cse45435 – vlsi design
DESCRIPTION
CSE45435 – VLSI Design. Lecture #2 Please note the change in Office Hours Office hours: Monday3.00 - 5.00 Tuesday 11.30 - 1.00. Trends in Microprocessor Technology. Evolution in Complexity. Silicon in 2010. Die Area:2.5x2.5cm Voltage:0.6 V Technology:0.07 m. - PowerPoint PPT PresentationTRANSCRIPT
Lecture #2 1
CSE45435 – VLSI Design
Lecture #2
Please note the change in Office Hours
Office hours: Monday 3.00 - 5.00 Tuesday 11.30 - 1.00
Lecture #2 2
Trends in Microprocessor Technology
Lecture #2 3
Lecture #2 4
Lecture #2 5
Evolution in Complexity
Lecture #2 6
Silicon in 2010
Die Area: 2.5x2.5cmVoltage: 0.6 VTechnology: 0.07m
Density Access Time(Gbits/cm2) (ns)
DRAM 8.5 10DRAM (Logic) 2.5 10SRAM (Cache) 0.3 1.5
Density Max. Ave. Power Clock Rate(Mgates/cm2) (W/cm2) (GHz)
Custom 25 54 3Std. Cell 10 27 1.5
Gate Array 5 18 1Single-Mask GA 2.5 12.5 0.7
FPGA 0.4 4.5 0.25
Lecture #2 7
WHY MONOLITHIC INTEGRATION OF A LARGE NUMBER OF FUNCTIONS ON A SINGLE CHIP?
Demand for higher computing power Low cost Small size More circuitry more transistors Dense packing requirement with limited die size
(less than 1.5cm on a side)
Lecture #2 8
Why build integrated Circuit?
Why build integrated Circuit? IC Technology is driving the whole innovative devices an
d systems which effected the way we live.Print a circuit, like printing a picture ICs are much smaller consume less power than discrete component easier to design and manufacture more reliable than discrete system can design more complex system cost no longer dependent on # of devices
Fast growth of electronic industry.
Lecture #2 9
VLSI applications VLSI applications
Electronic system in cars Digital electronics control VCRs Transaction processing system, ATM Personal computers and Workstations Medical electronic systems Laptops, cellphones, PDAs etc….
Lecture #2 10
The advantages of digital I Cs over discrete compone
nts
The advantages of digital I Cs over discrete compone
nts Size
much smaller both transistor and wires. leads to smaller parasitic resistances, capacitances and ind
uctances
Speed communication within the chips are much faster than betw
een the chips on a PCB - High speed of circuits on chip due to smaller size
Power Consumption Logic operation within the chip consumes much less power
S maller size -- > smaller parasitic capacitances and resistan
ce
-- > require less power to drive the circuit
Lecture #2 11
Advantages of IC at Syst em Level
Advantages of IC at Syst em Level
Smaller Physical Size can make small electronic appliances. ie. Por
table TV, handheld cellular telephone…
Lower Power Consumption reduces total power consumption of a whole
electronic circuit. cheaper power supply which leads to a simpl
er cabinet for power supply. Less heat,cooling fans may no longer be necessary.
Lecture #2 12
Advantages of IC at Syst em Level (cont.)
Advantages of IC at Syst em Level (cont.)
Reduced Cost Reduction in number of components.
Power Supply requirement.
Cabinets
The cost of building a whole system is reduced eventhough IC s cost more.
Lecture #2 13
Integrated Circuit Manufacturing
Integrated Circuit Manufacturing
Technology Select technology to build a complex system
in the fastest possible way.
Economics IC plant is very expensive. $1billion or more. II II I IIII II IIIIII II II IIIIIIIII
Lecture #2 14
Moore’s Law
1960In s,Gordon Moore: Co-founder of INTEL predicted IIII III IIIIII II IIIIIIIIIII IIIII IIII III
onentially (DIIIII every 18 months). Exponential improvement in technology is a natural trend: steam engines, dynamos, automobiles etc.
ln (#dev)
year
good
Lecture #2 15
Good News
Since the cost of the printing process (called wafer fabrication) was growing at a modest rate, it implied that the cost per function was dropping exponentially. At each new generation, each gate costs about 1/2 what it did 3 years ago. Shrinking an existing chip makes it cheaper!
yearyear
diecost
ln(cost/function)
Lecture #2 16
Bad News Although the cost of manufacturing
IC's remained approximately constant, the design cost did not. In fact, while designer productivity has improved with time, it has not increased at the same rate as the complexity of the chips.
So the cost of the chip design is growing exponentially with the complexity of the circuit. Integrating a system on a piece of silicon has an attractive manufacturing cost, but frightening design cost and risk. Need to build very complex stuff.
In addition, the number of custom IC designers was (and is) fairly limited. Even if you were willing to take the risk, where would you find the people to do the design?
year
ln(design cost/function)
year
ln(design cost)
Lecture #2 17
Design Technology
Lecture #2 18
VLSI Technology
- 1 . Schottky TTL (Transistor transistor logic)
A
B
C= A * B
Vcc
Lecture #2 19
VLSI Technology
2.ECL (Emitter coupled logic)
C= A + B
Vcc
C= A + B
A B
-V EE
NOR
Lecture #2 20
3.MOS (Metal Oxide semiconductor)
VLSI Technology
VDD
C = A + BBA
NOR
Lecture #2 21
VLSI Technology
4. CMOS (Complementary MOS)
VDD
C = A + BA
B
NOR
Lecture #2 22
Most Prominent Technology - CMOS
Smaller sized transistors Lower power consumption Zero static power
Dynamic power increases with switching
But SLOW compared to others
Compromise - BiCMOS Technology
Lecture #2 23
Manufacturing Steps
1. Circuit schematic - transistor circuit diagram
2. Layout generation
- rectangular patterns for transistors and interconnect
3. Mask generation 4. Chip fabrication
Lecture #2 24
Challenges faced
Defects in wafer· use minimum die area
Reduce cost
· use minimal layout area Increase speed
· use efficient interconnect patterns – ( long and winding paths reduce speed)
Short design timeHigh market competition
Lecture #2 25
Abstractions and Disciplines How to Deal with 109
Transistors? Digital abstraction
signals are 1 or 0 Switch abstraction
MOSFETs as simple switches
Gate abstraction Unidirectional elements Separable timing
Synchronous abstraction Race free logic Function does not depend
on timing
Partition the problem(Use hierarchy) Module is a box with
pins apply recursively
Lecture #2 26
Design Abstraction Levels
n+n+S
GD
+
DEVICE
CIRCUIT
GATE
MODULE
SYSTEM
Lecture #2 27
What is on an Integrated Circuit? Actually only two types of things:
Conducting layers which form the wires on the IC. There are many layers of wires (used to have 1
layer of metal, now advanced processes have 5-7 metal layers). Wires have electrical properties like resistance and capacitance.
(Requires insulators and contacts between layers.)
Transistors (the free things that fit under the wires).There are a few kinds of transistors. In this course
we will study MOS ICs, so we will work with MOS transistors. These transistors can be thought of as voltage controlled switches. The voltage on one terminal of the transistor determines whether the other two terminals are connected or not.
Lecture #2 28
MOSFET Fundamentals
N-channel Metal Oxide Semiconductor Field-Effect Transistor
NMOS Transistor
Lecture #2 29
The MOS Capacitor
Negative Voltage To Metal
+
+
+
++ +
+
+ ++
+
++
+
+
++
+
+
+
Lecture #2 30
Small Positive Voltage To Metal
The MOS Capacitor
+
+
+
++ +
+
+ ++
+
++
+
+
++
+
+
+
Lecture #2 31
The MOS Capacitor
Less Positive
n
More Positive Much More Positive
n << Ions
V < VT
n Ions
V VT
n >> Ions
V > VT
VT Minimum Voltage for Inversion
+
+
+++
++ ++ +++
++ + ++ +
++
++
+++
++ ++
+
++ ++++
+ +
++
++
++
++
+++
++
+
+++
+ +++
++ +
+ ++
+
Lecture #2 32
NMOS Transistor
Lecture #2 33
PMOS Transistor