compunetics, inc. 3/21/06 trace / space outers *current12 months24 months production engineering...
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Compunetics, Inc. 3/21/06
Trace / Space Outers * Current 12 Months 24 Months
Production
Engineering
0.0040” / 0.0035”
0.0015” / 0.0015”
0.0035” / 0.0035”
0.0012” / 0.0012”0.0030” / 0.0035”
0.0010” / 0.0010”
Technology Road Map
Trace / Space Inners * Current 12 Months 24 Months
Production
Engineering
0.0035” / 0.0035”
0.0015” / 0.0015”
0.0030” / 0.0030”
0.0012” / 0.0012”0.0025” / 0.0030”
0.0010” / 0.0010”
Trace Width Tol. Inners* Current 12 Months 24 Months
Production
Engineering
+/- 0.0005”
+/- 0.0003”
+/- 0.0004”
+/- 0.00025”+/- 0.0003”
+/- 0.0002”
Controlled Impedance Tolerance * Current 12 Months 24 Months
Production
Engineering
+/- 10%
+/- 2%
+/- 7%
+/- 2%+/- 5%
+/- 2%
Imaging And EtchingImaging And Etching * Half Ounce Copper
Compunetics, Inc. 3/21/06
Layer-to-Layer Registration Current 12 Months 24 Months
Production
Engineering
+/- 0.0030”
+/- 0.0025”
+/- 0.0030”
+/- 0.0025”+/- 0.0025”
+/- 0.0020”
Technology Road Map
Signal Pad Annular Ring Inners Current 12 Months 24 Months
Production
Engineering
0.0040”
0.0030”
0.0035”
0.0025”0.0030”
0.0020”
Plane Clearance Inners Current 12 Months 24 Months
Production
Engineering
0.016”
0.011”
0.014”
0.010”0.012”
0.008”
Copper Feature to Board Edge Current 12 Months 24 Months
Production
Engineering
0.0050”
0.0030”
0.0045”
0.0025”0.0040”
0.0020”
Imaging And Imaging And MechanicalMechanical
Compunetics, Inc. 3/21/06
Minimum Hole to Capture Pad Current 12 Months 24 Months
Production
Engineering
0.006” / 0.010”
0.003” / 0.006”
Technology Road Map
Aspect Ratio of Blind Microvia Current 12 Months 24 Months
Production
Engineering
0.5:1
0.7:1
0.6:1
0.8:10.7:1
1:1
Copper Filled Microvias Current 12 Months 24 Months
Production
Engineering
No
Evaluation
No
YesYes
Yes
Multi-Level Microvias (Stacked) Current 12 Months 24 Months
Production
Engineering
No
Yes
No
YesYes
Yes
Laser Drilled MicroviasLaser Drilled Microvias
0.005” / 0.009”
0.002” / 0.006”
0.004” / 0.008”
0.002” / 0.005”
Compunetics, Inc. 3/21/06
Number of Layers Current 12 Months 24 Months
Production
Engineering
26
52
28
5632
60
Technology Road Map
Smallest Mechanical Drilled Holes* Current 12 Months 24 Months
Production
Engineering
0.0060”
0.0040”
0.0060”
0.0040”0.0050”
0.0030”
MechanicaMechanicall
*.0.062” thick board
** 0.125 thick board
Compunetics, Inc. 3/21/06
Minimum Soldermask Web Current 12 Months 24 Months
Production
Engineering
0.0030”
0.0030”
0.0030”
0.0025”0.0030”
0.0025”
Technology Road Map
Minimum Soldermask Clearance Current 12 Months 24 Months
Production
Engineering
0.0030”
0.0025”
0.0025”
0.0020”0.0025”
0.0020”
Legend Min Height / Line Width Current 12 Months 24 Months
Production
Engineering
0.050” / 0.006”
0.040” / 0.005”
Soldermask And Soldermask And ScreeningScreening
0.030” / 0.006”
0.035” / 0.005”
0.035” / 0.005”
0.030” / 0.004”
Compunetics, Inc. 3/21/06
Aspect Ratio Current 12 Months 24 Months
Production
Engineering
9:1
12:1
10:1
13:111:1
14:1
Technology Road Map
PTH Tolerance (finished hole size) Current 12 Months 24 Months
Production
Engineering
+/- 0.0030”
+/- 0.0015”
+/- 0.0025”
+/- 0.0012”+/- 0.0020”
+/- 0.0010”
PlatingPlating
Compunetics, Inc. 3/21/06
Laser Drilled Blind Micro-Laser Drilled Blind Micro-viasvias
Challenging Technologies
Compunetics, Inc. 3/21/06
Extreme Technologies
Copper Filled Micro-viasCopper Filled Micro-vias
Via-in-pad Provides Flat Pad Surface for BGA AttachFlat Surface Optimal For Stacked Micro-vias Need For Special Plating ChemistryNeed For Special Plating EquipmentEnables Pin Escaping High Pin Count .5 mm Pitch BGAsTechnology Under Development at Several US Shops
Compunetics, Inc. 3/21/06
Extreme Technologies
Copper Filled Micro-viasCopper Filled Micro-vias
Current Plating Current Plating TechnologyTechnology
Compunetics, Inc. 3/21/06
Extreme Technologies
Copper Filled Micro-viasCopper Filled Micro-vias
Compunetics Test Compunetics Test ResultsResultsTest Boards Have Been Received
From (2) Chemistry Manufacturers
The Smaller The Hole, The More Flat the Plating
Plating of Close to 1:1 on Blind Microvias
Both Manufacturers to Receive Stacked Microvia Tests
Stress Testing In Progress
Compunetics, Inc. 3/21/06
Extreme Technologies
Copper Filled Micro-viasCopper Filled Micro-vias
Stacked Micro-Stacked Micro-viasvias
Compunetics, Inc. 3/21/06
Extreme Technologies
Copper Filled Micro-viasCopper Filled Micro-vias
Stepped Micro-Stepped Micro-viasvias
Compunetics, Inc. 3/21/06
Extreme Technologies
High Aspect Ratio Blind Micro-High Aspect Ratio Blind Micro-via Platingvia PlatingSome Designs Require More Dielectric Between Layers 1-
2 and Still Require Blind Micro-viasCurrent Technology at approx. 0.7:1 Aspect Ratio Industry Looking for Aspect Ratios of Greater Than
1.25:1Copper Filled Micro-via Chemistry and Equipment May
Help Increase Achievable Aspect Ratios
Compunetics, Inc. 3/21/06
New Equipment
Horizontal Plate Through LineHorizontal Plate Through Line
Plate Through Line Designed To Electroless Plate High Aspect Ratio Holes And Blind Laser Drilled Micro Vias
Increased Through Put And Easier Control Of Chemistry Less Start Up Time For Chemistry