deliverable description · 2019. 10. 14. · deliverable overview • 6.1.3.2 pp0/twinax [slac]...
TRANSCRIPT
Deliverable Description
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WBS Dictionary Definition:
6.1.3.1 Type-0 Services OkSThis WBS includes design, prototyping, and production of the inner flex cables for the pixel detector. The largest of these flexible cables are used to carry power and data on the rings. Smaller pigtail flexes are used to connect individual modules to either ring flexes or to PP0 in the barrel. The deliverable includes three different flavors of ring flexes cables and three flavors of pigtail flexes for module connections. A total of 132 ring flexes and 1444 pigtail flexes are needed for the pixel inner system.
6.1.3.2 PP0 TwinAx Data Transmission Cables SLACThis WBS covers the design, prototyping, and production of Patch Panel 0 (PP0), as well as TwinAx cables used for high-speed data transmission. Two flavors of PP0 boards are foreseen: one for data transmission, and the other for LV/HV/DCS. The deliverables include fully assembled data/command TwinAx bundles, and fully assembled PP0 boards. A total of 960 data/command bundles and 260 LV/HV/DCS PP0s are needed for the pixel inner system.
6.1.3.4 Type-I Services UCSCThis WBS covers the production of the Type-I electrical services for the pixel detector inner system. The Type-I services run between the Patch Panel 0 (PP0) and Patch Panel 1 (PP1). These cables carry low-voltage power, high-voltage power, and detector control system information. This deliverable includes electrical and mechanical design of the Type-I service bundles, construction of a production test stand, procurement of cables and connectors from commercial vendors, mechanical assembly of cables into bundles, electrical testing and burn-in, and shipment to the stave loading site. A total of 1,832 cables packages into 260 bundles are needed for the pixel inner system.
6.1.3.5 Optical Links OSUThis WBS covers the production of the optical carrier boards. The deliverable includes the procurement of the PCBs designed by Bern, optical components and ASICs fabricated by CERN, and electrical connectors, mounting of the components by a vendor, and QA of the loaded boards. A total of 480 boards is needed for the pixel inner system.
6.1.3.6 Serial Power Supplies OkSThis WBS covers R&D (completed) on serial power supplies for front-end low voltage, and purchase of supplies during production. A total of 284 supplies are needed for the inner system.
6.1.3.7 Equalizer Block SMUThe work covers the production of the equalizer ASIC (called GBCR for Giga-Bit Cable Receiver). GBCR is needed to compensate for the high-frequency attenuation of the data signal from the pixel modules after propagating through the 5.5 m TwinAx. The deliverable covers the design, prototyping, procurement, and quality assurance test of GBCR. The pixel inner system needs a total of 2020 GBCR chips.
Deliverable within L2 System
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6.1.3.1 6.1.3.2
6.1.3.2
6.1.3.4
6.1.3.5
6.1.3.7
6.1.3.6
Deliverable Overview
• 6.1.3.1 Type-0 Services [OkS]▪ Routes data, HV, DCS between pixel modules and PP0▪ Circular geometry in endcaps, “pigtails” in barrel▪ All custom, including MOPS (DCS ASIC) provided by foreign
collaborators▪ Challenges:
o High-density large-format circuits (especially in rings)o Data integrity @ 1.28 Gb/s [in RR]o Connectorization (multiple connectors needed?)o High current for serial powering
▪ External dependencies:o Module connector spec [not in RR]o Final services count [not in RR]o MOPS chip for rings [not in RR]o Pixel geometry (25x100 vs 50x50) [in RR]
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Deliverable Overview
• 6.1.3.2 PP0/TwinAx [SLAC]▪ Interface between Type-0 services and Type-1 services.▪ Located on the outside (in r) of the quarter shell▪ Custom PCB’s.▪ Challenges:
o High density of data transmission and power lines: ≥20 layer PCBo Data integrity through connectors and PCB [in RR]o High current from LV serial power, but without any active cooling
▪ External dependencies:o MOPS for barrel PP0 [not in RR]o Channel count specs from ATLAS [not in RR]o Power dissipation specs [not in RR]o Thermal/irradiation specs [not in RR]o Safety specs (derogation) [not in RR]
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Deliverable Overview
• 6.1.3.2 PP0/TwinAx [SLAC]▪ Equivalent of Type-1 and Type-2 services for data transmission▪ Routed along outside of quarter shells, passing through PP1, and out
to optoboxes [6.1.3.5].▪ Commercial cable (34 AWG Copper twinax), produced by TempFlex
(Molex)▪ Cable is cut to length and terminated on both ends (PP0 and
Optoboard connector), most likely by a commercial partner.▪ Challenges:
o Signal integrity [in RR]o Derogation of CERN fire safety standards needed [not in RR]o Packing strategy and bundle size fitting within cable trays [in RR]o Uniform termination of large number of twinax for bundle fabrication, strain relief
for thermal differential contraction with very limited take-up space [not in RR]
▪ External dependencieso Optobox interface specification [not in RR]o Channel number specs [not in RR]o Optobox termination spec [not in RR]o Thermal/irradiation specs [not in RR]
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Deliverable Overview
• 6.1.3.4 Type-1 Services [UCSC]▪ Routes LV, HV, DCS from PP0 to PP1▪ Run along cable trays on the outside (in r) of quarter shells▪ Commercial cables▪ Possibly custom termination boards▪ Challenges:
o Power loss in cable and at LV terminationo Strain relief at termination, especially for AWG 36 HV lines, direct attach vs
connector
▪ External dependencies:o PP1 connector specification [not in RR]o Thermal/irradiation specs [not in RR]o Power dissipation specs [not in RR]o Channel number specs [not in RR]
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Deliverable Overview
• 6.1.3.5 Optical Links [OSU]▪ Optoboards are near PP2, outside of ID volume▪ Take Twinax copper cable @ 1.28 Gb/s and output optical signals to
counting room▪ All custom, produced at Bonn▪ This WBS only includes QC of optoboards for Inner System▪ Challenges:
o No significant challenges identified.
▪ External dependencies:o Bonn for optoboards [not in RR]
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Deliverable Overview
• 6.1.3.6 Equalizer Block [SMU]▪ GBCR is a custom ASIC that recovers data transmission signals from
TwinAx for input into LPGBT▪ 6x6x1mm, fabricated in TSMC 65nm process ▪ Installed as part of the optobox ▪ First prototype exists, updated design to-be-submitted in November.▪ Challenges:
o High-speed signal recovery [in RR]o All the usual challenges of ASICs that sometimes require resubmission [in RR]
▪ External dependencies:o Services specs from ATLAS, e.g. adding additional lines to match lpGBT channel
count [not in RR]
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Risk Description
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WBS6.1.3 Communication and Power Services Type Threat Risk ID RD-06-01-03-001
Status Active
Expires 27-Nov-20
Title 1.28 Gb/s data transmission speed not achievable
Summary 1.28 Gb/s data transmission speed not achievable over the desired length.
Owner P. Grenier
Probability Pre 10% Post 5%
Cost [k$] Lo $9 Hi $160
Schedule Lo 2 Hi 6
Tech Impact 2(M)
Post Mitg Prob 1 (VL)
Impact Score Cost 1 (L) Sched 2 (M) Rank= 30
Mitigation Allocate more resources in connectorization and equalization
ResponseUse slightly larger twinax cables to operate at 1.28 Gbps, and/or operate at lower bandwidth and make use of data compression.
Comments
This risk includes all data transmission components. For twinax, the proposed use of larger cables has already been prototyped in the R&D phase and can fit in the present detector layout but introduce slightly more material.
Phase Affected
Risk Description
10
WBS6.1.3 Communication and Power Services Type Threat Risk ID RD-06-01-03-004
Status Active
Expires 24-Jan-23
Title Type-I service cables fail to fit in available space
Summary Type-I service cables, including data transmission cables, fail to fit in available space
Owner P. Grenier
Probability Pre 20% Post 5%
Cost [k$] Lo $10 Hi $160
Schedule Lo 2 Hi 4
Tech Impact 0 (N)
Post Mitg Prob 1 (VL)
Impact Score Cost 1 (L) Sched 2 (M) Rank= 30
Mitigation Detailed routing drawings and mechanical prototypes to ensure specified bundles fit in available space.
Response Reduce number of cables by using more aggressive data compression.
CommentsSpecifications for physical cable sizes are not fixed; the specifications are for electrical performance. More aggressive compression could impact physics performance.
Phase Affected
Risk Description
11
WBS6.1.3 Communication and Power Services Type Threat Risk ID RD-06-01-03-005
Status Active
Expires 1-Oct-19
Title Pixel cell size: 25x100.
Summary Current baseline is 50x50. If 25x100 is selected, the type-0 flex will have to be redesigned.
Owner P. Grenier
Probability Pre 20% Post 20%
Cost [k$] Lo Hi $100
Schedule Lo Hi 6
Tech Impact 0 (N)
Post Mitg Prob 5 (M)
Impact Score Cost 1 (L) Sched 2 (M) Rank= 90
Mitigation Anticipated design change.
Response Redesign Type-0 flex. Schedule delay. Add resources.
CommentsIf the International Collaboration decides to use 25x100 in L0 and R0, the Type-0 flex would have to be redesigned and reprototyped, which would require about 6 months.
Phase Affected
Risk Description
12
WBS6.1.3 Communication and Power Services Type Threat Risk ID RD-06-01-03-006
Status Active
Expires 25-Nov-22
Title Loss of key personnel
Summary Key engineers or technicians unavailable or lost to project
Owner P. Grenier
Probability Pre 10% Post 5%
Cost [k$] Lo Hi $400
Schedule Lo Hi 6
Tech Impact 2(M)
Post Mitg Prob 1 (VL)
Impact Score Cost 2 (M) Sched 2 (M) Rank= 30
Mitigation Cross-training and dissemination of information. Developing backup strategies.
ResponseA position would be posted and a new hire made. In the interim the existing staff would assume additional responsibility
CommentsThese are long term employess of the institutions with a strong commitment to the project. Worst case scenario involves increasing labor rates by 20% to be more competitive.
Phase Affected
Risk Description
13
WBS6.1.3 Communication and Power Services Type Threat Risk ID RD-06-01-03-007
Status Active
Expires 3-May-21
Title Additional GBCR chip iteration needed
Summary Production GBCR chip has bugs that cannot be worked around.
Owner P. Grenier
Probability Pre 40% Post 20%
Cost [k$] Lo $80 Hi $160
Schedule Lo 6 Hi 12
Tech Impact
Post Mitg Prob 5 (M)
Impact Score Cost 2 (M) Sched 3 (H) Rank= 210
Mitigation Extensive verification, validation, testing of prototype chips
Response Submit new version
CommentsA new submission requires at least six months to fix any problems, submit, and receive new chips back. Cost for submission is at least 80k, up to 160k.
Phase Affected
Risk Description
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WBS6.1.3 Communication and Power Services Type Threat Risk ID RD-06-01-03-002
Status Retired
Expires 24-Jan-23
Title Serial powering fails to meet specifications
SummaryFailure to meet the specifications for serial powering due to excessive current consumption or system is not ready.
Owner P. Grenier
Probability Pre 30% Post 10%
Cost [k$] Lo $70 Hi $120
Schedule Lo 2 Hi 4
Tech Impact 1 (L)
Post Mitg Prob 3 (L)
Impact Score Cost 1 (L) Sched 2 (M) Rank= 60
Mitigation More protyping of power supply and study of the cooling requirement.
Response Allocate more resource for prototyping and use new cables instead of the exisiting cables.
CommentsSpecifications for serial powering are still not finalized. May need to use bigger cables to reduce voltage drop and hence heat generation. Cost and delay due to one more prototype.
Phase Affected
Risk Description
15
WBS6.1.3 Communication and Power Services Type Threat Risk ID RD-06-01-03-003
Status Retired
Expires 1-Dec-20
Title Serial powering more complex to implement
Summary All aspects of Serial Powering need more developments.
Owner P. Grenier
Probability Pre 20% Post 5%
Cost [k$] Lo $100 Hi $100
Schedule Lo - Hi 6
Tech Impact 0 (N)
Post Mitg Prob 1 (VL)
Impact Score Cost 2 (M) Sched 2 (M) Rank= 30
Mitigation Perform deep studies and test of Serial Powering with RD53A chips.
Response Allocate more resource for prototyping and testing.
Comments
The various components fo the Serial Powering concept may need more developments: FE chip, cables or power supplies. Low impact is based on getting more complex power supplies (which may require the cost of additional round of prototypes). High impact is estimated on time needed to finalize the SP concept: 6 months.
Phase Affected