design of a peltier-based sealing device for rapid and ... · 29634, usa. 3. chemistry institute,...
TRANSCRIPT
Design of a Peltier-Based Sealing Device for Rapid and Effective Production of Polymer
Microchips
Thomas P. Remcho,1 Carlos D. Garcia,2 José Alberto Fracassi da Silva3
1. University of Virginia, Charlottesville, VA, USA. 2. Department of Chemistry, Clemson University, South Carolina, 29634, USA. 3. Chemistry Institute, State University of Campinas, UNICAMP, 13083-970, Campinas, SP, Brazil. Email: [email protected] [email protected] [email protected].
Develop a novel platform for thermal bonding uses a pair of identical Peltier elements. The substrates to be bonded are placed between the Peltier´s plates and the bundle is gently pressed in a small press was designed and built for the purpose of applying even pressure and allowing the device to become more self-contained.
Objetives
Background Setup
Conclusions Results
http://www.reuk.co.uk/wordpress/thermoelectric/what-is-a-peltier-cooler/
https://en.wikipedia.org/wiki/File:Peltier_(detail)_LMB.png
https://en.wikipedia.org/wiki/Thermoelectric_cooling
In a Peltier (Thermoelectric) device, a heat flow appears on the junction of a semiconductor when a electric current is applied. This effect has been extensively applied in cooler devices. Some popular examples of use are the portable refrigerators and CPU coolers.
DC POWER SUPPLY
6.2 V @ 3.2 A
40.6 oC
Aluminum block
Thermoelectric device
Microchip to be sealed
Microchip Fabrication
CO2 Laser engraving Poly(methyl methacrylate) (PMMA) substrates
Acknowledgements
0 100 200 300 400 500 600 700
0
10
20
30
40
50
60
70
80
T (
o C
)
time (s)
Model Log3P1
Equation y = a - b*ln(x+c)
Reduced
Chi-Sqr
0.3171
Adj. R-Square 0.99532
Value Standard Error
B a 18.38486 2.71788
B b -9.38965 0.48673
B c -11.4878 3.13299
Model Log3P1
Equation y = a - b*ln(x+c)
Reduced Chi-Sqr
1.64825
Adj. R-Square 0.99164
Value Standard Error
B a 78.6336 3.31777
B b 9.48265 0.65646
B c -358.19974 0.61964
6.2 V @ 3.2 A
0 100 200 300 400 500 600 700
0
10
20
30
40
50
60
70
80
Serie 1 Serie 2 Serie 3
T (
o C
)
time (s)
Repeatability data
PMMA microchips
PMMA microchips with copper integrated electrodes (PCB copper electrodes can also be prepared)
CHECK IT OUT !
By using two Peltier devices we were able to seal PMMA devices. Copper electrodes could also be embedded. The maximum temperature we measured was about 105 oC for the 4 A, 4x4 cm Peltier. Care must be taken to not damage the devices (solder points can melt at higher temperatures). Pressure applied to the bundle have also to be controlled, since the ceramic plate of the Peltier device can crack during the process. Some features of this approach are: Ramp temperature control Highly homogeneous sealing Low power consumption (about 20 W) Rapid heat and cool times (fast cooling can be obtained by
reversing the applied current Can be applied to any thermoplastic with some adaptations Allow integration of copper electrodes Large areas can be sealed by coupling more Peltier devices.
Thermocouple