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development kit...bmc connector with sm bus, i2c, lpc, 1x usb 2.0, 1x pci-e x1, ncsi signals 4 x gpi...

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  • Development Kit...BMC connector with SM Bus, I2C, LPC, 1x USB 2.0, 1x PCI-e x1, NCSI signals 4 x GPI + 4 x GPO pin header (interface multiplexed with µSD slot) SPI Flash Socket Button
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Information subject to change. Please visit www.seco.com to find the latest version of this datasheet www.seco.com Development Kit COM Express ™ The Development Kit contains the following material: CCOMe-C79 Carrier Board GPIO Header adapter cable (Free wires on one extremity) 2x Serial Adapter Cables 1x SATA cable Standard OCP module (10GBE) Front Panel module V995 with connecting cables Module not included. Must be purchased separately Mass Storage 2x S-ATA 7p M connectors µSD Card slot (interface multiplexed with GPIO header) Networking 1x GbEthernet RJ-45 connector 4x 10Gbase-KR interfaces on OCP Type-C connector 4x MDIO I2C interfaces on internal pin header 4x SDP interfaces on SMA RF connectors USB 4x USB 3.1 Host ports on Dual Type-A sockets PCI-e 2x PCI-e x4 Slots 1x PCI-e x8 Slot 1x PCI-e x16 Slot Serial Ports 2 x RS-232 ports on dedicated pin header (from module) Other Interfaces BMC connector with SM Bus, I2C, LPC, 1x USB 2.0, 1x PCI-e x1, NCSI signals 4 x GPI + 4 x GPO pin header (interface multiplexed with µSD slot) SPI Flash Socket Button / LEDs front panel header 4-pin tachometric FAN connector I2C + SM Bus on feature Pin header I2C Flash Socket SM Bus Smart Battery Connector 4 x 7-segment LCD displays for POST codes LPC/eSPI internal header Buzzer Power Supply ATX 24 poles connector for carrier board working only Auxiliary 12V connector for carrier board working only 12 VDC power in connector for COM Express module’s working Cabled Coin-cell connector for RTC Operating Temperature* 0°C ÷ +60°C (Commercial version) Dimensions 305x244mm (ATX form factor, 12” x 9.6”) *All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. COM EXP T7 DEV KIT FEATURES OF CCOMe-C79 DEVELOPMENT KIT CONTENTS Cross Platform Development Kit compatible with both x86 and Arm COM Express™ Type 7 modules Platform independent kit for fast Time-to-market SCHEMATICS PUBLICLY AVAILABLE Type 7

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Page 1: Development Kit...BMC connector with SM Bus, I2C, LPC, 1x USB 2.0, 1x PCI-e x1, NCSI signals 4 x GPI + 4 x GPO pin header (interface multiplexed with µSD slot) SPI Flash Socket Button

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Development KitCOM Express™

The Development Kit contains the following material:

CCOMe-C79 Carrier Board

GPIO Header adapter cable (Free wires on one extremity)

2x Serial Adapter Cables

1x SATA cable

Standard OCP module (10GBE)

Front Panel module V995 with connecting cables

Module not included. Must be purchased separately

Mass Storage 2x S-ATA 7p M connectorsµSD Card slot (interface multiplexed with GPIO header)

Networking

1x GbEthernet RJ-45 connector4x 10Gbase-KR interfaces on OCP Type-C connector4x MDIO I2C interfaces on internal pin header4x SDP interfaces on SMA RF connectors

USB 4x USB 3.1 Host ports on Dual Type-A sockets

PCI-e2x PCI-e x4 Slots1x PCI-e x8 Slot1x PCI-e x16 Slot

Serial Ports 2 x RS-232 ports on dedicated pin header (from module)

Other Interfaces

BMC connector with SM Bus, I2C, LPC, 1x USB 2.0, 1x PCI-e x1, NCSI signals4 x GPI + 4 x GPO pin header (interface multiplexed with µSD slot)SPI Flash SocketButton / LEDs front panel header4-pin tachometric FAN connectorI2C + SM Bus on feature Pin headerI2C Flash SocketSM Bus Smart Battery Connector4 x 7-segment LCD displays for POST codesLPC/eSPI internal headerBuzzer

Power Supply

ATX 24 poles connector for carrier board working onlyAuxiliary 12V connector for carrier board working only12 VDC power in connector for COM Express module’s workingCabled Coin-cell connector for RTC

Operating Temperature*

0°C ÷ +60°C (Commercial version)

Dimensions 305x244mm (ATX form factor, 12” x 9.6”)

*All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.

COM EXP T7 DEV KIT

FEATURES OF CCOMe-C79

DEVELOPMENT KIT CONTENTS

Cross Platform Development Kit compatible with both x86 and Arm COM Express™ Type 7 modules

Platform independent kit for fast Time-to-market

SCHEMATICS PUBLICLY AVAILABLE

Type 7

Page 2: Development Kit...BMC connector with SM Bus, I2C, LPC, 1x USB 2.0, 1x PCI-e x1, NCSI signals 4 x GPI + 4 x GPO pin header (interface multiplexed with µSD slot) SPI Flash Socket Button

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BLOCK DIAGRAM OF CCOMe-C79

COM EXP T7 DEV KIT

003.20


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