RockHydro Critical Design ReviewNorthwest Nazarene UniversityAdvisor: Dr. Lawrence

Chad LarsonBen Gordon

Seth LeijaDavid VinsonZach ThomasDrew Johnson

Section 1: Mission Overview◦ Purpose◦ Goals◦ Theory◦ Success◦ Benefits◦ Expected Results◦ Organizational Chart

Section 2: Design Description◦ Design Process◦ Design Requirements◦ User Guide Compliance◦ System Overview◦ Design View◦ Superhydrophobic◦ Flexible Chips◦ Radiation Hardened Chips◦ Pseudo code◦ Block Diagram

Table of Contents

Section 3: Prototyping/Analysis Section 4: Manufacturing Plan Section 5: Testing Plan Section 6: Risks Section 7: Project management plan Section 8: Conclusions

Table of Contents

Mission Overview

Study the feasibility of using Superhydrophobic materials in the presence of high acceleration and vibrations for possible use on space missions.

Test Radiation Hardened chips and new FleX chips with American Semiconductors Inc.

Mission Overview: Purpose

Do research on superhydrophic material that would allow it to be used in future space missions.

Gather data on Radiation hardened chips and to gain experience working with the microchip industry.

Mission Overview: Goals

Mission Overview: Theory When water is in contact

with the superhydrophobic surface (diatomaceous earth) it is more attracted to its own surface tension than it is to the material. This is because the material works like a microscopic bed of nails. Diatomaceous earth is a new material developed by John Simpson at Oakridge National Laboratory and is exceptional due to its high contact angle with water and low price.

For this mission to be considered a success, the SH material needs to be recovered and tested post-flight. It would be best if the Superhydrophobic material survived the flight.

Get usable data from the radiation hardened chips

Mission Overview: Success

The goal of this launch is to prove that this diatomaceous earth can survive a rocket launch and still be functional post-flight.

This material could have many different benefits if it is shown to survive space travel. The SH material has already been shown to work in microgravity by NNU and NASA’s SEED. NASA would benefit from the data gathered if they decide to use this material on future missions.

Mission Overview: Benefits

Mission Overview: Expected Results It is hypothesized that the material will

survive the high acceleration and vibrations and still be functional in post-flight testing.

It is expected that the radiation hardened chips will make less errors in the flight compared to the non-hardened chips.

Expected Results

Team Organization

American Semiconductors

Dale Wilson

Electrical David Vinson

Seth LeijaDrew Johnson

Superhydrophobic

Mechanical Ben GordonChad LarsonZach Thomas

AdvisorDr. Dan

Lawrence

AdvisorDr. Parke

Design Description

Design Superhydrophobic Encasement Design American Semiconductor Board/

Final Design of Plate. Build encasement/Build American

Semiconductor board. Implement into Plate

◦ Test board◦ Run full flight test

Design Process

Physical Envelope Cylindrical: Diameter: 9.3 inches Height: 4.75 inches Mass Canister + Payload = 20±0.2 lbf Center of Gravity Lies within a 1x1x1 inch

envelope of the RockSat payload canister‘s geometric centroid.

Design Requirements

A Superhydrophobic “donut” will be on one plate

The electrical systems will be on another plate above the original plate.

System Overview

Design View

Superhydrophobic “donut”

Flexible Chips

Geiger Counter Board

Arduino Board

Superhydrophobic

“Donut”

A donut shaped hollow object will house Superhydrophobic material. This shape allows for different forces on different axis.

This will be on the lower plate and will be placed around the center support.

Measured Donut

Bottom Outer Drawing

Bottom Inner Drawing

Top Inner Drawing

Top Outer Drawing

With Standoffs

Flexible Chips New flexible chips from American

Semiconductors will now be integrated in with the Arduino subsystem

American Semiconductors will work with students to design a board which will test their radiation hardened chips

Radiation Hardened Chips

Arduino/American Semiconductor Board

& Geiger Counter

Pseudo code for ArduinoloadTestVectors();runTestVectorsThroughASChips();readSensorData();writeSensorDataToSDCard();saveTestToSDCard();CompareResultsWithExpected();If Error

{writeErrorToSDCard();}

Our system will be activated by a G-Switch. When turned on, the Arduino will load test vectors from the attached SD card. Additional sensor data from previous RockON boards will also be written to the SD card. The test vectors will be run through different portions ASC’s chip and the results will be compared to the expected results. The raw data as well as the errors will both be written onto the SD card.

Using 1 PCB Geiger board will record radiation Arduino board will test the radiation

hardened chips and flex chips for error count Arduino will also have flash memory Activating with G-switch

There is software out there for Arduino that will be used

Electrical Design Elements

G-Switch

Arduino

ASC Chip(Packaged)

ASC Chip(Unpackaged

)

Voltage Regulator

SD Card

Clock

Microcontroller

PowerDataClock Power

Supply

Block Diagram

Prototyping/Analysis

Since the CDR, the superhydrophobic enclosure has been designed and is currently being prototyped on our dimension sst 1200es 3D printer. The materials have been collected from American Semiconductors and are in the process of being tested so they will function properly throughout the launch and flight.

Prototyping Plan

Detailed Mass Budget

32

Mass BudgetSubsystem Total Mass (lbf)

SH 2.5Electrical 1

…  …  …  …     Total 3.5Over/Under 6.5

The mass is scheduled to be found more thoroughly once the parts are procured

Ballast will be needed

Arduino board: 7 V with each I/O pin running on 40 mA.

Flexchips: 1.2 V, low but unknown amperage.

Geiger Counter: 9V, same as RockOn.

All parts will be turned on at the start of the flight.

Power Budget

Manufacturing Plan

SH “Donut” needs to be manufactured

Mechanical Elements

Print Prototype

Nov 30 Jan 25

Complete Fabrication

Mechanical Subsystem

Begin Testing

Jan 11

Fix errors in design

Jan 18

Electrical and Software Elements

Electronic Parts arrive

Dec 12

Board assembled

Electrical Subsystem

Jan 23

Board design complete

Feb 10 Feb 13

Testing Begins

This schedule was made with help from American Semiconductor Inc.

PCB Needs to be prototyped and manufactured

We suspect that there may be up to 5 small revisions made on the electronics.

The Arduino board, socket, SD card, and PCB still need to be obtained.

Electrical Elements

Testing Plan

Need to figure out how much water there needs to be to be useful in the “Donut”

Test for any leakage◦ To test for leakage the amount of vibration

resistance needs to be found◦ A passed test will be zero leakage

Test the contact angle of the superhydrophobic surface.

Mechanical Testing

The chips will be tested to make sure they produce the correct outputs before entering an area with radiation to see how much the radiation affects functionality.

Data will be taken at 1MHz

The electrical system will pass once it is shown to be able to gather data for a whole flight test. Correct voltages will be measured.

Electrical and Software Testing

Most of the code still needs to be written. We are waiting for all the parts to arrive and then will write the code with American Semiconductor’s help. American Semiconductors has a testing code that will hopefully be modified to complete our necessary actions.

Software

Risks

Previous Risk Factors Risk 1: SH enclosure

breaks Risk 2: G-switch fails to

start data collection Risk 3:Malfunction of

electrical board. 1: The SH enclosure will

be double layered and extensively tested.

2: Will just have to be accepted.

3: The board will be tested to be in perfect working order multiple times prior to launch.

Consequence

Risk 1 Risk 2

Risk 3

Possibility

Risk Factors Risk 1: Leads on

Flex chip fall off. Risk 2: G-switch

fails to start data collection

Risk 3: wires on packaged chip break due to G’s during launch

Consequence

Risk 2

Risk 1

Risk 3

Possibility

Project Management Plan

BudgetItem Amount Budgeted ($)

½ Can $7000.00 paid by American Semiconductors

Superhydrophobic Material Made by NNU for less then $50.00

Travel Funded by Idaho Space Grant

Facilities Provided by NNU

Radiation Hardened Chips and other Electronics

Provided by American Semiconductors

Electronics hardware $200 by NNU

With the “donut” being manufactured the main focus will be on the electrical system. We have established weekly meetings with American Semiconductors to stay on schedule.

Questions?

Conclusion