INTEGRATED CIRCUITS DIVISION

DS-CPC1978-R07 www.ixysic.com 1

e3

Characteristics

Features• 1.85Arms Load Current with 5°C/W Heat Sink• Low 2.3 On-Resistance• 800VP Blocking Voltage• 2500Vrms Input/Output Isolation• Low Thermal Resistance (0.35 °C/W)• Electrically Non-conductive Thermal Pad for Heat

Sink Applications• Low Drive Power Requirements• Arc-Free With No Snubbing Circuits• No EMI/RFI Generation• Machine Insertable, Wave Solderable

Applications• Industrial Controls / Motor Control• Robotics• Medical Equipment—Patient/Equipment Isolation• Instrumentation• Multiplexers• Data Acquisition• Electronic Switching• I/O Subsystems• Meters (Watt-Hour, Water, Gas)• Transportation Equipment• Aerospace/Defense

Approvals• UL 508 Recognized Component: File E69938

Pin Configuration

DescriptionIXYS Integrated Circuits Division and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high-power Solid State Relays.

As part of this family, the CPC1978 single-pole normally open (1-Form-A) Solid State Power Relay is rated for up to 1.85Arms continuous load current with a 5°C/W heat sink.

The CPC1978 employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications.

The unique i4-PAC package pioneered by IXYS enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low thermal resistance (0.35 °C/W).

Ordering Information

Switching Characteristics

Parameter Rating Units

Blocking Voltage 800 VP

Load Current, TA=25°C:

With 5°C/W Heat Sink 1.85Arms / ADC

No Heat Sink 0.75

On-Resistance (max) 2.3

RJC 0.35 °C/W

3-

4+

1 2

Part Description

CPC1978J i4-PAC Package (25 per tube)

Form-A

IF

ILOAD10%

90%

ton toff

CPC1978i4-PAC™ Power Relay

INTEGRATED CIRCUITS DIVISION CPC1978

1 Specifications

1.1 Absolute Maximum Ratings @ 25°C

Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.

1.2 Electrical Characteristics @ 25°C

1 Higher load currents possible with proper heat sinking.2 Measurement taken within 1 second of on-time.3 For applications requiring high temperature operation (TC > 60ºC) a LED drive current of 20mA is recommended.

Symbol Ratings Units

Blocking Voltage 800 VP

Reverse Input Voltage 5 V

Input Control Current 100 mA

Peak (10ms) 1 A

Input Power Dissipation 150 mW

Isolation Voltage, Input to Output 2500 Vrms

Operational Temperature -40 to +85 °C

Storage Temperature -40 to +125 °C

Parameter Conditions Symbol Minimum Typical Maximum Units

Output Characteristics

Load Current 1

Peak t10ms

IL- -

10 AP

Continuous No Heat Sink 0.75

Continuous TC=25°C 7.25 Arms / ADC

Continuous TC=99°C IL(99) 0.825

On-Resistance 2 IF=10mA, IL=1A RON - 1.7 2.3

Off-State Leakage Current VL=800VP ILEAK - - 1 A

Switching Speeds

Turn-OnIF=20mA, VL=10V

ton - 8 20ms

Turn-Off toff - 0.15 5

Output Capacitance VL=25V, f=1MHz Cout - 390 - pFInput Characteristics

Input Control Current to Activate 3 IL=1A IF - - 10 mA

Input Control Current to Deactivate - IF 0.6 - - mA

Input Voltage Drop IF=5mA VF 0.9 1.2 1.4 V

Reverse Input Current VR=5V IR - - 10 AInput/Output Characteristics

Capacitance, Input-to-Output - CI/O - 1 - pF

R07 www.ixysic.com 2

INTEGRATED CIRCUITS DIVISIONCPC1978

2 Thermal Characteristics

2.1 Thermal Management

Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal resistance of 12.5°C/W.

2.2 Heat Sink Calculation

Higher load currents are possible by using lower thermal resistance heat sink combinations.

Parameter Conditions Symbol Minimum Typical Maximum Units

Thermal Resistance (Junction to Case) - RJC - - 0.35 °C/W

Thermal Resistance (Junction to Ambient) Free Air RJA - 33 - °C/W

Junction Temperature (Operating) - TJ -40 - 100 °C

RθCA = - RθJC

(TJ - TA) IL(99)2

IL2 • PD(99)

TJ = Junction Temperature (°C), TJ ≤ 100°C *TA = Ambient Temperature (°C)IL(99) = Load Current with Case Temperature @ 99°C (ADC)IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX)

RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/WRθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)PD(99) = Maximum power dissipation with case temperature held at 99ºC = 2.86W

* Elevated junction temperature reduces semiconductor lifetime.

Heat Sink Rating

3 www.ixysic.com R07

INTEGRATED CIRCUITS DIVISION CPC1978

3 Performance Data

Unless otherwise specified, all performance data was acquired without the use of a heat sink.

The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.

35

30

25

20

15

10

5

01.30 1.31 1.32 1.33 1.34

Typical LED Forward Voltage Drop(N=50, IF=10mA, TA=25ºC)

LED Forward Voltage (V)

Dev

ice

Co

un

t (N

)

7.0 8.0 9.06.5 7.5 8.5

25

20

15

10

5

0D

evic

e C

ou

nt

(N)

Turn-On (ms)

Typical Turn-On Time(N=50, IF=10mA, IL=1ADC, TA=25ºC)

0.12 0.16 0.200.10 0.14 0.18

25

20

15

10

5

0

Typical Turn-Off Time(N=50, IF=10mA, IL=1ADC, TA=25ºC)

Turn-Off (ms)

Dev

ice

Co

un

t (N

)

35

30

25

20

15

10

5

01.65 1.66 1.67 1.691.68 1.70

On-Resistance (Ω)

Typical On-Resistance Distribution(N=50, IF=10mA, IL=1ADC, TA=25ºC)

Dev

ice

Co

un

t (N

)

35

30

25

20

15

10

5

0825 830 835 840 845 850

Blocking Voltage (VP)

Typical Blocking Voltage Distribution(N=50, TA=25ºC)

Dev

ice

Co

un

t (N

)

Typical LED Forward Voltage Dropvs. Temperature

1.8

1.6

1.4

1.2

1.0

0.8-40 -20 0 20 40 60 80 120100

Temperature (ºC)

LE

D F

orw

ard

Vo

ltag

e D

rop

(V

)

IF=50mAIF=20mAIF=10mA

LED Forward Current (mA)

0 5 10 15 20 25 30 35 40 45

1816141210

864210

50

Tu

rn-O

n (

ms)

Typical Turn-Onvs. LED Forward Current

(IL=0.5ADC, TA=25ºC)

0 5 10 15 20 25 30 35 40 45

0.18

0.17

0.16

0.15

0.14

0.13

0.12

0.11

0.10

050

LED Forward Current (mA)

Turn

-Off

(m

s)

Typical Turn-Offvs. LED Forward Current

(IL=0.5ADC, TA=25ºC)

LE

D C

urr

ent

(mA

)

-40

20.018.016.014.012.010.0

8.06.04.02.00.0

-20 0 20 40 60 80 100

Typical IF for Switch Operationvs. Temperature

(IL=0.5ADC)

Temperature (ºC)

-40

14

12

10

8

6

4

2

0-20 0 20 40 60 80 100

Typical Turn-On vs. Temperature(IF=10mA, IL=0.5ADC)

Temperature (ºC)

Turn

-On

(m

s)

-40

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0-20 0 20 40 60 80 100

Typical Turn-Off vs. Temperature(IF=10mA, IL=0.5ADC)

Temperature (ºC)

Turn

-Off

(m

s)

R07 www.ixysic.com 4

INTEGRATED CIRCUITS DIVISIONCPC1978

Unless otherwise specified, all performance data was acquired without the use of a heat sink.

The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.

Lo

ad C

urr

ent

(A)

-2.25 -1.5 -0.75 0.75 1.50 2.25

1.251.000.750.500.25

0-0.25-0.50-0.75-1.00-1.25

Typical Load Current vs. Load Voltage(IF=10mA, TA=25ºC)

Load Voltage (V)

0 20 40 60 80 1000

1

2

3

4

51ºC/W

5ºC/W

10ºC/W

No Heat Sink

Temperature (ºC)

Lo

ad C

urr

ent

(Arm

s)

Maximum Load Currentvs. Temperature with Heat Sink

(IF=20mA)

-40

855

850

845

840

835

830

825

820

815-20 0 20 40 60 80 100

Typical Blocking Voltagevs. Temperature

Temperature (ºC)

Blo

ckin

g V

olt

age

(VP)

-40

0.014

0.012

0.010

0.008

0.006

0.004

0.002

0-20 0 20 40 60 80 100

Temperature (ºC)

Lea

kag

e (μ

A)

Typical Leakage vs. TemperatureMeasured Across Pins 1&2

(VL=800VP)12

10

8

6

4

2

01ms10µs 100µs 100ms 10s10ms 1s 100s

TimeL

oad

Cu

rren

t (A

P)

Energy Rating CurveFree Air, No Heat Sink

-40

3.2

3.0

2.8

2.6

2.4

2.2

2.0

1.8

1.6

1.4-20 0 20 40 60 80 100

On

-Res

ista

nce

(Ω

)

Temperature (ºC)

Typical On-Resistancevs. Temperature

(IF=20mA, IL=0.5A)

5 www.ixysic.com R07

INTEGRATED CIRCUITS DIVISION CPC1978

4 Manufacturing Information

4.1 Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee

proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

4.2 ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

4.3 Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed.

4.4 Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.

Device Moisture Sensitivity Level (MSL) Rating

CPC1978J MSL 1

Device Maximum Temperature x Time

CPC1978J 245°C for 30 seconds

e3

R07 www.ixysic.com 6

INTEGRATED CIRCUITS DIVISIONCPC1978

4.5 Mechanical Dimensions

Isolated Heat Sink

1.270 TYP(0.050 TYP)

NOTE: Back-side heat sink meets 2500Vrms isolation to the pins.

20.879 ± 0.254(0.822 ± 0.010)

20.396 ± 0.508(0.803 ± 0.020)

15.240 ± 0.508(0.600 ± 0.020)

3.810 ± 0.254(0.150 ± 0.010)

2.362 ± 0.381(0.093 ± 0.015)

19.914 ± 0.254(0.784 ± 0.010)

5.029 ± 0.127(0.198 ± 0.005) 1.181 ± 0.076

(0.047 ± 0.003)

15.317 ± 0.254(0.603 ± 0.010)

1.930 ± 0.381(0.076 ± 0.015)

17.221 ± 0.254(0.678 ± 0.010)

DIMENSIONSmm

(inches)

0.635 ± 0.076(0.025 ± 0.003)

2.794 ± 0.127(0.110 ± 0.005)

For additional information please visit our website at: www.ixysic.comIXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC1978-R07©Copyright 2012, IXYS Integrated Circuits DivisionAll rights reserved. Printed in USA.12/17/2012

7 www.ixysic.com R07