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Strategic Elements Ltd
ABN 47 122 437 503
Suite 6/27 Railway Road
Subiaco WA 6008
Australia
Phone: +61 8 9278 2788
Fax: +61 8 9288 4400
16 May 2016
Company Announcements Office
Australian Securities Exchange
20 Bridge Street
SYDNEY NSW 2000
Dear Sir/Madam
PRINTED ELECTRONICS SECTOR
Please find an attached presentation from the Company in relation to its activities in the Printed
Electronics sector.
Strategic Elements Ltd
Phone: +61 8 9278 2788
Fax: +61 8 9288 4400
www.strategicelements.com.au
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printed electronics industry ASX:SOR
The global interest in the technology is booming… Almost every sector of our economy already is or will be affected, if not revolutionized, by printed electronics….
ORGANIC AND PRINTED ELECTRONICS 29
The wafer level technology includes batch pro-cessing, typically film substrates on a carrier. An adapted semiconductor line is used for process-ing. High resolution can be achieved by vacuum deposition and/or spin coating followed by pho-tolithography and wet or dry etching. The pro-duction cost is relatively high and the process is not compatible for conversion to in-line sheet to sheet or reel-to-reel processes.
Under hybrid technologies, we summarize com-binations of processes including large area pho-tolithography, screen printing or printed circuit board (PCB) technologies that make use of flexi-ble substrates (e.g. polymer films or paper). Depo-sition of materials happens by spin coating, blade coating or large area vacuum deposition, in some cases also partly by printing. Ink-jet print-ing and laser patterning are further technologies that are grouped in the hybrids and enable pro-duction at a medium cost level. At the moment hybrid appears to be possibly the most promising technology for further market penetration in the next few years, and it could also be combined with some amount of silicon for specific func-tions in hybrid systems.
Fully printed means continuous, automated mass-production compatible printing and coat-ing techniques (flexo, gravure, offset, slot-die,
from a large area unpatterned film, while others are additive, i. e. they only deposit material where it is wanted, e.g. by fusing a shadow mask.
There are no single standard processes in exist-ence today. Deciding which printing or other pat-terning process is used depends on the specific requirements of a particular device. In general, different processes have to be used for subse-quent steps of a multilayer device in order to optimize each process step. In an integrated product there may also be some steps in which printing processes are used at standard levels, e.g. for graphics or adhesives, and other critical ones where the highest quality standards need to be applied, e.g. for functional layers and small features. The above mentioned processes differ strongly with regard to, e.g., resolution and throughput and the feature size and throughput for some important processes at the highest quality level are shown in Figure 20.
Process Technology LevelsThe technologies that are used in organic elec-tronics range from batch, clean-room, etching based processes to mass printing processes that are capable of deposition of square meters of substrates per second. Here is a rough classifica-tion of the technologies in three different tech-nology levels:
Figure 21: Reel-to-reel printing of electronic devices. (Source: OE-A)
LOPEC is the industry event for printed electronics that success-fully combines technology and business. As a leading inter- national platform, LOPEC gives participants a broad overview of everything that this technology has to offer—from applications to research. It unites, inspires and realizes. Today and tomorrow. LOPEC makes printed electronics a stimulating experience.
The LOPEC conference compliments the exhibition perfectly and is the world’s leading conference for printed electronics. Care- fully chosen speakers present the latest applications, current busi- ness models and recent research results. A transfer of know- ledge at its finest.
Exhibitors and visitors give LOPEC and its content outstanding ratings. The results of our participant survey are available here: lopec.com/participantsurvey
LOPEC—the success story
133 exhibitors from 19 countries
More than 2,300 visitors from 42 countries
199 conference presentations from 28 countries
96% of participants feel that LOPEC’s importance is stable and/or growing.
Performance figures for LOPEC 2015:
Application sectors for printed electronics
Automotive
Lighting
Printing and graphic arts
Energy
Building and architecture
Logistics
Medical and pharmaceutical
Textiles
Consumer electronics
Packaging
White goods
2
Conveniently order your ticket to LOPEC 2016 online: lopec.com/tickets
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SOR recently announced an intended expansion of its involvement in the Printed and Flexible Electronics sector.
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Why is this very good timing ?...
1. Both poliAcal parAes have announced a surge in innovaAon funding and benefits for innovaAve sectors.
2. SOR has an extra advantage of being a Pooled Development Fund with generous tax concession for our shareholders.
3. Global Printed Electronics sector being ignored by Australian industry. F
or p
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+national focus on innovation
Surging na-onal focus on innova-on in Australia… n AddiAonal $1.1b in new funding
n R&D Tax IncenAve Program
n Australian Research Council funding
n Tax incenAves for investors
n Tax breaks for start-‐ups
n $127m of University collaboraAon
n $200 funding for CSIRO for Uni start-‐ups
However SOR has access to one more Federal Government benefit that provides
a significant advantage over other ASX listed companies….
SOR will leverage these new programs to benefit
shareholders…
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§ SOR operates under the Pooled Development Fund program, an Australian Federal Government program designed to increase investment in Australian SME’s.
§ Designed by Federal Government to in part drive investment into Australian innovaAon.
§ Under this Ausindustry Venture Capital Program our shareholders can pay no capital gains tax on the sale of their ASX listed shares.
§ Other benefits for shareholders include paying no tax on dividends received.
§ SOR as a Company also pays just 15% corporate tax rate on returns from backing Australian SME’s.
§ Over $1bn invested by the PDF program.
Australian Innovation
Entrepreneurs and researchers
*Shareholders should seek their own independent tax advice.
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§ PE can create flexible, transparent electronics which current semiconductors cannot.
§ PE can also be manufactured using cheap prinAng methods unlike current electronics made in expensive fabricaAon plants.
Printed electronics manufacturing facili;es cost 1/100th of tradi;onal semiconductor fabrica;on plants.
n InnovaAon on prinAng techniques and conducAve materials makes high throughput and volume producAon of electronics possible at low cost on flexible plasAc, paper, or texAle substrates.
n This flexibility enables integraAon of printed and flexible electronics into everyday items and places we had only dreamed of before.
This allows device manufacturers to place electronics in places and on products that have never been able to use electronics before.
ORGANIC AND PRINTED ELECTRONICS 29
The wafer level technology includes batch pro-cessing, typically film substrates on a carrier. An adapted semiconductor line is used for process-ing. High resolution can be achieved by vacuum deposition and/or spin coating followed by pho-tolithography and wet or dry etching. The pro-duction cost is relatively high and the process is not compatible for conversion to in-line sheet to sheet or reel-to-reel processes.
Under hybrid technologies, we summarize com-binations of processes including large area pho-tolithography, screen printing or printed circuit board (PCB) technologies that make use of flexi-ble substrates (e.g. polymer films or paper). Depo-sition of materials happens by spin coating, blade coating or large area vacuum deposition, in some cases also partly by printing. Ink-jet print-ing and laser patterning are further technologies that are grouped in the hybrids and enable pro-duction at a medium cost level. At the moment hybrid appears to be possibly the most promising technology for further market penetration in the next few years, and it could also be combined with some amount of silicon for specific func-tions in hybrid systems.
Fully printed means continuous, automated mass-production compatible printing and coat-ing techniques (flexo, gravure, offset, slot-die,
from a large area unpatterned film, while others are additive, i. e. they only deposit material where it is wanted, e.g. by fusing a shadow mask.
There are no single standard processes in exist-ence today. Deciding which printing or other pat-terning process is used depends on the specific requirements of a particular device. In general, different processes have to be used for subse-quent steps of a multilayer device in order to optimize each process step. In an integrated product there may also be some steps in which printing processes are used at standard levels, e.g. for graphics or adhesives, and other critical ones where the highest quality standards need to be applied, e.g. for functional layers and small features. The above mentioned processes differ strongly with regard to, e.g., resolution and throughput and the feature size and throughput for some important processes at the highest quality level are shown in Figure 20.
Process Technology LevelsThe technologies that are used in organic elec-tronics range from batch, clean-room, etching based processes to mass printing processes that are capable of deposition of square meters of substrates per second. Here is a rough classifica-tion of the technologies in three different tech-nology levels:
Figure 21: Reel-to-reel printing of electronic devices. (Source: OE-A)
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This is only the beginning.. the global market is expected to reach $340 Billion by 2030.
Printed and flexible electronics are already in the market. The global interest in the technology is booming. Almost every sector of our economy already is or will be affected, if not revoluAonized, by printed electronics.
According to research firm IDTechEx, the global market for printed and potenAally printable electronics, will rise from about USD 24 billion in 2014 to $70.4 billion in 2024, with a compound annual growth rate of 40 per cent. Those amounts jump dramaAcally when you include the total market value of the products that do, and could, incorporate PE components.
All informa;on from the Canadian Printable Electronics Industry Associa;on
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ORGANIC AND PRINTED ELECTRONICS 21
regard to the trend from health care at clinics and hospitals to health care at home. To some extent, the future is already here, since organic and printed electronics already enables products on the health care market, such as glucose test strips, lab-on-chip products and smart blister package for pharmaceuticals.
While we focus on clusters of applications based on functions, organic electronics contributes to innovation in different industrial sectors such as automotive or health care, with products cover-ing a range of functions. For this reason, OE-A has also begun to look at these market segments, and there have already been intensive discus-sions about how organic electronics may contrib-ute to the future of health care, especially with
Primary batteries, memory for brand protection,ITO-free transparent conductive films and touch sensors
Garments with integrated sensors,anti-theft/forgery labels, temperature sensor smart labels, printed sensors and test strips
Rechargeable batteries, transparent touch sensors, reflective display elements,flexible & large area ITO-free touch sensors
NFC enabled sensor labels, intelligent packaging, integrated systems on garment
Multi-cell batteries, wireless readable memory, printed logic chips, bendable ITO-free touch & gesture sensors
Directly printed batteries, smart objects integrating actives and passive devices, fully integrated touch & gesture sensors
Multi-cell batteries, wireless readable memory, printed logic chips, bendable ITO-free touch & gesture sensors
OLED on textile, disposable health monitoring systems, wireless sensors for smart buildings
OE-A Roadmap for Organic and Printed Electronics Applications 2015
Electronics & Components
Integrated Smart
Systems
Existing until 2015
Short term 2016–2018
Medium term 2019–2022
Longer term 2023+© OE-A 2015
! ! !
Rigid modules for design driven luminaires B2B and B2C
Flexible lighting for design driven applications
Mass-produced flexible lighting
General lighting
Curved OLED TVs, flexible OLED displays, mobile OLED displays, e-reader, wearables
In-moulded displays, (semi-) transparent bendable display, OLED monitors and TVs
Portable foldableOLED displays, (semi-) transparent rollable display
Stretchable display, rollable OLED TV, rollable consumer electronics
Consumer electronic chargers, solar lamps, architectual installations
Consumer electronics, mobile power, energy harvesting, specialized BIPV and BAPV
Mobile power, Internet of Everything energy harvesting, building integration, medium size off-grid
Large volume BIPV integration, large and industrial off-grid, grid-connected PV
Organic Photovoltaics
Flexible andOLED Display
ELO DLighting
Figure 13: 6th Edition of the OE-A Roadmap for organic and printed electronics, with forecast for the market entry in large volumes (general availability) for the different applications. The table is a further development of and update to the fifth version of the OE-A roadmap presented in 2013.
Australian Innovation
Entrepreneurs and researchers
SOR will seek to idenAfy and assess Australian Printed Electronics technologies and Companies for potenAal licensing and acquisiAon opportuniAes.
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The secret to Printed Electronics growth is collaboration - Dupont
§ IdenAfy potenAal partners from Industrial InnovaAon Centres, InnovaAon Clusters and Companies across the Printed Electronics supply chain.
§ Leverage partners global network and experAse in many areas. § Develop products faster and launching them earlier. § Gain be`er access to the target market.
Our strategy is to specifically focus technical research and development on those tasks that enable partnerships to be formed.
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“These prinAng, materials, paper and chemical companies of today will be the new electronic giants tomorrow” – IDTechEx “The demand for low-‐cost, non convenAonal electronic soluAons is real and its growing” – Xerox “Investors are increasingly drawn to the printed electronics market due to its low cost of entry and technological knowhow of convenAonal prinAng. The convenAonal prinAng methods are already mastered and this reduces the chances of any anomaly with the process” – Frost and Sullivan “Technologies for flexible electronics manufacturing will be major differenAators in the next generaAon of consumer and compuAng devices”– President’s Council of Advisors on Science and Technology “Flexible Hybrid Electronics has the potenAal to re-‐shape enAre industries, from the electronic wearable devices market, to medical health monitoring systems, to the ubiquitous sensing of the world around us – also known as the Internet of Things” -‐US Department of Defense “Printed Electronics.. the Holy Grail of low cost, high volume manufacturing. Follow the money” -‐ DuPont
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The current memory capacity of printed electronics and smart systems is limited. As memory capacity increases applica;ons will be able to expand their func;onality -‐ IDC
Memory is at the heart of electronics…
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