• Founded in 1999

• Started as a formulator and manufacturer of high performance adhesives in Permatang Tinggi

• Focused mainly in General

Electronic applications

Company Profile

1999 -2003 2004-2007

• Expanded R&D and started the

development of LED epoxy for Displays

• Initiated the research on silicone for LED

• Developed a wider range of products for General Electronic applications (>100 products)

• Appointed distributors in Malaysia, Thailand and Singapore

2008-2013

• Moved to a new factory in Bkt Minyak with total build-up area of 25k sqft

• Further expanded on R&D, Quality and Production capability and capacity

• Developed LED epoxy and silicone products for PLCC and high brightness lamps

• Setting up equipment & facilities to synthesize specialties silicone

• Appointed distributors in China and Taiwan

Penchem’s Factory Overview

R&D and Quality Laboratories

Administration Office Production

Warehouse

LED Silicone, TIM (Thermal Interface Material), Fiber Optic Adhesives

• Manufacturing facilities to synthesize specialties compounds

(Silicone & Hybrid) – 2012

• Develop Liquid Glass Hi-RI (1.55-1.70 ) / High UV/Thermal/Moisture

Resistance and excellent mechanical properties

Penchem’s Product Portfolio – Present & future

LED Epoxy, UV Epoxy, Silver Epoxy, SMT, COB, Potting & Sealant)

2007 - 2011 2000-2006 2012 - 2015

Some key reasons:

Wide range of high quality and performance products Custom formulations and solutions Cost effective alternative

• Synthesis of own key raw materials • Industry leading price and performance • Small Minimum Order Quantity, MOQ

Strong and comprehensive technical support • Provide competitors evaluations, incorporate with professional

system/equipment manufacturer to provide total solutions, materials failure

analysis and process trouble shooting

RoHS compliant (test report issue by SGS and accredited test labs)

Why Penchem Products

Penchem Analytical Capability & Services

Chemical and Molecular Analysis

GC-MS

GPC

UPLC-MS

MICRO-FTIR

Molecular modeling Analysis Software

Electrical, Reliability & Curing Analysis

Resistivity Meter

Dielectric Constant Meter

Hot Plate

Humidity Chamber

Xenon Test Chamber

Digital Programmable Oven

Digital Oven

Thermal, Optical and Physical Analysis

TGA

TMA

DMA

DSC

Tensile Tester

Hardness Tester

Viscometer

Refractor Meter

Chloride Ion Tester

Colour Assessment Chamber

Digital Balance

Density Meter

Microscope

>> We provide services on Material Analysis, Failure Analysis and Reliability Analysis <<

Quality Management System: ISO9001:2008 & ISO/TS 16949:2009 Environmental Management System: ISO14000:2004

Achievement 2012

The Most Innovative and Best Innovation Awards for the Synthesis of Specialty Silicones for Optoelectronic Applications

Achievement 2012

Quality Management Excellence Award 2011

Winning Together

24 October 2012

Research Collaboration with Universities 1. USM: Nano-silver electrical conductive adhesives (Completed) - Consultant Prof. Dr. Mariatti Jaafar - Funded student Khairul Annuar for M.Sc.

2. USM: Synthesis of silicone resins (In progress) - Consultant Assoc. Prof. Dr. Zulkifli Ahmad - Funded Penchem R&D Manager Rafiza Ramli for Ph.D.

3. India professor: Silicone chemistry & technology (In progress) - Consultant Dr. R.N. Kumar (also formerly USM professor) - Silicone synthesis techniques - Plan to jointly publish book on silicones with reputable American publisher

4. USM: Silicone acrylate synthesis (In progress) - Consultant Assoc. Prof. Dr. Zulkifli Ahmad - Funded Research Assistant Azliyana

5. USM: POSS silicone synthesis for LEDs and medical (In progress) - Consultant Assoc. Prof. Dr. Zulkifli Ahmad - Funded Penchem R&D Engineer Loh Tat Chuang for M.Sc.

6. UKM: Superconductors & conductive ceramics (Being planned) - Consultant Prof. Dato’ Dr. Roslan Abd Shukor - Increase thermal and electrical conductivity for electronic applications

7. USM: Carbon nanotube composites (Being planned) - Consultants Prof. Dr. Abdul Rahman Bin Mohamed & Prof. Dr. Mariatti Jaafar - Increase thermal and electrical conductivity for electronic applications

Global Footprint

New York China

California

Carolina

France

Japan

Taiwan

Malaysia

Thailand

Germany

Products Overview

Optoelectronic

Finished Products Product Category Product Code Applications Special Features

Casting Epoxy OP581 OP586 OP685 OP692 OP695 OP697

• Automobile lighting • Turn signal bulbs • Electronic signs • Signboards • Backlighting • Traffic signal lights

Package Type: Through hole LED (3mm, 5mm, Oval, Flat- top) Super Flux Snap LED

• Outstanding performance for outdoor applications • Pass 1000TMCL -55°C to 100°C and -45°C to +120°C • Meet MSL2 specifications • Low Iv degradation (<10%) at 1000hours HTOL • Comply to REACH & RoHS requirements

Encapsulation Silicone

OP955 OP957 OP954 OP966 OP968 OP970

• Commercial lighting • Architectural lighting • Outdoor lighting

Package Type: High power LED

• High transmission > 92% • High thermal & radiation resistance, Low stress • Low gas permeability • Wide range of refractive index (RI from 1.4 to 1.5)

Encapsulation Epoxy / Silicone

OP589 OP685 OP955 OP959

• Backlighting for signage, LCD panel (TV, hand phone, tablets, etc • Architectural Lighting • Automotive Accent Lighting

Package Type: PLCC/SMD LED

• Good heat & UV resistance • Meet MSL2 specification

Potting Epoxy OP281 • S4 (seven Segment Display) for counters and digital instruments.

• Low thermo-mechanical stress • Meet MSL2 specification

Thermal Interface Material (TIM)

Finished Products Product Category Product Code Applications Special Features

Silicone Pad TH936-1 TH938 TH977

• Heat sink for Power driver, IC for PC, Notebook, & Server • Heat sink for high power LED and controller • Heat sink for automobile and heat exchangers

• Very good thermal conductivity up to 3.6W/mK • 2 types of Pad: (a)Non-sticky and (b)One-side sticky • Can die cut to specific size and dimensions • Wide range of thickness (0.3mm up to 7mm)

Silicone Putty / Grease

TH931-2 TH932-2 TH940

• Excellent outdoor performance with good stability & reliability • Ease of use by dispensing or screen printing

Potting Silicone/ Epoxy

TH934 PT605

• 2-Part RTV potting compound • Good adhesion and weather ability • Good flow ability and self-levelling

Thermally Conductive Epoxy

TH732-1 TH670

• 1-Part heat curable epoxy • Excellent adhesion and good mechanical strength • Good thermal conductivity

General Electronic Finished Products Product Category Product Code Applications Special Features

Chip On Board Epoxy (COB)

EN453 EN485 EN521 EN525

• Chip-On-Board • Dam & Fill • Encapsulation and protect components and bonded wires

• Good mechanical and adhesion strength • Low stress • Good thermal-mechanical properties • Good whether ability

Die Attach / SMT Epoxy / Silver Epoxy / Under Fill

CB625 CB643 DA669 AG806

CB626 CB648 AG803

• Bonding chip and component on PCB • Die attach (Electrically & non- electrically conductive) • Under-fill

• Good mechanical and adhesion strength • High thixotropic, no bleeding and tailing • High electrical conductivity (silver epoxy)

Epoxy Sealant EN521 GL172 GL440 GL616

• Relays & Contactors • Fiber optic • Lens

• Low thermal-mechanical stress • High thermal and moisture resistance • Good chemicals resistance

Epoxy Potting / Silicone Potting

PT365 PT366 PT497 PT910

PT368 PT369 PT380

• Transformer • Sensor

• Low stress, Good thermal-mechanical properties and whether ability • Good flow ability & self-levelling

UV Epoxy / Silicone UV367 UV379-1 UV405 UV531 UV923

• Bonding Fiber optic • Bonding Lens • Tacking Coils • Coating

• High Refractive index (RI=1.4 to 1.5) • Good mechanical and adhesion strength • Fast curing

Penchem LED Packaging Materials

Encapsulant / Casting Materials

Epoxy

(Super Flux, SnapLED, PLCC)

Silicone (HB LED, PLCC)

[Heat & UV Curable]

Hybrid

(Epoxy-Silicone)

Die Attach Material

Silver Epoxy

Thermal Conductive

Material

Epoxy (Hard, Good Adhesion)

Silicone (Soft, Flexible)

Sealant / Potting Material

Epoxy (2-Part RT Curable)

Silicone (2-Part RT Curable)

Penchem LED Packaging Materials

Contact Information