based broadcast interconnect.
Which markets will see thebiggest impactChris Kruell, Director of Corporate Communications for Lightfleet Corporation, said that while the implications of this technology are far-reaching, the immediate initiatives lie within the government and financial services sector. These sectors use algorithms that are very sensitive to congestion and latency. Implementing the algorithms also enables scaling by using more parallel components. Lightfleet’s Corowave technology allows for broadcast with flat latency, so these applications can be scaled for the parallelism the perfor-mance target requires.
Specific algorithms Chris mentioned in-volve pattern matching. For example, tak-ing various audio samples and matching these samples against a database of voice tracks, key phrases, or other properties. The more nodes involved in the algorithm, the faster the matching can be performed, which can sometimes be a matter of life and death. With the current interconnect environment, a distributed database with regular high-speed switching runs into congestion issues fairly quickly. The band-width expansion issues described earlier can also lead to network congestion, which limits the scalability of this kind of application.
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second while maintaining extra-low, predictable latency. The shared data interconnect of the Lightfleet Corowave technology and the flat latency property it affords are extremely attractive for these kinds of applications.
SummaryThe industry has been moving toward using optics and optical communication for a while. Major system vendors have projects that use optics to communicate between processors. But these initiatives continue to look at point-to-point communications.
But the majority of high-volume network applications are broadcast by nature. The Lightfleet Corowave broadcast interconnect technology, coupled with a software architecture that takes advantage of the technology, is complementary to the publish/subscribe initiatives of many application developers and interoperates with legacy applications. It adds an important piece to the puzzle of advancing today’s communication infrastructure to the next level of usefulness.
For more information, contact Curt at [email protected].
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By tony romero
Tony reminds us of the objectives aimed
for during PICMG’s development of the
Advanced Mezzanine Card (AdvancedMC)
specification and notes that specification’s
place in endeavors including Long Term
Evolution (LTE) and WiMAX.
uring the energy crisis of 1973, E.F. Schumacher, a British economist, published a collection of essays called “Small is Beautiful.” One of his arguments dealt with the false notion of how people
measure their standard of living – assuming that people
who consume more have a higher standard of living. He argued that
since consumption is merely a means to well-being, the aim should be to maximize well-being with the minimum of consumption.
With the current economic and energy situation similar to his day, this mantra holds true with embedded applications – maximize innovation with minimum costs and time-to-market. To meet this need, the small and multifaceted Advanced Mezzanine Cards, also known as AdvancedMC modules, provide standards-based, flexible, low-profile, low-power, and cost-effective building blocks for numerous applications ranging from telecommunications to aerospace and defense to enterprise, industrial automation, and medical.
AdvancedTCA was defined more than five years ago as a next-generation, high-performance telecommunication architecture for core and aggregation layer applications. It was clear that
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designing large footprint, monolithic AdvancedTCA blades would never satisfy a wide breadth of applications. Hence, the AdvancedMC mezzanine standard was born to provide myriad mix-and-match options that can hot swap into AdvancedTCA carrier boards. The PICMG AdvancedMC subcommittee developed the AdvancedMC specification with flexible and high-bandwidth serial interconnect options with throughputs as high as 12.5 Gbps per lane, standards-based IPMI management, multiple form factors, and power requirements so that AdvancedMC modules could be characterized into numerous func-tions. Many of the first AdvancedMC modules were designed specifically for AdvancedTCA-based applications, including high-compute modules with high-bandwidth interconnects, high-speed, high-density I/O interface modules, and storage modules. AdvancedMCs are not limited to processor-based modules, although some AdvancedMCs are called PrAMCs, with the “Pr” standing for “processor.”
PICMG also had the foresight to support not only AdvancedTCA blades, but also future architectures, an approach that enables AdvancedMCs to be plugged directly onto a backplane. It has been a little more than two years since PICMG members ratified the MicroTCA platform specification, and its low-cost, low-profile flexible, and appliance-style architecture blasts the doors wide open for the type of applications that AdvancedMC modules can take on. MicroTCA’s size and cost-effectiveness make it a natural fit for edge or access layer telecommunications applications, military applications where space and power are at a premium such as in an aircraft fuselage or in a Humvee, medical applications such as diagnostic and imaging equipment demanding high-performance and compute-dense solutions, or cost-effective industrial automation or enterprise-level appliances. See Figure 1 for examples of AdvancedMCs and the low-profile MicroTCA platform.
Today AdvancedMC modules incorporate a wide array of functions to meet the growing demand for numerous embedded applications. The AdvancedMC ecosystem is strong and evolving, supported by a multitude of vendors, leading to new innovations and products at a fast rate.
Market forces at workMany market forces are swelling the de- mand for AdvancedMCs, and MicroTCA has helped boost this demand substantially. Embedded designers want to add higher levels of innovation, reach more customers,
reduce the costs, and launch the product quickly. Their architectures are testing the boundaries in higher computing densities, higher bandwidth, lower power, and lower profiles. Listed here are a few examples.
4-G wireless network applicationsSprint is working to roll out a WiMAX service, while AT&T and Verizon are focused on Long Term Evolution (LTE), which is the successor to GSM/UTS. The base stations that support these networks need to be modular and scalable, high-bandwidth, low-profile (to fit small cabinets in remote locations), and cost-effective. In addition, an organization called Open Base Station Architecture Initiative (OBSAI, www.OBSAI.org) is focused on creating an open market for base stations to reduce development efforts and costs.
With many network equipment providers implementing IP Multimedia Subsystems (IMS) for Voice over IP (VoIP), and video (IPTV), and many other services, OEMs have designed their products with AdvancedTCA and AdvancedMCs. These same vendors can develop scaled-down versions using MicroTCA for smaller deployments and continue to leverage the same AdvancedMC modules. In fact, t e use of MicroTCA, which provides ample compute and networking capacity for many installations, has the potential to increase vastly the quantity of AdvancedMCs used in these types of applications.
Aerospace and defenseOn the aerospace and defense side, two significant trends are generating demand. The first is the continuing migration to COTS standards-based embedded platforms. The main drivers are to reduce material and development costs while compressing the time needed to reach the market. The second trend is the U.S. Department of Defense (DoD) initiative called Network-Centric Operations (NCO) and the UK’s Network Enabled Capability (NEC), whose doctrine is to develop standard communication infrastructures to link the diverse set of intelligence gathering platforms, policy makers, commanders, war fighters, and support personnel for all the services. Improved information sharing will ensure a higher level of interoperability and situational awareness and enable highly synchro-nized missions.
Initiatives include the DoD’s Global Information Grid (GIG), the U.S. Army’s Future Combat Systems (FCS), and the U.S. Navy’s Cooperative Engagement Capability (CEC). Some applications will require a fully ruggedized platform and benefit from the efforts underway within PICMG to specify a ruggedized version of MicroTCA. Other applications, housed in spaces with humans where neither extended temperatures and low air pressure nor extreme shock and vibration are factors, will be able to take advantage of the existing MicroTCA platforms and their low costs.
Development budgets are getting tighter, performance and service expectations are increasing, densities are getting smaller, and consumers are demanding lower prices. In this atmosphere the drive to lower Total Cost of Ownership while offering innovative high-performance applications continues to push the envelope. The “Small is Beautiful” AdvancedMC ecosystem is there to help meet these needs.
Tony Romero is a Senior Product Manager with Performance Technologies. Tony has worked extensively in system architecture and product development of platforms with CompactPCI packet-switched backplanes, both pre-PICMG 2.16 and PICMG 2.16. His responsibilities have included managing computing platform products that comprise chassis, midplanes, system management, power supplies, and cooling. Prior to working at Performance Technologies, Tony worked for Primus Knowledge Solutions and Dell Computer Corporation.
Performance Technologies • www.pt.com • [email protected]
Figure 1
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AdvancedMCs are finding their
By venkataraman PraSannan
AdvancedMCs are ideal for introducing modularity, flexibility, and scalability while addressing many telco requirements including hot swap. However, the requisite thermal and form factor specifications place limits on the computational and I/O configurations these mezzanine cards can implement.
Understanding the AdvancedMC solution space, many system designers use modules for adjunct functionality, as evidenced by most AdvancedTCA implementations incorporat-ing a module site, particularly compute blades. The market for modules is strong, creating demand for a large number of available products that support solutions for computing,
AdvancedMCs provide an effective means to imple-
ment standards-based modular entities, but they
might not be a solution for everything. Determin-
ing the right fit requires an understanding of
thermals, connectivity, usage models,
and functional modularity.
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storage, and I/O, just to name a few. In addition to telecom, there are AdvancedMC success stories in Military, Aerospace, and Government (MAG) and also in low-end gateway appliances such as WiMAX base stations and other access boxes. Access deployments exceed core and edge, so the sheer size of the opportunity bodes well for AdvancedMC.
The excitement over AdvancedMC benefits, which include hot swap, fewer field replaceable units, and a Lego Block design approach, has some enthusiasts believing modules should be the staple for system designers. Designers need to consider these data flow and system requirements, however:
n 1 GbE versus 10 GbE fabricn Which processor architecture is usedn Options for addressing security, line cards, and redundancy
After considering the points just noted there will be circumstances where modules are too limiting. It’s essential to determine the right fit for AdvancedMCs in light of thermals, connectivity, usage models, and functional modularity requirements.
Thermal testingWhether a designer is working with a quad module AdvancedTCA carrier blade or a compute blade with a single site, it’s necessary to evaluate the airflow. For example, a storage module with a hard disk drive mounted on top can block the air needed to cool downstream components. Thermal solutions require engineering and validation effort, and it’s not enough to just dial down the power or the number of AdvancedMC modules. Having conducted thermal modeling on our carrier card with four module sites, we published guidelines informing customers how to work with it.
There are no universal thermal guidelines for AdvancedMC because environmental conditions are codependent on the type of modules employed and how they affect the airflow. System designers should be careful, because even if all the specs are met, it’s still possible to run into cooling issues.
“One of the pain points for most people working in AdvancedTCA is cooling the blades. To address that, we’ve developed a set of interoperability requirements based around thermals and, of course, test procedures corresponding to those requirements,” says Todd Keaffaber, Communications Platforms Trade Association (CP-TA) Technical Work Group Chair.
Module designers might not be able to max out the memory or use the highest performance CPU and still comply with the 40 W limit for a single-width board. As the silicon technology advances, shrinking die sizes and lowering thermals, AdvancedMCs will become increasingly more attractive. Progress is being made on performance-per-watt by devices such as the 2.2 W Intel Atom processor, which might be a good fit for AdvancedMC. Still, more help is needed from silicon makers to lower the power consump-tion of processors, memory, and physical layer chips.
Connectivity challengesWhen it comes to I/O, it’s really about Ethernet, and the question is whether to deploy 1 GbE or 10 GbE. E1/T1 and STM-1 aren’t going away, but the dominance of Ethernet will continue for at least the next few years. Has any technology taken on Ethernet and won?
AdvancedMC is a good fit for I/O functionality, such as generic E1/T1, but designers must match their I/O through-put with their processing capability. Plac-ing multiple 1 GbE and 10 GbE interfaces requires a lot of processing horsepower,
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and without a multicore processor and hardware acceleration the design could be unbalanced. We implemented an OCTEON CN58xx/CN38xx from Cavium, which can provide wirespeed packet processing for L2-L7 for the full line rate of 4 Gbps (4 x 1 GbE), as shown in Figure 1.
As networks transition to 10 GbE, module designers anxiously await optimized 10GBASE-T physical layer components (PHYs) that consume less power than the 10 to 12 W solutions launched last year. More costly 10 GbE optical modules consume about 3 W, but they are not cost-effective for some applications. Fortunately, lower-cost copper-based solutions, which operate within the same power specifications as today’s optical modules, are projected in the not too distant future.
For faster line rates, transceivers that support the new IEEE 802.3ap standard (also referred to as 10GBASE-KR) are available for running 10 Gbps serial data over backplane systems. Historically, Ethernet-based backplane interfaces were not standardized because Ethernet was designed for box interfaces. As a serial protocol, 802.3ap is simpler to route than Ethernet. Still, designers should be judicious when dealing with 10 Gbps, which might call for a beefed-up processor to handle the high throughput.
AdvancedMC is a clear winner for access devices where modularity is a require-ment, GbE performance is sufficient, and there’s less emphasis on availability and redundancy. Performance bottlenecks are less common in systems with lower I/O and computing requirements, and OEMs can easily employ standards-based modules that provide I/O scalability and reduce development effort.
Isolate and protectThe modularity of AdvancedMCs supports some practical usage models. It provides a means for customers to protect their Intellectual Property (IP) by isolating functionality onto custom modules. For example, customers with proprietary accelerators or failover mechanisms can deploy their functionality without revealing crucial details to third parties. Customers can also create a family of products using module options, like offering storage modules with a range of capacity or computing modules with different levels of performance.
MAG and some other verticals value standards-based modularity because it reduces certification and inventory costs. Modules can be upgraded as more processing power becomes available
Figure 1
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without having to upgrade and recertify the entire system. This is valuable because MAG design cycles are extremely long due to the need to address special requirements for security, ruggedization, sealed enclosures, and multiple radios. So CPU processing technology can be outmoded by the time the system actually starts to be deployed, and a modular approach allows the prime contractor to swap out the module when instructed to do so.
Is AdvancedMC a commodity? Not exactly. Yes, AdvancedMCs offer more reuse and economies of scale for relatively generic functionality (general-purpose computing versus application-specific protocols). But because low value subsystems are typically commoditized, this doesn’t apply to many AdvancedMC modules that implement fairly sophisticated functionality. AdvancedMCs are used to standardize and reuse functionality, but it’s difficult to achieve the large volumes needed to make them commodities. So don’t expect to buy AdvancedMC modules at your neighborhood electronics store.
Functional modularityIt’s important to take a top-down approach when identifying functional modules. System designers should take a platform or system approach by first partitioning the architecture into efficient subsystems and then modularizing those subsystems. In this way, they will define the right modules without messing up the data flow and the architecture.
When using a bottom-up approach – defining and piecing together a set of common modules – bottlenecks might arise from poorly provisioned modules lacking sufficient processing or I/O resources. In other words, designers shouldn’t skip performing thorough data throughput analysis when building complex equipment out of modules.
Cost/performance trends are keyAdvancedMC modules won’t solve every computing and I/O challenge, but they have their place, and developers are figuring out where they make the most sense. AdvancedMCs may play a key role in access equipment located at the network’s edge, where the scalability, size, and relatively low cost of MicroTCA are compelling. This growing access equipment market can deploy bare-bones, low-end MicroTCA systems, including chassis, backplane,
and virtual carrier card, for less than $500. Customers in other vertical markets, where cost, modularity, and standards-based solutions are highly valued, will pay close attention to the cost/performance trends of AdvancedMC-based solutions.
Venkataraman Prasannan (VP) is the Senior Director of ATCA Product Line Management at RadiSys Corp. He has more than 15 years of telecom and networking experience in marketing products and business management. Venkataraman is a frequent speaker and author on computer/communications topics for the communications industry. Prior to joining RadiSys, Venkataraman was with Tektronix where he was involved in various video networking and telecom test products for SONET/SDH, ISDN, and DS1/DS3 products. He holds Masters degrees in Business and Engineering and has prior experience as a software engineer working on real-time instrumentation.
RadiSys Corporationwww.radisys.com • [email protected]
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ATMIVAMC controller designed for use in all aspects of telecom networks • The ATMIV includes support forATM host termination, switching, and L2/L3/L4 or higher interworking between Gbe and ATM interfaces • With support for AAL2 and AAL5, the ATMIV has the ability for real-time voice and video over AAL2, as well as signaling and IP over AAL5 in 3G networks • Enables development flexibility in building nextgeneration infrastructure and can be configured in many ways depending on customer specificationsand preferred architecture • Application examples: 3G RNC, MSC, SGSN, and Node B; Voice over Packet; Video Streaming; Broadband Networks; ATM to IP gateways; Femtocell access controllers
HDCIII-SS7/ATMSignaling controller • 8 software selectable trunks of full E1, T1, or J1 per card • 2, 4, and 8 trunk card options available • A combination of up to 248 MTP2 LSLs and 8 MTP2 HSLs • Simultaneous support for MTP2 LSLs, HSLs, and SS7 ATM AAL5 • Supports up to 256 channels of one or a combination of protocols on one card, including Fr, HDLC, X25, LAPB/D/F/V5 • PMC, AMC, PCI/X, and PCIe board formats supported from a single driver
Adax Europe Ltd.www.adax.com
AMC-1000AdvancedMC processor board • Core 2 Duo single-width, mid-, full-size • Intel 3100 chipset • Single channel PC3200 DDR2 REG/ECC SODIMM RAM • Supports a 2 GB single channel PC3200 DDR2 REG/ECC SODIMM RAM and AMC.1 Type 1/4 or 8x PCIe x1; AMC.2 Type E2 (GbE 2x at Port 0-1); AMC.3 Type S2 (SATA 2x at Port 2-3) interfaces • Fully implements the Advanced Mezzanine Card modular design concept and brings feature-rich processor capabilities to an AdvancedMC carrier board and MicroTCA systems with the appropriate mechanical and electrical connections
ADLINKwww.adlinktech.com
Core Duo/Core 2 Duo PrAMCHighly integrated single-width, mid-size processor AMC • Supports Intel Core Duo/Core 2 Duo processor LV • Intel 3100 chipset 400/533 MHz FSB • Up to 2 GB DDRII 400 MHz SDRAM with ECC • One GbE (RJ-45), one USB 2.0 port, and one console port (mini-USB) to front panel • AMC connector routes dual GbE SerDes x2, SATA x2, USB x2, dual PCIe x4, or single PCIe x8 • Supports IPMI v1.5 and Serial-over-LAn function
Pentium M/Celeron M PrAMCHighly integrated single-width, mid-size processor AMC • Supports Intel Pentium Mprocessor Low Voltage or Celeron M processor Ultra Low Voltage • Intel 3100 chipset 400/533 MHz FSB • Up to 2 GB DDRII 400 MHz SDRAM with ECC • One GbE(rJ-45), one USB 2.0 port, and one console port (mini-USB) to front panel• AMC connector routes dual GbE SerDes (x2), SATA (x2), USB (x2), dual PCIe x4, or single PCIe x8 • Supports IPMI v1.5 and Serial-over-LAN function
Advantechwww.advantech.com
Shown here are recently introduced AdvancedMC modules and AdvancedMCdevelopment tools, controllers, connectors, and handles.An expanded guide is available at advancedmc-systems.com.
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V3020Single-width half-height AMC supporting PCi express over the backplane• High-performance low-power connectivity and packet processing for applicationsrunning in AdvancedTCA or MicroTCA platforms
AdvancedIO Systemswww.advancedio.com
A3803-AMCSerial Attached SCSI (SAS) host board adapter • 3 GBps per port, 8 ports • Connects to both SAS and SATA hard disk drives • AMC.3 support • AMC.1 support for PCI Express (x1, x2, x4, or x8) • LSI Logic’s Fusion-MPT featuring more than 140,000 I/O per second • Aggreg2ate I/O port bandwidth of 24 Gbps and full duplexcapability • Leverages existing SCSI infrastructure for investment protection and ease of migration • Allows point-to-point connection and higher availability with dual ported drives • Software support for all majoroperating systems including Windows, Linux, vxWorks, and LynxOS
A7404-AMC4 channels of 4.25 Gbps Fibre Channel performance • Aggregate I/O port bandwidth of 17 Gbps matched toa 20 Gbps PCI Express interface • Four port, 4 Gbps Fibre Channel Host Bus Adapter (HBA) with support forinitiator and target mode SCSI and IP protocol • AMC.0, AMC.1 compliant • Supports PCI Express x8 for upto 20 Gbps of aggregate data transfer • 4 independent channels at 4 Gbps each via SFP optical interface• Auto-negotiation support for 1, 2, and 4 Gbps links, fabric, point-to-point, and arbitrated loops • Can operate as an initiator (HBA) or as a target mode device allowing system builders to create RAID systems • Support for Windows, Linux, and vxWorks operating systems
Astek Corporationwww.astekcorp.com
F1/GX-AMCHybrid TI TCI6487 DSP and Altera Stratix II GX reconfigurable AMC • High-performance multicoreTI TMS320TCI6487 DSP: 3.0 GHz of total raw DSP processing power; 3 MB of on-chip L2 SRAM/cache; OBSAI and CPRI antenna interface support; specialized coprocessors • High-density Altera Stratix IIGX FPGA implementing BittWare’s ATLAnTiS framework for control of i/O, routing, and processing:15 full-duplex SerDes transceivers; up to 132,540 equivalent LEs; 252 embedded 18x18 multipliers(63 DSP blocks); 6.7 Mbits of RAM • IP available for: Serial RapidIO, PCI Express,Gbe, 10 Gbe/XAUi, CPri, and OBSAi
FPGA + DSP AMCsBuilding blocks for communications and wireless applications • Combining the inherent flexibility of MicroTCA with a reconfigurable AMC and a variety of AMC front panel modules creates a system that can be easily upgraded or modified without initiating frequent redesigns, enabling system designers to extendproduct life cycles, enable hardware reuse, and decrease time-to-market
BittWare www.bittware.com
AMC ConnectorAMC mezzanine compression-style connectors• Meets AMC specifications
Cinch Connectors, Inc.www.cinch.com
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AMC-D1F1-1200A mid-size AdvancedMC module that offers a compact, high-performance DSP/FPGA signal processing solution for AdvancedTCA and MicroTCA systems • Texas Instruments TMS320C6455 digital signalprocessor running at 1.2 GHz and a Virtex-4 FX100 FPGA from Xilinx • Optimized for applicationsrequiring high-end signal i/O bandwidth in a compact mid-height AMC form factor, such aswireless baseband, image processing, defense, and aerospace
AMC-6487CAn Advanced Mezzanine Card offering signal processing performance and bandwidth in a highly compact package • First single-width, full-height AdvancedMC card to be based on Texas instruments (Ti) multicore TMS320TCI6487 DSP • Suitable for wireless baseband and otherprocessing-intensive applications such as WiMAX and Long Term evolution of 3GPP (LTE) • Three software programmable TCI6487 DSPs, each con-taining three high-performance C64x+ cores running at 1 GHz as well as 3 MBon-chip memory • Multicore DSP provides significantly more effective performance than Ti’s single core TMS320C6455 device, and also affords a myriad of high-speed peripherals including Gbe, ddr2, antenna interface links (OBSAi/CPri), and two Serial rapidiO interfaces
CA-AMC-D4F1A single-width AdvancedMC module designed for high-bandwidth, high-performance signal process-ing, providing DSP and FPGA processing and 10 Gbps Serial RapidIO • 4x Texas Instruments TMS320C6455 DSPs running at 1 GHz, each with 256 MB of x32 DDR2-500 SDRAM • Xilinx FX40, FX60, or FX100 FPGA • Separate 32-bit 125 MHz EMIF connection to eachDSP plus I/O • Up to 18 MB of x36 NBTRAM • Serial RapidIO using onboardTundra Tsi578 switch gives full 4x 10 Gbps bidirectional lin s between allprocessing elements plus two external links to AdvancedMC connectorand one front panel port
CommAgilitywww.commagility com
Card Edge Connectors for AMC and MCH170-pin high-speed signal connector • Used for the interconnection of AMC and MCH modules into the backplane • Transfer high datarates of up to 12.5 Gbps • AMC backplane connector features press-fit eye of the needle contacts • Designed to allow up to 200 mating cycles • Integrated shield between the contact rows insures the connector performance in transferring high data rates
Conec Corporationwww.conec.com
CEN-RL20-CAVM20 Gbps programmable Cavium OCTEON/FPGA AMC • CEN-RL20 Cavium OCTEON daughter card • One (1) Cavium OCTEON 38XX or 58XX processor • 4 to 16 MIPS64 processors • 10 Gbps full-duplex application performance • Advanced security and intelligent application hardware acceleration including TCP,pattern matching, and compression/decompression • Memory: 2 GB DDR2 SDRAM (SODIMM); two (2) 36 MB RLDRAM, 64 MB flash • Front panel mini-USB serial console port • CEN-RL20 Xilinx Virtex-5 FPGA base card • One (1) Xilinx Virtex-5 LX110T FPGA for I/O, processing, and functional customization • Memory: Two (2) 18 Mb QDR memory (10 Gbps+ bandwidth), 64 MB DDR2 SDRAM, 64 MB flash • Custom, third-party, or off-the-shelf IP support • Support for one fabric and four telecom clocks • 20 Gbps wirespeed architecture • 20 Gbps packet streaming bandwidth via dual SPi4.2 interfaces between Cavium OCTeOn processor and Xilinx Virtex-5 FPGA • Front panel 10 Gbps CX-4 I/O connector to Xilinx Virtex-5 FPGA• Multiple 1 GbE, 10 GbE (XAUI), PCI Express, and Serial RapidIO backplane inter-faces • Ports 0 & 1: 1 GbE • Ports 4-7, 8-11, 17-20: 10 GbE, PCIe, Serial RapidIO.
CorEdge Networkswww.coredgenetworks.com
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AM 100/20xA Dual-Core Intel Xeon processor AdvancedMC module • Double-width,full-height AdvancedMC, 2.0 GHz or 1.66 GHz Dual-Core Xeon processor, up to16 GB ECC SDRAM • Suitable for AdvancedTCA, MicroTCA, and proprietary plat-forms • Utilizes 64-bit Intel 3100 server chipset, interfacing up to 16 GB of soldered DDR2 ECC memory • x8 PCI Express fabric connection (AMC.1 Type 8) • IPMI 1.5 and hot-swap compliant to AMC.0 • Serial ATA150 (AMC.3 Type S2) and dual GbE channels (AMC.2 Type E2) • Front panel supports graphics interface, RS-232 port, two USB ports • Support for Linux, Windows 2000, Windows Server 2003, Windows XP, Windows XP Embedded, and QNX
CRT and DFP AMCSingle-width, full- or mid-height AdvancedMC, CrT, and dFP graphics adapter, option for 2.5" SATAHard Disk Drive fitted • Suitable for AdvancedTCA, MicroTCA, and proprietary platforms • Analog CRToutput, up to 1,280 x 1,024 pixels at 85 Hz refresh rate • Up to 24-bit color • Digital flat panel output,up to 1,280 x 1,024 pixels at 60 Hz refresh rate • Up to 24-bit color • SATA150 (AMC.3 Type S2, port 2)• x1 PCI Express fabric connection (AMC.1 Type 1, port 4) • IPMI 1.5 and hot-swap compliant with AMC.0• Support for Linux, Windows 2000, Windows Server 2003, Windows XP, Windows XP Embedded, and QNX
Single/Dual HDD AMCDouble/single-width full- or mid-height AdvancedMC • Option of one or two 2.5" SATA hard disk or CompactFlash drives fitted • Suitable for AdvancedTCA, MicroTCA, and proprietary platforms • Compatible with RAID 0 and RAID 1 systems • Serial ATA150 (AMC.3 Type S2, ports 2 and 3) • IPMI 1.5 compliantto AMC.0
SY AMC/108 MicroTCA Development SystemPreconfigured system for development or testing AdvancedMC modules or a target MicroTCA application• High-performance processor board based on a 2.16 GHz Intel Core 2 Duo processor, graphics, andstorage as well as MCH, PSU, and cooling system
Concurrent Technologies, Inc.www.gocct.com
AMC Extender CardThe NAMC-EXT is an extender board for Advanced Mezzanine Cards (AMCs) • Support for all fabricinterfaces • 3 clock lines • Management and payload power can be disconnected individually toenable power measurement
AMC Load BoardAdvancedMC full-size (single-width, full-height) load board dedicated for testing the cooling and powerof MicroTCA systems • The board is hot-swap pluggable and has IPMI support • AdvancedMC load boardwith IPMI support • Configurable load from 0 W to 70 W in 7 steps • Configurable load by IPMI commands or push button the front panel • Onboard temperature sensors
Elma Electronicwww.elma.com
AMC.0 B+ Connectors170-circuit AdvancedMC connector solution for signal transmission up to 12.5 Gbps, with low cross talk • ept’s AMC.0 B+ connectors support PICMG AdvancedTCA industry specifications • The new press-fit design was optimized to provide significant cost and reliability advantages over other termination technologies • The press-fit process allows for the use of a standard “flat rock” insertion tool,requiring no custom tooling • The connector is also available without pegs for applications in which the AdvancedTCA guiding systemis not desired • ept’s AMC.0 B+ connectors are RoHS compliant
ept, Inc. USAwww.ept.de
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KSI8560 AMC ModuleFlexible single-wide AdvancedMC (AMC) module that serves as a General Purpose Processor (GPP) AMC or a high-density WAN I/O AMC • As a GPP module, the KSi8560 gives networking equipment manufacturers a cost effective and powerful modular processing element with its onboard Freescale PowerQUICC III MPC8560 processor • With its add-on WAn interface, the KSi8560 provides users a high-density i/O module ideal for data and signaling applications such as signal-ing gateways and softswitch signaling interface cards • Up to eightT1/E1/J1 interfaces are available • AMC (PICMG Advanced Mezzanine Card Base Specification) with up to 8 software selectable e1/T1/J1 interfaces• Freescale Semiconductor MPC8560 PowerQUICC III integrated communicationsprocessor • Up to 256 MB Double Data Rate (DDR) SDRAM with Error-Correcting Code (ECC) • 4 MB boot flash with redundancy, and up to 1 GB user flash • 16 MB Pseudo StaticRAM (PSRAM) • One 100 and two 10/100/1000 Ethernet ports • PCI Express fat pipe• Optional front panel E1/T1/J1 interfaces
PrAMC-6210 Processor AMC ModuleMPC8641d PowerPC based AdvancedMC Module is designed to the PiCMG AdvancedMC specification • Full and mid AdvancedMC form factor • Freescale MPC8641D PowerPC microprocessor • Dual-core processor capable of symmetric or asymmetric multiprocessing • Up to 2 GB Double Data Rate 2 (DDR2) SDRAM using dual memory controllers• Dual 4 MB NOR flash banks • 1 GB NAND flash • PCI Express and GbE fat pipes region interfaces
PrAMC-7210/7211 AMCdesigned to the AdvancedMC spec, making it usable in AdvancedTCA and MicroTCA based applications requiring high availability, scalability, and low cost • Intel Core 2 Duo processor core with 4 MB L2 cache running at 1.5 GHz• 667 MHz front side bus, connecting processor and Intel 3100 chipset • Up to 4 GB DDR-400 memory with ECC support • MontaVista CGL or Wind River Pne Linux operating environment combined with Basic Blade Services software compliant to the SA Forum HPI layer • AdvancedMC front panel support for USB 2.0, Intel 82551 based 10/100 Fast Ethernet and serial console port • 2 MB of BIOS flash with boot failover support
SpiderWareM3 Intelligent Platform Management ToolPlatform management software designed for remote management, monitoring, and maintenance of multiple IPMI-compatible platforms • Automated acquisition and update of IPMI information from AMC modules and platforms • Intelligent alarm monitoring and prioritization • Fault and alarm alerts • Sensor threshold setting • Monitoring of CPU and memory usage • Temperature monitoring and thresholdsetting • Field-replaceable unit information • HPI and XML over TCP/IP interfaces • DHCP configuration management
Emerson Network Power Embedded Computingwww.emersonnetworkpower.com/embeddedcomputing
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XPedite5140Freescale dual-Core MPC8641d Processor-based AMC module (AdvancedTCA/MicroTCA)with Dual-Bank DDR2 and Quad GbE • Freescale MPC8641D processor with dual e600 cores at 1.0 to 1.5 GHz each • Dual-bank DDR2-400/533/600 SDRAM, up to 4 GB (2 GB per bank) • AMC.1 x1/x2/x4/x8 PCI Express at 2.5 GBauds per lane• Quad GbE interfaces • 32-256 MB soldered NOR flash • 1-4 GB NAND flash• 1 MB SSRAM • Dual SATA II over AdvancedMC • VxWorks BSP • INTEGRITY BSP • QNX BSP • Linux LSP
XPedite6240Dual Freescale MPC7448 PowerPC Processor AMC module with two GbE ports • Dual Freescale MPC7448 PowerPC processors running at up to 1.7 GHz • Supports up to 1 GB of DDR SDRAM • Supports up to 128 MB of soldered flash • Two GbE ports • Two RS-232 ports • Optional PCI Express AMC Transport • Optional Ethernet AMC Transport • Green Hills INTEGRITY • QNX Neutrino BSP withSMP support • Linux LSP with SMP support • VxWorks BSP with VxMP support
XPedite6244Freescale MPC7448 PowerPC Processor AMC module with Gbe, USB, and SATA suppo t for MicroTCA/AdvancedTCA systems • Freescale MPC7448 PowerPC processor running at up to 1.7 GHz• Complies to AMC.0 and MicroTCA.0 • Supports up to 1 GB of 400 MHz DDR SDRAM • Supportsup to 64 MB of Soldered NOR Flash • Two SFP Ethernet ports • Two RS 232 ports • One USB port• Optional Ethernet AMC transport • Optional SATA transport • Green Hills INTEGRITY BSP,QNX Neutrino BSP, Linux LSP, VxWorks BSP
XPedite7040intel Core duo or intel Core2 duo processor-based AMC module with Gbe, USB, and SATA support (for AdvancedTCA and MicroTCA systems) • Intel 3100 chipset • Front-panel GbE • Front-panel RS-232 serial • Front-panel USB 2.0 • Complies with AMC.0 and MicroTCA.0 • AMC.1 x4 PCI Express Fat Pipe interface • AMC.2 dual GbE 1000BASE-BX interfaces • AMC.3 Dual SATA interfaces • Two PC3200 SO-RDIMMs, up to 8 GB • Up to 4 GB of NAND flash • Up to 4 MB of Firmware Hub (FWH) storage • AMI BIOS • Windows XP/Vista support Linux LSP • VxWorks BSP • QNX BSP
XPedite8040P.A. Semi dual-Core PWrficient PA6T-1682 Processor-Based AMC module (for AdvancedTCA and MicroTCA) • P.A. Semi PWRficient PA6T-1682 processor with dual PA6T Power Architecture cores at upto 2.0 GHz each • Dual front-panel GbE • Complies with AMC.0 and MicroTCA.0 (µTCA)• AMC.1 x8 PCI Express • AMC.2 10 GbE XAUI • AMC.2 GbE • Up to 4 GB of NAND flash • Two channels of DDR2 ECC SDRAM, up to 4 GB (2 GB each) • Up to 3 MB of LPC NOR flash • Front-panel Micro DB-9 RS-232 serial port • Linux LSP • VxWorks BSP • QNX BSP
XPort1040Multiprotocol four port Serial AMC module based on the MPC8270 PowerQUICC II Series • PC8270 atup to 450 MHz with integrated PCI • Four SCCs support a broad range of serial protocols • Softwareconfigurable serial interface modes • Hot swap support • 32-256 MB SDRAM • 16-128 MB soldered flash • 512 KB socketed flash • Two RS-232 SMC ports • Front or rear I/O • VxWorks BSP • Linux LSP
Extreme Engineering Solutionswww.xes-inc.com
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Telum 210 SASAn AdvancedMC supporting 2.5" onboard SAS hard disk drive storage with an LSi 1064e SAScontroller designed for use with AdvancedTCA Single Board Computers (SBCs), carriers, and MicroTCA platforms • 4 SAS channels • AMC.1 and AMC.3 compliant • Supports up to 2 off-board SASchannels • Supports up to 8 PCI Express lanes at transfer rates of 2.5 Gbps per lane full duplex • SAS hard disk drive up to 146 GB capacity • Supports 1.5 and 3.0 Gbps SAS data transfers • IPMI v2.0 compliant MMC • Supports RAID with integrated striping and mirroring firmware; no software support required • Supports single and dual port SAS drives • Support for Solaris, Linux, Windows 2000, and Windows XP • Available with mid-size or full-size faceplates
Telum NPA-58x4Intelligent high-performance 4-port GbE IP Packet Processor AdvancedMC • Designed for NEBScompliance • Meets requirements of demanding applications such as 3G/4G networks and IPTV• Enables secure, high-speed connectivity and complex security processing for content-awareapplications that need wirespeed performance • 600 MHz Cavium OCTEON CN5850 multicore Secure Communications Processor • U to 4 Gbps line-speed packet processing for Layers 2-7 • Suitablefor either AdvancedTCA or MicroTCA platforms • Single-width module available in either full-size or mid-size form factor • Can be optionally configured with either four front panel GbE ports supporting 1000BASe-T or 1000BASe-SX via Small Form Factor Pluggable (SFP) transceivers or four ports of Gbe to the AdvancedMC Extended Options Region to support Rear Transition Module applications • With four GbE lanes to the Fat Pipes Region, the module is fully optimized to avoid potential bottlenecks
GE Fanuc Intelligent Platforms, Inc.www.gefanucembedded.com
AdvancedMC Plug Connectorinjection molding tolerances are much tighter than what can be achieved in PCB production• Sophisticated design significantly reduces insertion and extraction forces • Consistent qualityguarantees 200 mating cycles and long service life • Enables the use of PCBs outside of the1.6 mm ±10% thickness range • Completely AMC.0 R2 spec. compliant • The plug connector isreplaceable, potentially reducing board scrap costs
AdvancedMC Connector (B+ style)AdvancedTCA - MicroTCA Connectors • Press-fit termination technology for connection reliability and assembly • Optimized footprint enables routing onlow layer count; Fully compliant with PICMG AMC.0 and MicroTCA specs• Excellent routing capabilities with wide-routing channels and low crosstalk • *con:card+ Design Enhancements • GuideSpring offsets PCB fingertolerance deviations by constantly pressing module against the opposite wall• GuideSpring secures module position against shocks and vibrationspreventing loss of contact and surface water
Harting Technology Groupwww.harting.com
LeanSTORDirectly incorporates NAND flash on AMC boards • Frees space to mount additional components onto AdvancedTCA system boards • Free up 7" x 3" (approx.) of space on the AdvancedTCA board formore components • Create a lighter product by eliminating the heavier solid state or hard drivecase • Improve shock and vibration performance with flash components directly on board• Improve time to market with the completed solution, fully tested and ready for integration• Simplify your design and procurement efforts • Capacities available: 32 GB to 128 GB
Intelliam, Inc.www.intelliam.com
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ProduCt GuIdEAdvancedMC
34 y August 2008 y CompactPCI and AdvancedTCA Systems
iSPAN 36CA AMCAdvancedMC, 4 port GbE packet processing • Delivers a high capacity line rate engine foruse in AdvancedTCA, MicroTCA, and other form factors to address the needs of iPSeC acceleration, policy management and routing, and content inspectionand management in the emerging 3G/4G, iMS, and voiP infrastructure appli-cation elements • AMC implementation of the Cavium Networks next generation 58xx multi-core Octeon network Services Processor family up to 600 MHz with support for 4 to 12 cores • 4x GbE interfaces on front panel • 4x GbE (AMC.2) + PCIe x1 (AMC.1) interfaces to the AdvancedMCconnector with management support across either interface • Up to 1 Gb of DDR2 SDRAM and optional RLDRAM for pattern matching and fast lookup • Delivered with software solutions for applications such as iPSeC acceleration, TCP/iP, and SrTP ofload
Interphasewww.interphase.com
Kaparel AdvancedMCAdvancedMC modules are plugged directly into a backplane without a carrier card • MicroTCA stands out dueto its very small design and its high scalability and reduced system costs • Compact design allows a variable installation in 300 mm deep, 482.6 mm (19" ) enclosures or instrument cases and wal -mounted enclosures• Complies with PICMG MicroTCA 0 R1.0 and AMC 0.R1.0 • System availability of at least 99.999% • Hot-swap compatible • 19" rack-mount, 482.6 mm, 3U, 200 mm deep • Stainless steel construction provides excellentcorrosion resistance • Available with 14 slots • MCH and AdvancedMC and power modules plugged directly into the backplane • Compact design for variable installation • RoHS compliant • Slot cooling 20 to 80 W per module• Full range of faceplates and filler panels • Air management panels and handles available
Kaparelwww.kaparel.com
AM41001.5 GHz Dual Core Freescale PowerPC MPC8641D • Up to 2.3 MIPS/MHz computing performance and highest ethernet bandwidth suitable for modular AdvancedTCA carriers or highly inte-grated, redundant MicroTCA multiprocessing systems • Integrated Altivec 128-bit Vector Processing Unit, which also replaces DSPs • Fits telecommunication equipment manufacturers and enterprise datacoms’ needs • Also suitable for medical, industrial imaging, and military/aerospace • Four GbE interfaces have advanced capabilities for TCP and UDP checksum acceleration • QoS support • Packet header manipulation • Able to sustain highest datarates • Suits applications with a demand for high data throughput • Vectorprocessing unit minimizes cache pollution while processing massive amounts of data • Up to 2 GB of soldered DDR2-SDRAM • 4 MB bootable redundant NOR flash
AM4520 SAS AMCFull-size/mid-size (AMC.0 Rev 2.0); AMC.3 compliant • Management through IPMI 1.5 implementation • Up to146 GB capacity; 10,000 rpm, 4.1 ms average seek time; 8 MB cache buffer for improved performance• S.M.A.R.T. technology capable • Power On Hour (POH) IPMI counter support to diagnose disk usage in termsof number of hours
AM5010AMC processor module • Double-width/mid-size • Low power budget with Intel Core2 Duo 1.5 GHz • Up to 4 GB SDRAM memory (soldered) with ECC running at 400 MHz • Graphics interface • Onboard SATA HDD optional• Up to 8 GB NAND flash memory via onboard USB 2.0 flash controller • Flexible Gigabit and PCI Express fabric interface • Monitoring features • PICMG AMC.0/.1/.2/.3 compliance • IPMI v1.5 support
Kontronwww.kontron.com
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ny
ProduCt GuIdEAdvancedMC
CompactPCI and AdvancedTCA Systems y August 2008 y 35
LTC4223-1Dual supply (12 V and 3.3 V) hot swap controller for Advanced MezzanineCard • Allows safe insertion into live AdvancedMC or MicroTCA backplane• Controls 12 V Main and 3.3 V auxiliary supplies • Limits peak fault current in ≤1µs • High side current sense, adjustable current limit with circuit breaker • Integrated 0.3Ω AUX switch • LTC4223-1: Latch Off After Fault LTC4223-2: Automatic retry after fault • Thermal shutdown protection • 16-lead SSOP and 5 mm x 4 mm dFn packages
Linear Technologywww.linear.com
Ensemble MPC-102A dual-core 8641D AMC module • Offers Serial RapidIO or PCI Express connections to the carrier card, along with four Gbe connections (two to the panel and two to the AdvancedMC connector), a SATA port, and dual RS-232 connections • Up to 10 Gbps raw I/O bandwidth on Serial RapidIO • 1.3 GHz PowerPC • 2 GB DDR2 SDRAM • Ideal for networking applications that process radar or sonar data
Ensemble MPQ-101Serial RapidIO PowerQUICC III AMC Module • Exceptionally powerful pro-cessing and Serial RapidIO connectivity • Onboard Freescale MPC8548E PowerQUICC III processor running at up to 1.3 GHz • Single width, full-height AMC • Front-panel USB and GbE connector • IPMI ontroller, firmware, and IMPB links • Supports Linux
Ensemble MTI-104Full-height AdvancedTCA AMC module designed for applicationdevelopment on four Texas instruments TCi6482 rapidiO dSPs• Application developers can optimize application code with the Quad TI DSP AMC module and get to market faster • Advanced performance for baseband development applications, with robust applicationdevelopment infrastructure • 4 TI RapidIO DSPs operating at 850 MHz core frequency • RapidIO and GbE interfaces, with 1x Serial RapidIOinfrastructure to each DSP • 64 MB of DDRII memory at 500 MBps per DSP• IPMI management software
Ensemble MTI-203rapidiO dSP/FPGA signal and video processing AdvancedMC Card for developing and deploying LTe, WiMAX,next-generation video, or basestation applications• High-performance AMC for next-generation mobile broadband applications • Supports 20 MHz WiMAX multi-antenna solutions on a single AMC • Combined DSP and FPGA technology for optimal application partitioning • Flexibility and value for LTE and WiMAX basestation developers • One Xilinx Virtex-4 FX100 FPGA with dual integrated Power Architecture cores, running at 400 MHz • Two 4x RapidIO fat pipes for data exchange • Two 1 GbE ports for configuration and control
Mercury Computer Systems Inc.www.mc.com
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ProduCt GuIdEAdvancedMC
36 y August 2008 y CompactPCI and AdvancedTCA Systems
Edge ConnectorMeets MicroTCA requirements • Easy press-fit termination • Cost effective termi-nal design • Excellent high-speed differential performance • Second source available • Product can be configured to serve many other high-speed interconnect needs
Molexwww.molex.com
Gigabit Ethernet AdvancedMCGbE AdvancedMC board with a native PCI Express design • Four GbE copper ports for use in a wide variety of next generation wireless and storage networking equipment • Single-width full height module, making it suitable for telecom equipment manufacturers to add multiple 10/100/1000 ethernet ports to networking equipment that utilizes the new AdvancedMC form factor • OEMs can use the LAn AdvancedMC board in high-performance embedded systems according to MicroTCA specifications • AdvancedMC cards are switch fabric based, hot-swappable, and fully managed for use in carrier and enterprise-class applications • Designed to deliver full wire-speed performance on all four Gigabit ports simultaneously, the LAN AdvancedMC board is based on two Marvell Yukon 88E8062 GbE controllers • 88E8062 controller is based on Marvell’s Concurrent Data Streaming (CDS) architecture that utilizes a highly innovative scheme to reduce the impact of system and peripheral latencies on PCie throughput to enable superior data streaming and application performance
One Stop Systemswww.onestopsystems.com
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ny
ProduCt GuIdEAdvancedMC
CompactPCI and AdvancedTCA Systems y August 2008 y 37
AMC111High-performance computing solution for AdvancedTCA and MicroTCA systems • Single board compute module designed for high-performance embedded applications • 64-bit single-core AMD Turion 2.0 GHz processor • Mid-size, single compute module • 64-bit memory addressability to 4 GB • PC3200 DDR SDRAM with ECC • Supports both 32- and 64-bit operating systems: Linux x64, Windows XP x64,Solaris 9/10 x64 • Full compliance with AMC.0 R1.1 specifications
AMC121High-performance Intel Core2 Duo computing solution for AdvancedTCA and MicroTCA systems • 64-bit Intel Core2 Duo Processor (1.5 GHz) single board compute module designed for high-performance embed-ded applications • Mini-SD Site for onboard program and OS storage • Single-width, mid-size module• 2v GB PC2-3200 DDR2 DRAM with ECC • Supports both 32- and 64-bit operating systems: NexusWare CGL OS, Linux x64, Windows XP x64, Solaris 9/10 x64 • Full compliance with AMC.0 R2.0 specifications
AMC13132-bit AMC compute module designed for high-performance embedded applications • Freescale™Dual-Core 1 GHz MPC8641D PowerPC Processor • Mid-size, single compute module • High-performance computing solution for AdvancedTCA and MicroTCA systems • Up to 2 GB ECC DDR2 SDRAM • Four GbE interfaces • AMC .0, .1, and .2 compatible • MiniSD Site for Onboard Program and OS Storage• Supports Both 32- and 64-bit Operating Systems incluiding NexusWare CGL
AMC14164-bit AMC compute module with the PA6T-1682 PowerPC processor designed for high-performance embedded applications • Single-width, mid-size compute module with PA6T-1682 PowerPC 2.0 GHz with 2 MB shared L2 cache • CompactFlash site for onboard program and OS storage • Up to 4 GB of DDR2 SDRAM with ECC w/PC2-5300 interface • Quad 1G or 2.5 G Ethernet • Du l 10G Ethernet • Supportsboth 32- and 64-bit versions of the nexusWare CGL OS and development environment
AMC335Intelligent Synchronous WAN Communications Mo ule • Multipurpose Intelligent Synchronous WAN Communications Module for AdvancedTCA and MicroTCA systems • Mid-size single AMC module• Full compliance with AMC.0 R2.0, AMC.1 R1.0, and AMC.2 R1.0 specifications • Four high-speedchannels capable of sustaining 2 Mbps per port • Freescale MPC8270 PowerQUICC II Processor• 128 MB Dedicated Processor SDRAM Memory handles extensive onboard traffic and Protocol Requirements • 32 MB Application Flash • NexusWare WAN Protocol Software: Radar Receiver,TADIL-B, HDLC, X.25, Frame Relay, ASYNC • NexusWare CGL OS and Development Environment• Broad Operating System Support includes Solaris, Windows, and Linux
AMC590Video/Storage AdvancedMC module with audio • Mid-size, single AdvancedMC form factor • High-performance 2D, 3D, and multimedia video with 128 MB GDDR3 Memory and DAC speeds of 400 MHz• QXGA resolution up to 2048 x 1536 • HDMI Connection for 480p, 720p, and 1080i output • Video accel-eration and dual-display support for VGA, HDMI, and DVI-D • Supports Standard SATA and SAS hard drives • 2.5-in. hard drive with 300+ GB capacity (based on market availability) • Compatible with RAID array applications • Dual-port access for storage (SAS mode only) • PCM and Dolby Digital 5.1 audio formats • Drivers available for 32- and 64-bit Operating Systems including: NexusWare CGL OS and Development environment, Linux x64, WindowsXP and Windows vista (32/64-bit support)
PMC531/532Mid-size, single AdvancedMC form factor • High-performance 2D, 3D, and multimedia video with 128 MB GDDR3 Memory and DAC speeds of 400 MHz • QXGA resolution up to 2048 x 1536 • HDMI connection for 480p, 720p, and 1080i Output • Video Acceleration and Dual-Display Support for VGA, HDMI, and DVI-D• Supports standard SATA and SAS hard drives • 2.5-in. hard drive with 300+ GB capacity (based on market availability) • Compatible with RAID array applications • Dual-port access for storage (SAS Mode Only) • PCM and Dolby Digital 5.1 audio formats • Drivers Available for 32- and 64-bit Operating Systems including nexusWare CGL OS and development environment, Linux x64, Windows XP, and Windows vista (32/64-bit support)
Performance Technologieswww.pt.com
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ny
ProduCt GuIdEAdvancedMC
CompactPCI and AdvancedTCA Systems y August 2008 y 39
AMCAdvanced Mezzanine Cards • Phillips Components is able to help you with yourcustom and standard requirements
Phillips Componentswww.phillipscomponents.net
AMC-A2 PrAMC boardHigh performance hot-swappable AdvancedMC processor module conforms to PiCMG AMC.0 r2.0• Supports AMD Athlon single- and dual-core processors with true multitasking for increased perfor-mance • SOCDIMM socket supports DDR2 667 MHz ECC memory up to 2 GB • Up to 8 GB optional onboard microDOC flash for local boot drive • Front panel interfaces - Two USB 2.0, one Serial • Pigeon Point module management • Extended availability assured
Pinnacle Data Systems, Inc.www.pinnacle.com
AMC7211A suitable component for Gigabit line card solutions • Based on the Cavium OCTEON Plusmulticore processor • Capable of meeting wirespeed packet processing for L2-L7 for the fullline rate of 4 Gbps • AMC7211 is compliant with AMC.0, AMC.1, and AMC.2 with support forfront or front i/O or rear i/O through build options
RadiSys Corporationwww.radisys.com
AMC-62EAMC.3 compliant disk drive module utilizing newly available extreme-environment SATA drives with enhanced thermal, shock and duty cycle characteristics • The module provides storage up to 80G, with temperature support of 0 ºC to +85 ºC, full (7 x 24) duty cycle and MTBF of 750,000 hours, combining the extended environmental requirements of neBS and AdvancedTCA chassis with the price/performance of SATA disk technology • Augments existing AdvancedMC disk offerings from SANBlaze, which include solid state disks, SATA disks, and SAS disks
SANBlazewww.sanblaze.com
IEA-R HandleRobust die-cast latch • Intuitive inject/eject operation • Industry-leadingergonomic design • Push-button activation of micro-switch• Positive locking with audible feedback • ID labels for customization
Schroffwww.schroff.us
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ny
ProduCt GuIdEAdvancedMC
40 y August 2008 y CompactPCI and AdvancedTCA Systems
Flush Mount AdvancedMC Module HandleMicroswitch protection against short-circuits during modular board hot-swapping in network, telecom, and general computing applications • Minimizesprotrusion on the front of the module faceplate• Satisfies all requirements of the PICMG AMC.0 R2.0 standard • Designed to align neatly with the faceplate for better appearance and to prevent potentialsnagging of cables in use
Southcowww.southco.com
SurfRider/AMCA roHS-compliant AdvancedMC dSP resource board, preintegrated with AdvancedTCA and MicroTCA chassis • Provides flexible yet heavy-duty multimedia processing capabilities • Comp ete mediaprocessing package for audio, video, modem, and fax • Flexible and scalable modular design supporting up to 8 TI C64x DSPs onboard • Carrier-grade, field-proven, and cost-effective • Built-in diagnosticsprovide easier troubleshooting and better application control • Can be provided as hardware-onlysolution for dSP-intensive applications
Surf Communication Solutionswww.surf-com.com
TAMC100A standard single-width mid-size or full-size AMC.1(PCI Express) compliant carrier for one single-size IndustryPack (IP) module • AMC.1 type 1 interface • IPMI interface • 8/32 MHz IP interface, no DMA • Routing of alliP interrupts on PCie inTA/MSi, local interrupt status register• Self healing fuses and RF-filtering for the power supply of the IndustryPack slot • HD50 SCSI-2 type connectors and status LEDs in EMI front panel • Operating temperature -40 °C to +85 °C
TAMC863A standard single-width/mid-height AMC.1 compliant module with four high-speed serial data communication channels • Synchronous/asynchronous serial interfaces implemented in FPGA logic• I/O access: front panel LEDs • Physical interface (individually programmable per channel): EIA-232, EIA-422, EIA-449, EIA-530, EIA-530A, V.35, V.36 and X.21 • Maximum data rate: 10 Mbps (synchronous), 2 Mbps (asynchronous), internal or external provided clock • EIA-232 up to 115.2 Kbps • Temperature range -40 °C to +85 °C
TAMC900High-performance analog to digital converter AdvancedMC • Virtex-5 FPGA and high-speed onboard memory • Single-width, mid-height PICMG AMC.1 module; x8 PCI port (AMC.1 Type 8 compliant)• Virtex-5 LXT FPGA; 4 MB QDR-II SRAM • Analog-to-Digital Converter: 8x LTC2254 ADCs, 105 MSps,14 bit • Signal Conditioning Adapter for flexible adoption to customer analog input requirements• 3 external clock inputs, 3 external trigger inputs • Operating temperature 0 °C to +55 °C
TEWS Technologies LLCwww.tews.com
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ny
ProduCt GuIdEAdvancedMC
CompactPCI and AdvancedTCA Systems y August 2008 y 41
TPS2358/2359Dual-slot controllers • Manage two 12 V rails and two 3.3 V rails for Advanced Mezzanine Cards in AdvancedTCA, MicroTCA, or custom systems • Hot swap, ORing, and status indicators for all four paths • Optional I C interface provides program-mability and monitoring with the highest integration, flexibility, and performance in one small package • Full power controlfor two AdvancedMC modules • Independent 12 V current limit and fast trip • 12 V FET ORing for MicroTCA • Internal 3.3 Vcurrent limit and ORing • Power Good and fault reporting through I2C • 36-pin QFN package (TPS2359); 48-pin QFN package
Texas Instrumentswww.ti.com
AMC207Dual-port 10BASE2 (with two additional 10/100 ports as media converter) AdvancedMC module • VadaTech offers this product in a single-width, mid-height form factor based on the AMC.1 specification (option for full-height design, see ordering options). The 10-BASE2 50 Ohm termination is set by a jumper on the board • AMC.1• Single-width, mid-height (Full-height option available) • Dual 10-Base2 Ethernet ports • Dual 10/100 Ethernet ports as media converter • PCIe x4 lanes • IPMI 2.0 compliant • RoHS compliant
AMC6032.5 inch SATA HDDs in a single-width, full-height storage module in the Advanced Mezzanine Card (AMC) form factor based on the AMC.1 or AMC.3 specifications • The hard disk drives can support data transfer rates of over 150 MBps and provides up to two 200 GB of storage capacity (total of 400 GB) Suitable for adding high-capacity storage and can run as RAID zero (striping across the two drivers for increased space and performance) or RAID one (mirroring two drives for fault failure) • It can also run as two independent disks • Two 2.5 inch SATA HDDs available up to 400 GB (two disks) • Optional Solid State Disk (SSD) • AMC.1 or AMC.3 options • IPMI 2.0 compliant • RoHS compliant • Support for: Linux, Windows, Solaris and VxWorks
VadaTech Inc.www.vadatech.com
XS-AMC24 x OC-3/STM1 or 1 x OC-12/STM-4 • 4 x GbE • ATM AAL0, AAL1, AAL2 & AAL5, and POS • Automatic Protection Switching • WinPath2 Network Processor • Termination, switching, and interworking capabilities from any port to any port • Suited for applications such as wireless networking, Voice over Packet, DSLAM, and media signaling gateways • Wintegra’s WinPath2 Network Processor • Interface to handle both ATM and IP simultaneously • Onboard 24K MIPS processor can run advanced protocols (3GPP, SS7, ATM, VoIP) while the Network Processor handles all the data path • I/O ports are highly configurableand supports a mix of: OC-3/STM-1, OC-12/STM-4, 10BASe-T, 100BASe-TX, 100BASe-FX, 1000BASe-T, and 1000BASe-X• Compliant with PICMG AMC.0, AMC.1 and AMC.2, XS-AMC2 can be used on AdvancedTCA, MicroTCA, CompactTCA, PC, and proprietary platforms
Xaylowww.xalyo.com
Dual-Slot AMC ConnectorCan stack two mid-size modules at 1U height • Yamaichi’s unique connector mounting technology, CMT (Compression Mount Technology), requires less PCB inner layers• CN074 AdvancedMC combines our CMT and patented flexible circuit board, YFLEX• This combination reduces insertion loss and cross talk to the absolute minimum• Our CN080 complies with the MicroTCA design, having 170 contacts on 0.75 mm pitch • The CN084 fits into the aggregated AMC backplane connectors with lowinsertion force and is available in various combinations
Yamaichiwww.yeu.com
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ny
ProduCt GuIdEAdvancedMC
42 y August 2008 y CompactPCI and AdvancedTCA Systems
Externally Adjustable AMC BaffleUses a faceplate mounted control knob to control airflow • With the external control knob, users can direct airflow away from blank boards and towards the active boards where the flow is most needed • FMC Meets the requirements ofPMC module manufacturers who require a solution that is compatible with the AMC standard • The FMC merges AMCand PMC technologies to create a new, mechanically sound solution
Hybrid AMC CarrierSuitable to support full-size legacy AMC modules • Working within thecurrent AMC standard, XTech solutions engineers adapted their mid-sizecarrier technology to accommodate full-size configurations • Hybrid AMC carrier solution enables mid-size and full-size bays in a robust, extrusion-based carrier• Unlike other full-size carriers, the XTech Hybrid AMC carrier uses standardized, easy-to-use AdvancedTCA ejectors with mid-size bays on either end • XTech carriers come fully assembled and can be customized to your application requirements
XTech www.xtech-outside.com
ZLE60400AdvancedMC optical extender card for Serial RapidIO • Zarlink PFOM Technology zLe60400 AMC optical extender card integrates two zL60304 four-port optical trans-ceivers • Interoperability with RapidIO 25 Gbps tota bandwidth • JTAG interface • MMC control for IMPI • 12 VDC power requirement local power option for standalone operation • Half/full height, single-width size • AdvancedMC slot (180 mm x 74 mm), weighs just 425 g • Standard operating temperature of 0 °C to 50 °C, extended operating temperature available• Standards compliance with AMC 0, AMC.1 AMC.4 and RoHS-5 • ZL60304 Parallel Fiber Optic Module: Four transmit and four receive channels each operating at up to 3.125 Gbps for a maximum throughput of 12.5 Gbps per module;transmission range of 300 meters at 2.5 Gbps and 100 meters at 3.125 Gbps
Zarlink Semiconductorwww.zarlink.com
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