dominant tm opto technologies domiled … junction temperature ... normalized at 10ma forward...

01/06/2017 V5.01

Features:> High brightness surface mount LED.> Based on InGaN technology.> 120° viewing angle.> Small package outline (LxWxH) of 3.2 x 2.8 x 1.8mm.> Qualified according to JEDEC moisture sensitivity Level 2.> Compatible to IR reflow soldering.> Environmental friendly; RoHS compliance.> Compliance to automotive standard; AEC-Q101.

DomiLEDWith the intense colors that seem to glow with energy and its significant brightness, DomiLED white LED is a highly reliable design device. Its dynamic nature makes it perfect choice for lighthing applications, office and home applications and standard industrial applications.

DATA SHEET:

DomiLEDInGaN White : DDW-CJG-I1

© 2005 DomiLED is a trademark of DOMINANT Opto Technologies.All rights reserved. Product specifications are subject to change without notice.

Applications:> Automotive: interior applications, eg: switches, telematics, climate control system, dashboard, etc.> Consumer appliances: LCD illumination as in PDAs, LCD TV.> Communication: mobile phone flash light, backlights in mobile phone display.> Display: full color display video notice board.> Industry: general lighting

DOMINANTOpto TechnologiesInnovating Illumination

TM

01/06/2017 V5.02

InGaN White: DDW-CJG-I1

Part OrderingNumber

Color ViewingAngle˚

Luminous Intensity @ 10mA IV (mcd) Appx 1.1

DDW-CJG-QR2-1-I1 White 120 112.5

Vr @ Ir = 10 µA

Electrical Characteristics at Ta=250CVf @ If =10 mA Appx 3.1

3.2 5.0

Part NumberMin. (V) Typ. (V) Max. (V) Min. (V)

DDW-CJG 2.7 3.8

Unit

Absolute Maximum RatingsMaximum Value

DC forward current

Peak pulse current; (tp ≤ 10µs, Duty cycle = 0.005)

Reverse voltage

ESD threshold (HBM)

LED junction temperature

Operating temperature

Storage temperature

Power dissipation (at room temperature)

Thermal resistance- Junction / ambient, Rth JA- Junction / solder point, Rth JS(Mounting on FR4 PCB, pad size >= 16 mm2 per pad)

20

200

5

2000

125

-40 … +100

-40 … +100

85

340180

mA

mA

V

V

˚C

˚C

˚C

mW

K/WK/W


TM

Optical Characteristics at Tj=250C

Min. Typ. Max.

71.5 180.0

01/06/2017 V5.03

InGaN White: DDW-CJG-I1DOMINANTOpto TechnologiesInnovating Illumination

TM

CharacteristicsSymbol Part Number Value Unit

Temperature coefficient of VF (typ)IF = 10mA; 0 ˚C <= T <= 100˚C

Temperature coefficient of IV (typ)IF = 10mA; 0 ˚C <= T <= 100 ˚C

Temperature coefficient of Cx (typ)IF = 10mA; 0 ˚C <= T <= 100 ˚C

Temperature coefficient of Cy (typ)IF = 10mA; 0 ˚C <= T <= 100 ˚C

TCV

TCIV

TCCx

TCCy

DDW-CJG

DDW-CJG

DDW-CJG

DDW-CJG

-5.2

-0.19

-0.0002

0.00006

mV / K

% / K


01/06/2017 V5.04


TM

DDW, Color Grouping Appx 2.1

Color Bin Structure

Bin0.29600.25900.291

0.26800.30450.27150.30050.28250.32880.30810.32880.32820.33860.32350.33860.34260.31000.29700.30700.31200.31970.31310.31890.33020.34840.33880.34840.3571

CxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCy

0.29100.26800.28500.27900.30050.28250.29600.29550.32880.32820.32880.34530.33860.34260.33860.35910.31970.31310.31890.33020.32880.32820.32880.34520.34840.35710.34840.3730

0.30050.28250.29600.29550.31000.29700.30700.31200.33860.34260.33860.35910.34840.35710.34840.37300.32050.29560.31970.31310.32880.30810.32880.32820.35820.37150.35820.3792

0.30450.27150.30050.28250.31300.28400.31000.29700.33860.32350.33860.34260.34840.33880.34840.35710.31300.28400.31000.29700.32050.29560.31970.31310.35820.35420.35820.3715

1 2 3 4

JK

JL

KK

KL

NK

NL

OK

OL

LK

LL

MK

ML

PK

PL

150 InGaN White: NAW-BHG

26/12/2012 V4.04

NAW-BHG, White Color Grouping

Chromaticity coordinate groups are measured with an accuracy of ± 0.01.

Bin

JK

JL

KK

KL

NK

NL

OK

OL

LK

LL

MK

ML

0.29600.25900.291

0.26800.30450.27150.30050.28250.32880.30810.32880.32820.33860.32350.33860.34260.31000.29700.30700.31200.31970.31310.31890.3302

Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy

0.29100.26800.28500.27900.30050.28250.29600.29550.32880.32820.32880.34530.33860.34260.33860.35910.31970.31310.31890.33020.32880.32820.32880.3452

0.30050.28250.29600.29550.31000.29700.30700.31200.33860.34260.33860.35910.34840.35710.34840.37300.32050.29560.31970.31310.32880.30810.32880.3282

0.30450.27150.30050.28250.31300.28400.31000.29700.33860.32350.33860.34260.34840.33880.34840.35710.31300.28400.31000.29700.32050.29560.31970.3131

1 2 3 4

White Bin Structure


TM

0.2300

0.2400

0.2500

0.2600

0.2700

0.2800

0.2900

0.3000

0.3100

0.3200

0.3300

0.3400

0.3500

0.3600

0.3700

0.3800

0.3900

0.2700 0.2800 0.2900 0.3000 0.3100 0.3200 0.3300 0.3400 0.3500 0.3600 0.3700

JL

JK

KL

KK

LL

LK

NK

NL

OL

ML

PL

PK

OK

MK

01/06/2017 V5.05


TM

Q1Q2R1R2

71.5 ... 90.090.0 ... 112.5

112.5 ... 140.0140.0 ... 180.0

Brightness Group Luminous Intensity (mcd) Appx 1.1

Luminous Intensity Group at Tj=25˚C

Forward Voltage (V) Appx 3.1

Vf Bining (Optional)Vf Bin @ 10 mA

0A

00

01

02

03

2.45 ... 2.75

2.75 ... 3.05

3.05 ... 3.35

3.35 ... 3.65

3.65 ... 3.95

Please consult sales and marketing for special part number to incorporate Vf bining.

01/06/2017 V5.06


TM

Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp≤10uS )

Allo

wab

le F

orw

ard

Cur

rent

( m

A )

Duty Ratio, %

Chromaticity Coordinate Shift

ΔC

X ,

Δ C

Y

Forward Current, mA

Rel

ativ

e In

tens

ity; N

orm

aliz

ed a

t 10m

AFo

rwar

d C

urre

nt, m

ARelative Intensity Vs Forward Current Forward Current Vs Forward Voltage

Maximum Current Vs Ambient Temperature Relative Intensity Vs Wavelength

Forward Current, mA Forward Voltage, V

Ambient Temperature Wavelength, nm

Forw

ard

Cur

rent

, mA

Rel

ativ

e In

tens

ity

16/10/2015 V4.06


Relative Luminous Intensity Vs Forward Current

Forward Current, mA

Rel

ativ

e In

tens

ity

0 10 20 30 40 50

0

0.4

0.8

1.2

1.6

2

2.4

Forward Current Vs Forward Voltage

Forward Voltage, V

Forw

ard

Cur

rent

, mA

2 2.5 3 3.5 4

0

10

20

30

40

50

Maximum Current Vs Ambient Temperature

Ambient temperature

Forw

ard

Cur

rent

, If

0 10 20 30 40 50 60 70 80 90 100

5

10

15

20

25

Relative Intensity Vs. Wavelength

Wavelength, nm

Rel

ativ

e In

tens

ity

400 450 500 550 600 650 700 750 800

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1


TM

Rel

ativ

e In

tens

ity; N

orm

aliz

ed a

t 20m

ARelative Intensity Vs Forward Current

Forward Current; mA

Rel

ativ

e In

tens

ity; N

orm

aliz

ed a

t 10m

A

0 5 10 15 20 25 30 35 40 45 50

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5


Forward Voltage, V

Forw

ard

Cur

rent

; mA

2 2.5 3 3.5 4

0

10

20

30

40

50


Ambient Temperature

Forw

ard

Cur

rent

; mA

0 10 20 30 40 50 60 70 80 90 100

5

10

15

20

25

Relative Intensity Vs Wavelength

Wavelength; nm

Rel

ativ

e In

tens

ity

400 450 500 550 600 650 700 750 800

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1


Allo

wab

le F

orw

ard

Cur

rent

( m

A )

Duty Ratio, %


ΔC

X ,

Δ C

Y

DDW-CJG-RS2-A

≤

10

100

1000

0.1 1 10 100

All

ow

ab

le F

orw

ard

Cu

rre

nt

( m

A )

Duty Ratio, %

Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp 10uS )

Forward Current, mA

0.0000

0.0100

0.0200

0.0300

0.0400

�C X

,��C

Y


Delta CX

Delta CYCy

-0.0400

-0.0300

-0.0200

-0.0100

0 5 10 15 20

�

Forward current (mA)

Cx

16/10/2015 V4.06



Forward Current, mA

Rel

ativ

e In

tens

ity

0 10 20 30 40 50

0

0.4

0.8

1.2

1.6

2

2.4


Forward Voltage, V

Forw

ard

Cur

rent

, mA

2 2.5 3 3.5 4

0

10

20

30

40

50


Ambient temperature

Forw

ard

Cur

rent

, If

0 10 20 30 40 50 60 70 80 90 100

5

10

15

20

25


Wavelength, nm

Rel

ativ

e In

tens

ity

400 450 500 550 600 650 700 750 800

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1


TM

Rel

ativ

e In

tens

ity; N

orm

aliz

ed a

t 20m


Forward Current; mA

Rel

ativ

e In

tens

ity; N

orm

aliz

ed a

t 10m

A

0 5 10 15 20 25 30 35 40 45 50

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5


Forward Voltage, V

Forw

ard

Cur

rent

; mA

2 2.5 3 3.5 4

0

10

20

30

40

50


Ambient Temperature

Forw

ard

Cur

rent

; mA

0 10 20 30 40 50 60 70 80 90 100

5

10

15

20

25


Wavelength; nm

Rel

ativ

e In

tens

ity

400 450 500 550 600 650 700 750 800

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1


Allo

wab

le F

orw

ard

Cur

rent

( m

A )

Duty Ratio, %


ΔC

X ,

Δ C

Y

DDW-CJG-RS2-A

≤

10

100

1000

0.1 1 10 100

All

ow

ab

le F

orw

ard

Cu

rre

nt

( m

A )

Duty Ratio, %


Forward Current, mA

0.0000

0.0100

0.0200

0.0300

0.0400

�C X

,��C

Y


Delta CX

Delta CYCy

-0.0400

-0.0300

-0.0200

-0.0100

0 5 10 15 20

�


Cx

16/10/2015 V4.06



Forward Current, mA

Rel

ativ

e In

tens

ity

0 10 20 30 40 50

0

0.4

0.8

1.2

1.6

2

2.4


Forward Voltage, V

Forw

ard

Cur

rent

, mA

2 2.5 3 3.5 4

0

10

20

30

40

50


Ambient temperature

Forw

ard

Cur

rent

, If

0 10 20 30 40 50 60 70 80 90 100

5

10

15

20

25


Wavelength, nm

Rel

ativ

e In

tens

ity

400 450 500 550 600 650 700 750 800

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1


TM

Rel

ativ

e In

tens

ity; N

orm

aliz

ed a

t 20m


Forward Current; mA

Rel

ativ

e In

tens

ity; N

orm

aliz

ed a

t 10m

A

0 5 10 15 20 25 30 35 40 45 50

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5


Forward Voltage, V

Forw

ard

Cur

rent

; mA

2 2.5 3 3.5 4

0

10

20

30

40

50


Ambient Temperature

Forw

ard

Cur

rent

; mA

0 10 20 30 40 50 60 70 80 90 100

5

10

15

20

25


Wavelength; nm

Rel

ativ

e In

tens

ity

400 450 500 550 600 650 700 750 800

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1


Allo

wab

le F

orw

ard

Cur

rent

( m

A )

Duty Ratio, %


ΔC

X ,

Δ C

Y

DDW-CJG-RS2-A

≤

10

100

1000

0.1 1 10 100

All

ow

ab

le F

orw

ard

Cu

rre

nt

( m

A )

Duty Ratio, %


Forward Current, mA

0.0000

0.0100

0.0200

0.0300

0.0400

�C X

,��C

Y


Delta CX

Delta CYCy

-0.0400

-0.0300

-0.0200

-0.0100

0 5 10 15 20

�


Cx

16/10/2015 V4.06



Forward Current, mA

Rel

ativ

e In

tens

ity

0 10 20 30 40 50

0

0.4

0.8

1.2

1.6

2

2.4


Forward Voltage, V

Forw

ard

Cur

rent

, mA

2 2.5 3 3.5 4

0

10

20

30

40

50


Ambient temperature

Forw

ard

Cur

rent

, If

0 10 20 30 40 50 60 70 80 90 100

5

10

15

20

25


Wavelength, nm

Rel

ativ

e In

tens

ity

400 450 500 550 600 650 700 750 800

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1


TM

Rel

ativ

e In

tens

ity; N

orm

aliz

ed a

t 20m


Forward Current; mA

Rel

ativ

e In

tens

ity; N

orm

aliz

ed a

t 10m

A

0 5 10 15 20 25 30 35 40 45 50

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5


Forward Voltage, V

Forw

ard

Cur

rent

; mA

2 2.5 3 3.5 4

0

10

20

30

40

50


Ambient Temperature

Forw

ard

Cur

rent

; mA

0 10 20 30 40 50 60 70 80 90 100

5

10

15

20

25


Wavelength; nm

Rel

ativ

e In

tens

ity

400 450 500 550 600 650 700 750 800

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1


Allo

wab

le F

orw

ard

Cur

rent

( m

A )

Duty Ratio, %


ΔC

X ,

Δ C

Y

DDW-CJG-RS2-A

≤

10

100

1000

0.1 1 10 100

All

ow

ab

le F

orw

ard

Cu

rre

nt

( m

A )

Duty Ratio, %


Forward Current, mA

0.0000

0.0100

0.0200

0.0300

0.0400

�C X

,��C

Y


Delta CX

Delta CYCy

-0.0400

-0.0300

-0.0200

-0.0100

0 5 10 15 20

�


Cx

16/10/2015 V4.06



Forward Current, mA

Rel

ativ

e In

tens

ity

0 10 20 30 40 50

0

0.4

0.8

1.2

1.6

2

2.4


Forward Voltage, V

Forw

ard

Cur

rent

, mA

2 2.5 3 3.5 4

0

10

20

30

40

50


Ambient temperature

Forw

ard

Cur

rent

, If

0 10 20 30 40 50 60 70 80 90 100

5

10

15

20

25


Wavelength, nm

Rel

ativ

e In

tens

ity

400 450 500 550 600 650 700 750 800

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1


TM

Rel

ativ

e In

tens

ity; N

orm

aliz

ed a

t 20m


Forward Current; mA

Rel

ativ

e In

tens

ity; N

orm

aliz

ed a

t 10m

A

0 5 10 15 20 25 30 35 40 45 50

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5


Forward Voltage, V

Forw

ard

Cur

rent

; mA

2 2.5 3 3.5 4

0

10

20

30

40

50


Ambient Temperature

Forw

ard

Cur

rent

; mA

0 10 20 30 40 50 60 70 80 90 100

5

10

15

20

25


Wavelength; nm

Rel

ativ

e In

tens

ity

400 450 500 550 600 650 700 750 800

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1


Allo

wab

le F

orw

ard

Cur

rent

( m

A )

Duty Ratio, %


ΔC

X ,

Δ C

Y

DDW-CJG-RS2-A

≤

10

100

1000

0.1 1 10 100

All

ow

ab

le F

orw

ard

Cu

rre

nt

( m

A )

Duty Ratio, %


Forward Current, mA

0.0000

0.0100

0.0200

0.0300

0.0400

�C X

,��C

Y


Delta CX

Delta CYCy

-0.0400

-0.0300

-0.0200

-0.0100

0 5 10 15 20

�


Cx

16/10/2015 V4.06



Forward Current, mA

Rel

ativ

e In

tens

ity

0 10 20 30 40 50

0

0.4

0.8

1.2

1.6

2

2.4


Forward Voltage, V

Forw

ard

Cur

rent

, mA

2 2.5 3 3.5 4

0

10

20

30

40

50


Ambient temperature

Forw

ard

Cur

rent

, If

0 10 20 30 40 50 60 70 80 90 100

5

10

15

20

25


Wavelength, nm

Rel

ativ

e In

tens

ity

400 450 500 550 600 650 700 750 800

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1


TM

Rel

ativ

e In

tens

ity; N

orm

aliz

ed a

t 20m


Forward Current; mA

Rel

ativ

e In

tens

ity; N

orm

aliz

ed a

t 10m

A

0 5 10 15 20 25 30 35 40 45 50

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5


Forward Voltage, V

Forw

ard

Cur

rent

; mA

2 2.5 3 3.5 4

0

10

20

30

40

50


Ambient Temperature

Forw

ard

Cur

rent

; mA

0 10 20 30 40 50 60 70 80 90 100

5

10

15

20

25


Wavelength; nm

Rel

ativ

e In

tens

ity

400 450 500 550 600 650 700 750 800

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1


Allo

wab

le F

orw

ard

Cur

rent

( m

A )

Duty Ratio, %


ΔC

X ,

Δ C

Y

DDW-CJG-RS2-A

≤

10

100

1000

0.1 1 10 100

All

ow

ab

le F

orw

ard

Cu

rre

nt

( m

A )

Duty Ratio, %


Forward Current, mA

0.0000

0.0100

0.0200

0.0300

0.0400

�C X

,��C

Y


Delta CX

Delta CYCy

-0.0400

-0.0300

-0.0200

-0.0100

0 5 10 15 20

�


Cx

Radiation Pattern

01/06/2017 V5.07


TM

08/12/2016 V7.09

InGaN Warm White: DDF-LJGDOMINANTOpto TechnologiesInnovating Illumination

TM

Radiation Pattern

Junction Temperature Tj(°C)

Rela

tive

Forw

ard

Volta

ge ∆

V F (V)


Rela

tive

Lum

inou

s In

tens

ity I re

l

Relative Luminous Intensity Vs Junction TemperatureIV/IV(25°C) = f(Tj); IF = 20mA


∆Cx

, ∆Cy

Chromaticity Coordinate Shift Vs Junction Temperature∆Cx, ∆Cy = f(Tj); IF = 20mA

0.270°

90°

80°

0

60°

50°

40°

30° 20°

0.6

0.4

1.0

0.8

10° 0°

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

-50 -30 -10 10 30 50 70 90 110 1300.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

-50 -30 -10 10 30 50 70 90 110 130

Rela

tive

Forw

ard

Volta

ge ∆

V F (V

)

Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 20mA

Junction Temperature Tj(°C) Junction Temperature Tj(°C)

Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV = 20mA

Rela

tive

Lum

inou

s In

tens

ity I r

el

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

-50 -30 -10 10 30 50 70 90 110 1300.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

-50 -30 -10 10 30 50 70 90 110 130

Rela

tive

Forw

ard

Volta

ge ∆

V F (V

)

Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 20mA


Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV = 20mA

Rela

tive

Lum

inou

s In

tens

ity I r

el

Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF =20mA

-10.0

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

10.0

-50 -30 -10 10 30 50 70 90 110 130

∆Cx

∆Cy

-0.030

-0.025

-0.020

-0.015

-0.010

-0.005

0.000

0.005

0.010

0.015

0.020

0.025

0.030

-50 -30 -10 10 30 50 70 90 110 130

Rela

tive

Wav

elen

gth ∆λ

dom

(nm

)

Relative Wavelength Vs Junction Temperature∆λdom = λdom - λdom (25°C) = f(Tj); IF = 20mA

∆Cx,

∆Cy

Chromaticity Coordinate Shift Vs Junction Temperature∆Cx, ∆Cy = f(Tj); IF = 20mA



01/06/2017 V5.08

DomiLED • InGaN White: DDW-CJG-I1 Package Outlines


TM

Note: Package is Pb-free.

Materials

Lead Frame

Housing

Encapsulant

Lead-finishing

Materials

Copper alloy

High temperature resistant plastic, PPA

Silicone resin

Pure tin plating, Sn

InGaN Warm White: DDF-LJG

08/12/2016 V7.010

DomiLED • InGaN Warm White: DDF-LJG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating


TM

Note : Primary thermal path is through Cathode lead of LED package.

01/06/2017 V5.09


Recommended Solder Pad


TM

08/12/2016 V7.011


Recommended Solder Pad


TM

01/06/2017 V5.010

Taping and orientation

• Reels come in quantity of 2000 units.• Reel diameter is 180 mm.


TM

08/12/2016 V7.012




TM

14/06/2016 V3.08

PrimaxPlus • 180 InGaN White: MBWW-KZHG Package Outlines

Material

Material

Lead-frame

Package


Cu Alloy With Au Plating

High Temperature Resistant Plastic

Silicone Resin

Au Plating

Note: This product is Pb free

180 InGaN White: MBWW-KZHGDOMINANTOpto TechnologiesInnovating Illumination

TM


12/10/

2016 V

3.07

Prima

xPlus

• 350

InGaN

Yellow

: MAZ

Y-YZH

G Pack

age Ou

tlines

Materi

al

Materi

al

Lead-fr

ame

Packa

ge

Encap

sulant

Solde

ring Le

ads

Cu All

oy Wit

h Au P

lating

High T

emper

ature R

esista

nt Plas

tic

Silicon

e

Au Pla

ting

DOMI

NANT

Opto T

echnol

ogies

Innova

ting Il

lumina

tionTM

Note:

This p

roduct

is Pb

free

350 InG

aN Ye

llow: M

AZY-Y

ZHG

Note :

Prima

ry ther

mal pa

th is th

rough

Cathod

e lead

of LED

packa

ge.

DOMI

NANT

Opto

Techn

ologie

s

09/05/

14 Prim

axPlus

350 InG

aN Wh

ite MA

W-YZ

HG -pv

3.docx

Pag

e 1 of 9

PRELIM

INARY

UNDER

DEVELO

PMENT

Engine

ering r

eferen

ce dat

a are n

ot verif

ied. Th

e spec

ificatio

ns are

subje

ct to

change

witho

ut notic

e.

Sup

er high

bright

ness s

urface

mount

LED f

or auto

motive

applic

ations.

120

view

ing an

gle.

Co

mpact

packa

ge out

line (Lx

W) of

3.7 x 3

.5 mm.

Ultr

a low h

eight p

rofile –

0.8 mm

.

Low

therma

l resist

ance;

Sup

erior co

rrosio

n robus

tness.

Co

mpatib

le to IR

reflow

solde

ring.

Prima

xPlus

350mA

White:

MAW-Y

ZHG 31/

05/201

3 V1.0

7

Prima

x • 175

InGaN

White:

MBWW

-FSC P

ackage

Outlin

es

Materi

al

Mater

ial

Lead-fr

ame

Packa

ge

Encap

sulant

Solde

ring Le

ads

Cu All

oy Wit

h Ag P

lating

High T

emper

ature R

esista

nt Plas

tic

Silicon

e Resi

n

Ag Pla

ting

DOMI

NANT

Opto T

echnol

ogies

Innova

ting Il

lumina

tionTM

Note:

This p

roduct

is Pb

free

175 InG

aN Wh

ite: MB

WW-FS

C

18/04/

2016 V

1.08

Prima

xPlus

100 InG

aN Wh

ite: PQ

W-SS

G Pack

age Ou

tlines

InGaN

White:

PQW-

SSG

DOMI

NANT

Opto T

echnol

ogies

Innova

ting Il

lumina

tionTM

Materi

al

Mater

ial

Lead-fr

ame

Packa

ge

Encap

sulant

Solde

ring Le

ads

Cu All

oy Wit

h Ag P

lating

High T

emper

ature R

esista

nt Plas

tic

Silicon

e Resi

n

Sn Pla

ting

Note:

This p

roduct

is Pb

free

DOMI

NANT

Opto

Techn

ologie

s

24/09/

13 Prim

axPlus

100 InG

aN Wa

rm Wh

ite MA

F-PSC

-pv3.d

ocx

Page 1

of 14

PRELIM

INARY

UNDER

DEVELO

PMENT

Engine

ering r

eferen

ce dat

a are n

ot verif

ied. Th

e spec

ificatio

ns are

subje

ct to

change

witho

ut notic

e.

Sup

er high

bright

ness s

urface

mount

LED.

120

view

ing an

gle.

Co

mpact

packa

ge out

line (Lx

W) of

3.7 x 3

.5 mm.

Ultr

a low h

eight p

rofile –

0.8 mm

.

Low

therma

l resist

ance.

Co

mpatib

le to IR

reflow

solde

ring.

Prima

xPlus

100mA

Warm

White:

MAF-P

SC

Note :

Prima

ry ther

mal pa

th is th

rough

Catho

de lea

d of LE

D pack

age

InGaN

Warm

White:

DDF-L

JG

08/12/

2016 V

7.010

Domi

LED •

InGaN

Warm

White:

DDF-L

JG Pa

ckage

Outlin

es

Materi

al

Materi

al

Lead-fr

ame

Packa

ge

Encap

sulant

Solde

ring Le

ads

Cu All

oy Wit

h Ag P

lating

High T

emper

ature R

esista

nt Plas

tic, PP

A

Silicon

e Resi

n

Sn-Sn

Plating

DOMI

NANT

Opto T

echnol

ogies

Innova

ting Il

lumina

tionTM

Note :

Prima

ry ther

mal pa

th is th

rough

Cathod

e lead

of LED

packa

ge.

07/07/

2011 V

4.06

SPNo

vaTM • In

GaN W

hite : N

PW-RS

Z Pack

age Ou

tlines

InGaN

White

: NPW

-RSZ

Materi

al

Mater

ial

Lead-fr

ame

Packa

ge

Encap

sulant

Solde

ring Le

ads

Cu All

oy Wit

h Ag P

lating

High T

emper

ature R

esista

nt Plas

tic, PP

A

Silicon

e Resi

n

Sn-Sn

Plating

DOMI

NANT

Opto T

echnol

ogies

Innova

ting Il

lumina

tionTM

07/07/2011 V4.0

6

SPNova

TM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads



Silicone Resin

Sn-Sn Plating

DOMINANT

Opto Technologies

Innovating Illumination TM

12/10/2016 V3.07

PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines

Material

Material

Lead-frame

Package




Silicone

Au Plating


TM


350 InGaN Yellow: MAZY-YZHG


DOMINANT Opto Technologies

09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9

PRELIMINARY UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to change without notice.

Super high brightness surface mount LED for automotive applications.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance;

Superior corrosion robustness.

Compatible to IR reflow soldering.

PrimaxPlus 350mA White: MAW-YZHG

31/05/2013 V1.07

Primax • 175 InGaN White: MBWW-FSC Package Outlines

Material

Material

Lead-frame

Package




Silicone Resin

Ag Plating


TM


175 InGaN White: MBWW-FSC

18/04/2016 V1.08

PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines

InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination

TM

Material

Material

Lead-frame

Package




Silicone Resin

Sn Plating



24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14



Super high brightness surface mount LED.

120 viewing angle.



Low thermal resistance.


PrimaxPlus 100mA Warm White: MAF-PSC

Note : Primary thermal path is through Cathode lead of LED package


08/12/2016 V7.010


Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM


07/07/2011 V4.06

SPNovaTM • InGaN White : NPW-RSZ Package Outlines


Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

12/10/2016 V3.07


Material

Material

Lead-frame

Package




Silicone

Au Plating


TM









120 viewing angle.







31/05/2013 V1.07


Material

Material

Lead-frame

Package




Silicone Resin

Ag Plating


TM



18/04/2016 V1.08



TM

Material

Material

Lead-frame

Package




Silicone Resin

Sn Plating







120 viewing angle.








08/12/2016 V7.010


Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM


07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

12/10/2016 V3.07


Material

Material

Lead-frame

Package




Silicone

Au Plating


TM









120 viewing angle.







31/05/2013 V1.07


Material

Material

Lead-frame

Package




Silicone Resin

Ag Plating


TM



18/04/2016 V1.08



TM

Material

Material

Lead-frame

Package




Silicone Resin

Sn Plating







120 viewing angle.








08/12/2016 V7.010


Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM


07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

12/10/

2016 V

3.07

Prima

xPlus

• 350

InGaN

Yellow

: MAZ

Y-YZH

G Pack

age Ou

tlines

Materi

al

Materi

al

Lead-fr

ame

Packa

ge

Encap

sulant

Solde

ring Le

ads

Cu All

oy Wit

h Au P

lating

High T

emper

ature R

esista

nt Plas

tic

Silicon

e

Au Pla

ting

DOMI

NANT

Opto T

echnol

ogies

Innova

ting Il

lumina

tionTM

Note:

This p

roduct

is Pb

free

350 InG

aN Ye

llow: M

AZY-Y

ZHG

Note :

Prima

ry ther

mal pa

th is th

rough

Cathod

e lead

of LED

packa

ge.

DOMI

NANT

Opto

Techn

ologie

s

09/05/

14 Prim

axPlus

350 InG

aN Wh

ite MA

W-YZ

HG -pv

3.docx

Pag

e 1 of 9

PRELIM

INARY

UNDER

DEVELO

PMENT

Engine

ering r

eferen

ce dat

a are n

ot verif

ied. Th

e spec

ificatio

ns are

subje

ct to

change

witho

ut notic

e.

Sup

er high

bright

ness s

urface

mount

LED f

or auto

motive

applic

ations.

120

view

ing an

gle.

Co

mpact

packa

ge out

line (Lx

W) of

3.7 x 3

.5 mm.

Ultr

a low h

eight p

rofile –

0.8 mm

.

Low

therma

l resist

ance;

Sup

erior co

rrosio

n robus

tness.

Co

mpatib

le to IR

reflow

solde

ring.

Prima

xPlus

350mA

White:

MAW-Y

ZHG 31/

05/201

3 V1.0

7

Prima

x • 175

InGaN

White:

MBWW

-FSC P

ackage

Outlin

es

Materi

al

Mater

ial

Lead-fr

ame

Packa

ge

Encap

sulant

Solde

ring Le

ads

Cu All

oy Wit

h Ag P

lating

High T

emper

ature R

esista

nt Plas

tic

Silicon

e Resi

n

Ag Pla

ting

DOMI

NANT

Opto T

echnol

ogies

Innova

ting Il

lumina

tionTM

Note:

This p

roduct

is Pb

free

175 InG

aN Wh

ite: MB

WW-FS

C

18/04/

2016 V

1.08

Prima

xPlus

100 InG

aN Wh

ite: PQ

W-SS

G Pack

age Ou

tlines

InGaN

White:

PQW-

SSG

DOMI

NANT

Opto T

echnol

ogies

Innova

ting Il

lumina

tionTM

Materi

al

Mater

ial

Lead-fr

ame

Packa

ge

Encap

sulant

Solde

ring Le

ads

Cu All

oy Wit

h Ag P

lating

High T

emper

ature R

esista

nt Plas

tic

Silicon

e Resi

n

Sn Pla

ting

Note:

This p

roduct

is Pb

free

DOMI

NANT

Opto

Techn

ologie

s

24/09/

13 Prim

axPlus

100 InG

aN Wa

rm Wh

ite MA

F-PSC

-pv3.d

ocx

Page 1

of 14

PRELIM

INARY

UNDER

DEVELO

PMENT

Engine

ering r

eferen

ce dat

a are n

ot verif

ied. Th

e spec

ificatio

ns are

subje

ct to

change

witho

ut notic

e.

Sup

er high

bright

ness s

urface

mount

LED.

120

view

ing an

gle.

Co

mpact

packa

ge out

line (Lx

W) of

3.7 x 3

.5 mm.

Ultr

a low h

eight p

rofile –

0.8 mm

.

Low

therma

l resist

ance.

Co

mpatib

le to IR

reflow

solde

ring.

Prima

xPlus

100mA

Warm

White:

MAF-P

SC

Note :

Prima

ry ther

mal pa

th is th

rough

Catho

de lea

d of LE

D pack

age

InGaN

Warm

White:

DDF-L

JG

08/12/

2016 V

7.010

Domi

LED •

InGaN

Warm

White:

DDF-L

JG Pa

ckage

Outlin

es

Materi

al

Materi

al

Lead-fr

ame

Packa

ge

Encap

sulant

Solde

ring Le

ads

Cu All

oy Wit

h Ag P

lating

High T

emper

ature R

esista

nt Plas

tic, PP

A

Silicon

e Resi

n

Sn-Sn

Plating

DOMI

NANT

Opto T

echnol

ogies

Innova

ting Il

lumina

tionTM

Note :

Prima

ry ther

mal pa

th is th

rough

Cathod

e lead

of LED

packa

ge.

07/07/

2011 V

4.06

SPNo

vaTM • In

GaN W

hite : N

PW-RS

Z Pack

age Ou

tlines

InGaN

White

: NPW

-RSZ

Materi

al

Mater

ial

Lead-fr

ame

Packa

ge

Encap

sulant

Solde

ring Le

ads

Cu All

oy Wit

h Ag P

lating

High T

emper

ature R

esista

nt Plas

tic, PP

A

Silicon

e Resi

n

Sn-Sn

Plating

DOMI

NANT

Opto T

echnol

ogies

Innova

ting Il

lumina

tionTM

07/07/2011 V4.0

6

SPNova

TM • InGaN White : NPW-RSZ Package Outlines


Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads



Silicone Resin

Sn-Sn Plating

DOMINANT

Opto Technologies

Innovating Illumination TM

12/10/2016 V3.07


Material

Material

Lead-frame

Package




Silicone

Au Plating


TM









120 viewing angle.







31/05/2013 V1.07


Material

Material

Lead-frame

Package




Silicone Resin

Ag Plating


TM



18/04/2016 V1.08



TM

Material

Material

Lead-frame

Package




Silicone Resin

Sn Plating







120 viewing angle.








08/12/2016 V7.010


Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM


07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

12/10/2016 V3.07


Material

Material

Lead-frame

Package




Silicone

Au Plating


TM









120 viewing angle.







31/05/2013 V1.07


Material

Material

Lead-frame

Package




Silicone Resin

Ag Plating


TM



18/04/2016 V1.08



TM

Material

Material

Lead-frame

Package




Silicone Resin

Sn Plating







120 viewing angle.








08/12/2016 V7.010


Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM


07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

C

A

08/12/2016 V7.012




TM

01/06/2017 V5.011

Packaging Specification


TM

08/12/2016 V7.013



TM

01/06/2017 V5.012


TM


Average 1pc DomiLED/Multi DomiLED 1 completed bag (2000pcs)

0.034 190 ± 10Weight (gram)

CardboardBox

Dimensions (mm) Empty BoxWeight (kg)

Super Small

Small

Medium

Large

For DomiLED

Reel / BoxCardboard BoxSize

Weight (gram) 0.034 240 ± 10

DOMINANT TM

Moisture sensitivity level

Moisture absorbent material +Moisture indicator

The reel, moisture absorbent material and moisture indicator aresealed inside the moisture proof foil bag

Reel

Barcode label

Label

(L) Lot No : lotno

(P) Part No : partno

(C) Cust No : partno

(G) Grouping : group

(Q) Quantity : quantity

(D) D/C : date code

(S) S/N : serial no

DOMINANT Opto TechnologiesML TEMP2 260˚CRoHS Compliant

Made in Malaysia

325 x 225 x 190

325 x 225 x 280

570 x 440 x 230

570 x 440 x 460

0.38

0.54

1.46

1.92

9 reels MAX

15 reels MAX

60 reels MAX

120 reels MAX

01/06/2017 V5.013

Time (sec)0 50 100 150 200

300

250

225

200

175

150

125

100

75

50

25

275

Tem

pera

ture

(˚C

)Classification Reflow Profile (JEDEC J-STD-020C)

Ramp-up3˚C/sec max.

255-260˚C10-30s

60-150s

Ramp-down

6˚C/secmax.

Preheat 60-180s

480s max

217˚C

Recommended Pb-free Soldering Profile


TM


01/06/2017 V5.014


TM

Appendix

1) Brightness:1.1 Luminous intensity is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).1.2 Luminous flux is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).

2) Color:2.1 Chromaticity coordinate groups are measured with an internal reproducibility of ± 0.005 and an expanded uncertainty of ± 0.01 (accordingly to GUM with a coverage factor of k=3).2.2 DOMINANT wavelength is measured with an internal reproducibility of ± 0.5nm and an expanded uncertainty of ± 1nm (accordingly to GUM with a coverage factor of k=3).

3) Voltage:3.1 Forward Voltage, Vf is measured with an internal reproducibility of ± 0.05V and an expanded uncertainty of ± 0.1V (accordingly to GUM with a coverage factor of k=3).

Revision History

Page

-

2

3, 6

1, 12

1, 14

Subjects

Initial release

Add Thermal Resistance

Add CharacteristicsAdd graph: Allowable Forward Current Vs Duty Ratio

Add graph: Chromaticity Coordinate Shift

Add FeaturesUpdate Packaging Specification

Update Product PhotoAdd Appendix

Date of Modification

01 Mar 2012

02 Apr 2013

06 Jun 2014

16 Oct 2015

01 Jun 2017


01/06/2017 V5.015


TM

NOTE

All the information contained in this document is considered to be reliable at the time of publishing. However, DOMINANT

Opto Technologies does not assume any liability arising out of the application or use of any product described herein.

DOMINANT Opto Technologies reserves the right to make changes to any products in order to improve reliability, function

or design.

DOMINANT Opto Technologies products are not authorized for use as critical components in life support devices or systems

without the express written approval from the Managing Director of DOMINANT Opto Technologies.


About Us


TM

DOMINANT Opto Technologies is a dynamic company that is amongst the world’s leading automotive LED manufac-turers. With an extensive industry experience and relentless pursuit of innovation, DOMINANT’s state-of-art manu-facturing and development capabilities have become a trusted and reliable brand across the globe. More information about DOMINANT Opto Technologies, a ISO/TS 16949 and ISO 14001 certified company, can be found under http://www.dominant-semi.com.

Please contact us for more information:

DOMINANT Opto Technologies Sdn. BhdLot 6, Batu Berendam, FTZ Phase III, 75350 Melaka, Malaysia.Tel: +606 283 3566 Fax: +606 283 0566E-mail: [email protected]

dominant tm opto technologies domiled … junction temperature ... normalized at 10ma forward...

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