copyright pdes, inc. r 2000.07.19 iso/iec 10303-210 capabilities for power electronics roanoke,...
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Copyright PDES, Inc.
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2000.07.19
ISO/IEC 10303-210 Capabilities for Power Electronics
Roanoke, VirginiaJuly 19, 2000
Thomas R. ThurmanRockwell Collins Inc
Other Contributors:
Gregory L. Smith: The Boeing Company
Michael T. Keenan: The Boeing Company
John G. DeLoof: ATI Corp.
Frederick A. Tolmie: Rockwell Collins Inc.
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2000.07.19
Agenda– Contributors / Development Summary– Domain & Scope– Technology Capability– Requirements Capability– Simulation Model– Part Model– Product Structure– Physical model– Physical Design Control– Geometry– Configuration Management– External Definition– AP 210 Implementation Projects
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2000.07.19
AP 210 Project Contributors
PDES, Inc. Naval Supply Systems Command RAMP Program
Office NASA Goddard Space Flight Center Rockwell Collins Inc. Army Tobyhanna Depot Boeing Defense & Space Group Delphi-Delco Electronics Systems NIST
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2000.07.19
AP210 Development Summary
ISO/IEC 10303-210 is currently in IS Preparation ISO 10303-310 Abstract Test Suite in Preparation Next Milestones
– Register IS Document
– Deliver 310 Document to Secretariat
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AP210 Domain
Domain is Configuration Controlled Design of Electronic Assemblies, their Interconnection and Packaging
Product Enclosure
Package
Die
Packaged PartPrinted Circuit Assemblies
Interconnect Substrate
Die
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2000.07.19
AP210 Scope
Scope is the “As-Required” & “As-Designed” Product Information
– Design “In Process”
– Design “Release” Sharing Partners:
– Design / Analysis
– Manufacturing / Analysis
– Customer Sharing Across Several Levels of Supply Base
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DeviceSupplier
Configuration ManagedCorporate Data Process
System EngineerSimulation Model Supplier
Assembly & FabricationVendor
Customer
Package DataSupplier
Requirements
AP210 Usage Supply Chain
Design Team
MCAD
ECAD
AP210: Electronic Assembly,Interconnect and Packaging Design
Technology
Physical• Component Placement• Bare Board Design• Layout templates• Layers non-planar, conductive & non-conductive• Material product
• Geometrically Bounded 2-D• Wireframe with Topology • Surfaces• Advanced BREP Solids • Constructive Solid Geometry
Part• Functionality• Analysis Support • Shape 2D, 3D • Package• Material Product• Properties
Configuration Mgmt• Identification• Authority • Effectivity • Control• Requirement Traceability• Analytical Model• Document References
Product Structure/Connectivity
• Functional• Packaged
• Fabrication Design Rules• Product Design Rules
Requirements• Design• Allocation• Constraints• Interface• Rules
• Geometric Dimensioning and Tolerancing
Geometry
Design Control
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Technology Capability
Generic Assembly and Interconnect Data Model– Through hole, SMT, fine-line, MCM’s, molded parts, single chip package, etc.
Design for Manufacture: Technology Capability and Constraints– Example: Explicitly State Relationship Between Land Shape Requirements and
Interconnect Fabrication Technology Data.
» Material Identification & Composition (e.g., IPC -xxxx)
» Interconnect Fabricator Process Capability
» Package Terminal Characteristics
» Substrate to Terminal Joint Characterization (I.e., solder joint models)
Product Design Rule Constraints
Technology• Fabrication Design Rules• Product Design Rules
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2000.07.19
Requirements Capability
Requirements• Design• Allocation• Constraints• Interface• Rules
Supports System Engineering Methodology Throughout Standard, ie., allocation.
Requirements can be Extracted from Specifications and may be Assigned to Almost any Design Aspect for purposes of design reuse, constraints, or interface control.
May be Geometric Based: Nesting Shape Limits Some Design aspects Serve as Explicit Requirements for Other Design Aspects (e.g., Connectivity for Layout) Implements organization standard design rules for assembly and layout.
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Simulation Model
Simulation Model is a Product Model Simulation Model includes Interface Declaration Simulation Model includes Source Code whose Syntax
is Defined by External Simulation Language (I.e., VHDL, Spice, VHDL-AMS, Mast, Verilog, ...)
Simulation Model Port Type Classification defines the Engineering Domain that the Network Listing models Represent
» Electrical--Causal, non-causal, lumped, distributed
» Thermal, Displacement
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2000.07.19
Part Model Capability
Information structures– Rich Pin-Mapping Capability– Tightly Coupled Simulation Models and Product Definition Data– Defined Parameter Types– Defined Port Names and Types– Simulation Models Instantiated by Explicit Assignment of
Product Definition Data to Parameters and Ports Provides Verifiable Correlation Between the 2D Land Pattern
and the 3D Geometric Representation of the Component
Part• Functionality• Termination • Shape 2D, 3D • Single Level Decomposition• Material Product• Characteristics
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2000.07.19
Part Model Capability (cont-d)
Part• Functionality• Termination • Shape 2D, 3D • Single Level Decomposition• Material Product• Characteristics
Extend Industry Standard Package Definition from Drawings to Direct Digital Application, E.G., JEDEC MO-156, Issue A
Implements Programmable “Make From” Parts
“White Box” Model for Detailed Analysis Multi-level Multi-Discipline Part Shape
Representation– Environment– Purpose– Material Condition
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Product Structure and Connectivity
Hierarchical Models include: Functional, Physical, Requirements, Rules, Assembly, PCB, Parts, and Materials
Functional Model: Folded Hierarchical Network, Flattened Network, Flattened Network With Routing Constraints
Network Description Capability: – Generic, or Multi-discipline
Product Structure/Connectivity
• Functional• Packaged
Interconnect (e.g., PCB) is a Separately Defined product Multiple Assemblies for Same Interconnect Multiple Interconnects in the Same Assembly
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Product Structure and Connectivity
Signal Based Characterization of Functional Unit:
– Signal Data Type Definition– Allowed Signal Categories (e.g., ATLAS)
– Uses External Definition Capability
Schematics: Schematics Module in AP 212 Schematics Symbol: Schematics Symbol
Module in AP 212 Pin Mapping: Included in AP 210
Product Structure/
• Functional• Packaged
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2000.07.19
Physical Model Capability
Assembly Component Placement Topologically Explicit Model of
the Layout “Metal” Functional Conductivity
Characterization of Layout “Metal” in Electrical, Optical, Thermal Domains.
Physical• Component Placement• Bare Board Design• Layout Templates• Layers non-planar, conductive & non-conductive• Material product
Lumped, Distributed, Thermal Terminals Geometric Context for Supporting Mapping Between
Circuit, S Parameter, Full-3D Electrical Models Material Description, Composition, and Assembly
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2000.07.19
Physical Model Capability(cont-d)
“Define Once, Reuse Many Times” Design Intent Preserved for Complex
Layouts (Multiple Conflicting Planes and Signal Lines)
Easy to Extract Bare Board Test Data
Physical• Component Placement• Bare Board Design• Layout Templates• Layers non-planar, conductive & non-conductive• Material product
Explicit Stratum Material and Complex Stackup Model Material Definitions Include Composition and Assembly
Note: Use AP 209 for Woven Material Definition
Classify Holes, Line Widths for Tolerances
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2000.07.19
Physical Design Control
Industrial Benefit
– Groundwork for Significantly Improving Cycle Time
– Basis for Rule-Based GD&T engines in CAD/CAM
Methodolody– Application-to-application exchange (e.g., between CAD/ CAM and
Coordinate Measurement Machines.) Without Human Interpretation
– Explicitly Based on the ASME Y14.5M and ISO 1101 Standards for Drawing Based Exchange of GD&T Data.
• Geometric Dimensioning and Tolerancing
Design Control
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Physical Design Control
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Geometry Capabilities
2D Compatible with IPC, EDIF, and GDSII
3D Geometry Models based on AP 203 and others (not all geometry from AP 203 used).
Moves electronic product representation into 3D Realm
• Geometrically Bounded 2-D Wireframe with Topology • Surfaces• Advanced BREP Solids • Constructive Solid Geometry• Open Shell Model
Geometry
Parametric Curves (tapers, etc.) Open Shell Model Supports “Layout Metal” on Curved Surfaces.
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Configuration and Design Management Capabilities
Conventional Design Control for In-Process and Released Data
Include Simulation Models Associate Different Design Discipline
Models with Same Product Definition
Configuration Mgmt• Identification• Authority • Effectivity • Control• Requirement Traceability• Analytical Model• Document References
Net Change Capability:
– Add, Delete, Change Properties
– Applies to Any Sensible Design Object (Constrained by Rules in Data Model)
– Allow Direct Correlation Between Change on Drawing and Design Database Change
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External Definition
Externally Defined Data types Reference Authoritative Documents, for example:
– IEC 1182-1 1988 (Land Shapes, Land Patterns)– JEDEC MO-156, Issue A, Date APR 1994
– Externally Defined Data Types Provide Technology Independence.
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2000.07.19
AP210 Implementations
PreAmp Application Framework Uses CD BD&SG Durability Analysis Uses DIS ProAM Uses DIS RASSP Manufacturing Interface Uses DIS-WD1 TIGER Program Uses DIS-WD1 RAMP Manufacturing Interface Will use IS PDES INC. Electromechanical Pilot Project Uses IS Member Companies will use IS