CompanyPresentation

Jun 10, 2014

Where quickturn and small volume PCB orders are all

done in-house.

★Our Milestones ★Organization Chart ★Revenue by Year ★Business Strategies ★Fabrication Capabilities ★Technology Roadmap ★Main Production Facilities ★Quality Assurance ★QA Systems & Final Inspections

OutlineOutline

Our MilestonesOur Milestones

MilestonesMilestones

1996 Established Speedy Circuits as a “quickturn” prototype PCB 1996 Established Speedy Circuits as a “quickturn” prototype PCB

fabrication shop with 50 employees.fabrication shop with 50 employees.

1997 Successfully created metal core (aluminum) boards.1997 Successfully created metal core (aluminum) boards.

1998 Adopted microwave materials (PTFE), such as Rogers, Polyimide, 1998 Adopted microwave materials (PTFE), such as Rogers, Polyimide,

Nelco, and Taconic, in production. Nelco, and Taconic, in production.

1999 1999 Granted UL certificate of registration.

2000 2000 Given approval by UL for heavy copper of up to 6 oz for

internal layers.

2001 Successfully applied sequential blind/buried vias in production.2001 Successfully applied sequential blind/buried vias in production.

2002 Successfully created vias in pads. 2002 Successfully created vias in pads.

2003 Awarded ISO9001 (2000 version) NSF-ISR Certification. 2003 Awarded ISO9001 (2000 version) NSF-ISR Certification.

2004 Successfully applied two-build-up implement to create 2+N+2 HDI 2004 Successfully applied two-build-up implement to create 2+N+2 HDI

boards.boards.

2005 Achieved high aspect ratio hole of ^15:1 in place of ^12:1.2005 Achieved high aspect ratio hole of ^15:1 in place of ^12:1.

2006 Moved into a new and bigger facility and increased our workforce to 250. 2006 Moved into a new and bigger facility and increased our workforce to 250.

2007 Successfully adopted manufacturing techniques to create flexible and rigid-flex PCBs.2007 Successfully adopted manufacturing techniques to create flexible and rigid-flex PCBs.

2008 Acquired additional equipment, including two drilling machines, two NC routing 2008 Acquired additional equipment, including two drilling machines, two NC routing machines and two flying probe type testers, resulting in increased production capacity. machines and two flying probe type testers, resulting in increased production capacity.

2009 Granted ISO9001 (2008 version) NSF-ISR Certification. 2009 Granted ISO9001 (2008 version) NSF-ISR Certification.

2010 Successfully created stacked vias/HDI-SBU via-fill copper plating and blind microvias 2010 Successfully created stacked vias/HDI-SBU via-fill copper plating and blind microvias

4+N+4. 4+N+4.

2011 Acquired a new gold plating line (ImmAu, hard gold, soft bondable gold) and LDI for 2011 Acquired a new gold plating line (ImmAu, hard gold, soft bondable gold) and LDI for

fine line/space of 2 mils.fine line/space of 2 mils.

2012 Acquired new Orbotech InCAM systems to enhance our CAM capability for HDI design 2012 Acquired new Orbotech InCAM systems to enhance our CAM capability for HDI design

boards.boards.

2013 In April, we started offering fabrication services for multilayer flexible PCBs at our shop.2013 In April, we started offering fabrication services for multilayer flexible PCBs at our shop.

In May, direct laser drill superseded the opening copper window laser drill In May, direct laser drill superseded the opening copper window laser drill

method, thus achieving Any-Layer Interstitial Via Hole (ALIVH) in HDI fabrication.method, thus achieving Any-Layer Interstitial Via Hole (ALIVH) in HDI fabrication.

2014 Applied laser micro-via filled copper plate and thru-hole copper plate at the same time, 2014 Applied laser micro-via filled copper plate and thru-hole copper plate at the same time,

thus significantly reducing lead times for HDI PCB manufacturing, and effectivelythus significantly reducing lead times for HDI PCB manufacturing, and effectively

meeting market demand for quickturn HDI-SBUs.meeting market demand for quickturn HDI-SBUs.

Organization Chart Organization Chart

Effective June 11, 2014

General Manager

Paul Lien

Administration & Production II

Ivy Song

Finance

Dilys Huang

Production I

Human Resources

Purchasing

General Affairs

Maintenance

Security &Environmental Protection

Accounting

Finance

Dry Film

CU PlatingDrill

Solder Mask

Mass LaminationNC Routing & V-Score

Production Control & Production I

HugKuo Wang

Chairman of the Board

QA Dept.

Aaron Chao

QA

OQC

QC

FQC

Production Control

QA & Production III

Jacky Chen

Production Control

Shipping Dept.

E-Test

Administration

MIS

Material warehouse

Production II

Production III

Project

CAM Dept.C.C Lee

Front-EndEngineering Dept.Eric Lee

Sales

Jeremy Chuang

Oversea Sales

Local Sales

Gold

AOI

ENG & CAM Dept.

Yc Chang

Revenue by YearRevenue by Year

RevenueRevenue

Revenue by Type of PCBRevenue by Type of PCB

2/L10/L

8/L

6/L

4/L

12/L↑

Revenue by Sales RegionsRevenue by Sales Regions

Asia 40%

Australia 5%

Europe 5% Others 5%

USA 50%

Business StrategiesBusiness Strategies

Main FocusMain Focus Quickturn prototype & small volume productionQuickturn prototype & small volume production - - Engineering samples & prototypes.Engineering samples & prototypes. - Single-sided up to 42-layer count. - Single-sided up to 42-layer count. - Operating 24 hours a day, 7 days a week. - Operating 24 hours a day, 7 days a week.

Diversified products and servicesDiversified products and services - Providing a variety of materials (i.e., PTFE, Teflon, etc.) for microwave - Providing a variety of materials (i.e., PTFE, Teflon, etc.) for microwave applications, metal core, rigid-flex, etc. Achieving more than you can applications, metal core, rigid-flex, etc. Achieving more than you can imagine.imagine.

Highest quality & reliable productsHighest quality & reliable products - Impeccable quality system support- Impeccable quality system support - Delivering high reliability PCBs- Delivering high reliability PCBs On-time delivery - Speedy Circuits: All that the name implies is quickness- Speedy Circuits: All that the name implies is quickness. .

Fabrication CapabilitiesFabrication Capabilities

Process Capability Process Capability

SpecificationsCapability

2010 2011 2012 2013 2014

Material

FR 4PTFE

PolyimidePI

FR 4PTFE

PolyimidePI

FR 4PTFE

PolyimidePI

FR 4PTFE

PolyimidePI

FR 4PTFE

PolyimidePI

Min. dielectric thickness 2 mil 2 mil 2 mil 2 mil 2 mil

Max. layer count 40 42 42 46 50

Max. working panel size 20“x30” 21“x31” 21“x31” 21“x31” 21“x31”

Max. board thickness .250“ .250“ .280“ .280“ .280“

Min. board thickness .016“(6L) .016“(6L) .016“(6L) .016“(6L) .016“(6L)

Min. line/space

I/L 3/2.5 Mil 2.5/2.5 Mil2/2 Mil 2/1.5 Mil 2/1.5 Mil

O/L 3/2.5 Mil 2.5/2.5 Mil2.5/2 Mil 2/2 Mil 2/2 Mil

Warp 0.001“/in. 0.001“/in. 0.001“/in. 0.0008“/in. 0.0008“/in.

SpecificationsCapability

2010 2011 2012 2013 2014

BGA pitch 0.35mm 0.30mm 0.25mm 0.2mm 0.2mm

Layer-to-layer registration 4 mil 3 mil 3 mil 3 mil 3 mil

Finish hole size (min.)

Mechanical drill .004“ .004“ .004“ .003“ .003“

Laser drill .004“ .003“ .003“ .0025“ .002 “

True-hole position +/-.002“ +/-.002“ +/-.002“ +/-.0015“ +/-.0015“

Finish hole size Tolerance

PTH +/-.002“ +/-.002“ +/-.002“ +/-.0015“ +/-.0015“

Non-PTH +/-.001” +/-.001” +/-.001” +/-.001” +/-.001”

Aspect ratio (board thickness/FHS) 20 20 20 24 30

Heavy copperInner layer 6 OZ 6 OZ 6 OZ 6 OZ 10 OZ

Outer layer 10 OZ 10 OZ 12 OZ 16 OZ 16 OZ

Specifications Capability

2011 2012 2013 2014

Buried/blind via Yes 4+N+4 Yes 9+N+9 Yes 9+N+9 Yes 10+N+10

Plasma desmear Yes Yes Yes Yes

Outline tolerance +/-.004“ +/-.004“ +/-.004“ +/-.004“

Surface finish HASLENIG

Immersion silverOSP(ENTEK)

CarbonImmersion tin

Electrolytic gold

HASLENIG

Immersion silverOSP(ENTEK)

CarbonImmersion tin

Electrolytic gold

HASLENIG

Immersion silverOSP(ENTEK)

CarbonImmersion tin

Electrolytic gold

HASLENIG

Immersion silverOSP(ENTEK)

CarbonImmersion tin

Electrolytic gold

Impedance control +/-5% +/-5% +/-5% +/-5%

RoHS compliant Yes Yes Yes Yes

HDI-SBU Microvias Capability

formed using laser drill with via filled copper plating.

Plated filled blind microvia advantage.• Reduces capture pad size of fine pitch BGA.

By reducing the via hole size, it significantly helps the designer to obtain more routing spaces.

• Reduces board real estate for slimming and portability purposes.

By reducing the board size and weight of the product, it improves the electrical performance of  the system.

• Increases reliability

Providing stacked vias allows stronger interconnections and obtains better thermal management.

This also significantly increases board reliability at more severe operation circumstances.

Conventional Plating A plated filled blind microvia

Filled ResinPlated Copper

Technology RoadmapTechnology Roadmap

Technology Goals

Issue Goal ApplicationCurrent 2014 2015

Status Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

Heavy copper

O/L copper13~16 oz Cu

Power module

12 oz

I/L copper 7~10 oz Cu

6 oz

Layer count/board thickness 50/10mm Back panel 46/6.5mm

Aspect ratio 30:1 Back panel 24:1

Line/space/pad O/L 2/2/6 mil Flip chip 2/2/8 mil

Drill hole size 3.9mil Flip chip 4.9 mil

Layer-to-Layer registration 2 mil Flip chip 3 mil

Main Production Main Production Facilities Facilities

Production FacilitiesProduction FacilitiesProcess Equipment Q’ty

CAM engineering Par CAM (IGI), InCAMFilm laser plotter (EIE SWISS)

303

Dry film UV exposure machineLDI (laser direct image)Thin core pre-treatment lineThin core etch/strip lineCCD camera (punch A/W) Dry film laminatorAutomatic dry film laminatorThin core dry film developing line

42111311

Process Equipment Q’ty

AOI system CAMTEK Orion 706 (6/6 mils)CAMTEK Orion 868 (4/4 mils)Orbotech Discovery-OLB (1.6/1.6 mil)Orbotech Fusion 22 (1/1 mil)

1112

Gold plating Electrolytic hard gold plating lineElectrolytic soft gold plating line Immersion gold plating line (ENIG)

111

Process Equipment Q’ty

Lamination Automated black oxidation lineVacuum lamination hot press (Vigor)Vacuum lamination cold press (Vigor) Vacuum high-speed lamination machine (Vigor)Dual x-ray target drilling system (AbleTek)

16111

Drilling NC drilling machine (52 spindles)Pre-treatment (belt scrubbing & micro-etch)Laser drill (Mitsubishi-ML605GTW -H)ⅡX-ray (registration controller)

10111

Process Equipment Q’ty

Copper plating Chemical desmear (permanganate) & PTH line Plasma desmearHigh-pressure hydraulic de-burr lineSurface copper subtracted linePanel plating line Acid cupric chloride etching lineHDI via filled copper plating (three baths)Pattern plating lineAlkaline ammonia etching line

111111111

Process Equipment Q’ty

Solder mask Surface pre-treatment lineSemi-auto printing machineUV exposure machine (7 KW)Optical alignment exposure machine (8 KW)Solder mask developing lineLED direct imaging (screen)

142111

Silkscreen Printing workstation (manual) UV exposure machine (3 KW) for stencilInkjet legend printer (Sprint-100 Orbotech)

312

Process Equipment Q’ty

Fabrication CNC router machine (18 spindles)Beveling machineV-groove machine

611

Electrical test Dedicated tester (SINK)Flying probe type testers Emma (ELX6146-limitation by 5 mils)Emma (E4M6151-limitation by 2 mils)Mania (U8-Board size 24” x 27” Max.)

1711

TDR measurement Polar CITS500S Polar CITS900S4 Agilent E5063A ENA Series network analyzer

111

FQC Hole counterIR reflowFinal cleaning machine

111

Shipping Vacuum packaging machine 2

Quality Assurance Quality Assurance

QA Department & Function

Engineer: 5 Inspector: 4

Engineer: 5Inspector: 24

Engineer: 4Inspector: 22

1. In-process audit2. Incoming inspections3. Rejected material review4. Supplier quality check

1. QS maintenance2. FA inspection3. Reliability test4. Equipment calibration5. Customer service

1. 100% visual inspection2. Outgoing quality inspections & tests3. Microsection inspection4. Impedance measurement5. Dimension measurement

ISO9001: 2008 certified by NSF-ISR since 2000

Quality Management

UL registeredcertified by UL since 2003

Quality Process

IPQC Chemical laboratory Physical Laboratory Micro-section Lamination thickness measurement L/S measurement control CMI control copper thickness Impedance control measurement

In-process Control

Thermal stress test 288 10 sec.℃ Ionic contamination test IR reflow test Electrical test Peeling tests on solder mask & legend ink Hi-pot test Impedance TDR measurement

Reliability Tests

QA Systems & QA Systems & Final Inspections Final Inspections

Outgoing Inspections Fabricating in accordance with quality standards under the following criteria: IPC-6011, IPC-6012, IPC-6013 and IPC-A-600G. Also conduct following test procedures:

- Visual inspection - Electrical test- Physical dimensions - Board thickness- Hole size & hole status - Tape test on gold plating and S/M- PTH copper thickness - Board bending & warpages check - Layer-to-layer registration - Solderability test- Impedance TDR measurement - Other special requirements as per customers’ requests

YOU are our most valuable client.

We look forward to supplying your next prototype board requirements

Speedy Circuits