designing for system scalability from 622 mbps to 6.25 gbps
TRANSCRIPT
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Designing for System Scalability From 622 Mbps to 6.25 GbpsTeradyne Connection SystemsGautam Patel
RDC ConsultingRobert Cutler
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AgendaRoutingMaintaining Differential ImpedanceAnti-Pad Shape & ResonanceBoard Material ConsiderationsUse of Back-DrillingConnector Selection
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Implementation is the KeyMany Implementations That Function Acceptably at 622 Mbps Have Problems at 6.25 GbpsConsiderations Include:− Differential Trace Geometry
Stripline vs. MicrostripNeckdowns
− Maintaining Differential Impedance− Anti-Pad Shape & Resonance− Board Material Considerations− Use of Back-Drilling
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Use of Microstrip Surface Layers
Microstrip Is Lossier Than Comparable StriplineMicrostrip Exhibits More Phase Dispersion Due to Differing Dielectrics− Board Material & Air
Microstrip Typically Requires ~10 w Spacing Between Pairs to Keep Coupled Noise <0.5%622 Mbps Signaling Could Tolerate More Noise, but at 6.25 Gbps, S/N Ratio Much More CriticalStripline Preferred at 6.25 Gbps
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10W Spacing is Very InefficientA typical case involves 6 mil traces. Spacing to adjacent signals needs to be at least 50 mils.
FR4FR4
Not to scale!
> 50 6 > 50 6 > 50
Layer 2 ground planeLayer 2 ground plane
6.25G Diff Pair6.25G Diff Pair4
FR4 Surface FR4 Surface MicrostripMicrostrip StructureStructure
2
Adjacent signal
Adjacent signal
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Typical Microstrip Implementation at 622 Mbps
31-Mil Spacing Between Pairs (6.5/10.5/6.5) Means Noise in Excess of 1.5%. (This is maximum backward crosstalk per a 2-D field solver).
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Trace Neckdowns in BGA Pin Field Many CAD Designers Will Neck Down a Differential Pair in the BGA Pin Field to Accomplish Two-Track Routing
Significant Impedance Mismatch If Not Implemented Properly
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Typical Neckdown at 622 Mbps Does Not Compensate for Impedance
3.75/7.25/3.75 Pair = 100Ω
3.75/4/3.75 Pair = 88Ω
3.75/4/3.75
3.75/7.25/3.75
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“Closely Coupled” Pairs Must be Handled Properly
Closely-Coupled Differential Pair Must Maintain a Constant Space Between the P & N TracesIf Spacing Changes, So Does Differential ImpedanceAt 622 Mbps, Impedance Variation Can Typically Be Tolerated At 6.25 Gbps, Impedance Changes Will Degrade Signals Significantly
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Typical Problem With Closely Coupled Pair
Trace Separates Around Pad
ZDIFF Increases
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Pairs in Proximity to PWR/GND IslandsIn Many Designs, a Trace Pair Is Routed in Close Proximity to a Power or Ground IslandIt Is Critical That Spacing Between the Pair & Island Is Sufficient to Ensure That Differential Impedance Is Not Altered by the Effect of the Island
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Typical Pair Routed Rear PWR/GND Island
Island Is Too Close to Trace Pair—Must Be at Least 20 Mils
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Closely Coupled Pairs & SMAs
If a Closely Coupled Pair Splits to SMAs, Differential Impedance Will Increase SignificantlyTraces Should Widen After Split to Achieve a 50ω Single-Ended Impedance Thus, Differential Impedance in Both Sections Will Be 100ω
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Closely Coupled Pair Splits to SMA Connectors
Traces Must Widen to 50ΩSE After the
Split to Maintain Impedance
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Anti-Pad Shape at 6.25 Gbps is CriticalConnector Anti-Pads Are Not Critical at 622 Mbps At 6.25 Gbps, the Plated Through Hole Impedance, Return Loss & Resonance Will Significantly Impact Overall Signal IntegrityExpanded Anti-Pads Are Recommended for High-Performance Differential Connectors− Higher Resonant Frequency− Less Capacitance− Improved Return Loss
Removal of Non-Functional Pads Is Critical at 6.25 Gbps
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Typical GbX Anti-Pad Design at 622 Mbps
Round Anti-Pads Around Each Pin Degrades Performance
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Measured Resonance of Anti-Pad Diameters Need better legend
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GbX Recommended Expanded Anti-Pad
Anti-Pad44 mils
Pad36 mils
TERADYNE GbX ANTI-PAD
35 mils
Covered by Teradyne Patent!
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Simulated Resonance for Different Anti-Pads
Round Via With “Non-Functional”Pads in Place
“Ovalized”Anti-Pad & Non-Functional Pads RemovedRound Via With
“Non-Functional”Pads Removed
Highest resonance is preferred
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Board Material Considerations FR4 May Or May Not Be Acceptable at 6.25 Gbps Factors to Consider Are:− Link Lengths− Trace Widths− Connector Interfaces− Board Thickness & Via Stub Issues− S/N Ratio Required− Device Parameters: Pre-Emphasis,
Equalization, Input Sensitivity, Etc.
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6.25-Gbps Eye-Pattern Over 12" of FR4 & N4000-13SI & 2 GbX Connectors
FR4 N4000-13SIMeasurements Taken With a Min Stub
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S-Parameter Measurements of GbX Over Various Lengths W/ Min Stub Over N4000-13SI
GbX Min stub over N4000-13SI
-70
-60
-50
-40
-30
-20
-10
050 500
950
1400
1850
2300
2750
3200
3650
4100
4550
5000
5450
5900
6350
6800
7250
7700
8150
8600
9050
9500
9950
1040
0
1085
0
1130
0
1175
0
1220
0
1265
0
1310
0
1355
0
1400
0
1445
0
1490
0
Frequency(MHz)
SDD
12 (d
B) 12in
24in30in36in
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S-Parameter Measurements of GbX Over Various Lengths W/ Min Stub Over FR4
SDD12 GbX min stub over FR4
-140
-120
-100
-80
-60
-40
-20
0
50 500
950
1400
1850
2300
2750
3200
3650
4100
4550
5000
5450
5900
6350
6800
7250
7700
8150
8600
9050
9500
9950
1040
0
1085
0
1130
0
1175
0
1220
0
1265
0
1310
0
1355
0
1400
0
1445
0
1490
0
Frequency (MHz)
SDD
12 (d
B) 12in
24in30in36in
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Loss Summary of FR4 & N4000-13SI
Length FR4 N4000-13SI Length FR4 N4000-13SI12in(305mm) min stub -4.9 -4.11 12in(305mm) min stub -8.58 -7.3812in(305mm) max stub -4.63 -4.73 12in(305mm) max stub -22.43 -17.0124in(610mm) min stub -8.07 -5.76 24in(610mm) min stub -13.49 -9.8424in(610mm) max stub -8.84 -5.77 24in(610mm) max stub -25.64 -20.0430in(761mm) min stub -10.1 -6.83 30in(761mm) min stub -16.04 -11.330in(761mm) max stub -10.8 -6.92 30in(761mm) max stub -29.3 -20.9136in(914mm) min stub -11.39 -8.09 36in(914mm) min stub -18.39 -12.6336in(914mm) max stub -12.36 -8.15 36in(914mm) max stub -30.62 -21.29
Length FR4 N4000-13SI12in(305mm) min stub -14.84 -13.1612in(305mm) max stub -21.66 -24.7424in(610mm) min stub -24.65 -17.3524in(610mm) max stub -33.97 -32.6730in(761mm) min stub -28.92 -20.1730in(761mm) max stub -39.09 -34.5736in(914mm) min stub -33.94 -22.6636in(914mm) max stub -43.32 -39.02
Freq. = 3.125GHzFreq. = 1.625GHz
Freq. = 6.25GHz
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25© 2005
Laminate Cost Factor By Material Type
0123456
FR4FR4 H
i Tg
Turbo
Megtro
nN40
00-13
Getek
IS 620
N4000-
13 SI
Polyimide
N6000
LD 621
Tacpreg
N6000-
SIGete
k 2 TLX
R4350
PWB Price Ratio by Material Type
0.81.01.21.41.61.82.0
FR4
FR4 Hi T
gTu
rboMeg
tron
N4000-
13Gete
kIS 62
0N40
00-13
SIPolyim
ideN60
00LD 62
1Tacp
regN60
00-SI
Getek 2 TL
X R43
50
Material & PWB Costs by Material Type
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Back-Drilling Not Required at 622 Mbps
Back-Drilling the Backplane Is Not Required at 622 Mbps Via Effects at 322 Mbps Are Typically Not SevereAt 6.25 Gbps, Back-Drilling Will Significantly Improve Eye Integrity
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Stubs Add Delay & Rise-Time Degradation
62ps
77ps
99ps
80%
20%
50%
PTH Stub Tr (ps) (20-80%) Delay (ps)Trace Only 123 Reference15 mil Stub 124 6265 mil Stub 131 77
Full 225 mil Stub 169 99
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Frequency Domain Analysis of a Plated Through Hole (Resonant Structure)
Bottom Signal Layer
Top Signal Layer
Top Signal Layer
Bottom Signal Layer
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3.125 Gbps Example
Ff
.22" (5.6 mm)Stub
Reference Trace
.090" (2.3mm) Stub
7.0 dB1.2dB
1.2 dB0.5 dB
3.0 GHz1.5 GHz
Delta From Reference
Stub Depth0.090" (2.3 mm)0.220" (5.6 mm)
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Backdrilling, A Solution to the Stub Effect
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S21 of Back-Drilled BackplaneVia Stub About 72-Mils Long in 300-Mil Thick BackplaneResonant “Notch”Increases in Frequency to>8 GHz—Well Beyond Frequencies of Interest
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Frequency Domain Analysis of Back-Drill Depths at 0.5mm Intervals
4.5mm0.180"
2.5mm0.100"
Stub Depth
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Max Stub (4.5 mm) Min Stub (0.5 mm)
Stub-Effect Eye Pattern Analysis 2.5 Gbps FR-4 Over 12" (305 mm), NO Connector
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Stub Effect Eye Pattern Analysis 5.0 Gbps FR-4 over 12" (305 mm), NO Connector
Max Stub (4.5 mm) Min Stub (0.5 mm)
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Stub Effect Eye Pattern Analysis 12.0 Gbps FR-4 Over 12" (305 mm), NO Connector
Max Stub (4.5 mm) Min Stub (0.5 mm)
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36© 2005
S-Parameter Measurements of GbX Over Various Lengths W/ Max Stub Over N4000-13SI
SDD12 of GbX Max Stub N4000-13SI
-90
-80
-70
-60
-50
-40
-30
-20
-10
050 500
950
1400
1850
2300
2750
3200
3650
4100
4550
5000
5450
5900
6350
6800
7250
7700
8150
8600
9050
9500
9950
1040
0
1085
0
1130
0
1175
0
1220
0
1265
0
1310
0
1355
0
1400
0
1445
0
1490
0
Frequency (MHz)
SDD
12 (d
B) 12in
24in30in36in
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6.25 Gbps Eye-Pattern Over 24" of N4000-13SI & 2 GbX Connectors
Min Stub ~0.22" stub
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Teradyne Back Drilling Experience
Reliability− Extensive Telcordia Testing for 20 Year
Service Life Indicated No Adverse Effect on Compliant Pin Gas Tight Interface
− Additional Testing Beyond Telcordia Could Not Make It Fail
Negligible Effect on Yield
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7.5
8
8.5
9
9.5
10
10.5
11
11.5
12
12.5
First-I Second-I Third-I First-R Second-R Third-R
Forc
e, lb
s
Telcordia Group 1 Results: Compliant Pin Insertion-RetentionCompliant Pin Performance Testing Shows No Adverse Effects on the Back Drilled Hole After 3 Insertions & Retentions
88 Insertion Data Points66 Retention Data Points
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Assumes All Boards Are FR-4 Material
Back-Drilling Costing Examples
9%7%6%Back-Drilling Cost Increase %
$30$500
00
50020
0.250Example 1
$140$50Back-Drilling Charge$1500$750Rough PWB Price10000Depth 3 / Hole Count
Example 3Example 2
2000500Depth 2 / Hole Count30001000Depth 1 / Hole Count4030Layer Count
0.3500.300PWB ThicknessAttribute
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Connector SelectionConnector Performance Requirements for 622 Mbps Are Vastly Different Than for 6.25 GbpsAt 622 Mbps, Risetime of the Signal Is Around
1 ns, Which Typically Exceeds the Electrical Length of the ConnectorConnector Crosstalk & Reflections Become a
Much Larger Issue at 6.25 Gbps Than at 622 Mbps—This Needs to Be Considered When Making a Connector Selection
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Connector Selection
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Connector Selection• Crosstalk Will Also Become An Issue at 6.25-Gbps Data Rates• Unfortunately, a Connector That Had Acceptable Performance at 622 Mbps May Be Inadequate at 6.25 Gbps
Differential Backward X-talkRow 100ps 1nsAB 4.40% 0.70%CD 4.50% 0.90%EF 4.20% 1.00%GH 4.10% 0.80%
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Connector Selection• Ideally, Choose a Connector Family That Is Flexible, Cost Effective & Has the Performance Desired at Both High & Low Speeds• A Connector Family That Offers Density, Performance & the Ability to Mix & Match Low- & High-Speed Signals Is Preferred
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Hybrid Connector Solution
Design Any Combination of the VHDM® Product Family on One Stiffener to Create a Customized Board Slot− VHDM L-Series: Optimized
Solution for Low-Speed Connections
− VHDM: For Single-Ended, High-Density Connections
− VHDM H-Series: High-Density, High-Speed With Greater Signal Integrity
− VHDM-HSD™: For High-Speed Differential Signals
Optimize Cost & Performance Within a Single Connector
VHDM L-Series
VHDM
VHDM H-Series
VHDM-HSD
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SummaryImplementation Is the Key to System ScalabilityBack-Drilling Provides Best Cost/Performance Balance & Has Become Accepted Practice Due to Its High ReliabilityFlexibility Within a Connector Family to Allow for Both High- & Low-Speed Signals
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Teradyne Connection SystemsResources
Complete Product Libraries on Our Website at www.teradyne.com/tcs− High-Speed, High-Density Connectors− High-Performance Circuits− Backplane Systems
White Papers− Practical Guidelines for the Implementation of Back
Drilling Plated Through Hole Vias in Multi-Gigabit Board Applicationsby Tom Cohen, Teradyne Connection Systems