defects in solids
DESCRIPTION
Defects in Solids. . 0-D or point defects vacancies, interstitials, etc. control mass diffusion 1-D or linear defects dislocations control deformation processes 2-D or planar defects grain boundaries, surfaces, interfaces, heterophase boundaries 3-D or volume defects - PowerPoint PPT PresentationTRANSCRIPT
Defects in Solids• 0-D or point defects
– vacancies, interstitials, etc.– control mass diffusion
• 1-D or linear defects– dislocations– control deformation processes
• 2-D or planar defects– grain boundaries, surfaces, interfaces, – heterophase boundaries
• 3-D or volume defects– voids, secondary components (phases)
Surface Tension as a Force
FL
surface tension, g energy / area
to increase liquid area, energy is required
we must do work on the system
dwrev = Fdx = gdA A = 2Lx
x dx
dA = 2Ldx
Fdx = 2gLdx F = 2gL
Force of surface tension acts in a direction parallel to surface
Imaging Grain Boundaries
external surface
grains in the solid
if smooth, difficult to observe
surface tension smooth is not thermodynamically preferred
thermal anneal or thermal ‘etch’ to equilibrate
grain 1 grain 2
f
gSS
gSVgSV
gSS = 2gSVcos(f /2)
balance of forces
Defects in Solids• 0-D or point defects
– vacancies, interstitials, etc.– control mass diffusion
• 1-D or linear defects– dislocations– control deformation processes
• 2-D or planar defects– grain boundaries, surfaces, interfaces, – heterophase boundaries
• 3-D or volume defects– voids, secondary components (phases)
(mechanical properties – yield, metals)
(mechanical props – fracture, ceramics)
Volume Defects / Heterophase Boundaries• Composites
– Two or more distinct types of materials, “phases”– Boundary between them is a heterophase interface
A
B
• At grain boundaries– Second phase concentrated at triple
contacts of host grain boundaries– Typical when liquid phase forms at
high temperature
liquid / amorphous
grain 1grain 3
grain 2
Balance of forces
interphase boundary
gSS
gLS gLS
f
gSS = 2gSLcos(f/2)
• Pores– 2nd phase is a void– increases scattering– thermal insulation– white, not transparent
Volume Defects and Mechanics• A secondary (different) material: “phase”
– in metals: secondary phases tend to pin dislocations• Pores
– in ceramics: tend to be source of failure
s = F/A
e = DL/L
ceramic
metal
Mechanical Behavior
sy
sfrac
Y
Y
Y – from chemical bonds
sy – due to dislocation glide
sy (obs) << sy (theo)
sfrac – due to volume defects
sfrac (obs) << sfrac (theo)
F
F
L
x
“graceful” failure
“catastrophic” failure
Evaluate sfrac(theoretical)
F = dE/dR
attra
ctiv
ere
puls
ive
F
RR0
ER (interatomic distance)
E0
R0
bond energy curve
bond force curve
s = F/A
theofracs
approximate s as sinusoidal
x
ths
2πsinthxs s
R0 ~ a0
0
xYa
linear region: Ys e
2π~ thxs s
0
xYa
02πthY
as
fracture plane
F
F
???
/2
x = 0
simultaneous failure
0
RYR
D
Evaluate sfrac(theoretical)
02πthY
as 1. ~ ao 2πth
Ys
2. Obtain by equating mechanical energy (work) of creating two surfaces to their surface energy
a0
ths
/2
x = 0
s
x
E Fdx /E area dxs2
0
2π/ sinthxwork area dx
s
πths
surface energy / area of fracture = 2g2 π
th
gs
2 π
2πtho th
Yagss
12
gs
tho
Ya
Griffith’s equation If some plastic deformation occurs:
geff = gsurf + gplastic
Evaluate sfrac(observed)1
2
0
~ gs s
obs theofrac frac
Ya
Stress concentration at crack tips
12
2tip appcs s
1122
2 appo
c Yags
Why??
2c only this region of the material supports the load
can show:radius of curvature
take fracture to occur when: s s theotip frac
12
4appo
Ya c
g s
obsfracs ao
12
4obsfrac
Yc
gs
in general: ½ s obsfrac c
measured fracture stress is not an “inherent” material property
s = F/A
inte
rnal
forc
e lin
es
atomically sharp crack tip
12s stip appc
obsfracs
Evaluate sfrac(observed)
Alternative derivation: again, consider energy balance
0( )E c E
+ surface energy
take fracture to occur when: c > c*obsfracs
122
πobsfrac
Ycgs
as before:
½obsfrac cs
measured fracture stress is not an “inherent” material property
= initial energy
- released strain energy
22π0 4E cc Y
sg
E(c)
c
energy per unit thickness
crack length
crack energy
c*
2 2π cYs
4cg
2c
Fracture Behavior• In general:
@ failure:
custom:
not @ failure:K, KC units: pressure (length)½
in practice, need to specify geometry of the experimentshear vs. tension, etc. geometric constant
characterization: put in a crack of known length and defined geometry
½,geometrytip app appf c kcs s s
½frac fractip app kcs s
½
theofracobs
frac kcs
s
½ ½(π ) (π )
theofracobs C
fracK
k c cs
s fracture toughness
stress intensity factorcritical stress intensity
indep. of geometry depends on crack length
depends on geometry
theofrac
ks
To strengthen ceramics, pay attention to cracks
½)π( cK appls
½(π )obsC fracK cs
KI Stress Intensity Factors
Chiang, Bernie, and Kingery, “Physical Ceramics: Principles for Ceramic Science & Engineering” Wiley 1997
Crack-Loading Modes
Courtney, “Mechanical Behavior of Materials,” McGraw-Hill 2000
½(π )applK csI
molten potassium
salt
Strengthening of Ceramics• Process to eliminate cracks (internal)• Polish to eliminate surface cracks• Blunt crack tip• Anneal (heat treat) to eliminate randomly
distributed internal stresses• Quench (a silicate glass) to induce
compressive stress on surface• Ion exchange to induce surface compressive
stress
s
tension
compression
stension
compression
NaO*SiO2
K
Na
once crack penetrates compressive region, material shatters explosively
Strengthening of Ceramics• Transformation toughening• Cool ZrO2: cubic tetragonal monoclinic • Modify with CaO:
cubic tetragonal monoclinic + cubic• Rapid cooling: tetragonal monoclinic is slow
obtain tetragonal + cubic
cubic
tetragonal
crack catalyzes tetragonal monoclinic transitionincrease in volume upon transitionDV places compressive stress on crack (closes it)
Mechanical Properties• Elastic properties
– depend on chemical bonding, not so sensitive to slight variations in composition, processing
• Yield stress (metals)– can be manipulated by processing– fairly reproducible
• Fracture stress (ceramics)– an almost meaningless property– depends on details of crack/pore distribution– achieving reproducibility is a major effort