confidential and proprietary - nxp semiconductors...• the key data-driven optimizations to reduce...
TRANSCRIPT
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, t
he Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony
are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack,
ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ
Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks
of Freescale Semiconductor, Inc. All other product or service names are the property
of their respective owners. © 2011 Freescale Semiconductor, Inc.
Confidential and Proprietary
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
2
Confidential and Proprietary
• eSys (130nm Hip7NVM) products have been in production for
many years. As the 0.13um Hip7NVM process becomes more
and more mature and defectivity (D0) gets lower and lower, it
enables us to reduce the Burn-In durations via stress
optimization to further improve manufacturing throughput without
impacting the baseline PPM performance.
• Although current production Burn-In is stated to be 14 hours, the
actual stress duration is only about 10 – 11 hours while the rest is
buffer time for slowest parts in NVM W/E cycling.
• The key data-driven optimizations to reduce the Burn-In duration to 5 hours: •NVM write/erase cycle reduction from 1500 cycles to 100 cycles (~2.5 hours saving)
•NVM bulk read stress to replace HTOL flash reads (~2 hours saving)
•Scan and BIST duration reduced (~1.5 hour savings)
• Qualification plan: • Qual vehicle / driver product:
•100K production reject analysis to confirm no risk from the key updates
•10K validation flow to validate the Burn-In implementation and no additional fallout from additional Burn-In
•Derivative products:
•Qual-By-Similarity (QBS) to the driver product, with IP gap analysis
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
3
Confidential and Proprietary
Qual Vehicle
• MPC5565
Derivative Product
• MPC5554, MPC5566, MPC5553, MPC5533, MPC5534, MPC5567, MPC551x
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
4
Confidential and Proprietary
Tests in Burn-In (TIBI)
RAM BIST
Current: 60 minutes; Reduce to 20 minutes
Non-NVM Module Exercise
NVM High-Voltage Stresses
Post-Stress TIBI
SCAN Stress
Current: 60 minutes; Reduce to 20 minutes
NVM Write/Erase Cycling
Current: 1500 cycles (3 hours); Reduce to 100 cycles (30 minutes)
NVM Read Disturb
Current: 2 hours; Reduce to 12 minutes (duty cycle improvement)
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
5
Confidential and Proprietary
• All Hip7NVM devices run 1500 Write/Erase(W/E) cycles
• With high-voltage (HV) erase stress prior to W/E cycling, most
cycling related defects are screened by HV stress.
− Reducing R/W cycling to 100 cycles on all blocks.
• Validated by
− reviewing data logs of Burn-In W/E cycling failures from 6 months
production data of MPC5565 (~895k units)
All units with valid Burn-In cycling fail code failed at 1st cycle
− collecting and verifying Burn-In W/E cycling failures from 100k
MPC5565 (eSys) devices.
No W/E cycling failures beyond 100 cycles – all failed within 30 cycles.
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
6
Confidential and Proprietary
-0.02%
0.00%
0.02%
0.04%
0.06%
0.08%
0.10%
Burn
in 1
0H
V W
E (
cycle
1)
Burn
in 1
0H
V W
E (
cycle
2)
Burn
in 1
0H
V W
E (
cycle
3)
Burn
in 1
0H
V W
E (
cycle
4)
Burn
in 1
0H
V W
E (
cycle
5)
Burn
in 1
0H
V W
E (
cycle
6)
Burn
in 1
0H
V W
E (
cycle
7)
Burn
in 1
0H
V W
E (
cycle
8)
Burn
in 1
0H
V W
E (
cycle
9)
Burn
in 1
0H
V W
E (
cycle
10)
Burn
in 1
KW
E (
cycle
1)
Burn
in 1
KW
E (
cycle
s2
-10)
Burn
in 1
KW
E (
cycle
s11
-50)
Burn
in 1
KW
E (
cycle
s51
-99)
Burn
in 1
KW
E (
cycle
s100
-…
Burn
in 1
KW
E (
cycle
s200
-…
Burn
in 1
KW
E (
cycle
s300
-…
Burn
in 1
KW
E (
cycle
s400
-…
Burn
in 1
KW
E (
cycle
s500
-…
Burn
in 1
KW
E (
cycle
s600
-…
Burn
in 1
KW
E (
cycle
s700
-…
Burn
in 1
KW
E (
cycle
s800
-…
Burn
in 1
KW
E (
cycle
s900
-…
Burn
in 1
KW
E (
cycle
1000)
Burn
in 1
KW
E (
invalid
…
602 603 604 605 606 607 608 609 610 611 640 641 642 643 644 645 646 647 648 649 650 651 652 653 654
• The below chart shows the W/E failure by cycle count
• All valid Burn-In W/E cycling failures occur at cycle 1 after HV erase stress.
Fail code corresponding to failing W/E cycle # Fail codes for HV stress cycles
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
7
Confidential and Proprietary
• Collected and verified all Burn-In NVM W/E cycling fails
• All NVM W/E cycling fails failed within 30 cycles
0.000%
0.001%
0.002%
0.003%
0.004%
0.005%
0.006%
0.007%
0.008%
W/E cycle count
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
8
Confidential and Proprietary
• Replace the NVM continuous reads with the bulk read stress
− Current continuous reads: read one 32-Byte page at a time. Loop through all pages in entire flash array for 2 hours. The total stress time for each bit on 2MB flash array is: (1/65536)*120 minutes = 110 mS.
− New bulk read stress: all bits in the flash array are stressed in parallel. Total stress time for each bit is 2 minutes.
− Much improved stress duty cycle via bulk read vs old continuous reads during HTOL
− Elevated stress gate voltage in bulk read stress (5v vs. 4.2v). 5v is below the normal program verify voltage of 6v and safe to NVM.
• MPC5565 100k production Burn-In reject analysis showed all HTOL flash continuous read failures can be caught by the new bulk read stress.
• The new bulk read stress has already been used in C90 production Burn-In to replace HTOL continuous read stress, and no quality issue from millions for C90 units shipped afterwards.
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
9
Confidential and Proprietary
• Scan and BIST reduced to 20 minutes each from 1 hour each
− Current Hip7NVM probe program already contains HVST (high-
voltage stress test) to cover SRAM and logic.
• MPC5565 6-month production data (895k) showed 0 RAM
BIST fail.
• MPC5565 100K production reject analysis showed 0 fail from
Scan and BIST at Burn-In.
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
10
Confidential and Proprietary
5Hr BI
(125C)
Hot
test
Room
test
Assy
Data
Review
Fail collection + analysis
Fail collection + analysis
Cold
test
Hot
test 5Hr BI
(125)
Room
test 4Hr BI
(125C)
Fail collection
+ analysis
Cold
test
Room
test
Burn-In
Segment
A
Burn-In
Segment
B
Burn-In
Segment
C
Wafer
probe
Result :
No genuine failure observed after Burn-In Segment A (target 5 hour Burn-In)
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
11
Confidential and Proprietary
Conclusion:
• New 5 hour Burn-In flow provides equivalent test coverage to
the current 14 hour Burn-In flow.