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Design and Characterization of CMOS Inverter in Cadence: A Tutorial Mr. M. Tasleem Khan Mr. Harikrishna Veldandi Workshop on Instruction Enhancement Programme (IEP) 18-Apr-17 1

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Design and Characterization of CMOSInverter in Cadence: A Tutorial

Mr. M. Tasleem Khan Mr. Harikrishna Veldandi

Workshop on Instruction Enhancement Programme (IEP)

18-Apr-17 1

Outline

• Technology scaling

• CMOS Inverter Fundamentals

18-Apr-17 2

• Switching Threshold

• Noise Margins

• Propagation delays

• Power consumption

FINFET

SOI etc.

Moore’s Law is an observation that says the number of transistors on integrated circuits doubles every two years

A typical roadmap of Technology Scaling

Moore’s Law

18-Apr-17 3

Leakage currents

Goals of Technology Scaling

cheaper

faster

smaller

Lower power

• Double transistor density

• Reduce gate delay

• Reduce energy per transition

18-Apr-17 4

• Its all about designing the logic gates at transistor level so

that, it can be utilized in designs at algorithmic and

architectural levels.

• NAND and NOR are universal gates since they are readily

available in integrated-circuit form.

• The design analysis for NAND and NOR gates need

fundamentals of CMOS inverter.

• The objective of this presentation is to give gate level

design from transistor level perspective.

Digital IC Design

18-Apr-17 5

CMOS Inverter Fundamentals

• Voltage Transfer Characteristic

• Switching Threshold/Noise Margins

• Propagation Delay

• Transient Response

• Power Dissipation

Statics (deals with logic levels)

Dynamics (deals with timing)

18-Apr-17 6

Deals with both logic levels and timing)

Inverter Statics: Voltage Transfer CharacteristicsVDD

Vin Vout

CL

G S

D

D

G

S

Cutoff Linear Saturation

pMOS Vin -VDD= VGS> VT Vin -VDD=VGS< VT

Vin -Vout=VGD< VT

Vin -VDD=VGS> VT

Vin -Vout=VGD>VT

nMOS Vin = VGS< VT Vin =VGS> VT

Vin -Vout =VGD> VT

Vin =VGS> VT

Vin -Vout =VGD< VT

NMOS

PMOS

18-Apr-17 7

A typical VTC of inverter in 250 nm technology

00.5

1

1.52

2.5

0 0.5 1 1.5 2 2.5Vin (V)

Vo

ut(V

)

NMOS off

PMOS res

NMOS sat

PMOS res

NMOS sat

PMOS sat

NMOS res

PMOS sat NMOS res

PMOS off

• Curve characterizes CMOS inverter

1) What are the parameters that changes the shape

of this curve?

2) How does it affect the performance of inverter?

Impact of Process Variation and Supply Voltage

00.5

1

1.52

2.5

0 0.5 1 1.5 2 2.5Vin (V)

Vout(V

)

Nominal

Good PMOS

Bad NMOS

Bad PMOS

Good NMOS

Process variations (mostly) cause

a shift in the switching threshold

0

0.5

1

1.5

2

2.5

0 0.5 1 1.5 2 2.5

Vin (V)

Vout(V

)

Device threshold voltages

are kept (virtually) constant

Good transistor has smaller oxide thickness, smaller length, higher width and smaller threshold voltage; vice-versa for bad-transistor

0.8

0.9

1

1.1

1.2

1.3

1.4

1.5

0 1 10(W/L)p/(W/L)n (in semilog)

VM is relatively insensitive to variations in device

ratio, though it changes, for example, if ratios are 3,

2.5 and 2 then VM’s of 1.22V, 1.18V, and 1.13V

.1 ~3.4

-18

-16

-14

-12

-10

-8

-6

-4

-2

0

0 0.5 1 1.5 2Vin

(1+r)gain ----------------------------------

(VM-VTn-VDSATn/2)(n - p )

>>>determined technology parameters, especially and influence through VDD and VM

Variation of Switch Threshold and Gain

Noise Margins Determining VIH and VIL

0

1

2

3

VIL VIHVin

VOH = VDD

VM

By definition, VIH and VIL are

where dVout/dVin = -1 (= gain)

VOL =

GND

A piece-wise linear approximation of VTC

NMH = VDD - VIH

NML = VIL - GND

Approximating:

VIH = VM - VM /g

VIL = VM + (VDD - VM )/g

So high gain in the transition region is very

desirable

Dynamics of CMOS Inverter: Propagation delay

Propagation Delay, Tp: tpHL and tpLH always measured with respect to output and it

indicates how quickly output is affected by input.

•Measured between 50% transition from input to output

•Overall delay, tp, defined as the average of tpLH and tpHL i.e., (tpLH + tpHL)/2

tpHL

tpLH

t

t

Vin

Vout

50%

50%

tr

10%

90%

tf

Rise and fall time, Tr and Tf

•Defines slope of the signal

•Defined between the 10% and 90%

of the signal (affected by the

capacitance loads)

18-Apr-17 12

Switch Model: CMOS inverter

VDD

Rn

Vout

CL

Vin = V DD

VDD

Rp

Vout

CL

Vin = 0

Response time is determined by the time to charge CL through Rp (discharge CL

through Rn)

18-Apr-17 13

VDD

Vout

Vin = VDD

Ron

CL

tpHL = f(Ron.CL)

= 0.69 RonCL

t

Vout

VDD

RonCL

1

0.5

ln(0.5)

0.36

)/( LonCRt

OHout eVV

CMOS Inverter Propagation Delay

18-Apr-17 14

Tips to design a fast gate

•tpHL = f(Ron*CL)

•Keep output capacitance, CL, small

•low fan-out

•keep interconnections short (floor-plan your layout!)

•Decrease on-resistance, Ron ,of transistor

•increase W/L ratio

•make good contacts (slight effect)

18-Apr-17 15

A typical transient response of CMOS inverter

0 0.5 1 1.5 2 2.5

x 10-10

-0.5

0

0.5

1

1.5

2

2.5

3

t (sec)

Vout(V

)

tp = 0.69 CL (Reqn+Reqp)/2

tp

HL

tpL

H

18-Apr-17 16

Delay (tpHL) as a function of VDD and sizing

0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.41

1.5

2

2.5

3

3.5

4

4.5

5

5.5

VDD

(V)

t p(n

orm

alized)

2

2.2

2.4

2.6

2.8

3

3.2

3.4

3.6

3.8

1 3 5 7 9 11 13 15

self-loading effect (intrinsic

capacitance dominates)

Dimininshing return

18-Apr-17 17

PMOS/NMOS Ratio Effects

3

3.5

4

4.5

5

1 2 3 4 5

of 2.4 (= 31 k/13 k) gives

symmetrical response

of 1.9 gives optimal performance

= (W/Lp)/(W/Ln)

x 10-11

tpLH

tp

tpHL = aspect ratio of PMOS to aspect ratio of NMOS

Power Dissipation

• So far effect of input magnitude and timing of CMOS inverter

has been analyzed to design various paramters.

• How about combining both effects? It gives the birth of power

consumption in CMOS inverter.

• Power consumption determines heat dissipation and energy

consumption

Estimating power in CMOS requires different modeling!!!

18-Apr-17 19

Power Dissipation

•Power (in CMOS) = static power + dynamic power

•Dynamic power:

•(dis)charging capacitors

•temporary paths from VDD to VSS

•proportional to switching frequency

•Static power:

•static conductive paths between rails

•leakage

•increases with temperature

18-Apr-17 20

•Power consumption is related with propagation delay

•fast charge transfer => fast gate

•fast gate => more power consumption

Dynamic Power

Vin Vout

CL

Vdd

Energy/transition = C L * Vdd2

Power = Energy/transition * f = CL * Vdd2 * f

Need to reduce C L, Vdd , and f to reduce power.

Not a function of transistor sizes!

•No path exists between VDD and VSS in steady state

•No static power consumption! (ideally)

•Main reason why CMOS replaced NMOS

18-Apr-17 21

18-Apr-17 22

Thank You!!!

18-Apr-17 23

Switching Threshold

• VM where Vin = Vout (both PMOS and NMOS in saturation since VDS = VGS)

VM rVDD/(1 + r) where r = kpVDSATp/knVDSATn

• Switching threshold set by the ratio r, which compares the relative driving strengths of the PMOS and NMOS transistors

• Want VM = VDD/2 (to have comparable high and low noise margins), so want r 1

(W/L)p kn’VDSATn(VM-VTn-VDSATn/2)

(W/L)n kp’VDSATp(VDD-VM+VTp+VDSATp/2)=

18-Apr-17 24

Inverter Delay• Minimum length devices, L=0.25mm

• Assume that for WP = 2WN =2W

• same pull-up and pull-down currents

• approx. equal resistances RN = RP

• approx. equal rise tpLH and fall tpHL delays

• Analyze as an RC network

WNunit

Nunit

unit

PunitP RR

W

WR

W

WRR

11

tpHL = (ln 2) RNCL tpLH = (ln 2) RPCLDelay (D):

2W

W

unit

unit

gin CW

WC 3Load for the next stage:

18-Apr-17 25

Inverter with Load

Load (CL)

Delay

Assumptions: no load -> zero delay

CL

tp = k RWCL

RW

RW

Wunit = 1

k is a constant, equal to 0.69

18-Apr-17 26

Inverter with Load

Load

Delay

Cint CL

Delay = kRW(Cint + CL) = kRW Cint(1+ CL /Cint)

= Delay (Internal) + Delay (Load)

CN = Cunit

CP = 2Cunit

2W

W

18-Apr-17 27

Inverter Transient Response

-0.5

0

0.5

1

1.5

2

2.5

3

0 0.5 1 1.5 2 2.5

VDD=2.5V

0.25mm

W/Ln = 1.5

W/Lp = 4.5

Reqn= 13 k ( 1.5)

Reqp= 31 k ( 4.5)

tpHL = 36 psec

tpLH = 29 psec

so

tp = 32.5 psec

Vin

t (sec) x 10-10

tf trtpHL tpLH

From simulation: tpHL = 39.9 psec and tpLH = 31.7 psec

CMOS Inverter

CMOS NAND GateRing Oscillator

Design steps of CMOS Inverter

1. Plot the transient response of inverter with a minimum size of transistor

For 180 µm Technology Wn=Wp = 0.24 µm and Ln = Lp = 0.18 µm

2. Calculate the rise time (tr) and fall time (tf) of inverter and find the ratio (K)

3. Then size Wn = 0.24 µm, Wp = K Wn µm,

r

f

tK

t

Objective: Rise time and fall time of inverter should be the same and load CL= 5pF

1

2 p

fnT

Oscillation frequency of Ring Oscillator

35.53.27 3.3

10.83

r

f

t nK K

t n

Thank You!!!