dmm presentation
TRANSCRIPT
- 1. Engineering Presentation By Mike Ryland
- 2. ABOUT ME Graduated from CSUN in 2004 (B.S.M.E.) Core member of CSUN FSAE 2003/04 Race Team 10+ Years experience in New Product Development ProEngineer CREO and Solidworks expert power user Experienced with Aerospace Qualification / Documentation Advanced Interconnect design experience Design of custom Military connectors for use in Harsh Environments (Tactical Communications) Design for Space Applications (1,000,000 cycle RF switches) Pursuing M.S.M.E at CSUN (15 of 30 units completed)
- 3. Professional Experience EATON, Camarillo, Ca. 09/2013 to 01/2015 (1 Year, 5 Months) Senior Product Engineer HAAS Automation, Oxnard, Ca. 04/2013 to 08/2013 (4 months) Mechanical Engineer III (R&D) ISI, Camarillo, Ca. 06/2012 to 04/2013 (10 month contract) Project Engineer PTI Technologies, Oxnard, Ca. 07/2008 to 06/2012 (4 years) Mechanical Engineer Dow Key Microwave, Ventura, Ca. 09/2006 to 07/2008 (2 Years) Mechanical Design Engineer PTI Technologies, Oxnard, Ca. 06/2004 to 08/2006 (2 years, 2 months) Manufacturing Engineer
- 4. Certifications GD&T per ASME y14.5 1994 - Geometric Learning Solutions Solidworks Cosmos Professional - Go Engineer Solidworks PDM Jumpstart - Go Engineer Solidworks Routing Enovia PLM Administrator certifications - Enovia Solidworks Advanced Surface Design - Solidworks World Solidworks Mold Design / Plastics - Solidworks World Professional and Personal Development Eaton University Six Sigma Eaton University Project management Eaton University Project Management Certification Eaton University ProLaunch for Project Management Eaton University Feasibility studies Eaton University Influencing and Peer Communication Eaton University Managing Risk in Engineering Project
- 5. Recent Awards (Eaton)
- 6. My Engineering Degree
- 7. GD&T Certification
- 8. TECHNICAL PRESENTATION DENSE MEMORY MODULE
- 9. Custom Connector
- 10. Connector - Card Interface
- 11. Contact to Pad Alignment Challenge
- 12. Edge Card Connector Concept Design
- 13. DMM Connector Configuration
- 14. DMM Connector Configuration Top View
- 15. DMM Connector Configuration Bottom View (Pin Array)
- 16. Pin Socket Interconnect Array
- 17. Pin-Socket-BGA/LGA Array Interconnects
- 18. DMM Board Thermal Management
- 19. 1U Chasis and DMM Module Detail
- 20. Contact Design
- 21. Contact Design cont.
- 22. Contact Design cont.
- 23. Housing Design
- 24. Housing Design cont.
- 25. Housing Design cont.
- 26. Tolerance Analysis
- 27. Tolerance Analysis cont.
- 28. Connector Prototype
- 29. Contact Prototypes
- 30. Contact Prototypes
- 31. PERMANENT SET AFTER .015 DEFLECTION
- 32. MAX RESIDUAL STRESS, K000029902 NORMAL FORCE, BENDING STRESS AND PERMANENT SET
- 33. MAX STRESS (Uniform Distribution) TAPERED BEAM UNIFORMELY DISTRIBUTES STRESS ALONG THE LENGTH OF THE CONTACT/BEAM. MINIMIZE LOCAL STRESS CONCENTRATIONS, UTILIZING FULL LENGTH OF BEAM TO DISTRIBUTE STRESS. NORMAL FORCE 5.3 GRAMS PER CONTACT MAX STRESS/DEFLECTION OCCURS AT STEP 10 OF 26, 1.528 SECONDS INTO THE 4.2 SECOND SIMULATION USING A PARABOLIC LOADING/UNLOADING CURVE. STEPS ARE .042 SECONE INCREMENTS.
- 34. STRESS DISTRIBUTION (cont). ANIMATION DEMONSTRATING ONE COMPLETE CYCLE OF LOADING-UNLOADING TAPERED BEAM UNIFORMELY DISTRIBUTES STRESS ALONG THE LENGTH OF THE CONTACT/BEAM. MINIMIZE LOCAL STRESS CONCENTRATIONS, UTILIZING FULL LENGTH OF BEAM TO DISTRIBUTE STRESS. NORMAL FORCE 5.3 GRAMS PER CONTACT MAX STRESS/DEFLECTION OCCURS AT STEP 10 OF 26, 1.528 SECONDS INTO THE 4.2 SECOND SIMULATION USING A PARABOLIC LOADING/UNLOADING CURVE. STEPS ARE .042 SECONE INCREMENTS.
- 35. REACTION FORCE (X) MOMEMT = 5.3 GRAMS
- 36. MAX FIBRE/SURFACE STRESSES TENSION (+) AND COMPRRESSIVE (-) STRESSES
- 37. SETUP AND ASSUMPTIONS INPUT CURVE LOADING/UNLOADING CYCLE .015 PRESCRIBED DISPLACEMENT NO FIXED CONSTRAINTS WERE USED. ROLLER/SLIDER AND REFERENCE GEOMETRY/ SYMMETRY WAS USED TO MAKE SIMULATIONS AS REALISTIC AS POSSIBLE.
- 38. Solder Tab K000029903 STRESS ANALYSIS
- 39. DEFLECTION
- 40. DEFLECTION (Cont)
- 41. STRAIN
- 42. Final DMM Module
- 43. Questions