description: a design review of a full-featured 350w ... · a design review of a full-featured ......
TRANSCRIPT
Power Supply Design Seminar
Topic 2 Presentation:
A Design Review of a Full-Featured 350-W Offline Power Converter
Reproduced from 2012 Texas Instruments Power Supply Design Seminar
SEM2000, Topic 2 TI Literature Number: SLUP301
© 2012, 2013 Texas Instruments Incorporated
Power Seminar topics and online power training modules are available at:
ti.com/psds
Topic 2
A Design Review of a Full-Featured 350-W Offline Power Converter
Milan Marjanovic and Matthias Ulmann
SLUP301
Agenda
1. Specification and Overview
2. Power Board
3. ADC Card
4. MCU Card
5. Conclusion
Texas Instruments – 2012 Power Supply Design Seminar 2-2 SLUP301
Specification and Overview Input • Universal AC input voltage range 85- to 265-VAC, 50/60 Hz
Output • 12- to 14-V DC adjustable
• 25-A continuous, 30-A peak
• Ripple < 12 mVpp (at 20-MHz BW measured)
• Load step 2% to 100% with voltage deviation < 1%
Mechanics • Silent power = no forced air → Efficiency > 90%
• Slim line, maximum height < 2 in./50 mm Extras • Hold-up time > 20 ms for harsh environments
• All converters synchronized to the same switching frequency → Switching frequency is selectable (170 kHz ±10%)
• Full monitoring with a microcontroller → Analog design with digital monitoring
Texas Instruments – 2012 Power Supply Design Seminar 2-3 SLUP301
Universal Input85- to 265-VAC, 50/60 Hz
12- to14-V DC25-A/30-A peak
L
N
+
-
Primary Secondary
PFCInputEMI
Filter
OutputEMI
Filter
ACRectifier Isolated
DC/DCConverter
Analog
VoltageCurrent
Temperature Man-MachineInterface
CLK Microcontroller
forMonitoring
Vout Setting
Digital
(fswitch)
Aux.PowerSupply
Specification and Overview
Texas Instruments – 2012 Power Supply Design Seminar 2-4 SLUP301
Agenda
1. Specification and Overview
2. Power Board
3. ADC Card
4. MCU Card
5. Conclusion
Texas Instruments – 2012 Power Supply Design Seminar 2-5 SLUP301
Power Board – AC Input EMI Filter
Texas Instruments – 2012 Power Supply Design Seminar 2-6
Common-Mode Filter L2, C1, C5 and L3, C2, C6
Differential-Mode Filter L1, L4, C3, C4 for low frequency FB1-FB6 for high frequency
Y-Capacitors C1, C2, C5, C6
Main Switch
LineNeutral
Earth
85..265-VAC
CT1
J1
CT2
F15 A
FB1
FB2
FB3
FB4
FB5
FB6
LNG
L2400 µH C3
C1 L32.6 mH
L14.7 µH
R1open
C2RT1
275 VRT2
275 V
C6
4.7 nF
4.7 nF
C4
0.68 µFR2open
4.7 µHL4
C5
0.68 µF1 nF
1 nF
L_OUT
N_OUT
SLUP301
Texas Instruments – 2012 Power Supply Design Seminar
[V]
[A]
Forward Voltage
VThreshold
Dio
de C
urre
nt
ǻI
ǻV
+
-
OUT
~
~
IN
Power Board – AC/DC Rectification – Diode Losses 1
2-7
RDiode =
ΔVΔI
PDiode = VForward×IDiode,avg + RDiode×IDiode, rms2
PDiode,n = VForward×IDiode, avg + RDiode×
IDiode, rms2
n
Single Diode
n Diodes in Parallel
Diode Losses = Static Losses + Dynamic Losses
Forward Voltage Dynamic Resistance
SLUP301
Power Board – AC/DC Rectification – Diode Losses 2
Texas Instruments – 2012 Power Supply Design Seminar 2-8
Input Voltage • 110-V AC/60 Hz, 13.8 V at 25-A load, 90% efficiency and Current: • 1.7-A rms/1.6-A avg/4.9-A peak per diode
Diode 1N5406: • 600-V, 3 A • 0.8-V voltage drop at 1.6-A average • 40-mΩ dynamic resistance
PDiode = VForward × IDiode,avg + RDiode × IDiode,rms2
PDiode = 0.6 V×1.6 A+80 mΩ× (1.7 A)2 = 1.0 W+0.2 W = 1.2 WPBridge rectifier = 4 × PDiode = 4 × 1.2 W = 4.8 W
Result: • Diode losses mainly due to static losses • Paralleling diodes provides little improvement • Losses can only be reduced by using an element with a lower voltage drop or by eliminating the need for a diode
SLUP301
IDiode
IMOSFET
Power Board – AC/DC Rectification – FET and Diode Parallel
Texas Instruments – 2012 Power Supply Design Seminar 2-9
FET IPW60R041C6: • 600 V, 49 A • 41-mΩ on-resistance • 290-nC gate charge
Solution: MOSFET in parallel with the diodes
PFET = RDS×I2FET, rms
PFET = 41mΩ× 1.7 A( )2 = 0.1W
PFET rectifier = 4×PFET = 4×0.1W = 0.4 W
Result: • Losses reduced by 93% • Switching and driving losses are negligible at line
frequency • If optimized for 110-V grid (15-A fused):
− GSIB2040: 400 V, 20 A, 0.6-V threshold, 20 mΩ 4x 5.2 W = 20.8 W (equals 1.3%) − IPP200N25N3G: 250 V, 20 mΩ, 64 A
4x 1.1 W = 4.4 W (equals 0.3%)
SLUP301
High-Side DriverCarrying
Gate DriverUCC27324
High-Side DriverCarrying
Gate DriverUCC27324
InputEMI
Filter
Phase
Neutral
AC
Low-SideGate Driver
½ UCC27323
Low-SideGate Driver
½ UCC27323
Q1D1
Q2D2
Q4D4
Q3D3R2 R3
R1 R4
OperationalAmplifierOPA333
RShunt
-DC
+DC
InterleavedCCM PFC
ILoad
MicrocontrollerMPS430F2012
Power Board – AC/DC Rectification – Block Diagram
Texas Instruments – 2012 Power Supply Design Seminar 2-10 SLUP301
N/C N/C
INA OUTAGND VDD
INB OUIB
+12V_PAC
12
3
4
87
665
U1UCC27324D
C2
100 nF
1
5
2
4
3
T1980 µHC1 10 µF
D5BZX84C15
D41N4148
D2BAT54
R412.1 k
D3BAT54C
D11N4148
R227.4
Q2MMBT2907
Q1MMBT2907
C4
1 nF
R1
33
C3
100 nFR310.0 k
Source
Gate
Power Board – AC/DC Rectification – High-Side Gate Driver
Texas Instruments – 2012 Power Supply Design Seminar 2-11
• INA/INB: 200-kHz PWM generated by MSP430™ microcontroller • Open-loop configuration
FET Switch Off Time Base: 500 µs/div FET Switch On
SLUP301
Start
Load Current > 0 A
Voltage Phase = 1
Voltage Neutral = 0
Voltage Phase = 1
Voltage Neutral = 0
Switch OFF Q1, Q3
Switch OFF Q2, Q4
Switch OFF Q1, Q3
Switch OFF Q2, Q4
Switch OFF Q2, Q4
Switch ON Q1, Q3
Switch OFF Q1, Q3
Switch ON Q2, Q4
NO
NONO
YES YES
Power Board – AC/DC Rectification – Software
Texas Instruments – 2012 Power Supply Design Seminar 2-12
Switching of MOSFET needs to behave like a diode rectifier: • Energy flows in one direction only • The MOSFET only conducts if the
voltage and current on the switch are positive at the same time
• The MOSFET must not switch under any other circumstances
SLUP301
Power Board – PFC Considerations
Texas Instruments – 2012 Power Supply Design Seminar 2-13
Continuous conduction mode interleaved PFC with UCC28070
Advantages: • Reduced high-frequency current ripple • Easier EMI filtering • Easier scalability to higher power levels
(multiphase systems possible) • Low profile possible (<50 mm needed) Disadvantages: • Hard switching topology (needs fast reverse recovery diode) • Higher EMI issues at higher frequency range (50-200 MHz)
SLUP301
390-V DC @ 0.9-A nom. / 1.15-A max.
Bulk
Capacitor
Mains Voltage PFC Voltage
PWM 1 Current Sense 2
PWM 2Current
Sense 1
AC/DC
Rectifier
Full
Bridge
Active
In-Rush
Control
Interleaved CCM
PFC Controller
UCC28070
CLK
350 kHz
Gate Driver
UCC27324
Gate Driver
UCC27324
Power Board – PFC – Block Diagram
Texas Instruments – 2012 Power Supply Design Seminar 2-14 SLUP301
Power Board – PFC – Component Selection
Texas Instruments – 2012 Power Supply Design Seminar 2-15
Results in a power stage efficiency of 97% at high line.
Key points for maximum efficiency:
• Interconnects as short as possible with sufficient copper cross section (4 A/mm²)
• Fast switching MOSFETs with low gate charge:
– Rule of thumb: 50% switching losses, 50% conduction losses
• Fast switching MOSFET → Fast recovery diode needed SiC technology boosts efficiency by more than 2%
• Toroid core (high flux, MPP) for PFC choke with single-layer winding: – Low distributed capacitance – Low conduction losses
SLUP301
0.75
0.80
0.85
0.90
0.95
1.00
0 5 10 15 20 25 30
Output C urrent [A]
Po
we
r F
ac
tor
110 VAC 230 VAC
Power Board – PFC – Power Factor
Texas Instruments – 2012 Power Supply Design Seminar 2-16 SLUP301
80
70
60
50
40
30
20
10
0
-10
-20
A
SGL
1AP
Center 2.121320344 MHz
F1
Span 29.85 MHz
67DB
Max/Ref Lv1
80 dBµV
0 dBµV
Marker 1 (T1)
48.87 dBµV
8.75411965 MHz
RBW
VBW
SWT
10 kHz
100 kHz
60 s
RF Att
Unit
10 dB
dBµV
Limit check:
Passed
1 MHz 10 MHz
1
Power Board – PFC – Conducted Emission
Texas Instruments – 2012 Power Supply Design Seminar 2-17
• 230-VAC in, 390-VDC at 0.9-A load • PFC and auxiliary supply running
SLUP301
(A,B)
(C,D)
(A,B)-(C,D)
VIN
0 V
VIN
0 V
0 V
+VIN
-VIN
0°
(A,B)
(C,D)
(A,B)-(C,D)
VIN
0 V
VIN
0 V
0 V
+VIN
-VIN
90 °Phase-Shifted Full Bridge
(A,B)
(C,D)
(A,B)-(C,D)
VIN
0 V
VIN
0 V
0 V
+VIN
-VIN
180°
Phase D
Phase C
Phase B
Phase A
VIN
VOUT
(A,B) (C,D)
Power Board – Full Bridge – Functionality
Texas Instruments – 2012 Power Supply Design Seminar 2-18 SLUP301
Gate Drive
Transformers
Current Sense
Transformer
Full Bridge
Transformer
Interleaved
CCM PFC
Gate Signals
Phase A, B, C, D
12-14 VDC
25-A cont./30-A peak
Phase E Phase F
Phase D
Phase C
Phase B
Phase A
+
-
Gate Driver
UCC27324
Gate Driver
UCC27324
Phase-Shifted
Full Bridge
Controller
UCC28950
+12-V
Sec.
CLK
350 kHz
PWM
Vout
Power Board – Full Bridge
Texas Instruments – 2012 Power Supply Design Seminar 2-19 SLUP301
+12 V_S
High Side
Low Side
Low Drive H-OUT2
H-OUT1
U1UCC27324D
1234
8765
1
2
3 4
6
5N/C N/CINA OUTAGND VDDINB OUIB
C3100 nF D6
BAT54A
D2BAT54C
D1 HRW0202A
C2
D5
C4
100 nF
100 nF
HRW0202A
T1450 µH1
1034
87
D3BAT54S
C6
C7
22 nF
100
R3
100
R1
100100 nF
R4
Q1PMD3001D C2
22 nF
C1
100 nF
R2
10.0
Q2IRFB9N65A
D4MURS360T3G
Power Board – Full Bridge – Gate Driver
Texas Instruments – 2012 Power Supply Design Seminar 2-20
Controller on secondary side needs MOSFET driver with galvanic isolation: • Low-side gate driver UCC27324 on secondary side drives single-ended transformer • Npn-pnp pair placed close to power MOSFET, eliminating influence of interconnect inductance and
enabling fast switching • Cost-effective, simple, reliable • High gate capacitance also applicable (higher power level)
SLUP301
Power Board – Full Bridge – Component Selection
Texas Instruments – 2012 Power Supply Design Seminar 2-21
Key points for maximum efficiency:
• Transformer: – Highest possible cross-section with the lowest possible core volume – Pot cores (RM and P) are well-suited and generate low EMI – Litz wire and single layer to minimize skin and proximity effect – Rule of thumb: 50% copper losses, 50% core losses – Epcos N97 RM core
• MOSFETs with moderate switching speed for primary side to prevent extremely high dV/dt (self-destruction, EMI) • Fast-switching MOSFETs for synchronous rectification
Infineon OptiMOS 3
• High-current storage choke with lowest DCR (flat wire) Coilcraft SERxxxx series
SLUP301
Channel 2: Leg (A,B), 200 V/divChannel 3: Leg (C,D), 200 V/divChannel F1: (A,B)-(C,D), 220 V/divTime Base: 2 µs/div
Leg CD Leg AB
AB-CD
C3
F1
Power Board – Full Bridge – Switching Waveforms
Texas Instruments – 2012 Power Supply Design Seminar 2-22 SLUP301
Channel 2: Output voltage AC coupled, 200 mV/div
250 mV peak-peak
Channel 4: Output current, 5 A/div
Time Base: 1 ms/div
Output Current
Vout AC
C4
C2
Power Board – Full Bridge – Transient Response
Texas Instruments – 2012 Power Supply Design Seminar 2-23 SLUP301
Power Board – Full Bridge – Control Loop
Texas Instruments – 2012 Power Supply Design Seminar 2-24
• Bandwidth: 25.2 kHz • Phase margin: 61 degrees • Gain margin: 15 dB
Frequency (k)300 300 k
1 k
Hz
Gain
(d
B)
-20
60
Ph
ase (
deg
)-1
80°
180°
-10 dB
-5 dB
0 dB
5 dB
10 dB
15 dB
20 dB
25 dB
30 dB
35 dB
50 dB
55 dB
-135 deg
-112.5 deg
-90 deg
-67.5 deg
-45 deg
-22.5 deg
0 deg
22.5 deg
45 deg
67.5 deg
90 deg
112.5 deg
135 deg
157.5 deg
5-Phase
5-Gain
10 k
Hz
100 k
Hz
SLUP301
Agenda
1. Specification and Overview
2. Power Board
3. ADC Card
4. MCU Card
5. Conclusion
Texas Instruments – 2012 Power Supply Design Seminar 2-25 SLUP301
ADC Card – Specification
Texas Instruments – 2012 Power Supply Design Seminar 2-26
Task: • Sense mains and PFC voltage and transfer to MCU card • Transfer CLK signal from MCU card to PFC controller Solution: • I2C for data transfer:
- Better noise and EMI immunity compared to an analog signal - ADC with I2C interface placed on primary side
• ISO7520/1 for galvanic isolation instead of optocoupler: - Speed (1 Mbps) - Aging - Thresholds - Isolation (5-kV rms reinforced)
SLUP301
PFC Voltage
Mains Voltage
CLK PFC
85-265 VAC
390 VDC
12- BitǻȈ ADC
350-W Power Supply
MCU
Card
Co
mm
on
-Mo
de F
ilte
r
ADC Card
SA74LVC1G17
OPA 2335
ADS 1015
ISO 7520
ISO 7521
SCL
SDA
Primary Secondary
CLK
I2C
Common-Mode Filter
370 at 100 MHz, 450-m DCR
ADC
Card
CLK
SCL (I2C)
SDA (I2C)
VCC
MCU
Card
ADC Card – Block Diagram
Texas Instruments – 2012 Power Supply Design Seminar 2-27 SLUP301
Agenda
1. Specification and Overview
2. Power Board
3. ADC Card
4. MCU Card
5. Conclusion
Texas Instruments – 2012 Power Supply Design Seminar 2-28 SLUP301
MCU Card – Human-Machine Interface
Texas Instruments – 2012 Power Supply Design Seminar 2-29
• Display: – Mains and PFC voltage – Output voltage and current – Heat sink and chassis temperature
• Control: – CLK for synchronization: PFC, full bridge, auxiliary supply
(Dithering with an MSP430™ MCU with higher PWM resolution possible) – PWM for setting the output voltage – Enabling of the full bridge
• Monitoring: – Disable output when a parameter is out of range
(Mains/PFC voltage, output voltage/current, temperature)
SLUP301
V
I
10 Bit
ADC
V
V 350-W Power Supply
ADC Card
Mains Voltage
PFC Voltage
Enable
PWM 1
Vout Adjustment
PWM 2
CLK
µController
MSP430F2252
USCI
JTAG
Digital I/ODigital I/O
Timer_A
Timer_B
Spy-Bi-Wire
DebuggingI2C Bus
Output Voltage
Output Current
LCD
2x 16
Push-Buttons
4x
Temperature
Chassis
Temperature
PFC, Full Bridge
MCU Card
MCU Card – Block Diagram
Texas Instruments – 2012 Power Supply Design Seminar 2-30 SLUP301
YES NO
Initialization
Read-Out
ADC Card
Analog Inputs
Push-Buttons
Check
Parameters
User Inputs? Update Display
Update Outputs
(PWM, Enable)
Process Input
Start
Update Display
Read-Out
Read-Out
MCU Card – Software
Texas Instruments – 2012 Power Supply Design Seminar 2-31 SLUP301
Texas Instruments – 2012 Power Supply Design Seminar 2-32
1. Specification and Overview
2. Power Board
3. ADC Card
4. MCU Card
5. Conclusion
Agenda
SLUP301
92.5
92.0
91.5
91.0
90.5
90.0
89.5
89.090 130 170 210 250
Effic
ienc
y (%
)AC Input Voltage (V)
FET AC Recifier Diode AC Rectifier
Eff
icie
ncy (
%)
230-VAC 110-VAC
Output Current (A)
94
90
86
82
78
74
70
66
62
0 5 10 15 20 25 30
Texas Instruments – 2012 Power Supply Design Seminar 2-33
Conclusion – Efficiency Plug-to-Plug
• 13.8 V at 25.0 A • 0.9% difference at 110-VAC operation • 0.3% difference at 230-VAC operation
• 13.8-V output voltage • 90.4% peak efficiency at 110-VAC • 92.2% peak efficiency at 230-VAC
SLUP301
80
70
60
50
40
30
20
10
0
-10
-20
Max/Ref Lv1
80 dBµV
0 dBµV
Marker 1 (T1)
51.00 dBµV
1.24704133 MHz
RBW
VBW
SWT
10 kHz
100 kHz
30 s
RF Att
Unit
10 dB
dBµV
Limit check:
Passed
1 MHz 10 MHz
1
A
SGL
1AP
F1
67DB
Center 2.121320344 MHz Span 29.85 MHz
Texas Instruments – 2012 Power Supply Design Seminar 2-34
Conclusion – Conducted Emission
• 230-VAC in, 13.8-VDC at 25-A load • PFC, full bridge and auxiliary supply running
SLUP301
+
-
OutputEMIF ilter
Universal Input85-265 VAC, 50/60 Hz
InputEMI
Filter
AC Rectifierwith
MOSFETs
InterleavedCCM PFCUCC28070
390 VDC Phase-ShiftedFull BridgePowerstage
Primary Secondary
L
N
PWM PWM PWM
PWM
PWM
High-SideGate Drive
Full Bridge
Current Sense
Gate Drive
Flyback Transformer
I2C
Synchronization
SEC AUX
Synchronization
AC AUX
PRI AUX
12-14 VDC25-A/30-A peak
SynchronousRectification
Phase-ShiftedFull BridgeControllerUCC28950
Out
put V
olta
ge S
ettin
g
Out
put V
olta
ge
Out
put C
urre
nt
MCU CardMSP430F2252
AuxiliaryPower Supply
UCC2813AC RectifierControl CircuitMSP430F2012
ADCCard
ISO7520ISO7521
Texas Instruments – 2012 Power Supply Design Seminar 2-35
Conclusion – System Block Diagram
SLUP301
Conclusion – System Block Overview
Au
x.
Su
pp
ly
Input EMI Filter
Phase-Shifted
Full Bridge
MCU Card
AC Rectifier
Interleaved CCM PFC
ADC Card
Output
EMI Filter
Texas Instruments – 2012 Power Supply Design Seminar 2-36
9.1 in. 230 mm
10.8 in. 275 mm
SLUP301
Conclusion – Summary
Texas Instruments – 2012 Power Supply Design Seminar 2-37
Input • Universal AC input voltage range 85-265-VAC, 50/60 Hz
Output • 12-14-VDC adjustable
• 25-A continuous, 30-A peak
• Ripple < 12 mVpp (at 20-MHz BW measured)
• Load step 2% to 100% with voltage deviation < 1%
Mechanics • Silent power = no forced air → Efficiency > 90%
• Slim line, maximum height < 2 in./50 mm
Extras • Hold-up time > 20 ms for harsh environments
• All converters synchronized to the same switching frequency → Switching frequency is selectable (170 kHz ± 10%)
• Full monitoring with MSP430™ microcontroller → Analog design with digital monitoring
SLUP301
Additional Resources
Texas Instruments – 2012 Power Supply Design Seminar 2-39
Interleaved PFC Topology • http://focus.ti.com/download/trng/docs/seminar/Topic5MO.pdf • http://www.ti.com/lit/an/slua479b/slua479b.pdf • http://www.ti.com/lit/an/slua369b/slua369b.pdf Phase-Shifted Full Bridge • http://www.ti.com/lit/an/slua560c/slua560c.pdf • http://www.ti.com/lit/an/slyt378/slyt378.pdf • http://www.ti.com/lit/an/slua107a/slua107a.pdf • http://www.ti.com/lit/ml/slup102/slup102.pdf Dithering • http://focus.ti.com/download/trng/docs/seminar/Topic_2_Rice_Gehrke_Segal.pdf Isolated I2C • http://www.ti.com/lit/an/slyt403/slyt403.pdf
Complete System • Search for “PMP5568” on TI.com (schematics, layout, software)
SLUP301
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B090712
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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Interface interface.ti.com Medical www.ti.com/medical
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Wireless Connectivity www.ti.com/wirelessconnectivity
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