date : 30th october 2008 - maxim integrated · 2017. 9. 20. · september 26, 2008 subject:...

Date : 30th October 2008

To : Hana Semiconductor (Ayutthaya) Co.,Ltd.

Section 1 : SVHC list

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NITTO DENKO ELECTRONICS (M) SDN BHD

Company. Number.177726 A

NO. 2, PERSIARAN BUDIMAN, SEKSYEN 23, 40300 SHAH ALAM, SELANGOR D.E TEL:603-55417733 FAX: 603-55417857/58/59

Guarantee Letter

We,Nitto Denko Electronics (M) Sdn Bhd, hereby declare that the product as attached list supplied to Hana

Semiconductor (Ayutthaya) Co.,Ltd. do not contain or do not intentionally use any raw mateiral contained the

substances listed below under section 1 and 2. We also do not intentionally use them in the manufacturing process.

Item Substances Name CAS NO % Weight (If Any)

Dear Customer,

Anthracene 120-12-7 Not Used

4,4'- Diaminodiphenylmethane 101-77-9 Not Used

Dibutyl Phthalate 84-74-2 Not Used

Cyclododecane 294-62-2 Not Used

Cobalt Dichloride 7646-79-9 Not Used

Diarsenic Pentaoxide 1303-28-2 Not Used

Diarsenic Trioxide 1327-53-3 Not Used

Sodium Dichromate7789-12-0 and

10588-01-9Not Used

5-Tert-Butyl-2,4,6-Trinitro-M-Xylene (Musk Xylene) 81-15-2 Not Used

Bis (2-Ethyl(Hexyl)Phthalate) (DEHP) 117-81-7 Not Used

Hexabromocyclododecane (HBCDD) and All Major

Diastereoisomers Identified (α – HBCDD, β-HBCDD, γ-

HBCDD)

25637-99-4 and

3194-55-6 (134237-51-

7, 134237-50-6, 134237-

52-8)

Not Used

Alkanes, C10-13, Chloro (Short Chain Chlorinated Paraffins) 85535-84-8 Not Used

Bis(Tributyltin)Oxide 56-35-9 Not Used

Lead Hydrogen Arsenate 7784-40-9 Not Used

Triethyl Arsenate 15606-95-8 Not Used

Benzyl Butyl Phthalate 85-68-7 Not Used

Section 2 : List of substance according to 52 items under Annex XVII of REACH Regulation No. 1907/2006. If any of

substance from 52 items is present, declared content is attached. Except RoHS (EU Directive 2002/95/EC), if any of

substance from 6 items is exceeding the established maximum concentration values, declared content is attached.

6 Banned Hazardous Substance threshold limit per EU Directive 2002/95/EC are as follows:

1) LEAD(Pb) < 1000 ppm

2) MERCURY(Hg) < 1000 ppm

3) CADMIUM(Cd) < 100 ppm

4) HEXAVALENT CHROMIUM(Cr 6+) < 1000 ppm

5) POLYBROMINATED BIPHENYL(PBB), < 1000 ppm

6) POLYBROMINATED DIPHENYL ETHER(PBDE), < 1000 ppm

NameLoo Yew Whye

TitleQA Manager

The undersigned hereby certifies that he/she is an employee of the company above who has the authority to sign for the

company. All information provided is true and correct to the best of that company's knowledge and belief.

Products: MP-150SG, MP-8000DSA, MP-8000AN, MP-8000CH4 and MP-8000CH

REMARK:This survey is completed by the information we have now and we did not re-investigate all items of your

request.

Signature

Date30th October 2008

PAGE 1

Date : 30th October 2008

To : Hana Semiconductor (Ayutthaya) Co.,Ltd.

Section 1 : SVHC list

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11

12

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Date30th October 2008

REMARK:This survey is completed by the information we have now and we did not re-investigate all items of your

request.

Section 2 : List of substance according to 52 items under Annex XVII of REACH Regulation No. 1907/2006. If any of

substance from 52 items is present, declared content is attached. Except RoHS (EU Directive 2002/95/EC), if any of

substance from 6 items is exceeding the established maximum concentration values, declared content is attached.

6 Banned Hazardous Substance threshold limit per EU Directive 2002/95/EC are as follows:

1) LEAD(Pb) < 1000 ppm

2) MERCURY(Hg) < 1000 ppm

3) CADMIUM(Cd) < 100 ppm

4) HEXAVALENT CHROMIUM(Cr 6+) < 1000 ppm

5) POLYBROMINATED BIPHENYL(PBB), < 1000 ppm


TitleQA Manager

Signature

Products: MP-101S and HC-100XG-BM

The undersigned hereby certifies that he/she is an employee of the company above who has the authority to sign for the

NameKazuyoshi Kitajima

Triethyl Arsenate 15606-95-8 Not Used

Benzyl Butyl Phthalate 85-68-7 Not Used

Bis(Tributyltin)Oxide 56-35-9 Not Used

Lead Hydrogen Arsenate 7784-40-9 Not Used

Hexabromocyclododecane (HBCDD) and All Major 25637-99-4 and Not Used

Alkanes, C10-13, Chloro (Short Chain Chlorinated Paraffins) 85535-84-8 Not Used

5-Tert-Butyl-2,4,6-Trinitro-M-Xylene (Musk Xylene) 81-15-2 Not Used

Bis (2-Ethyl(Hexyl)Phthalate) (DEHP) 117-81-7 Not Used

Diarsenic Trioxide 1327-53-3 Not Used

Sodium Dichromate 7789-12-0 and Not Used

Cobalt Dichloride 7646-79-9 Not Used

Diarsenic Pentaoxide 1303-28-2 Not Used

Dibutyl Phthalate 84-74-2 Not Used

Cyclododecane 294-62-2 Not Used

Anthracene 120-12-7 Not Used

4,4'- Diaminodiphenylmethane 101-77-9 Not Used

Item Substances Name CAS NO % Weight (If Any)

NITTO ELECTRONICS KYUSHU CORPORATION

QUALITY ASSURANCE DEPARTMENT

2307-2, YOSHIDA, YOSHINOGARI, KANZAKI, SAGA,842-0031, JAPAN TEL:0952-53-3820 FAX: 0952-52-7203

Guarantee LetterDear Customer,

We,Nitto Electronics Kyushu Corporation, hereby declare that the product as attached list supplied to Hana

PAGE 2

Henkel Corporation Phone 310.764.4600 Email Address 20021 Susana Road Fax 310.764.2545 www.henkelna.com Rancho Dominguez, CA 90221 USA

September 26, 2008

Subject: ABLEBOND® 8600, 8380, 84-1LMI, 84-1LMIS, 84-3, 84-3J, 826-2, 965-1L, 2025D, 2039H, 2200D, 2815A, 8006NS, 8290, 8390A, 2033SC, 2600AT, & 84-1LMISR4 Adhesives

To Whom It May Concern: Ablestik’s paste and film adhesives products have been safely used for microelectronic applications for over 40 years. They provide a balance of properties that enables the finished product to meet your stringent end use requirements. On the basis of our review of the formulation and the Material Safety Data sheet for each component, Ablestik, neither uses nor adds any substance listed below, to the formulation of ABLEBOND® 8600, 8380, 84-1LMI, 84-1LMIS, 84-3, 84-3J, 826-2, 965-1L, 2025D, 2039H, 2200D, 2815A, 8006NS, 8290, 8390A, 2033SC, 2600AT, & 84-1LMISR4 Adhesives:

Email Address www.henkelna.com

Henkel Corporation Phone 310.764.4600 20021 Susana Road Fax 310.764.2545 Rancho Dominguez, CA 90221 USA


It should be noted that ICP data is not provided by Ablestik Laboratories for packaging materials but Ablestik does require all packaging suppliers to comply with all local and regional laws, including environmental and regulatory requirements. Ablestik, as a Responsible Care Company, strives to protect the health and safety of our employees, our customers’ employees and the environment while providing technically superior products that offer unsurpassed value. If you have any questions about this information, please contact Safety, Health, and Environment Department of Ablestik. Phone #: (310) 605-5748, Fax #: (310) 763-2725. Thank you, LaToya Baker

^ Thailand Smelting And Refining Co., Ltd.llLllt--ll

[IireEI4]l 116t17-18 Srivit Bldg. Soonthornkosa Rd.!-' _:

Klongtoey Bangkok Thailand 10110

Date : November 18,2008To : Hana Semiconductor (Ayutthaya) Co.,Ltd.

Dear Related persons,

We, Thailand Smelting And Refining Co., Ltd , hereby declare that Pure Tin Full Ball excluding packaging has supplied

to Hana Semiconductor (Ayutthaya) Co.,Ltd. do not intentionally use any raw mateiral contained the substances l isted

below under section 1 and 2 into our tin alloy process. We also do not intentionally use them in the manufacturing

proGess,

S e c t i o n l : S V H C l i s t

Section 2 : List of substance according to 52 items under Annex XVll of REACH Regulation No. 1907/2006. lf any of

substance from 52 items is present, declared content is attached. Except RoHS (EU Directive 2002l95lE0l, if any of

substance from 6 items is exceeding the established maximum concentration values, declared content is attached.6 Banned Hazardous Substance threshold limit per EU Directive 2002/95/EC are as follows:1) LEAD(Pb)2) MERCURY(Hg)3) CADMTUM(Cd)4) HEXAVALENT CHROMIUM(Cr 6+)5) POLYBROMINATED BIPHENYL(PBB),

< 1000 ppm< 1000 ppm< 100 ppm< 1000 ppm< 1000 ppm


The undersigned hereby certifies that he/she is an employee of the company above who has the authority to sign for thecompany. All information provided is true and correct to the best of that company's knowledge and belief.

NameSomkiat Thanakijrungroj

Branch ManagerTitle

Signature

Date

-4rl'^-{T'

Item Substances Name CAS NO % Weight (lf Any)

1

2

4

5

7

a

I

1 0

1 1

1 2t c

1 4

1 5

t o

Anthracene

4,4'- Diaminodiphenylmethane

Dibutyl Phthalate

Cyclododecane

Cobalt Dichloride

Diarsenic Pentaoxide

Diarsenic Trioxide

Sodium Dichromate

5-Tert-Butyl-2,4,6-Trinitro-M-Xylene (Musk Xylene)

Bis (2-Ethyl(Hexyl)Phthalate) (DEH P)

Hexabromocyclododecane (HBCDD) and All MajorDiastereoisomers ldentif ied (q - HBCDD, B-HBCDD, y-HBCDD)

Alkanes, C10-13, Chloro (Short Chain Chlorinated Paraffins)

Bis(Tributyltin )OxideLead Hydrogen Arsenate

Triethyl Arsenate

Benzyl Butyl Phthalate

120-12-7

101-77-9

84-74-2

294-62-2

7646-75-9

1303-28-2

1327-53-3

7789-12-0 and1 0588-0 1 -9

81-15-2

117-81-7

25637-99-4and 3194-55-6 (134237-

51-7, 134237-50-6,134237-52-8)

85535-84-8

56-35-9

778440-9

1 5606-95-8

85-68-7

1-Dec-08 PAGE 1

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L"*T"!l-,E,*iALAf.d FIAGUM 15117,400CICI $HAii A'LA&4, SALAT{G*R nAnUL rH$,&ru, tu4ALAY$i&T€L: f3-SjS3 9000 FA.X; S3-51S3 90il1

Date:7.11.2008

To : Hana Semiconductor (Ayutthaya) Co.,Ltd.i}ATH:

Guarantee LetterDear Customer,

We, Mirc,'il'ligh-fe.(M)s.ln Flh.l ,harahydeclarethattheproductasattachedlistsuppliedtoHanaSemiconductor

(Ayutthaya) Co.,Ltd. do not contain or do not intentionally use any raw mateiral contained the substances listed below

under section I and 2. We also do not intentionally use them in the manufacturing process.

Section 2 : List of substance according to 52 items under Annex XVll of REACH Regulation No. {907/2006. lf any ofsubstance from 52 items is present, declared content is attached. Except RoHS (EU Directive 2002/95/EC), if any ofsubstance from 6 items is exceeding the established maximum concentration values, declared content is attached,Banned Hazardous Substance threshold limit per EU Directive 2002/95/EC are as follows:

6

1) LEAD(Pb)2) MERCURY(Hg)3) cADMTUM(cd)4) HEXAVALENT CHROMIUM(Cr 6+)5) POLYBROMINATED BIPHENYL(PBB),

< 1000 ppm< 1000 ppm< 100 ppm< 1000 ppm< 1000 ppm

6) POLYBROMINATED DIPHENYL ETHER(PBDE), < lOOO PPM

The undersigned hereby certifies that he/she is an employee of the company above who has the authority to sign for thecompany. All information provided is true and correct to the besl oi that company's knowledge and belief.

Name

I tile

Signature

nefa

Casev Chinq

7.11.2008

--pnce

r

Item Substances Name CAS NO % Weight (lf Any)

1

')

3

4

5

7

6

9

10

11

13

14

15

16

Anthracene

4,4 - Diaminodiphenylmethane

Dibutyl Phthalate

ar,^l^d^d6^.66vtv,vvvvvve,

'v

Cobalt Dichloride

Diarsenic Pentaoxide

Diarsenic Trioxide

Sodium Dichromate

5-Tert-Butyl-2,4,6-Trinitro-M-Xylene (Musk Xylene)

Bis (2-Ethyl(Hexyl)Phthalate) (DEHP)

Hexabromocyclododecane (HBCDD) and All MajorDiastereoisomers ldentified (q - HBCDD, p-HBCDD, y-HBCDD)

Alkanes, C10-13, Chloro (Short Chain Chlorinated Paraffins)

Bis(Tributyltin)Oxide

Lead Hydrogen Arsenate

Triethyl Arsenate

Benzyl Butyl Phthalate

tzu- l1-t

101 -77-g

84-74-2

294-62-2

7646-79-9

1303-28-?

1 327-53-3

7789-12-0 and 1058801-9

81-1 5-2

1 17-81-7

25637-99-4 and3194-55-6 (134237-51-7, 1 34237 -50 -6, 1 34237 -

52-8)

85535-84-B

56-35-9

7784-40-9

1 5606-95-8

85-68-7

Subject : Non Use of Restricted/Prohibited Substances Declaration

date : 30th october 2008 - maxim integrated · 2017. 9. 20. · september 26, 2008 subject:...

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