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30
1/30 ¡ Semiconductor MSM66201/66P201/66207/ 66P207 OLMS-66K Series 16-Bit Microcontroller GENERAL DESCRIPTION The MSM66201/66207 is a high performance microcontroller that employs OKI original nX-8/ 200 CPU core. This chip includes a 16-bit CPU, ROM, RAM, I/O ports, multifunction 16-bit timers, 10-bit A/D converter, serial I/O port, and pulse width modulator (PWM). The MSM66P201/66P207 is the OTP (One-Time Programmable) version of the MSM66201/66207. FEATURES • 64K address space for program memory : Internal ROM : MSM66201 16K bytes MSM66207 32K bytes • 64K address space for data memory : Internal RAM : MSM66201 512 bytes MSM66207 1024 bytes • High-speed execution Minimum cycle for instruction : 400ns @ 10MHz • Powerful instruction set : Instruction set superior in orthogonal matrix 8/16-bit data transfer instructions 8/16-bit arithmetic instructions Multiplication and division operation instructions Bit manipulation instructions Bit logic instrucitons ROM table reference instructions • Abundant addressing modes : Register addressing Page addressing Pointing register indirect addressing Stack addressing Immediate value addressing • I/O port Input-output port : 5 ports ¥ 8 bits (Each bit can be assigned to input or output) Input port : 1 port ¥ 8 bits • Built-in multifunctional 16-bit timer :4 Following 4 modes can be set for each timer : Auto-reload timer mode Clock output mode Capture register mode Real time output mode • Serial port : 1 channel (Synchronous/UART switchable mode with baud rate generators) • 16-bit pulse width modulator :2 • Watchdog timer • Transition detector :4 • 10-bit A/D converter : 8 channels • Interrupts Nonmaskable :1 Maskable : Internal 16/external 2 • Stand-by function STOP mode : Software clock stop mode HALT mode : Software CPU stop mode HOLD mode : Hardware CPU stop mode E2E1027-27-Y4 This version: Jan. 1998 Previous version: Nov. 1996

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Page 1: DATASHEET SEARCH SITE | · PDF fileOLMS-66K Series 16-Bit Microcontroller ... P3.4/TM0IO Falling edge trigger or level trigger is selectable. ... RD Output strobe activated during

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¡ Semiconductor MSM66201/66P201/66207/66P207¡ SemiconductorMSM66201/66P201/66207/66P207OLMS-66K Series 16-Bit Microcontroller

GENERAL DESCRIPTION

The MSM66201/66207 is a high performance microcontroller that employs OKI original nX-8/200 CPU core. This chip includes a 16-bit CPU, ROM, RAM, I/O ports, multifunction 16-bittimers, 10-bit A/D converter, serial I/O port, and pulse width modulator (PWM). TheMSM66P201/66P207 is the OTP (One-Time Programmable) version of the MSM66201/66207.

FEATURES

• 64K address space for program memory : Internal ROM : MSM66201 16K bytesMSM66207 32K bytes

• 64K address space for data memory : Internal RAM : MSM66201 512 bytesMSM66207 1024 bytes

• High-speed executionMinimum cycle for instruction : 400ns @ 10MHz

• Powerful instruction set : Instruction set superior in orthogonal matrix8/16-bit data transfer instructions8/16-bit arithmetic instructionsMultiplication and division operation instructionsBit manipulation instructionsBit logic instrucitonsROM table reference instructions

• Abundant addressing modes : Register addressingPage addressingPointing register indirect addressingStack addressingImmediate value addressing

• I/O portInput-output port : 5 ports ¥ 8 bits

(Each bit can be assigned to input or output)Input port : 1 port ¥ 8 bits

• Built-in multifunctional 16-bit timer : 4Following 4 modes can be set for each timer : Auto-reload timer mode

Clock output modeCapture register modeReal time output mode

• Serial port : 1 channel (Synchronous/UART switchablemode with baud rate generators)

• 16-bit pulse width modulator : 2• Watchdog timer• Transition detector : 4• 10-bit A/D converter : 8 channels• Interrupts

Nonmaskable : 1Maskable : Internal 16/external 2

• Stand-by functionSTOP mode : Software clock stop modeHALT mode : Software CPU stop modeHOLD mode : Hardware CPU stop mode

E2E1027-27-Y4

This version: Jan. 1998Previous version: Nov. 1996

Page 2: DATASHEET SEARCH SITE | · PDF fileOLMS-66K Series 16-Bit Microcontroller ... P3.4/TM0IO Falling edge trigger or level trigger is selectable. ... RD Output strobe activated during

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¡ Semiconductor MSM66201/66P201/66207/66P207

• Package64-pin plastic shrink DIP (SDIP64-P-750-1.78) : (MSM66201-¥¥¥SS) (MSM66P201-¥¥¥SS)

(MSM66207-¥¥¥SS) (MSM66P207-¥¥¥SS)64-pin plastic QFP (QFP64-P-1414-0.80-BK) : (MSM66201-¥¥¥GSBK)(MSM66207¥¥¥GS-

BK)68-pin plastic QFJ (PLCC) (QFJ68-P-S950-1.27) : (MSM66201-¥¥¥JS) (MSM66P201-¥¥¥JS)

(MSM66207-¥¥¥JS) (MSM66P207-¥¥¥JS)64-pin ceramic piggyback (ADIP64-C-750-1.78) : (MSM66G207VS)

(¥¥¥ indicates the code number.)* The piggyback type is used only for engineering samples.

Page 3: DATASHEET SEARCH SITE | · PDF fileOLMS-66K Series 16-Bit Microcontroller ... P3.4/TM0IO Falling edge trigger or level trigger is selectable. ... RD Output strobe activated during

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¡ Semiconductor MSM66201/66P201/66207/66P207

BLOCK DIAGRAMP4

.0/T

M0C

KP4

.1/T

M1C

KP3

.4/T

M0I

O

P3.7

/TM

3IO

P3.1

/RXD

P3.0

/TXD

P2.7

/RXC

P2.6

/TXC

P4.4

/TR

NS0

P4.7

/TR

NS3

P5.0

/AI

0

P5.7

/AI

7

P4.2

/PW

M0

P4.3

/PW

M1

P3.2

/INT0

P3

.3/IN

T1

P2.3

/CLK

OU

T

V REF

RESO

UT

NMI

AGN

D

TIM

ER0–

3

SER

IAL

POR

T

TRAN

SI-

TIO

N D

.

A/D

CON

V.

PWM

0,1

INTE

RRUP

TCO

NT.

PERI

PHER

ALCO

NT.

WD

T

SSP

LRB PS

W

ALU

ALU

CON

T.

ACCU

MU

LATO

RTE

MPO

RAR

YCO

NST

ANTS

R.

MEM

OR

Y

CON

T.

PC RAP

INST

RU

CTIO

ND

ECO

DER

IR

RAM

1024

¥ 8

bits

RO

M32

K ¥

8 bi

ts

B U S P O R T C O N T .

EA REA

DY

ALE

PSEN

RD WR

AD0/

P0.0

AD7/

P0.7

A8 /

P1.0

A15/

P1.7

OSC1

POR

T

P0

P1

P2

P3

P4

P5

SYST

EM CON

TRO

LLER

OSC0

RESFLT

HOLD/P2.4HLDA/P2.5

GNDVDD

*2 *1

*1M

SM66

201

16K

¥ 8

*2M

SM66

201

512

¥ 8

Page 4: DATASHEET SEARCH SITE | · PDF fileOLMS-66K Series 16-Bit Microcontroller ... P3.4/TM0IO Falling edge trigger or level trigger is selectable. ... RD Output strobe activated during

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¡ Semiconductor MSM66201/66P201/66207/66P207

PIN CONFIGURATION (TOP VIEW)

20

1

2

3

4

5

6

7

8

9

1011

12

13

14

15

16

1718

19

CLKOUT/P2.3

AD0/P0.0

AD1/P0.1

AD2/P0.2

AD3/P0.3

AD4/P0.4

AD5/P0.5

AD6/P0.6

AD7/P0.7

A8/P1.0

A9/P1.1A10/P1.2

A11/P1.3

A12/P1.4

A13/P1.5

A14/P1.6

A15/P1.7

P2.0P2.1

P2.2

P3.7/TM3IO

VDD

VREF

AGND

P5.7/AI7

P5.6/AI6

P5.5/AI5

P5.4/AI4

P5.3/AI3

P5.2/AI2

P5.1/AI1P5.0/AI0

P4.7/TRNS3

P4.6/TRNS2

P4.5/TRNS1

P4.4/TRNS0

P4.3/PWM1

P4.2/PWM0P4.1/TM1CK

P4.0/TM0CK

45

64

63

62

61

60

59

58

57

56

5554

53

52

51

50

49

4847

46

21

22

23

24

2526

27

28

29

30

31

32

44

43

42

41

4039

38

37

36

35

34

33

RESOUT P3.6/TM2IO

ALE P3.5/TM1IO

PSEN P3.4/TM0IO

RD P3.3/INT1WR P3.2/INT0

READY P3.1/RXD

EA P3.0/TXD

FLT P2.7/RXC

RES P2.6/TXC

OSC0 P2.5/HLDA

OSC1 P2.4/HOLDGND NMI

64-Pin Plastic Shrink DIP

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¡ Semiconductor MSM66201/66P201/66207/66P207

PIN CONFIGURATION (TOP VIEW) (Continued)

48

47

46

45

44

43

42

41

40

39

38

1

2

3

4

5

6

7

8

9

10

11

A8/P1.0

A9/P1.1

A10/P1.2

A11/P1.3

A12/P1.4

A13/P1.5

A14/P1.6

A15/P1.7

P2.0

P2.1

P2.2

P5.2/AI2

P5.1/AI1

P5.0/AI0

P4.7/TRNS3

P4.6/TRNS2

P4.5/TRNS1

P4.4/TRNS0

P4.3/PWM1

P4.2/PWM0

P4.1/TM1CK

P4.0/TM0CK

��64 63 62 61 60 59 58 57 56 55 54

P0.7

/AD

7

P0.6

/AD

6

P0.5

/AD

5

P0.4

/AD

4

P0.3

/AD

3

P0.2

/AD

2

P0.1

/AD

1

P0.0

/AD

0

V DD

V REF

AGN

D

17 18 19 20 21 22 23 24 25 26 27

WR

REA

DY EA FLT

RES

OSC

0

OSC1

GN

D

NMI

HO

LD/P

2.4

HLD

A/P2

.5

12CLKOUT/P2.3

13RESOUT

14ALE

15PSEN16RD

28TX

C/P2

.6

29R

XC/P

2.7

30TX

D/P

3.0

31R

XD/P

3.1

32IN

T0/P

3.2

37 P3.7/TM3IO

36 P3.6/TM2IO

35 P3.5/TM1IO

34 P3.4/TM0IO

33 P3.3/INT1

53P5

.7/A

I7

52P5

.6/A

I6

54P5

.5/A

I5

50P5

.4/A

I4

49P5

.3/A

I3

64-Pin Plastic QFP

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¡ Semiconductor MSM66201/66P201/66207/66P207

PIN CONFIGURATION (TOP VIEW) (Continued)

AI3/P5.3

AI4/P5.4

AI5/P5.5

AI6/P5.6

AI7/P5.7

AGND

VREF

VDD

AD0/P0.0

AD1/P0.1

AD2/P0.2

AD3/P0.3

AD4/P0.4

AD5/P0.5

AD6/P0.6

AD7/P0.7

P3.2/INT0P3.1/RXD

P3.0/TXD

P2.7/RXC

P2.6/TXC

P2.5/HLDA

P2.4/HOLD

NMI

GND

OSC1OSC0

RESFLTEAREADY

WR

A8/P

1.0

A9/P

1.1

A10/

P1.2

A11/

P1.3

A12/

P1.4

A13/

P1.5

A14/

P1.6

A15/

P1.7

P2.0

P2.1

P2.2

CLKO

UT/

P2.3

RES

OU

T

ALE

PSEN RD

P5.2

/AI2

P5.1

/AI1

P5.0

/AI0

P4.7

/TR

NS3

P4.6

/TR

NS2

P4.5

/TR

NS1

P4.4

/TR

NS0

P4.3

/PW

M1

P4.1

/TM

1CK

P4.0

/TM

0CK

NC

P3.7

/TM

3IO

P3.6

/TM

2IO

P3.5

/TM

1IO

P3.4

/TM

0IO

P3.3

/INT1

VDD

NC

P4.2

/PW

M0

GND

��

61

62

63

64

65

66

67

68

1

2

3

4

5

6

7

8

9

10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44

NC : No-connection pin

68-Pin Plastic QFJ (PLCC)

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¡ Semiconductor MSM66201/66P201/66207/66P207

PIN DESCRIPTION

Type DescriptionSymbol

P0.0–P0.7/AD0–AD7

P1.0–P1.7/

A8–A15

P2.0–P2.2

P2.5/HLDA

P2.6/TXC

AD: Outputs the lower 8 bits of program counter during external program memory fetch, and receives the addressed instruction under the control of PSEN. This pin also outputs the address and outputs or inputs data during an external data memory access instruction, under the control of ALE, RD, and WR.

P1: 8-bit input-output port. Each bit can be assigned to input or output.

A: Outputs the upper 8 bits of program counter (PC8–15) during external program memory fetch. This pin also outputs the upper 8 bits of address during external data memory access instructions.

P2: 8-bit input-output port. Each bit can be assigned to input or output.

TXC: Transmitter clock input/output pin.

P3: 8-bit input-output port. Each bit can be assigned to input or output.

P2.4/HOLD HOLD: Input pin to request the CPU to enter the hardware power-down state.

P3.0/TXDP3.1/RXD

P0: 8-bit input-output port. Each bit can be assigned to input or output.I/O

I/O

I/O

TXD: Transmitter data output pin.I/O

HLDA: HOLD ACKNOWLEDGE: the HLDA signal appears in response to the HOLD signal and indicates that the CPU has entered the power-down state.

P2.3/CLKOUT CLKOUT: Output pin for supplying a clock to peripheral circuits.

P2.7/RXC RXC: Receiver clock input/output pin.

P3.2/INT0 RXD: Receiver data input pin.P3.3/INT1 INT: Interrupt request input pin.

Falling edge trigger or level trigger is selectable.P3.4/TM0IOTM0IO-TM3IO: One of the following signals is output or input.P3.5/TM1IO

P3.6/TM2IOP3.7/TM3IO

• Clock at twice the frequency range of the 16-bit timer overflow• Load trigger signal to the capture register input• Setting value output

Whether the signal is input or output depends on the mode.

P4.0/TM0CK P4: 8-bit input-output port. Each bit can be assigned to input or output.P4.1/TM1CK TM0CK, TM1CK: Clock input pins of timer 0, timer 1.P4.2/PWM0P4.3/PWM1P4.4 – P4.7/TRANS0 – TRANS3

TRANS: Transition detector. The input pins which sense the falling edge and set the flag.PWM: 16-bit pulse-width modulator output pin.

I/O

P5.0 – P5.7/AI0 –AI7

P5: 8-bit input port.AI: Analog signal input pin for A/D converter.

I

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¡ Semiconductor MSM66201/66P201/66207/66P207

PIN DESCRIPTION (Continued)

RESOUT Outputs "H" level in the case of internal reset.Reset to"L" level by program.

ALE Address Latch Enable:

PSEN Program Strobe Enable:

RD Output strobe activated during a bus read cycle.Used to enable data onto the bus from the external data memory.

WR Output strobe during a bus write cycle.Used as write strobe to external data memory.

IREADY Used when the CPU accesses low-speed peripherals.

EA Normaly set to "H" level.If set to "L" level, the CPU fetches the code from external program memory.

FLT If FLT is "H" level, ALE, WR, RD, PSEN are set to "H" level when reset.If FLT is set to "L", ALE, WR, RD, PSEN are set to floating level when reset.

RES RESET input pin.

OSC0

OSC1Basic clock oscillation pin.

NMI Non-maskable interrupt input pin (falling edge).

VREF Reference voltage input pin for A/D converter.

AGND Ground for A/D converter.

VDD System power supply.

GND Ground.

Type DescriptionSymbol

O

O

O

O

O

I

I

I

I

I

O

The timing pulse to latch the lower 8 bits of the address output from port 0 when the CPU accesses the external memory.

The strobe pulse to fetch to external program memory.

Basic clock oscillation pin.

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¡ Semiconductor MSM66201/66P201/66207/66P207

REGISTERS

Accumulator

ACC

15 0

Control Register (CR)

PSW

Bit 15 : Carry flag (CY)Bit 14 : Zero flag (ZF)Bit 13 : Half carry flag (HC)Bit 12 : Data descriptor (DD)Bit 8 : Master interrupt priority flag (MIP)Bit 9,5,4: User flag (MIP)Bit 2-0 : System control base 2-0 (SCB2-0)

PC

LRB

SSP

15 0

15 0

X1

X2

DP

USP

Index Register 1

Index Register 2

Data Pointer

User Stack Pointer

15 0

Pointing Register (PR)

Local Register

R1

R3

R5

R7

R0

R2

R4

R6

ER0

ER1

ER2

ER3

7 0 7 0

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¡ Semiconductor MSM66201/66P201/66207/66P207

SFR

Address(HEX)

Name Symbol R/W 8/16-bitOperation

Reset

0000

0001

0002

0003

0004I

0005I

0006

0007

0010I

0011

0012I

0013

0018

0019

001A

001B

001CI

System stack printer

Local register base

Program status word

Accumulator

Standby control register

Watchdog timer

Peripheral control register

Stop code acceptor

Interrupt request register

Interrupt enable register

External Iinterrupt control register

SSP(ASSP)

LRB(ALRB)

PSWL(APSW)

PSWH

ACC

SBYCON

WDT

PRPHF

STPACP

IE

EXICON

IRQ

R/W

W

R/W

W

8/16

8

8/16

FFH

FFH

undefined

C8H

0CH

00H

00H

F8H

FDH

"0"

00H

00H

00H

00H

FCH

00H/WDTis stopped

0020

0021

0022

0023

0024

0025

0026I

0028

0029

002A

002C

002D

002E

002F

0030

0031

Port 0 data register

Timer 0 counter

P3IO

P3SF

P4

P4IO

TM0

R/W

8

undefined

Port 0 mode register

Port 2 secondary function control register

P3

P2SF

P2IO

P2

P1IO

P1

P0IO

P0

P4SF

Port 5 P5

0032

0033Timer 0 register TMR0

0034

0035Timer 1 counter TM1

0036

0037Timer 1 register TMR1

Port 1 data register

Port 1 mode register

Port 2 data register

Port 2 mode register

Port 3 secondary function control register

Port 3 data register

Port 3 mode register

Port 4 secondary function control register

Port 4 data register

Port 4 mode register

R

R/W 16

00H

undefined

00H

undefined

00H

07H

undefined

00H

00H

undefined

00H

00H

00H

00H

00H

00H

00H

00H

00H

00H

Note: A I mark in the address column indicates that there is a bit that does not exist in theregister.

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¡ Semiconductor MSM66201/66P201/66207/66P207

Addres(HEX)

Name AbbreviatedName

R/W 8/16-bitOperation

Reset

003A

003B

003C

003D

003E

003F

0040

0041

0042

0043

0046I

0048

0049

004AI

004C

004D

Timer 2 register

TCON2

TCON3

TRNSIT

STTM

16

00H

Timer 0 control register

TCON1

TCON0

TMR3

TM3

TMR2

STTMR

STTMC

004EI

0050I

0051

0054

0055

0056I

0058I

0059I

Timer 3 counter

Timer 3 register

Timer 3 control register

Timer 1 control register

Timer 2 control register

Transition detector registerSerial port transmission baud rate generator counter

00H

00H

00H

00H

00H

00H

00H

00H

00H

undefined

00H

00H

0CH

00H

00H

0EH

80H

undefined

00H

undefined

F0H

80H

A0H

SRTM

SRTMR

SRTMC

STCON

Serial port transmission baud rate generator register

Serial port transmission baud rate generator control register

Serial port transmission mode control register

Serial port transmission data buffer register

Serial port receiving error register

A/D scan mode register

A/D select mode register

A/D conversion result register 0

Serial port receiving baud rate generator counter

Serial port receiving baud rate generator registerSerial port receiving baud rate generator control register

Serial port receiving mode control register

Serial port receiving data buffer register

0060I

0061

STBUF

SRCON

SRBUF

SRSTAT

ADSCAN

ADSEL

ADCR0

R/W

W

R/W

R

R/W

R

8

8/16 undefined

0038

0039Timer 2 counter

00HTM2

00H

SFR (Continued)

Note: A I mark in the address column indicates that there is a bit that does not exist in theregister.

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¡ Semiconductor MSM66201/66P201/66207/66P207

SFR (Continued)

Note: A I mark in the address column indicates that there is a bit that does not exist in theregister.

Address(HEX)

Name AbbreviatedName

R/W 8/16-bitoperation

Reset

0062I

0063A/D conversion result register 1 ADCR1

0064I

0065ADCR2

0066I

0067ADCR3

0068I

0069ADCR4

006AI

006BADCR5

R

8/16

undefined

006CI

006DADCR6

006EI

006FADCR7

0070

0071PWMC0

00H

00H

0072

0073PWM 0 register PWMR0

00H

00H

0074

0075PWM 1 counter PWMC1

00H

00H

0076

0077PWM 1 register PWMR1

00H

00H

0078

007A

PWM 0 control register PWCON0 00H

00H8

PWM 1 countrol register PWCON1

R/W

A/D conversion result register 2

A/D conversion result register 4

A/D conversion result register 5

A/D conversion result register 6

A/D conversion result register 7

PWM 0 counter

A/D conversion result register 3

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¡ Semiconductor MSM66201/66P201/66207/66P207

ADDRESSING MODES

The MSM66201/66207 provides independent 64K-byte data and 64K-byte program space withvarious types of addressing modes. These modes are shown below, for both RAM (for data space)and ROM (for program space).

1. RAM Addressing Modes (for data space)1.1 Register Direct Addressing

RORDP

DP

Example

1.2 Displacement Addressinga) Zero Page

18H SFR0000H

0018H

LA,

Example

b) Direct Page

off 10H RAMxx00H

xx10H

STA,

Example

1.3 Pointing Register (PR) Indirect Addressinga) Data Point (DP) Indirect

RAM[DP]SLL

DP

Example

b) User Stack Pointer (USP) Indirect

RAM[USP]

–128 to +127USP

SRL 10HExample

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c) Index Register (X1, X2) Indirect

RAM[X1]

0 to 65535X1

INC 300HExample

1.4 Immediate Addressing

MOV #27FHSSP,

Example

2. ROM Addressing Modes (for program space)2.1 Direct Addressing

200H ROM0200H

LC A,

Example

2.2 Simple Indirect Addressinga) Local Register Indirect

ROM[ER0]LC

ER0

A,Example

b) Pointing Register Indirect1) Data Pointer (DP) Indirect

ROM[DP]LC

DP

A,Example

2) User Stack Pointer (USP) Indirect

ROM[USP]LC

USP

A,Example

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3) Index Register (X1, X2) Indirect

ROM[X1]LC

X1

A,Example

c) System Stack Pointer (SSP) Indirect

ROM[SSP]LC

SSP

A,Example

d) Local Register Base (LRB) Indirect

ROM[LRB]LC

LRB

A,Example

e) RAM Indirect

RAMA, [0C0H]J

ROM

Example

0C0H

2.3 Double Indirect Addressinga) Data Pointer (DP) Double Indirect

RAM

[[DP]]J

DP

ROM

Example

b) User Stack Pointer (USP) Double Indirect

RAM

–128 to +127

USP

LC A, [–2 [USP]]Example

ROM

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c) Index Register (X1, X2) Double Indirect

RAM

0 to 65535

X1

LC A, [10000H [x1]]Example

ROM

2.4 Indirect Addressing with 16-bit Offseta) Pointing Register Indirect

1) Data Pointer (DP) Indirect

ROM

0 to 65535

DP

LC A, [100H [DP]]Example

2) User Stack Pointer (USP) Indirect

ROM

0 to 65535

USP

LC A, [100H [USP]]Example

3) Index Register (X1, X2) Indirect

ROM

0 to 65535

X1

LC A, [100H [X1]]Example

b) RAM Indirect

ROM

0 to 65535

LC A, [2000H [80H]]Example

RAM

80H

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MEMORY MAPS

Program Memory Space

0000H

7FFFH *

FFFFH

0000H

0027H0028H

0037H0038H

7FFFH *

InternalROM Area

VectorTableArea

(40 bytes)

ExternalMemory

VCALTableArea

(16 bytes)

* MSM66201 : 3FFFH

Data Memory Space

0000H

047FH *

FFFFH

0000H

007FH0080H

00BFH00C0H

047FH *

SFR Area SpecialFunctionRegistors

PORT, A/DC,TIMER, PWM,

etc....

007FH0080H00BFH00C0H

PR Area

00FFH0100H

ZeroPage

InternalRAMArea

PR0PR1PR2PR3PR4PR5PR6PR7

(Low Order)

X2

DP

USP

* MSM66201 : 027FH

(High Order)

80

82

84

86

ExternalMemoly

Area

X1

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ABSOLUTE MAXIMUM RATINGS

Parameter

Supply Voltage

Input Voltage

Output Voltage

Analog Input Voltage

Power Dissipation

Storage Temperature

Symbol

VDD

Condition

GND=AGND=0V

Rating

–0.3 to 7.0

Unit

VI

VO

VAI

PD

TSTG

64-pin shrink DIP

64-pin QFP

–0.3 to VDD+0.3

–0.3 to VDD+0.3

–0.3 to VREF

930

565

–55 to +150

V

mW

°C

Analog Ref. Voltage VREF –0.3 to VDD+0.3

Ta=85°Cper Package

68-pin QFJ 1120

(Ta=25°C)

RECOMMENDED OPERATING CONDITIONS

Parameter

Supply Voltage

Memory Hold Voltage

Operating Frequency

Ambient Temperature

Fan Out

Symbol

VDD

Condition Range

4.5 to 5.5

Unit

VDDH

fOSC

N

MOS load

P0

2.0 to 5.5

0 to 10

20

2

V

MHz

Ta –40 to +85 °C

TTL loadP1, P2, P3, P4 1

fOSC £ 10MHz

fOSC = 0Hz

VDD = 5V ±10%

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ELECTRICAL CHARACTERISTICS

DC Characteristics

Note: 1 Applied to P02 Applied to P1, P2, P3 and P43 Applied to P54 Applied to ALE, PSEN, RD, WR and RESOUT5 Applied to RES and NMI6 Applied to READY and EA7 Applied to FLT8 Applied to OSC0* VDD or GND for ports serving as the input pin. No load for any other.** Applied to MSM66P201/66P207

Parameter Symbol Condition Min. Max. Unit"H" Input Voltage 1, 3, 6

"H" Input Voltage 5, 7VIH

2.4

4.0

4.2

3.6

VDD+0.3

VDD+0.3

VDD+0.3

VDD+0.3

—"H" Input Voltage 8

"H" Input Voltage 2

Typ.—

"L" Input Voltage 1, 2, 3, 6

VIL

–0.3

–0.3

–0.3

0.8

0.8

0.4

V"L" Input Voltage 5, 7

"L" Input Voltage 8

VOH4.2

4.2

—IO = –400mA"H" Output Voltage 1, 4

"H" Output Voltage 2

VOL—

0.4

0.4IO = 3.2mA"L" Output Voltage 1, 4

"L" Output Voltage 2

IO = –200mA

IO = 1.6mAInput Leakage Current 3, 6, 7

IIH/IIL

1/–1

1/–20

10/–10

mAVI = VDD/0VInput Current 5

Input Current 8

"H" Output Current 1

"H" Output Current 2IOH

IOL

–2

–1

10

5

mAVO = 2.4V"L" Output Current 1

"L" Output Current 2

ILO — ±2 mAOutput Leakage Current 1, 2, 4 VO = VDD/0V

CI

CO

—pF

Input Capacitance

Output Capacitance

5

7f = 1MHzTa = 25°C

IDDS—

10

100mACurrent Consumption

(during STOP) *0.2

1

VDD = 2V

IDDH—

**—

10

15Current Consumption(during HALT)

6

8fOSC = 10MHzNo Load

IDD—

**—

35

40

mA

Current Consumption20

30

(VDD = 5V ± 10%, Ta = –40 to +85°C)

IREF—

2

10Analog Reference Power Supply Current

0.3

0.5

A/D in operation

A/D stopped

mA

mA

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AC Characteristics

• External program memory control

• External data memory control

Parameter Symbol Condition Min. Max. Unit

Clock (OSC) Pulse

ALE Pulse Width

RD Pulse Width

WR Pulse Width

RD Pulse Delay Time

WR Pulse Delay Time

Low Address Setup Time

Low Address Hold Time

High Address Setup Time

Data Hold Time

tfW

tAW

tRW

tWW

tRAD

tWAD

tAAS

tAAH

tAAD

tDH

CL = 50pF

50

3tfW–204tfW–204tfW–20tfW–20tfW–20

2tfW–35tfW–20tfW–20

tfW–20

tfW+20tfW+20

2tfW+20tfW+40tfW+40

tfW+40

ns

(VDD=5V±10%, Ta=–40 to +85°C)

Data Delay Time tDD tfW–20 tfW+40

Memory Data Hold Time tMH 0 tfW–20

Memory Data Setup Time tMS 100 —

High Address Hold Time tAWH tfW–20 tfW+40

High Address Hold Time tARH tfW–20 tfW+40

Parameter Symbol Condition Min. Max. Unit

Clock (OSC) Pulse

ALE Pulse Width

PSEN Pulse Width

PSEN Pulse Delay Time

Low Address Setup time

Low Address Hold Time

High Address Delay Time

High Address Hold Time

Instruction Setup Time

Instruction Hold Time

tfW

tAW

tPW

tPAD

tAAS

tAAH

tAAD

tAPH

tIStIH

CL = 50pF

50

3tfW–204tfW–20tfW–20

2tfW–35tfW–20tfW–20tfW–20

100

0

tfW+202tfW+20tfW+40tfW+40tfW+40

tfW–20

ns

(VDD=5V±10%, Ta=–40 to +85°C)

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EFGHIJPQRSTUt∆W

CLK

tPADtPW

tAAS tAAH

tAAD tAPH

ALE

AD0-7

A8-15

t∆W

PSEN

PQRSTUtIS tIH

PC0-7 INST0-7

PC8-15

tAW

$%&'()/01234tRAD

tRW

tAAS tAAH

tAAD tAPH

AD0-7

A8-15

RD

/01:;<234=>?tMS tMH

RAP0-7 DIN0-7

RAP8-15������������tWADtWW

tAAS tAAH

tAAD tAWH

AD0-7

A8-15

WR��������������tDH

RAP0-7 DOUT0-7

RAP8-15

tDD

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• Serial port control

Master mode

Slave mode

Parameter Symbol Condition Min. Max. Unit

Clock (OSC) Pulse Width

Serial Clock Pulse Width

Input Data Setup Time

Input Data Hold Time

tfW

tSCKW

tSTMXS

tSTMXH

tSRMXS

tSRMXH

— 50

8tfW

8tfW+40

6tfW–20

2tfW+10

50

ns

CL=50pF

Output Data Setup Time

Output Data Hold Time

(VDD=5V±10%, Ta=–40 to +85°C)

Parameter Symbol Condition Min. Max. Unit

Clock (OSC) Pulse Width

Serial Clock Pulse Width

Input Data Setup Time

Input Data Hold Time

tfW

tSCKW

tSTSXS

tSTSXH

tSRSXS

tSRSXH

— 50

8tfW

6tfW+40

6tfW–20

100

100

ns

CL=50pF

Output Data Setup Time

Output Data Hold Time

(VDD=5V±10%, Ta=–40 to +85°C)

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QRSTUVNOPQVEFCDEIJKFGHIK'()*2345"#$%&'-./012*5��$%���"#$���()*����%&'(�*t∆W

OSC

t∆W

tSCKW tSCKW

tSTMXStSTMXH

tSRMXH tSRMXS

tSCKW tSCKW

tSTSXHtSTSXS

tSRSXH tSRSXS

SCK

SDOUT(TXD)

SDIN(RXD)

SCK

SDOUT(TXD)

SDIN(RXD)

Valid Valid

Valid Valid

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A/D Converter Characteristics

• Operating range

• A/D Converter accuracy Normal operation mode

Parameter Symbol ConditionMin.

Unit

Resolution

Crosstalk

n

EA

ER

EC

See the recommended

circuit.VR=VDD

VAG=GND=0VAnalog input source

impedance £5kW

One channel conversion time

tC=64ms

Bit

Absolute Error

Relative Error

*

±0.5

*

±0.5

10+3.0–3.5

±1.5

*

10

±1.0

Typ. Max.

EZ 0Zero Point Error 0 — — +3.0 +2.0

EF –0.5LSB

Full Scale Error –1.0 — — –3.5 –3.5

Differential Linearity Error ED — — — —

— —

+3.0 +2.0

+2.0–3.5

(VDD=5V±10%, fOSC=10MHz, Ta=–40 to +85°C)

* VDD=5V, Ta=25°C

HALT/HOLD operation mode

Parameter Symbol ConditionMin.

Unit

Resolution

Crosstalk

n

EA

ER

EC

See the recommended

circuit.VR=VDD

VAG=GND=0VAnalog input source

impedance £5kW

One channel conversion time

tC=64ms

Bit

Absolute Error

Relative Error

*

±0.5

*

±0.5

10+2.0–3.5

±1.0

*

10

±0.5

Typ. Max.

EZ +0.5Zero Point Error +0.5 — — +2.0 +1.0

EF –1.0LSB

Full Scale Error –1.5 — — –3.5 –2.0

Differential Linearity Error ED — — — —

— —

+2.0 +1.0

+1.0–2.0

(VDD=5V±10%, fOSC=10MHz, Ta=–40 to +85°C)

* VDD=5V, Ta=25°C

Parameter Symbol Condition Min. Max. Unit

Power Supply Voltage

Analog Reference Voltage

Operating Temperature

VDD

VR

VAI

RR

Top

fOSC £ 10MHz 4.5

4.5

VAG

–40

5.5

VDD

VR

+85

V

kW

°C

VAG = GND = 0VAnalog Input Voltage

Analog Reference Power Voltage Resistance

Typ.

16

—VDD = 5V ± 10%

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• Recommended circuit

ReferenceVoltage

VREF

AI0-7

VDD

GNDAGND

+5V

0V

+

47 mF

0.1 mF

+

47 mF

0.1 mF

0.1 mF

RI

+–

Analog Input

~

RI (Analog input source impedance) £ 5kW

• A/D Converter conversion characteristics 1

3FF

[HEX]

000EZMIN

EZMAX

VREF [V]

EFMAX

EFMIN

Ideal Conversion (center line)

Actual Conversion (center line)

Actual Conversion width

Analog Input

Conversion Code

Conversion Characteristics Diagram 1

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Absolute error (EA)The absolute error indicates a difference between actual conversion and ideal conversion,excluding a quantizing error. The absolute error of the A/D converter gets larger as itapproaches the zero point or full scale. (Refer to Conversion Characteristics Diagram 1.)

Relative error (ER)The relative error indicates a deviation from a line which connects the center point of the zeropoint conversion width with that of the full scale conversion width, excluding a quantizingerror.The relative error of this A/D converter is almost due to a differential linearity error.

Zero point error (Ez) and full scale error (EF)The zero point error and full scale error indicate a difference between actual conversion andideal conversion at the zero point and full scale, respectively. (Refer to ConversionCharacteristics Diagram 1.)

A/D Converter Conversion Characteristics 2 (temperature characteristics)

Conversion Characteristics Conversion CharacteristicsDiagram 2-1 Diagram 2-2

Differential linearity error (ED)

The differential linearity error indicates a difference between the actual conversion width(actual step width) and ideal value (1LSB).With this A/D converter, a voltage for actual conversion is shifted and the inclination of avoltage is changed, with changes of temperature (see Conversion Characteristics Diagram 2-1). Specifications described in the foregoing tables are established from Eta shown inConversion Characteristics Diagram 2-1 (ED=Eta–1LSB). Conversion Characteristics Diagram2-2 shows temperature characteristics of differential linearity of Es in Conversion CharacteristicsDiagram 2-1.

3FF

[HEX]

000

ES

Eta [V]

–40°C

+25°C

+85°C

+4

[LSB]

0

Temparature Ta

+3

+2

+1

–40 +85

During normal operation

During HALTES

Conversion Code

Analog Input

ESDifferentialLinearity

[°C]

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(Unit : mm)

PACKAGE DIMENSIONS

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, whichare very susceptible to heat in reflow mounting and humidity absorbed in storage.Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for theproduct name, package name, pin number, package code and desired mounting conditions(reflow method, temperature and times).

SDIP64-P-750-1.78

Package materialLead frame materialPin treatmentSolder plate thicknessPackage weight (g)

Epoxy resinCu alloySolder plating5 mm or more8.70 TYP.

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(Unit : mm)

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, whichare very susceptible to heat in reflow mounting and humidity absorbed in storage.Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for theproduct name, package name, pin number, package code and desired mounting conditions(reflow method, temperature and times).

QFP64-P-1414-0.80-BK

Package materialLead frame materialPin treatmentSolder plate thicknessPackage weight (g)

Epoxy resin42 alloySolder plating5 mm or more0.87 TYP.

Mirror finish

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(Unit : mm)

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, whichare very susceptible to heat in reflow mounting and humidity absorbed in storage.Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for theproduct name, package name, pin number, package code and desired mounting conditions(reflow method, temperature and times).

QFJ68-P-S950-1.27

Package materialLead frame materialPin treatmentSolder plate thicknessPackage weight (g)

Epoxy resinCu alloySolder plating5 mm or more4.50 TYP.

Mirror finish

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(Unit : mm)

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, whichare very susceptible to heat in reflow mounting and humidity absorbed in storage.Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for theproduct name, package name, pin number, package code and desired mounting conditions(reflow method, temperature and times).

ADIP64-C-750-1.78