dependable embedded systems the spp 1500 research program

45
SPP1500.itec.kit.edu Dependable Embedded Systems The SPP 1500 Research Program by Jörg Henkel (Coordinator) Karlsruhe Institute of Technology (KIT), Germany Together with: J.Becker, O, Bringmann, U.Brinkschulte, S.Chakraborty, R.Ernst, H.Härtig, L.Hedrich, A.Herkersdorf, P.Marwedel, M.Platzner, U.Schlichtmann, O.Spinczyk, W.Rosenstiel, M.Tahoori, J. Teich, N. Wehn, H.-J.Wunderlich

Upload: others

Post on 18-Dec-2021

3 views

Category:

Documents


0 download

TRANSCRIPT

SPP1500.itec.kit.edu

Dependable Embedded Systems The SPP 1500 Research Program

by Jörg Henkel (Coordinator) Karlsruhe Institute of Technology (KIT), Germany

Together with: J.Becker, O, Bringmann, U.Brinkschulte, S.Chakraborty, R.Ernst, H.Härtig, L.Hedrich, A.Herkersdorf, P.Marwedel, M.Platzner, U.Schlichtmann, O.Spinczyk, W.Rosenstiel, M.Tahoori, J. Teich, N. Wehn, H.-J.Wunderlich

2

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium The SPP 1500

!  Approved by DFG Senate in Spring 2009

!  41 Submissions, 12 accepted !  Kick-Off: January 2011 !  Projected Duration: 3 x 2 years !  Budget: 9+ Mio. Euro

3

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium

Overview !   Background of the SPP 1500

“Dependable Embedded Systems” !   Focus and Goals !   Exemplary Projects

4

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Variabilities

Que

lle: I

ntel

, 65

nm

frequ

ency

Leakage

Variations for processors an single die

1.2 nm 32 nm

Que

lle: I

ntel

, 65

nm

latency of an Inverter # d

op. a

tom

s # of dop. atoms in T-channel

5

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Soft Errors through Radiation

n+ n+

p+

N-Well

P-Well

P-Substrate

Isolation

Gate

+-+-

+-+- +-

+- +- +-

+-

+- Depletion Region

High-Energy Particle (Neutron or Proton)

!   radiation effects on semiconductor devicesàSoft Errors !   alpha particles !   low-energy neutrons !   high-energy neutrons/protons

!   radiation event !   ion track formation !   ion drift !   ion diffusion

!   Sensitive areas: !   Channel region of NMOS !   Drain region of PMOS !   “off” state is more sensitive

n+---

- ---- --

- --- -- ----

----

- ---

-- -

+++++++++

++++++++++++++++++

++

n+

--

--

-

-- --

- -

- -

-

--

-

--

+

++

+

++++ +

++

++

3

2

1

010-13 10-12 10-11 10-10 10-9

Time (seconds)

Cur

rent

(arb

itrar

y un

it)

Source: Baumann, TI@Design&Test’05, Ziegler, IBM@IBM JRD’96

HeYX AZ

AZ

42

42 +→ −−

6

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Temperate remains a Problem

Src

: Hen

kel,

Ebi

, Am

rouc

h

!   Example showing localized computation switching between two areas on the chip

MTTF [years]

Temp (Celsius) K. S

kadr

on e

t al.,

ICC

AD

200

4

6.85 7.24 7.73 8.34

9.06

5 6 7 8 9

10

0 5 10 15 20 25

7

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Temperature and Leakage

!   Thermal “runaway” problem: !   Increase in temperature leads to increase in leakage power

à feedback loop possible! !   Sub-threshold leakage

approximated by where A and B are constants à exponential growth!

BT

subI A e−

≈ ⋅

[Zhang 2003]

8

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Aging: TDDB

!   TDDB: Time Dependent Dielectric Breakdown !   Created by:

!   Accumulation of trapped charges at dielectric

!   Effects: !   Increase of power consumption !   Slowing of switching speed

(TDDB)

9

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Aging: Electro-Migration

Source: [Stott, 2010]

(Electro-migration)

!   Electro-migration: aging effect due to transport of mass in metal interconnects

!   directly linked to temperature !   Basic Mean time to failure modeled

by Black’s Equation:

!   MTTF decreases exponentially with temperature à Goal: reduce peak temperatures

[wikipedia]

Qn kTMTTF Aj e

⎛ ⎞⎜ ⎟− ⎝ ⎠=

10

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium NBTI

!   Negative Bias Temperature Instability !   Breakdown of Si-H bonds at

the silicon-oxide interface due to voltage/thermal stress à causes interface traps

!   Affects mostly P-MOSFETs because of negative gate bias !   Effect in N-MOSFETS is

negligible

!   NBTI is not yet fully understood

n p

S oxide gate

D

Si Si Si

H+ O H H

P-type MOSFET

Si Si

O H trap

Vg

Vg < 0 à STRESS! Vg = 0

p

11

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium NBTI

!   NBTI manifests itself as a shift in Vth !   Causes increase in transistor delay !   Delay faults are responsible for

NBTI induced bit-flips and resulting circuit failure

!   Recovery effect in periods of no stress ! When voltage and temperature are

low, Vth can shift back towards ist original value

!   Full recovery from a stress period only possible in infinite time à In practice overall Vth shift increases monotonously over longer periods, e.g. months/years

Vth

shi

ft [V

] Time

Stress Recovery

Vg

[V] 0

-1

12

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium NBTI

Std deviation in 65nm SRAM P-MOSFETS Std deviation at 32nm

Vth

shi

ft [V

]

Vth

shi

ft [V

]

Time [years] Time [years]

SRAM Vth shift Std. deviation

SRAM Vth shift Std. deviation

!   Mean Vth shift mainly due to Temperature/Voltage !   Small technology nodes have less Vth shift due to lower voltages

!   However: Standard deviation of Vth shift mainly due to structure size !   Small technology nodes and small P-MOSFETs (e.g. SRAM) show large

deviations from the mean Vth shift à inceased reliability concern

Src: IBM, KIT

13

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Other Effects

!   This was not a complete list …

!   See call: “It is the goal of this Priority Program to develop new system-level methods and architectures that can cope with the negative effects caused by the inherent unreliability observed at transistor and physical level when migrating to new technology nodes”

14

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium

Overview !   Background of the SPP 1500

“Dependable Embedded Systems” !   Focus and Goals !   Exemplary Projects

15

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium

Focus

Devices, Technology, Physics, …

Logic

Architecture

HW/SW System

Dig

ital h

ardw

are/

softw

are

syst

ems

Physical sources

Faults

Error

Failure

Bit-FlipSingle/multi

Temporal andSpatial correlated

Radiation Process variationTemperature Coupling (C)

JitterSignal /

Vdd noise

Crosstalk

Wrong CPU reg. value

Wrong branch decision

Crash Data corruption

“No effect”

Permanent/transient

Electro-migration

Fault Model is needed!

16

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Focus (cont’d)

Dependable Embedded Software

!   Hardware-dependent software !   Operating system and

middleware !   Management of

observation strategies

!   Performing online tests

!   Perform adaptation !   Scheduling and allocations

schemes !   Application software:

!   instruction-level !   task-level !   algorithm level

17

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Focus (cont’d)

Dependable Embedded Software

Dependable Hardware Architectures

!   Hardware Architectures: various levels !   Register-Transfer !   Micro-Architecture !   System-on-Chip

!   Technology Abstractions provides physical properties

!   Distinguish between: !   Permanent and transient

problems !   Fabrication time and run-time

(detect and fix) !   Possible means:

!   Masking of undependable components

!   Reconfiguration !   static !   dynamic

18

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Focus (cont’d)

Dependable Embedded Software

Dependable Hardware Architectures

Technology Abstraction

!   This SPP does not deal with technology!

!   Means and architectures should be as technology independent as possible

!   Technology abstraction should: !   Characterize technology !   Provide technology parameters !   Model undependability !   …

19

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Focus (cont’d)

Dependable Embedded Software

Dependable Hardware Architectures

Technology Abstraction

20

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Focus (cont’d)

Dependable Embedded Software

Dependable Hardware Architectures

Technology Abstraction

Ope

ratio

n/O

bser

vatio

n/A

dapt

atio

n

21

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium

Dependable Embedded Software

Dependable Hardware Architectures

Technology Abstraction

Ope

ratio

n/O

bser

vatio

n/A

dapt

atio

n

Des

ign

Met

hods

Focus (cont’d)

22

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Cross-layer techniques are key

Dependable Embedded Software

Dependable Hardware Architectures

Technology Abstraction

Ope

ratio

n/O

bser

vatio

n/A

dapt

atio

n

Des

ign

Met

hods

23

spp1500.itec.kit.edu

DFG SPP 1500

J. Henkel DVLSI Symposium

Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

Goals !  We are NOT investigating technology

!   Bit flip model as resilience articulation point (RAP)

!   Investigate reliability cost trade-offs !   What trade-offs exist !   Energy/throughput/area/lifetime

!   2D/3D MPSoC’s, reconfigurable hardware

!   Focus on embedded systems !   Consider and take advantage of application knowledge

!   Consider the whole stack: hardware, software, application !   Interaction HW/SW/application !   Cross-layer optimization

24

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium

Cost per Transistor

Goals C

ost

Reliability Cost

Product Cost

time

Error resilient Architectures

Scaling NOT profitable Scaling profitable

25

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium

Overview !   Background of the SPP 1500

“Dependable Embedded Systems” !   Focus and Goals !   Exemplary Projects

26

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium

Dependable Hardware Architectures

!   Hardware Architectures: various levels !   Register-Transfer !   Micro-Architecture !   System-on-Chip

!   Technology Abstractions provides physical properties !   Distinguish between:

!   Permanent and transient problems !   Fabrication time and run-time (detect and fix)

!   Possible means: !   Masking of undependable components !   Reconfiguration

!   static !   dynamic

27

spp1500.itec.kit.edu

DFG SPP 1500

J. Henkel DVLSI Symposium

Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

Adaptive Reliability for SoCs using a CGRA

!   Traditional approaches to implement reliable SoCs are expensive and inefficient !   Hardware might have to be duplicated or triplicated to

achieve desired reliability. !   Not all SoC components are required all the time.

!   The ARES project focuses on SoCs that include a Coarse Grained Reconfigurable Architecture (CGRA) !   Traditionally CGRAs are used in a SoC as accelerators

of functionality that is not required all the time. !   In the ARES project CGRAs are used to provide

redundancy to SoC components that are not required all the time => time-multiplexed redundancy

(Source: Rosenstiel, Tübingen)

28

spp1500.itec.kit.edu

DFG SPP 1500

J. Henkel DVLSI Symposium

Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

Adaptive Reliability for SoCs using a CGRA

! Two-Layer Methodology 1.  Harden the CGRA 2.  Use hardened CGRA to improve

reliability of other SoC-components HW1 HW2 HW3

CPU reliable CGRA

MEM

! Benefits !   Redundant hardware only for one component (CGRA)

instead of all SoC components. ! Reliability can be adjusted to the level required by the

current applicaiton. ! Functionality of defective SoC components can be

replicated by the CGRA to enable gracefull degradation.

(Source: Rosenstiel, Tübingen)

29

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium

Error Resilience Exploration of ASIP Timing Errors

FER/BER Analysis

Bit true high performance C++ simulation framework

Source (RNG) Encoding Modulation

AWGN

Channel

Error-free Reference Decoder

Investigate impact of errors on decoding performance via graphical interface

De- Modulation

Varying channel SNR

Over-clocking

XILINX IESE Tool: 70MHz

(Source: Wehn, Kaiserslautern)

30

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium

Dependable Embedded Software

?

(Src: paragoninnovations)

31

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium

Dependable Embedded Software

!  Only hardware-dependent software is considered !   Possible means:

!   Operating system and middleware !   Management of observation strategies !   Performing online tests !   Perform adaptation

!   Scheduling and allocations schemes !   Application software:

!   instruction-level !   task-level !   algorithm level

32

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium

Separate error detection from error correction!

�  An error is signaled, ©  Error detection executed in a short amount of time,

classification decides if, when and how to handle the error, �  Normal system execution continues, ➂  If required, error correction takes place after timing-critical tasks have

finished but before error has fatal consequences.

➁ ➀

©

(Source: Marwedel/Engel)

33

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium

Application analysis provides information on error propagation

!   Values assigned to reliable variables must also be reliable

!   Unreliable variables can tolerate errors

!   Constraints:

!   Pointers/array indices must be reliable

!   Loop Conditions must be reliable

!   Reliability of if-conditions depends on statements inside body (Source: Marwedel/Engel)

34

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Technology Abstraction

?

(Src: Intel)

35

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Technology Abstraction !   This SPP does not deal with technology !  Means and architectures should be as technology

independent as possible !   Technology abstraction should:

!   Characterize technology !   Provide technology parameters !   Model undependability !   …

36

spp1500.itec.kit.edu

DFG SPP 1500

J. Henkel DVLSI Symposium

Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

Lifting Device-Level Characteristics for Error

Resilient System-Level Design

Cross-Layer Methods Circuit Level Timing Analysis with restrictions given by the software program. è Program dependent circuit timing with parameterization on yield and aging.

System Analysis With Technology Information Mapping of tasks under consideration of processor age, desired yield, error probability, ...

Hardware-Level Abstraction Models

Abstraction of timing behavior of circuit elements into error probability dependent on given parameters (Age, Yield, Temperature, etc.)

Embedded System

(Source: Schlichtmann/Chakraborty)

37

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Design Methods

Design Space Generate Extensible Processor Prototoyping Synthesis and

Tape Out

Application Profiling

Indentify - pre-dedined blocks - parameter settings Define - Extensible Instructions - in/exclusion of blocks - parameters settings

Retargetable Tool Generation Compiler Linker

Instruction Set Simulator Assembler

Synthesizeable RTL of - core

- blocks

y n

Explore Extensible Pro-cessor Design

Space

Generate Extensible Processor Prototoyping Synthesis and

Tape Out

Application Profiling

Indentify - Extensible instructions - pre-designed blocks - parameter settings Define - Extensible Instructions - in/exclusion of blocks - parameters settings

Retargetable Tool Generation Compiler Linker

Instruction Set Simulator Assembler

OK ? [Henkel03]

?

38

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Design Methods

!   Design methods and tools for dependable !   Hardware design !   Software design (application software, OS, middleware) !   Simulation !   Synthesis !   Design space exploration

!  Means: !   Design systems from the very beginning with dependability in mind

(and not just as an afterthought) !   Therefore: consider dependability as THE major design constraint (in

front of power, performance, area etc.) !   Co-Design of HW/SW/OS/Middleware/Application

39

spp1500.itec.kit.edu

DFG SPP 1500

J. Henkel DVLSI Symposium

Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

Providing Efficient Reliability in Critical Embedded Systems

!   Motivation !   Increasing vulnerability of VLSI circuits and

embedded systems to radiation induced soft errors

!   Traditional fault tolerant approaches are either too costly or ineffective

!   Need for cost effective approaches applicable to embedded systems

!   This Project !   Hierarchical techniques and methodologies !   At both hardware and software levels to ensure

cost-effective reliability !   Multi-level reliability modeling, effective

concurrent error detection and recovery schemes

Cost

Failure Rate

+

+

Reliability+

Mainstream systems

(handhelds, mobile, ASICs)

Traditional Fault-tolerance,

High-end systems

Proposed Approaches:

Tolerating High Failure Rates at

Low Cost

Towa

rds

nano

scal

e

(Source: Tahoori, KIT)

40

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Operation, Observation,

Adaptation !  Operation !   Scheduling and dispatching of resources

!  Observation !   Observe sources of undependability !   When and how often to observe !   What to observe !   Resources for observation: how many and where to place etc.

!   Adaptation !   Reaction to undependable operation !   Self-adaptation (e.g. bio-inspired like in organic computing) !   Convergence of adaptation strategies

?

41

spp1500.itec.kit.edu

DFG SPP 1500

J. Henkel DVLSI Symposium

Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

Reliable Computing Base

Operating System Support for Redundant Multithreading

!   OS replicates application binaries ! Automatic (no programmer

involvement) !   Flex ib le ( turn on/of f per-

application) !   High appl icat ion coverage

(replication includes device drivers & protocol stacks)

!   Low overhead (loosely coupled replicas, distributed across CPU cores)

(Potentially faulty) Hardware

Fiasco.OC Microkernel

L4Re OS Runtime Replicator

Application

Application

Appli-cation Applicat

ion Applicat

ion Device Driver

Appli-cation

User Mode Kernel Mode

(Source: Ernst/Härtig)

42

spp1500.itec.kit.edu

DFG SPP 1500

J. Henkel DVLSI Symposium

Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

VirTherm-3D

!   Provides thermal-aware task allocation and rerouting physical connections between tasks, agents and I/O

!   Architecture & Operating System !   Virtualization layer on L4

microkernel basis for processing virtualization

!   Agent-based thermal management for monitoring and task migration

!   Communication virtualization with HW enablement

SW  Task  

Therm  Agent  

Run2me  

SW  Task  

Therm  Agent  

OS  

SW  Thread  

Dedicated  IP  Block  

VNA  

Core   Core  

Mem   VNA  

Core   Core  

Mem   VNA  

Core  

Mem   VNA  

Mem  Ctrl  

I/O  Ctrl  

HW  Accl  

R   R  

R   R  

R   R  

VNA  

HW  Accl  

ReconOS-­‐Kernel  

SW  Thread  

HW  sc

hedu

ler  

HW  Thread  

HW  Thread  

HW  Thread  

HW  Accl  

VNIC  

Core  

Mem  

Core  

Mem  

Dedicated  IP  Block  

VNA  

Core   Core  

Mem   VNA  

Core  

Mem   VNA  

Mem  Ctrl  

HW  Accl  

R  

R  

R  

VNA  

HW  Accl  

HW  Accl  

Core  

Mem  

Core  

Mem  

Core   Core  

Mem   VNA  

I/O  Ctrl  

R  

R  

R  

VNIC  

Dedicated  IP  Block  

VNA  

Core   Core  

Mem   VNA  

Core  

Mem   VNA  

Mem  Ctrl  

HW  Accl  

R   R  

R  

VNA  

HW  Accl  

HW  Accl  

Core  

Mem  

Core  

Mem  

Core   Core  

Mem   VNA  

I/O  Ctrl  

R   R  

R  

VNIC  

Fiasco-­‐µC/VMM  

(Source:Henkel/Herkersdorf)

43

spp1500.itec.kit.edu

DFG SPP 1500

J. Henkel DVLSI Symposium

Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

VirTherm-3D

!   VirTherm-3D !   Dias PyroView infrared thermal camera on Virtex-5/-2 !   Generating heating in one layer and simulating effect on

active/idle layer above to calibrate thermal model

(Source:Henkel/Herkersdorf)

44

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium Summary !   The SPP 1500 aims at technology-induced reliability

problems !   Focus is on:

!   Dependable Hardware Architectures !   Dependable Embedded Software !   Technology Abstraction !   Design Methods !   Operation, Observation and Adaptation

!   Cross-layer techniques are key !   The topic of reliability remains very hot (several

international projects; large submission numbers in international conferences)

45

spp1500.itec.kit.edu Jörg Henkel, Dec. 1, 2012, Tokyo, Japan

DFG SPP 1500

J. Henkel DVLSI Symposium

Thank you for Attention!