design requirements for automotive reliability

1

Robert BOSCH GmbH, Automotive Electronics

AE/EIP | 7/8/2006 | © Robert Bosch GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third parties.

Automotive Electronics

Design Requirements for Automotive Reliability

Valentin von TilsDirector Platform Development ASICs

ESSDERC 2006,Montreux, SwitzerlandSeptember 22, 2006

2 AE/EIP | 7/8/2006 | © Robert Bosch GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third parties.



Automotive Electronics in German Newspapers (2003)

3




Outline

Journey from Yesterdays Vision to Today‘s World

Requirements for Future Systems

Expected Market Trends

Reliability Trends

Impact on Power Semiconductors

Summary

4




1960: Vision

“The development of semiconductors is just at the beginning…

Using semiconductors, ideas like electronic gasoline injection as well as control systems that allow steering, accelerating and braking through a small control stick, orsteering systems that guide the car automatically on the road, or radar units that show obstacleseven in dense fog, as well as some others, can become reality…

Electronics is starting to change and to improve the electric vehicle system and is thus adding increased safety to the car.”

source: R. Bosch GmbH, Dr. Callsen, „The Importance of Semiconductors for the Electrical Vehicle Equipment“. FISITA congress, 1960.

5




Automotive Electronic Yesterday ...

6


Semiconductor History 20th Century

Silicon DiodeMass Production

ICDevelopment

60‘s50‘s


Germanium Diode

Development&

Start of MassProduction

70‘s

ICMass Production

MOS-ICDevelopment


Pressure SensorsMikro Mechanical

6“-Wafer FabOpening

90‘s80‘s

MOS-ICMass Production

Opening of MicroElectronics

Technical Center

50 years ofAutomotive Experience

7


Milestones of automotive technology

1897 1902 1951 1967 1976

Low-voltage magneto ignition for vehicles

High-voltage magneto ignition with spark plugs

Diesel injection pump

Gasoline injection pump for cars

Electronic gasoline injection (Jetronic)

Lambda sensor for three-way catalytic converter

Antilock braking system (ABS)

1927


1978


1933

Acquisition of Ideal-Werke, today's Blaupunkt GmbH

8


Milestones of automotive technology

1991 1995 1997 2001 2002

Combined digital control of gasoline injection and ignition (Motronic)

• Electronic stability program (ESP) • Vehicle navigation system with voice guidance

Common-rail high-pressure injection system for diesel engines

Electrohydraulic brake

Electronic battery management (EBM)

• Electronic diesel injection (EDC)• Traction control system (TCS)

Controller Area Network (CAN)

Third generation common-rail technology, with piezo in-line injectors

1979 1986


2003





EngineManagement

Emission control

Interior Sensing

Traction Control System

Chassis Control

Anti-lock Braking System

Electronic Stability Program

Airbag electronics, safety belts,over-roll Bar

Cruise Control

Navigation Park-Pilot

Electronic power steering

ca. 30 electric/electronic systems,50-100 micro processors,

>100 sensors within modern mid-size cars

10




Traffic Density vs. Car Safety

Seat-Belts

Airbag Side-Airbag ESP

ABS

Sources: “Statistisches Bundesamt“ and Bosch

% Change (1970 = 100%)

0%

50%

100%

150%

200%

250%

300%

1970 1975 1980 1985 1990 1995 2000 2005

Traffic DensityTotal AccidentsInjuredKilled

11




Reduction of Pollution (caused by cars)

all numbers = limit values in g/km

100

100

100

1990 1995 2000 2005CO0

50

50

50

0

21,2ECE R15/04

2,72 1,0 0,64 0,50

97% 98%

EU1

EU30,196

0,140,10

0,05 0,025EU4Particles

EU2

State-of-the-art2004

81% 91%

5,8ECE R15/04

1,36 0,97 0,90 0,56 0,300

90% 95%

HC + NOX

0,2788/436/

EEC

%

12




Reduction of Fuel Consumption

6,0

6,5

7,0

7,5

8,0

8,5

9,0

9,5

10,0

10,5

11,0

1978

1980

1982

1984

1986

1988

1990

1992

1994

1996

1998

2000

2002

1/3-MixNEFZ

Fuel

cons

umpt

ion

[l/10

0km

]

Catalyser Diesel DIE-Gas

Common Rail

BDE

Source: VDA

35%

13




„Intelligent Vehicle“

Airb

agSy

stem

Therm.

System

Kinetics

internal

data

Environ

ment

Position

Tele-maticInfo.

Engine

Brake

System

Steering

System

Trans-missionElectr.System

VehicleFunctions

"IntelligentSensors"

"IntelligentActuators"

HumanMachineInterface

Mon

itorin

g

Fusi

on,

Con

solid

atio

n

Coordination

14




Outline

Journey from Yesterdays Vision to Today’s World



Reliability Trends

Impact on Power Semiconductor

Summary

15




The Future of Automotive Electronics

“The number of ECUs in the car will decrease ?“Answers of the car manufacturers: The number of ECUs will decrease does not mean: The functionality given by electronics will decrease!

Means:Number of ECUs may decrease in order to

Manage the complex electronic systemReduce the number of failure sourcesMake the system more reliableLimit the cost

16

Automotive Electronics Roadmap Design Requirements for Automotive Reliability

Components with Electronic

System-Integration


Networking of ECUs

Networking of Cars and Environment

1980 1990


2000 2010

Safety, Environment, Fun & Comfort

Digital Systems, Integration, Networking

17




In-car orsmall distance

Cell Phone

Broadcast (terrestr.)Satellite Broadcast

Networking with Environment

BluetoothW-LAN

GSM/UTMSModule

CarRadioModuleServices

platform

18




The next big step: „The sensitive vehicle“

Combination ofintelligent surroundsensors with activeand passivesafety systems

Contribution to reducefatalities by 50% (EU e-safety goal)

19




Integrated Vision System: Applications NightVision

Lane Detection

Object Detection Road Sign Recognition

20




Challenges for Automotive Electronics

Convergence of Systems- new functions often require networking of different systems- systems accessible from outside (wireless)- need to integrate subsystems of different suppliers

How to keep vehicles – despite their increasing electronics content –affordable for the consumer ?

How to assure extended lifetime reliability and availability of the vehicles despite the underlying very complex electronic systems ?




Industrial

-10°C 70°C

5-10 years

environment

<< 1%

conditional

up to 5 years

Automotive

-40°C 85/155°C

up to 15 years

0% up to 100%

target: zero failure

true

up to 30 years

Consumer

0°C 40°C

1-3 years

low

< 10%

none

none

Requirements on Automotive Semiconductors

Parameter

temperature

operation time

humidity

tolerated fieldfailure rates

documentation

supply

22

Increasing Temperature Requirements

150

Am

bien

t Tem

pera

ture

50

Automotive

Consumer

125°C

20041996 2012

C°

1992 2000 2008

Drivers:

rising temperatures under the hood

rising power dissipationof microcontrollers

rising control units‘ loads

higher component integration into smallerpackages

more applications indifficult locations




23

1995 2005 2010

Silicon insideof the actuators

Tj < 210°C

0

500

1000

1500

2000

2500

3000

oper

atin

g lif

e tim

e (h

)

130 150 170 190 210temperature (°C)

Silicon separateof the actuators

Tj < 150°C

Silicon adjacentto the actuators

Tj < 175°C


Temperature requirements for automotive semiconductors



24

Operating Conditions for Automotive Control Units

20

40

60

0 20 40 60 80

Env

ironm

enta

l Tem

pera

ture

PCB

PCB on Metal µ Hybrid

application

80

100

120

°C

140

160

EM

PECU

ABS/ESP

EPS

TC


Potential

EM


Peak Acceleration g(Sinus)


EM = Engine Management, TC = Transmission Control,EPS = Electrical Power Steering, PECU = Pump Electronic Control Unit

25

Intelligent Actuator: Control Unit for Electrical Power Steering (EPS)



Features:

Compact designusing automotive specificLTCC and DBC technologiestemperatures up to 125°Ccurrent up to 100 A mounting direct at the steering gearacceleration (shock) up to 40 g


26




Outline




Reliability Trends


Summary

27




1976 1978 19801982 1984 19861988 1990 19921994 1996 19982000 2002

Lambda Sens. ABS Airbag Navigation E-GAS

Diesel DI Xenon ESP BDE Climate Control%

Automotive Electronics: Installation Rates (WEU)



Automotive Electronic Sales by Region

10

20

30

40

50

60

70

Bill

ions

of D

olla

rsDesign Requirements for Automotive Reliability

30.1

37.039.6

43.245.9

48.851.9

55.659.6

64.0

'03 '04 '05 '06 '07 '08 '09 '10 '11 '12

Part of Total CAGR2003 2012 ‘03/’12

Asia/Pac 12% 21% 12.3%

Europe 36% 39% 7.8%

Japan 25% 21% 4.1%

Americas 27% 19% 4.9%

World total 7.1%

Source: Bosch



Automotive Semiconductor Sales by Region


13,7

17,018,4

20,422,1

24,126,2

28,631,3

34,2

5

10

15

20

25

30

35

40

Bill

ions

of D

olla

rs

'03 '04 '05 '06 '07 '08 '09 '10 '11 '12

Part of Total CAGR2003 2012 ‘03/’12

Asia/Pac 8% 22% 14.9%

Europe 39% 41% 9.8%

Japan 19% 18% 5.8%

Americas 34% 19% 6.5%

World total 9.6%

Source: Bosch

30




Outline




Reliability Trends


Summary

31




Reliability RequirementsReliability = (1 - probability of a failure) per electronic device- at 0 km- in the field over a given period of time

Increasing realibility demands due to higher usage of electronicdevices in vehicles

Car industry requirement:

For each ECU: 0-km and field failure rates < 10 ppm/year

Derived requirement:

for each component: 0-km and field failure rates < 1 ppm/year

32




How to reach reliability against early failuresAssignment and control of ppm limits for each step of the value creation chain:

Assignment and control of ppm limits for each electronic component depending on its complexity

Agreement with all suppliers about ppm limits

Application of systematic in-process quality assurance measures throughout the value creation chain

Intensive “quality mindset” training of all employees

Tight control of failure rate development - regularly followed with high management attention

33

Breakdown of ECU ppm reliability requirementsDesign Requirements for Automotive Reliability



ECU -failure

faulty design/SW „Mass production failure“

/ bad materialElectronic

components (EC)ECU plant Logistics

EC mech..+EC-Logistics

0

0

10

3

7

0

µC ASIC Flash R MLCCInductors...0,5 0,2 0,02 0 00,1

ASIC0,2

(simplified, example values)

7

0-Defect will be the game of the future. And this will be judged by the

customer only.

34




Reliability against Aging Failures:Operating Conditions of Automotive Electronics

Thermal: operating temperature rangenumber and stroke of temperature cycles over lifetime

Mechanical:vibration load – peak mechanical accelerations

Climate/Environment:humidity and corrosive substances (salt, fluids, vapors…)

Σ vehicle application dependent

35




Systematic Design for ReliabilityDefinition of technology, design and components for the application

(1) Describe known failure mechanisms bymathematical models using parametersfrom prior end-of-life testing

(2) Determine the real-life, applicationspecific “load profiles” from vehicletesting

(3) Simulate the field reliabilityusing the failure models (1) andthe real-life load profiles (2)

Verification of technology, design and components for the application

(4) Define (shortened) release test profilesusing physical failure models (1) andapplication load profiles (2)

(5) Perform release testing forconfirmation of the life-timereliability of the design

(6) Do additional end-of-life testingfor further design confirmationand verification / improvementof failure models.

36




Outline




Reliability Trends


Summary




Die Kraft der Luft

Wiper

Injectors

Active ValveAdjustment

Active Steering

MirrowAdjustment

Seat Position Control

Window Lifter

ActiveSuspension

ConvertibleRoof

Rear WindowDefroster

SunroofAir Condition

Throttle regulation

Adaptive Front Light

Fan Control

38




Impact on Power Semiconductors

Power Semiconductors are used in safety critical applications(i. e.: x-by-wire)

RequiredContinuous control of parameters, that show critical operation conditions:voltage, current, temperatureOn site / attached control logic to ensure safe operation

39




µC +Speicher

Peripherie Perip

herie

StellerSensoren

Sign

al-

Auf

bere

itung

µC +Speicher

Peripherie Perip

herie

StellerSensoren

Sign

al-

Auf

bere

itung

µC +Memory

Peripherals

Bus Bus

Actuator

Power

Control

Domain based systems architecture

Sensor

Sign

al-

Con

ditio

ning

standard components

Intelligent SatelliteSensors

Intelligent Satellite

Actuators

Central Domain ECU

Inter Domain Bus

automotive specific semiconductor solutions (ASSP, SoC, ASIC, MEMS)

Peripherals

40




Control Circuitry in High End Ignitor (SoC)

B

CurrentControl

Over voltageFlag

Driver-Stage

OverheatProtection

Voltageclamping

C

E

Vfl

OverheatLimiter

CurrentFlag

Ifl

41

Current Regulator and TolerancesDesign Requirements for Automotive Reliability



Standard Solution Current Regulator:

2. Signal Processing• Offset• CMRR (Common Mode Rejection Ratio)• Gain• Anti Aliasing Filter (Nyquist –Criteria)

3. A/D Converter• Quantization Error/ Noise• Gain Error due to Reference

1. Shunt• Tolerance %• Tolerance Tk

4. Controller• Quantization Error

actual Value

Set Value

T1

Load

Signalprocessing

U+

µc

A/DConverter

DriverUnit

Reference

Udiff

Ucm

RShunt

Udiff + CMMR * Ucm

42

CG208: Fully integrated Low Side Current RegulatorDesign Requirements for Automotive Reliability



Application: High precision low cost current regulator for e.g. transmission control valves

Features: • Dual channel current regulator • Temperature monitor • Fully integrated current controllers

• Low Side power switches • Integrated shunts and • Free wheeling diodes

• Current range up to 1,2A • High accuracy (∆I < 1%) • SPI controlled load current • SPI controlled dither ampl. and freq. • SPI controlled loop characteristics • Fault detection and protection (additional load and µc clock monitor)

ASIC Name: CG208 SOP: Jan. 2007 Package: Bare die, TQFP_ePad44 Process: BCD4S

43




Outline




Reliability Trends


Summary

44




Summary

The trend towards more comfort and more safety will continue.Customer expectations and legal requirements will require “fault tolerant” systems.Diagnostic capability will be mandatory for future electronic systems.Intelligent, redundant systems have to be developed.

45




Thank you!

design requirements for automotive reliability

Documents