company confidential © 2013 sgi ® 1 sgi ® rackable ® servers first last title

Company Confidential © 2013 SGI®

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SGI® Rackable®

Servers

First LastTitle


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Speed and Scale

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ExascaleFemtometer

Lightyear

Yottascale

Finding Answers™


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Our Strategy and Focus

Business Computing

HPC

High Performance Computing

Redundancy Speed & Scale

BusinessApplicatio

ns


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Our Strategy and Focus

Business Computing

HPC

High Performance Computing

Redundancy Speed & Scale

BusinessApplicatio

ns

BigData


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• Rackable® Value Proposition• Half-Depth Servers• Standard-Depth Servers

Agenda


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Customer Problems• Getting the right configuration for a

cluster for specific applications is difficult

• Setting up a cluster can take a lot of time and is prone to error

• Managing clusters can be very difficult• Expanding clusters can lead to

disappointing performance and management challenges


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SGI® Servers for Speed and Scale

HPC

Commercial Scientific

Modeling & Simulation

Cloud

PublicPrivate

Government

Big Data

Hadoop In-memory Analytics Archive

SGI® ICE™ X SGI® UV™ 2000 CloudRack™ C2Rackable® Rackable®


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• Best of breed components, tested and integrated by SGI® Engineering

• Complete software stack including SGI Management Center and SGI Performance Suite

• Integrated, stood-up and tested in SGI factory• Not on your floor

• Not in some 3rd party’s facility

• Supported Worldwide by SGI

Rackable® Clusters Value Proposition


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Comprehensive factory integration simplifies on-site deployment and management

Entirely built on industry-standard hardware and software components, enabling access to the full spectrum of the Linux ecosystem

Full integration with the SGI Performance Suite, which optimizes the performance of applications running on standard Linux, and with the SGI Management Suite, which enables ease of administration, including dynamic power and GPU monitoring and management

Fully Integrated in SGI® Factory


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Complete Factory Integration - SGI Rackable® Cluster: Nodes labeled per customer requirements Delivered fully cabled to switches Cables labeled per customer requirements Servers mounted in rack, if ordered Static IP address range applied Fully integrated and tested software on head node Provisioned compute nodes per customer requirements GigE and IB fabric tested using MPI

Fully Integrated in SGI® Factory(2)


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SGI delivers tightly integrated solutions based on Linux®

For HPC clusters, SGI provides a complete Linux technical computing stack

For virtualized environments, SGI offers VMware certified platforms, supports Red Hat RHEL with KVM, and Microsoft Hyper-V

Full system management and monitoring for both data center and HPC environments with SGI Management Center

Linux Operating Systems: Novell SLES 10 & 11; Red Hat RHEL 5 & 6, CentOS 5 & 6*

Fully Integrated in SGI® Factory (3) SGI Linux HPC Stack

* Shipping when available

Performance Optimization

SGI Performance Suite

System Management SGI Management Center

Workload Manager Altair® PBS Professional™

MPI SGI MPT, Intel MPI Runtime

RAS SGI Foundation Software

File and datamanagement

SGI CXFS, SGI DMF, Lustre


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Hundreds of thousands of SGI Rackable® servers in production powering the world’s largest internet and technical computing environments

Robust reliability and availability features at both the application architecture level and at the server level

World class professional consulting, installation and support services.

Ultimate System RAS and Management Capability


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High Density

Both Rackable® half-depth and standard-depth servers can be deployed at leading core densities: C1001 half-depth server: 2,944 cores/46U cabinet in 92

servers mounted back to back C2112 standard-depth server: 2,688 cores/42U cabinet in

21 quad-node servers (84 nodes)

Rackable servers also deliver a high local storage density, a central requirement for many applications

Practical density is key as most data centers are power limited. A key SGI strength is designing at the cabinet level, optimizing power and thermals for the real life data center environment


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SGI servers can cut 10-150+W of power vs. competitive designs

Power savings delivered by Optimizing component choices

CPU, memory, hard drives Delivering superior thermal

designs that cut cooling fan power

Maximizing AC and DC power supply efficiency and right-sizing power supplies to server configurations

Eco-Logical™ Benefits


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SGI Global Services – Worldwide Reach

Our Global Presence

United States

Atlanta

AustraliaSydney

JapanTokyo

Our Customer Experience

500 Services Professionals in

50 Countries

Global Customer Service Center Infrastructure

Global Logistics Infrastructure with over 60 Spare Parts Depots

Same Day Support in 150 Major Metro Areas in over 20 Countries

Customized Support Available 7x24 via E-mail, Telephone or Web

Support in Multiple Languages

United Kingdom

Reading


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All Rackable servers are 19” rack mount compatible

Rackable® Form Factors

Half-Depth Servers Mount back-to-back in Rackable™

cabinets for double density or in 2-post racks

Ideal for homogeneous deployments implemented at cabinet or row level

Choose either flow-through or hot-aisle containment configurations

15.5” deep form factor ideal for thermals and reducing fan power

Front-facing ports and rail-less design increase serviceability

Best of blade features, without lock-in to a handful of motherboard designs!

Standard-Depth Servers Mount in all standard racks (rail-

based) Ideal for heterogeneous deployments,

including use as HPC management nodes with SGI ICE or UV systems

Not all available motherboard options fit within a half-depth footprint (e.g. many 4S options)

Multi-node solutions such as C2112 server (four nodes in 2U) available for high density deployments

Rear-facing ports ideal for compatibility (e.g. attaching to external storage systems)


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C1103/C1104G

Features 1U dual-socket server

Ideal for GPU Computing

3 x 3.5” or 4 x 2.5” hot-swap drives

Two or three GPUs (C1103 also available with up to 4 x PCIE x8)

Key Models C1103-TY12: Intel Xeon 5600

C1104G-RP5: Intel Xeon E5-2600

Rackable® Standard-Depth Servers

C1110

Features 1U dual-socket server

4x 3.5” or 10 x 2.5” hot-swap drives

Two PCIe Gen 3 x16 slots

Redundant Power Supply (RPS)

Key Models C1110-RP6: Intel Xeon E5-2600

C1110-RN3: Intel Xeon E5-2400


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C2108 Features

2U dual-socket server

Ideal HPC management/head node

Up to 8 x 3.5” hot-swap drives

Up to five expansion slots

1+1 Redundant AC Power Supplies

Key Models C2108-RP2: Intel Xeon E5-2600

C2108-G9: AMD Opteron 62/300


C2112 Features

2U quad-node dual-socket server

Ideal for HPC cluster nodes

Up to 12 x 3.5” hot-swap drives (3/node)

Four low-profile expansion slots (1/node)

Optional QSFP QDR/FDR InfiniBand port/node


Key Models C2112-4RP4: Intel Xeon E5-2600

C2112-4G10: AMD Opteron 62/300


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H2106 Features

2U quad-socket server

Ideal HPC management/head node


32 DIMM slots for up to 1024GB memory using 32GB DIMMs

Four low-profile expansion slots


Key Model H2106-G7: AMD Opteron 62/300

C2110G Features

2U quad-socket server

Ideal high GPU/socket density node


8 DIMM slots

Up to four GPUs

Two AC Power Supplies

Key Model C2110G-RP5: Intel Xeon E5-2600


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Choice of 22U, 36U, 40U, 44U racks & full range of AMD/Intel

server models

FlexibilityFlexibility DensityDensity

Half-depth server design mounted back-to-back for

2x density

ServiceabilityServiceability

I/O in front and clean cabling reduces maintenance time by up to 75%

IPMI remote management

Unobstructed central air plenum for

superior ventilation

Thermal Management

& Power Distribution

Thermal Management

& Power Distribution

DC Power option provides power savings of up to

30%

Passive cooling design for highest

reliability

Rackable® Half-Depth Advantage


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Hot aisle/cold aisle Typical data center

footprint

Two Airflow Options

Chimney

In-cabinet hot aisle containment

Easily duct hot air out Optimal cooling

Front to Back Airflow


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26” wide, 40” deep Can support both half-depth back-to-back and

standard-depth front-to-back deployments 26” width cabinet cable troughs sufficient for

large cable bundles including InfiniBandinterconnect cabling

Heights offered: 22U, 36U,40U, 44U

24” wide 24” width cabinet better aligned with standard 24 x 24”

data center floor tiles Heights offered: 36U, 42U and 46U Can support both half-depth back-to-back and

standard-depth front-to-back deployments

Rackable® Half-Depth Server Cabinets


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AC power supplies replaced with 96.5% efficient DC power supply with 2 million hours MTBF

Rectifiers convert AC input to DC power for 10%-30% power savings Now available in 1U model

DC distribution bars inside cabinet deliver N+M redundant DC power to individual servers

Easily deployed in any existing AC data center (no infrastructure upgrades needed)

Allows rack-level UPS at significant cost savings over individual chassis RPS

AC-to-DC rectification within the rack for superior combination of reliability and efficiency

Rackable® Half-Depth Rack-level DC Power Delivery


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C1001 Features

• Blade level density (2,208 cores/46U rack)

• 1 x 3.5” / 2 x 2.5” hot-swap drives

• 6 Gb SAS

• Single expansion slot

• AC or DC power

Key Models

• C1001-TY8: Intel Xeon 5600

• C1001-RP6: Intel Xeon E5-2600

• C1001-C1: AMD Opteron 4200

• C1001-G13: AMD Opteron 62/300

Rackable® Half-Depth Servers

C2005 Features

Industry-leading thermals

Up to 5 x 3.5” / 10 x 2.5” hot-swap drives

6 Gb SAS

Up to five expansion slots

AC, DC, or AC RPS power

Key Models C2005-TY6: Intel Xeon 5600

C2005-RP1: Intel Xeon E5-2600

C2005-RN1: Intel Xeon E5-2400

C2005-C3: AMD Opteron 4200

C2005-G11: AMD Opteron 62/300


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4 x 2.5” + 2 x 3.5” tray1 slot on riser

8 x 2.5” tray5 low-profile slots

(2-6)

4 x 3.5” tray1 slot on riser

2 x 3.5” tray5 low-profile slots

(2-6) Plus additional lower-left bay capabilities:

Internal 3.5” drive and/or DVD-ROM & AC or DC power supply Hot-Swap 3.5” drive or pair 2.5” drives & AC or DC power supply Redundant AC power supply

Four top drive tray / expansion slot configurations:

Rackable® Half-Depth Server: C2005


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Rackable® Half-Depth Servers

C30xx Features

High local storage density (720TB and 360 cores/46U cabinet)

Storage and/or I/O focused models

Key Models ISS3012-TY15: Intel Xeon 5600 ISS3009-TY15: Intel Xeon 5600 ISS3012-RP1: Intel Xeon E5-

2600 ISS3009-RP1: Intel Xeon E5-

2600

H4002 Features

Specialized applications Quad-socket models Overclocking options

Key Models H4002-G6: AMD Opteron

6200


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• Rackable™ servers are industry-leading in their configurability and flexibility

• Designed from the data center down, Rackable™ servers are well suited for both homogeneous and heterogeneous scale-out environments

• Fully Integrated for Easy Deployment

• Optimized for RAS and ease of management

Summary


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QUESTIONS?

SGI® Rackable® Servers


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Rackable® Servers Backup Slides


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Rackable® Server Model Grid


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Rackable® Standard Depth: Single Node

Model C1104G-RP5 C2110G-RP5 C2108-RP2 C1110-RP6

Form Factor 1U standard-depth 2U standard-depth

2U standard-depth

1U standard-depth

CPU 2 x Intel Xeon E5-2600 2 x Intel Xeon E5-2600

2 x Intel Xeon E5-2600


Max. Cores 16 16 16 16

Chipset Intel C600 Intel C600 Intel C600 Intel C600

Memory 8 x DDR3 8 x DDR3 24 x DDR3 16 x DDR3

Hard Drives 4 x 2.5” 10 x 2.5” 8 x 3.5”; 12 x 3.5” or 24 x 2.5”

4 x 3.5” or 10 x 2.5”

Expansion Slots

Two PCI-E 3.0 x 16 (two internal, one external) double-wide slots; one PCI-E 3.0 x8 low-profile

slot

Four PCI-E 3.0 x16 (internal only) double-width slots

(optional riser card for 2 additional

external PCI-E 3.0 x16 double width slots***),

One PCI-E 3.0 x8 and one PCI-E

2.0 x4 low profile

Six PCI-E 3.0 x 8 Full Height

1 x Intel SAS Module***

1 x PCI-E Gen3 x 8 Intel I/O Expansion

module

One PCI-E 3.0 x 16 Full Height and one PCI-E 3.0 x16 Low-

Profile

Networking 2 x GigE 2 x GigE 4 x GigE 3 x GigE

Management IPMI 2.0 IPMI 2.0 IPMI 2.0 IPMI 2.0

Power Supply

AC RPS AC RPS AC RPS AC RPS

*** not available at launch


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Rackable® Standard Depth: Single Node (Cont’d)

Model C2108-G9 H2106-G7 C1103-TY12

Form Factor 2U standard-depth

2U standard-depth

1U standard-depth

CPU 2 x AMD Opteron

62/300 Series

4 x AMD Opteron

62/300 Series

2 x Intel Xeon 5500/5600

Max. Cores 32 64 12

Chipset AMD SR5690 + SP5100

AMD SR5690 + SR5670 +

SP5100

Intel 5520

Memory 16 x DDR3 32 x DDR3 12 x DDR3

Hard Drives 8 x 3.5” 6 x 3.5” 3 x 3.5”

Expansion Slots

Three PCI-E 2.0 x8

Two PCI-E 2.0 x16 and two PCI-E 2.0 x8

[Two PCI-E 2.0 x16] or [one PCIE 2.0 x16 and two PCI-E 2.0 x8] or [four PCI-E 2.0 x8]. Additional PCI-E 2.0 x4 LP

Networking 2 x GigE 2 x GigE 2 x GigE

Management IPMI 2.0(TBD: KVM)

IPMI 2.0 + KVM

IPMI 2.0

Power Supply

AC RPS AC RPS AC


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Rackable® Standard Depth: Multi-Node

Model C2112-4RP4 C2112-4RP3 C2112-4G10

Form Factor 2U standard-depth

2U standard-depth

2U standard-depth

Nodes/Server Four Four Four

CPU/Node 2 x Intel Xeon E5-2600


2 x AMD Opteron 62/6300 series

Max. Cores/Node 16 16 24

Chipset/Node Intel C600 Intel C600

Memory/Node 16 x DDR3 8 x DDR3 8 x DDR3

Hard Drives/Node 4 x 2.5” or 3 x 3.5”

4 x 2.5” or 3 x 3.5”

3 x 3.5”

Expansion Slots/Node

One PCI-E 3.0 x16 low-profile

PCI-E 3.0 Intel I/O Module

One PCI-E 3.0 x16 low-profile

PCI-E 3.0 Intel I/O Module

1 x PCIe Gen 3 x16 low-profile

Networking/Node 2 x GigE + optional QSFP QDR or FDR* InfiniBand per

node

2 x GigE + optional QSFP QDR or FDR* InfiniBand per

node

2 x GigE + optional IB QDR

single-port

Management/Node IPMI 2.0 IPMI 2.0 IPMI 2.0

Power Supply AC RPS AC RPS AC RPS* Not at launch


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Rackable® Half-Depth: C1001

Model C1001-TY8 C1001-C1 C1001-G13 C1001-RP6

Form Factor 1U half-depth 1U half-depth 1U half-depth 1U half-depth

CPU 2 x Intel Xeon 5500/5600

2 x AMD Opteron 4200



Max. Cores 12 16 32 16

Chipset Intel 5520 AMD SR5690 + SP5100

AMD SR5690 + SP5100

Intel C600

Memory 18 x DDR3 12 x DDR3 16 x DDR3 16 x DDR3

Hard Drives 1 x 3.5” or 2 x 2.5”

1 x 3.5” or 2 x 2.5”

1 x 3.5” or 2 x 2.5”

1 x 3.5” or 2 x 2.5”

Expansion Slots 1 x PCI-E 2.0 x16 1 x PCI-E 2.0 x16 1 x PCI-E 2.0 x16 1 x PCI-E 2.0 x16

Networking 3 x GigE 3 x GigE 3 x GigE 3 x GigE

Management IPMI 2.0 + KVM IPMI 2.0 + KVM IPMI 2.0 + KVM IPMI 2.0 + KVM

Power Supply AC or DC AC or DC AC or DC AC or DC


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Rackable® Half-Depth: C2005

Model C2005-TY7 C2005-TY15 C2005-C3 C2005-G11 C2005-RP1 C2005-RN1

Form Factor 2U half-depth 2U half-depth 2U half-depth 2U half-depth 2U half-depth 2U half-depth

CPU 2 x Intel Xeon 5500/5600

2 x Intel Xeon 5500/5600





Max. Cores 12 12 16 32 16 16

Chipset Intel 5520 Intel 5520 AMD SR5690 + SP5100

AMD SR5690 + SP5100

Intel C600 Intel C600

Memory 18 x DDR3 12 x DDR3 8 x DDR3 16 x DDR3 16 x DDR3 12 x DDR3

Hard Drives 5 x 3.5”, 10 x 2.5” or

combination

5 x 3.5”, 10 x 2.5” or

combination

5 x 3.5”, 10 x 2.5” or

combination

5 x 3.5”, 10 x 2.5” or

combination

5 x 3.5”, 10 x 2.5” or

combination

5 x 3.5”, 10 x 2.5” or

combination

Expansion Slots (Single

Riser Slot Also

Available)

Three PCI-E 2.0 x8 and one

PCI-E 2.0 x4

Four PCI-E 2.0 x8 and one PCI-E 2.0 x4

Two PCIE-E 2.0 x16, one PCI-E

2.0 x8, one PCI-E 2.0 x4 and one PCI-

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One PCI-E 2.0 x16 or two

PCI-E 2.0 x8 (auto-

selected), one PCI-E 2.0 x8, one PCI-E 2.0

x4

One PCI-E 3.0 x8 full-height

(horiz) or 5 PCI-E 3.0 half-

height x8 (vertical)

Two PCI-E 3.0 x16, one PCI-E 3.0 x8 and two

PCI-E 3.0 x4

Networking 4 x GigE 2 x GigE 4 x GigE 2 x GigE 2 or 4 x GigE 2 or 4 x GigE

Management IPMI 2.0 + KVM

IPMI 2.0 + KVM

IPMI 2.0 + KVM

IPMI 2.0 + KVM

IPMI 2.0 + KVM

IPMI 2.0 + KVM

Power Supply

AC, AC RPS or DC

AC, AC RPS or DC

AC, AC RPS or DC

AC, AC RPS or DC

AC, AC RPS or DC

AC, AC RPS or DC


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Rackable® ServerMotherboards


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SGI Board Form FactorsSGI leverages three principal form factors to achieve best-in-class designs that are thermally superior:

EATX form factor Offset

CPU/memory Ideal for 2U+

Rackable + CloudRack

EATX form factor Rear

CPU/memory Ideal for 1U-2U

Rackable + CloudRack

“Twin” form factor

Ideal for Rackable std-depth + CloudRack


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Intel Romley Platform (SandyBridge EP and EN)


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Processor(2) Intel® Xeon® E5-2600 (Romley EP) 130W 8 core CPUs

ChipsetIntel® C600 series PCH (Patsburg-A/-D)

Memory(4) memory channels per CPU(8+8) U/LR/RDDR3 1.5V, 1.35V DIMMs

PCI Expansion Slots(6) PCI-E G3 x8 slots

Network(4) GbE ports (Intel® I350-AM)

Storage (2) SATA-III ports(4) SATA-II ports RAID 0/1/10/5 support(8) SATA/SAS from SCU 3Gb ports RAID 0/1/10 support

(w/upgrade key)VGA & IPMI 2.0

Server Engines Pilot III iBMC w/iKVMShared management port (dedicated via add-on module)

Form FactorSSI EEB (12” x 13”)

Target ApplicationsSearch engineHadoop / storage serverWorkstation

RP1 (Intel® S2600CP “Canoe Pass”)


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Target ApplicationsCPU-centric HPCSearch engineVirtual machine


ChipsetIntel® C600 series PCH (Patsburg-A/-D)


PCI Expansion Slots(2) PCI-E G3 x16 slots(2) PCI-E G3 x4 slots

Network(3) GbE port

Storage (2) SATA-III ports(4) SATA-II ports RAID 0/1/10/5 support(8) SATA/SAS from SCU 3Gb ports RAID 0/1/10 support]

VGA & IPMI 2.0ASPEED AST2300 iBMC w/iKVMShared management port

Form FactorEATX (12” x 13”)

RP6 (Tyan® S7056)


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Target Applications“Summit” RFP2U storage server


ChipsetIntel® C600 series PCH (Patsburg-A w/option keys)

Memory(4) memory channels per CPUS2600GL4 – (8+8) U/LR/RDDR3 1.5V, 1.35V DIMMsS2600GL4 – (12+12) U/LR/RDDR3 1.5V, 1.35V DIMMs

PCI Expansion Slots(6) PCI-E G3 x8 slots (riser)

Network(4) GbE port (Intel® Powerville-17)

Storage (2) SATA-III ports(4) SATA-II ports RAID 0/1/10/5 support(8) SATA/SAS 3Gb ports RAID 0/1/10 support (module)

VGA & IPMI 2.0Server Engines Pilot III iBMC w/iKVMShared management port (dedicated via add-on module)

Form Factor16.5” x 16.5”

RP2 (Intel® S2600GZ4/GL4 “Grizzly Pass”)


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ChipsetIntel® C600 series PCH (Patsburg-A/-B)


PCI Expansion Slots(4) PCI-E G3 x16 slots

Network(1) IB QDR (CX3) WPQ SKU(1) IB FDR (CX3) Q2 2012***(2) GbE ports (Intel® Powerville)

Storage (2) SATA-III ports (one via SATA DOM)(4) SATA-II ports RAID 0/1/10/5 support (via module)

VGA & IPMI 2.0Server Engines Pilot III iBMC w/iKVMShared management port (dedicated via add-on module)

Form FactorSFF (6.8” x 18.9”)

***not available at launch

Target ApplicationsGPU or CPU-centric HPCApplication gatewayVirtual machineSearch engine

RP4 (Intel® S2600WP “Washington Pass”)


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ChipsetIntel® C600 series PCH (Patsburg-A)


PCI Expansion Slots(4) PCI-E G3 x16 slots(1) PCI-E G3 x8 slot

Network(2) GbE ports (Intel® I350)

Storage (2) SATA-III ports(4) SATA-II ports RAID 0/1/10/5 support

VGA & IPMI 2.0Server Engines Pilot III iBMC w/iKVM (w/key)Shared management port

Form FactorSFF (7.71” x 16.64”)

Target ApplicationsGPU-centric HPCStorage serverApplication gatewaySearch engine

RP5 (SuperMicro® X9DRG-HF)


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RN1(Intel® S2400GP “Granite Pass”)

Processor (2) Intel® Xeon® E5-2400 (Sandy Bridge-EN)95W

ChipsetIntel® C600 series PCH (Patsburg-A/D/T)


PCI Expansion Slots (2) PCI-E G3 x16 slot (1) PCI-E G3 x8 slot (1) PCI-E G3 x8 slot x4 electrical (1) PCI-E G2 x8 slot x4 electrical (1) PCI 32bit/33MHz slotNetwork

(2/4) GbE ports (Intel® I350-AM)Storage

(2) SATA-III ports(4) SATA-II ports RAID 0/1/10/5 support(8) SATA/SAS from SCU 3Gb ports RAID 0/1/10 support

(w/upgrade key)VGA & IPMI 2.0

Server Engines Pilot III iBMC w/iKVMShared management port (dedicated via add-on module)

Form FactorSSI EEB (12” x 13”)

Target Applications

Search engineHadoop / storage serverWorkstation


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AMD Socket G (Magny Cours)


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G11

Form Factor: EATX Chipset: AMD SR5690 + SP5100 CPU: 2 x AMD Opteron 6200 Memory: 16 x DDR3 DIMM (Max. 1600MHz) Expansion Slots:

One PCI-E 2.0 x16 or two PCI-E 2.0 x8 (auto-selected), one PCI-E 2.0 x8, one PCI-E 2.0 x4

Networking: Two GigE (Two Intel 82574L) Management: IPMI 2.0 + KVM Options: Onboard SAS motherboard SKU available Manufacturer model: Asus KGPE-D16


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G13


One PCI-E 2.0 x16 Networking: Three GigE (Intel 82576EB + Intel 82574L) Management: IPMI 2.0 + KVM Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S8236IL


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C1


One PCI-E 2.0 x16 Networking: Three GigE (Intel 82576EB + Intel 82574L) Management: IPMI 2.0 + KVM Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S8226


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C3


Two PCIE-E 2.0 x 16, one PCI-E 2.0 x8, one PCI-E 2.0 x4 and one PCI-33 Networking: Four GigE (Intel 82576EB +2 x Intel 82574L) Management: IPMI 2.0 + KVM Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S8225


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Intel Tylersburg Platform (Westmere EP)


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TY6

Form Factor: EATX Chipset: Intel 5500 CPU: 2 x Intel Xeon 5500 or 5600 (Up to 130W) Memory: 8 x DDR3 DIMM (Max. 1333MHz) Expansion Slots:

One PCI-E x8 and One PCI-E x4 Networking: Embedded dual port Intel® 82576 Gigabit

Ethernet with Intel I/O Acceleration Technology (I/O AT) Management: IPMI 2.0 + KVM Options: Modular SAS and SAS RAID solution via optional

Intel® I/O Expansion Module Manufacturer model: Intel S5500WB


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TY7

Form Factor: EATX Chipset: Intel 5520 (Tylersburg 36D) CPU: 2 x Intel Xeon 5500 or 5600 (Up to 95W) Memory: 18 x DDR3 DIMM (Max. 1333MHz) Expansion Slots:

Four PCI-E 2.0 x8 and PCI-E x4 slot Networking: Four GigE (Intel 82576 + 82574L) Management: IPMI 2.0 + KVM (also Roamer compatible) Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S7012 Application: Edge servers with high memory requirements

and/or need for multiple NICs


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TY8

Form Factor: EATX Chipset: Intel 5520 (Tylersburg 36D) CPU: 2 x Intel Xeon 5500 or 5600 (Up to 95W) Memory: 18 x DDR3 DIMM (Max. 1333MHz) Expansion Slots:

PCI-E 2.0 x16 or two x8 (auto-selected) Networking: Three GigE (Intel 82576 + 82574) Management: IPMI 2.0 + KVM (also Roamer compatible) Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S7016 Positioning: Application/edge servers with high memory

requirements and/or need for multiple NICs


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TY15

Form Factor: EATX Chipset: Intel 5520 CPU: 2 x Intel Xeon 5500 or 5600 (Up to 130W) Memory: 12 x DDR3 DIMM (Max. 1333MHz) Expansion Slots:

Four x PCI-E 2.0 x8 and one x4 Networking: Embedded dual port Intel® 82575EB Gigabit

Ethernet Management: IPMI 2.0 + KVM Options: Modular SAS and SAS RAID solution via optional

Intel® I/O Expansion Module Manufacturer model: Intel S5520HC


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Rackable® ServersModel Reference

Slides


56

• Rackable server model numbering is logical and extensible. Important for a large and growing product line.

• All Rackable model numbers are structured as follows:• C: Compute Server• <numeral>: Number of U’s• <numeral>: Form factor

• 0 = half-depth, 1 = std-depth, 2 = ICE Cube optimized

• <two numerals>: Number of hot-swap drive bays• Default to 3.5” bays if a server has the choice of either 2.5”

or 3.5”

• <hyphen>• <optional numeral>: Number of nodes (one, if not present)• <motherboard identifier>: Based on chipset architecture

Rackable® Model Numbering Introduction


57

• Rackable C2112-4RP4 (“Steelhead-WP”):• C = Compute Server• 2 = 2U• 1 = Standard Depth• 12 = 12 x 3.5” hot-swap drive bays• 4 = four nodes• RP4 = the 4th Romley-Platform board qualified

Rackable® Model Numbering Example


58

Form Factor: 1U half-depth

Hard Drives (hot-swap):

One 3.5” SAS/SATA drive

Two 2.5” SAS/SATA/SSD drives

Access via hinged Roamer LCD

Expansion Slot: One standard-height (on riser)

Power Supply: AC or DC

Remote Management: Integrated IPMI 2.0 + KVM or Roamer

Positioning:

Ideal general-purpose edge server

High configuration flexibility, expansion slot, up to 18 DIMM slots



59

Form Factor: 2U half-depth Hard Drives:

Up to five 3.5” SAS/SATA drives Up to ten 2.5” SAS/SATA/SSD drives 2.5” / 3.5” combinations supported Access to lower left bay drive(s) via hinged Roamer LCD

Expansion Slots: One standard-height (on riser) or five low-profile slots, config.

dependent.

Power Supply: AC or DC New redundant AC RPS option

Remote Management: Integrated IPMI 2.0 + KVM or Roamer Positioning:

Ideal general purpose 2U half-depth server where greater local storage density or I/O expansion is required. Strong in Internet search, scale-out database configurations.



60

Form Factor: 4U half-depth CPU: AMD Opteron 6200 - quad socket Hard Drives:

Two 3.5” SAS/SATA drives

Memory: 32 x DDR3 1600/1333/1066/800 MHz Expansion Slots:

1 x PCIEx16 (full height) 3 x PCIEx8 (full height)

Power Supply: AC, Redundant AC, (or DC) LSI SAS 2008 : 6Gbs, RAID 0, 1, 10 option 3 x GigE onboard ports Positioning:

Typically sold with redundant AC power, SAS drives as a database server.

Rackable® Half-Depth Server: H4002-G6


61

Rackable® Standard-Depth Servers(Intel Xeon E5-2600 and E5-2400)1U

C1104G-RP5

2U

C2110G-RP5

1U 2U

C1110-RP6 C2108-RP2

2U/Multi-node

C2112-4RP4


62

Rackable® C1104G-RP5Code Name “Pyramid 1U”

Chassis Profile 1U standard-depth

Servers/System One dual-socket

Chipset Intel® C600

Max. Processors Two Intel® Xeon® E5-2600

Max. CPU TDP 115W

Memory Slots 8 DIMM slots

Memory Type1600/1333/1066/800 MHz DDR3 ECC

Reg

Max. Hard Disk Drives

4 x 2.5" drives

Expansion Slot

Three PCI-E 3.0 x16 (two internal and one external) double-width slots

One external PCI-E 3.0 x8 low-profile slot

Networking (Onboard)

Dual-Port GigE controller (Intel® I350)

IPMI Remote Management Integrated IPMI 2.0

Power Supply 1800W Redundant* Platinum Level

*Redundant per configuration

Compute GPU/ Co-processor support:• Tesla M2075, M2090**, K10, K20, Xeon PHINVIDIA graphics GPU support: • Quadroplex 7000

**130W standard Max CPU TDP. 135W CPU TDP with ambient temp. restrictions


63

Code Name “Pyramid 2U”





Max. CPU TDP 130W


Memory Type1600/1333/1066/800 MHz DDR3 ECC

Reg

Max. Hard Disk Drives 10 x 2.5” drives

Expansion Slot

Four internal PCI-E 3.0 x16 double-width

One external PCI-E 3.0 x8 low profile and one PCI-E 2.0 x4 full height

Networking (Onboard) Dual-Port GigE controller (Intel® I350)


Power Supply 1800W Redundant** Platinum Level

**Redundant per configuration

Compute GPU/ Co-processor support:• Tesla M2075, M2090, K10, K20, Xeon PHINVIDIA graphics GPU support: • Quadroplex 7000

Rackable® C2110G-RP5


64

Code Name “Steelhead-WP”


Servers/System Four dual-socket (hot-pluggable)

ChipsetFour Intel® C600

(one/server)

Max. ProcessorsEight Intel® Xeon® E5-2600

(two per server node)

Max. CPU TDP 135W*

Memory Slots 64 DIMM slots (16/server)

Memory Type 1600/1333/1066/800 MHz DDR3 ECC reg.

Max. Hard Disk Drives16 x 2.5" drives (four per server)

or 12 x 3.5” drives (three per server)

Expansion Slots/Networking

Four PCI-E 3.0 x16 low-profile (one/server)

Four single port IB QDR or FDR onboard optional (one/server)

Four Gen3 x8 I/O module(one/server)



Power Supply 1200W Redundant** Platinum Level*130W standard Max. 135W with ambient temp. restrictions **Redundant per configuration

Rackable® C2112-4RP4


65

Code Name “Steelhead-JP”


Servers/System Four dual-socket (hot-pluggable)

ChipsetFour Intel® C600

(one/server)

Max. ProcessorsEight Intel® Xeon® E5-2600

(two per server node)

Max. CPU TDP 135W*

Memory Slots 32 DIMM slots (8/server)

Memory Type 1600/1333/1066/800 MHz DDR3 ECC reg.

Max. Hard Disk Drives16 x 2.5" drives (four per server)

or 12 x 3.5” drives (three per server)

Expansion Slots/Networking

Four PCI-E 3.0 x16 low-profile (one/server)

Four single port IB QDR or FDR onboard optional (one/server)

Four Gen3 x8 I/O module(one/server)



Power Supply 1200W Redundant** Platinum Level*130W standard Max. 135W with ambient temp. restrictions **Redundant per configuration

Rackable® C2112-4RP3


66

Code Name “Summit”





Max. CPU TDP 135W*


Memory Type1600/1333/1066/800 MHz DDR3

ECC reg.

Max. Hard Disk Drives 8 x 3.5“

12 x3.5" or 24 x2.5” drives

Expansion Slots

• Six PCIe Gen3 x8 Full Height or Two PCIe Gen3 x16 Double Width and two PCIE Gen3 x8

Full Height• 1 x PCIe Gen3 x8 Intel I/O

module option

Networking (Onboard) Quad-Port GigE controller(Intel® I350)


Power Supply 750W Redundant Platinum Level**

*130W standard Max. 135W with ambient temp. restrictions** Redundant per configuration

Compute GPU/ Co-processor support:• Tesla K20, Xeon PHI

Rackable® C2108-RP2


67

Code Name “Bison”





Max. CPU TDP 135W


Memory Type1600/1333/1066/800 MHz

DDR3 ECC reg.

Max. Hard Disk Drives 4 x 3.5“ or 10 x 2.5"

drives

Expansion SlotsOne PCIE Gen3 x16 full

height and one PCIE Gen3 x16 low profile

Networking (Onboard)Three GigE controllers (twoIntel® I350 and one Intel®

82574L)IPMI Remote Management Integrated IPMI 2.0

Power Supply650W Redundant PS or

450W Single PS

Rackable® C1110-RP6


68

Rackable™ Standard-Depth Servers(Intel 5600 and AMD 62/300)

2U

C2108-G9

1U

2U

2U

C1103-TY12

H2106-G7

C2112-4G10


69

C1103-TY12 (1U)

Processor Support Dual Nehalem-EP Xeon CPU, 5500 series

Memory Capacity 12 DIMM, DDR3 1333/1066/800 MHz

Expansion Slots 2 x PCI-e X16 Gen 2.0 (Full height, double width) - Optional riser cards to split one or both x16 slots in two x 8 slots - 1 x PCI-e X4 (Low-profile)

I/O ports1 x VGA, 1 x COM, 2 x Gbit LAN, 2 x USB 2.0 ports

System managementOn board BMC (Baseboard Management Controllers) supports IPMI2.0

Drive Bays 3x hot-swap 3.5” SATA HDD

System Cooling4 fans w/ Optimal Fan Speed Control

Power Supply1400W High-efficiency power supply

NVIDIA compute GPU support:• S2090, M2075, M2090, M2070QNVIDIA graphics GPU support: • Quadro FX 1800, 3800, 4800, 5800• Quadro 2000, 4000, 5000, 6000• Quadroplex 7000


70

Processor Support AMD Socket G34 Opteron™ 6200 /6300 Series – dual socket

Memory Capacity 16 DIMM , DDR3 1600/1333/1066/800 MHz

Expansion Slots 1 UIO slot3 PCI-E 2.0 x8 slot



Drive Bays

8 x 3.5” SATA/SAS HDD or SSDs: JBOD, RAID 0, 1, 5, 6, 10

System Cooling4x PWM Fans w/ Optimal Fan Speed Control

Power Supply2 x 720W High-efficiency redundant power supplies

C2108-G9 (2U)


71

Processor Support 4 nodes per chassisAMD Socket G34 Opteron™ 6200 /6300 Series – dual socket

Memory Capacity 8 DIMMs (per node), DDR3 1600/1333/1066/800 MHz

Expansion Slots 1 x PCI-e X16 Gen 2 per node (low profile)IB QDR single port optional



Drive Bays 3 x 3.5” SATA HDD (per node), JBOD

System Cooling4x PWM Fans w/ Optimal Fan Speed Control

Power Supply2 x 1600W High-efficiency redundant power supplies

C2112-4G10 (2U)C2112-4G10 (2U)

Nvidia graphics GPU support: Quadroplex 7000


72

H2106-G7 (2U)

Power Supply1400W High-efficiency Gold Level Redundant Power (RPS optional)

Expansion Slots2 x PCI-E 2.0 x16 (low profile)1 x PCI-E 2.0 x8 slot (low profile)

System Cooling6x 4-pin PWM Fans w/ Optimal Fan Speed Control

Drive Bays6x Hot-swappable 3.5” SAS/SATA Hard Drive Bays

I/O ports1 VGA, 1 COM, 2 Gbit LAN, 4 USB 2.0 ports.IPMI 2.0

Processor Support & ChipsetAMD Socket G34 Opteron™ 6200/6300 Series – quad socket

Memory Capacity32 DIMMs DDR3 1600/1333/1066/800 MHz


73

Why Romley?


74

Romley Value Propositions• Most dramatic performance improvement in a

generation, in some cases up to 3X performance increase

• Most flexible and highest price-performance product line in the industry

• Ideal for workloads in Private Enterprise and Public Cloud, Hadoop, HPC

• Most ecological solution in the industry using fine-grained power optimization

• Replacing systems from 2007 will result in a 66% TCO decrease


75

New Capabilities for Romley• New server for GPU compute “Pyramid”

• 3 GPUs + IB in a 1U, or up to 6 GPUs + IB in a 2U• RPS available• Consolidates capabilities from several models

• New 2U/4 node dense cluster node “Steelhead”• Same great density, increased I/O options

• New 2U I/O rich server “Summit”• Six Full Height PCIE slot options, consolidates three models

• New 1U model with RPS: “Bison”• New capability!• Redundant Power Supply option and up to 10 x 2.5” HDDs

in 1U


76

“SandyBridge” Servers Summary Project Code Name “Tylersburg”Equivalent Key Features Application Areas

“Steelhead” C2112-4RP4 and C2112-4RP3

C2112-4TY14C1104-2TY9

4 x 2S nodes in a 2U; optional on-board IB; 4 LP PCIe x 16 slots

HPC—dense cluster compute node; cloud

“Summit” C2108-RP2 C2108-TY10C2108-TY11

Single 2S EATX Motherboard; Up to 24 x 2.5 in. HDD; Up to 6 Full Height PCIe slots

Head node for HPC cluster

“Pyramid” C1104G-RP5 (1U),C2110G-RP5 (2U)

C1103-TY12C3108-TY11H4002

Single 2S slim Motherboard; up to3 x GPUs in 1U or 6 x GPUs in 2U; RPS

HPC—GPU computing

“Bison” C1110-RP6 New capability! 1 x 2S EATX motherboard; RPS

Media, Financial Services computer/rending node


77

Rackable® Networking

Reference Slides


78

Ethernet adaptersThe Silicom SFP+ 10 Gigabit Ethernet PCI Express server adapters are based on Intel 82599ES Ethernet controller with SFP portsThe fourth-generation (T4) technology from Chelsio provides the highest 10GbE performance available and dramatically lowers host-system CPU communications overhead with onboard hardware that off-loads TCP/IP, iSCSI, FCoE, and iWARP RDMA processing from its host system

Silicom PE210G2SPi9 Chelsio T420-CR


79

LG-Ericsson stacking switches

• 24 port and 48 port switches provide the infrastructure for Ethernet clusters as well as the administrative fabric for the IB clusters

• Max. stacking limit is 192 ports (4 x 48port switches)

• Fat tree topology utilizing the10 GbE switch at L2 and 1 GbE switches at L1 to support large clusters

iPECS Ethernet SwitchES-4500G Series

iPECS 10G Data Center SwitchES-5000XG Series


80

Mellanox/Voltaire IB QDR switches

108 CXP-CXP cables Fully non-blocking Flexible Racking 12 x 12X connectors

4036

36 port QDR (1U)

4200

144 port QDR (11U)

324 port QDR (19U)

2 x 4700

648 ports QDR

4700

IS5025/IS5030/IS5035 36-port 40Gb/s InfiniBand Switch Systems

IS5300 324-Port InfiniBand Chassis Switch


81

Qlogic QDR IB switches

6U

1U

Form Factors:– 36 port, Internally Managed (1U)– 72-96 port, Director Class (5U), – 108-144 port, Director Class (6U) – 216-288 port, Director Class

(10U) – 324-432 port, Director Class

(14U)– 648-864 port, Director Class

(29U)


82

Mellanox IB FDR adapters and switches5th generation SwitchX® InfiniBand switch devices, up to 56Gb/s (FDR) full bisectional bandwidth per portOnboard subnet manager, enabling simple, out-of-the-box fabric bring-up for up to 648 nodesCompliant with IBTA 1.21 and 1.3Mellanox ConnectX-3 provides one adapter for InfiniBand, 10/40 Gig Ethernet or Data Center Bridging fabrics.PCIe Base 3.0 compliant, 1.1 and 2.0 compatible

SX6025/SX6036 36-port 56Gb/s InfiniBand Switch Systems

SX6536 648-Port InfiniBand Director SwitchConnectX®-3

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