dominant tm opto technologies mini domiled innovating
TRANSCRIPT
27/11/2018 V4.01
Features:> High brightness surface mount LED.> Based on InGaN technology.> 120° viewing angle.> Small package outline (LxWxH) of 2.0 x 1.4 x 1.3mm.> Qualified according to JEDEC moisture sensitivity Level 2.> Compatible to both IR reflow soldering.> Environmental friendly; RoHS compliance.> Compliance to automotive standard; AEC-Q101.> Passed Corrosion Resistant Test. Appx. 4.1
Mini DomiLEDWith the intense colors that seem to glow with energy and its significant brightness, Mini DomiLED white LED is a highly reliable design device. Its dynamic nature makes it perfect choice for lighthing applications, office and home applications and standard industrial applications.
DATA SHEET:
Mini DomiLEDInGaN White : DNW-EJG-F1P5-I5
© 2005 DomiLED is a trademark of DOMINANT Opto Technologies.All rights reserved. Product specifications are subject to change without notice.
Applications:> Automotive: interior applications, eg: switches, telematics, climate control system, dashboard, etc.> Communication: indicator and backlight in mobilephone.> Display: full color display video notice board.> Industry: white goods (eg: Oven, microwave, etc.).
DOMINANTOpto TechnologiesInnovating Illumination
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27/11/2018 V4.02
Part OrderingNumber
Color ViewingAngle˚
Luminous Intensity @ 5mA (mcd) Appx. 1.1
DNW-EJG-RS1-F1H5-I5
DNW-EJG-R2S-I1L5-I5
DNW-EJG-R2S-M1P5-I5
White
White
White
120
120
120
112.5
140.0
140.0
Electrical Characteristics at Tj=250CVf @ If = 5 mA Appx. 3.1
2.9
Part NumberMin. (V) Typ. (V) Max. (V)
DNW-EJG 2.6 3.2
Optical Characteristics at Tj=250C
Min. Typ. Max.
180.0
224.0
224.0
224.0
285.0
285.0
Unit
Absolute Maximum RatingsMaximum Value
DC forward current
Peak pulse current; (tp ≤ 10µs, Duty cycle = 0.005)
Reverse voltage Appx. 6.1
ESD threshold (HBM)
LED junction temperature
Operating temperature
Storage temperature
Power dissipation (at room temperature)
Real Thermal resistance- Junction / ambient, Rth JA real- Junction / solder point, Rth JS real(Mounting on FR4 PCB, pad size >= 5 mm2 per pad)
20
100
5
2000
110
-40 … +100
-40 … +100
70
530230
mA
mA
V
V
˚C
˚C
˚C
mW
K/WK/W
Vr @ Ir = 10 µA Appx. 6.1
5.0
Min. (V)
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
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27/11/2018 V4.03
DNW, Color Grouping Appx. 2.1
Color Bin Structure
Bin0.24980.20530.24020.21080.22690.21850.21360.22620.20030.23390.25970.22040.25090.22640.23880.23480.22670.24320.21460.2516
CxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCy
0.25890.20000.24980.20530.23880.23480.22670.24320.21460.25160.26820.21460.25970.22040.25090.22640.24160.26230.23120.2719
0.26820.21460.25970.22040.25090.22640.23880.23480.22670.24320.27750.22920.27000.23610.26240.24310.25200.25270.24160.2623
0.25970.22040.25090.22640.24020.21080.22690.21850.21360.22620.27000.23610.26240.24310.25200.25270.23880.23480.22670.2432
1 2 3 4
F1
F2
F3
F4
F5
G1
G2
G3
G4
G5
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
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0.18
0.20
0.22
0.24
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.18 0.20 0.22 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38
L
1
5
2
K
J
H
N
M
3
P
F
I
4
G
27/11/2018 V4.04
Bin0.27000.23610.26240.24310.25200.25270.24160.26230.23120.27190.27970.25090.27330.25900.26460.27000.25590.28100.24720.29200.28980.26640.28480.27570.27800.28830.27120.30090.26440.31350.30070.28300.29710.29350.29220.30770.28730.32190.28240.33610.31130.29920.30900.31080.30600.32660.30300.34240.30000.3582
CxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCy
0.27750.22920.27000.23610.26240.24310.25590.28100.24720.29200.28610.24270.27970.25090.27330.25900.27120.30090.26440.31350.29500.25680.28980.26640.28480.27570.28730.32190.28240.33610.30450.27170.30070.28300.29710.29350.30300.34240.30000.35820.31380.28620.31130.29920.30900.31080.31830.36210.31700.3791
0.28610.24270.27970.25090.27330.25900.26460.27000.25590.28100.29500.25680.28980.26640.28480.27570.27800.28830.27120.30090.30450.27170.30070.28300.29710.29350.29220.30770.28730.32190.31380.28620.31130.29920.30900.31080.30600.32660.30300.34240.32310.30080.32190.31540.32090.32810.31960.34510.31830.3621
0.27970.25090.27330.25900.26460.27000.25200.25270.24160.26230.28980.26640.28480.27570.27800.28830.26460.27000.25590.28100.30070.28300.29710.29350.29220.30770.27800.28830.27120.30090.31130.29920.30900.31080.30600.32660.29220.30770.28730.32190.32190.31540.32090.32810.31960.34510.30600.32660.30300.3424
1 2 3 4
H1
H2
H3
H4
H5
I1
I2
I3
I4
I5
J1
J2
J3
J4
J5
K1
K2
K3
K4
K5
L1
L2
L3
L4
L5
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
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27/11/2018 V4.05
Bin0.32190.31540.32090.32810.31960.34510.31830.36210.31700.37910.33350.31720.33390.33360.33410.34720.33490.38300.33530.40060.34470.33470.34650.35300.34790.36730.35170.40530.35360.4243
CxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCy
0.32310.30080.32190.31540.32090.32810.33490.38300.33530.40060.33390.33360.33410.34720.33450.36540.35170.40530.35360.42430.34650.35300.34790.36730.34980.38630.36870.42760.37190.4473
0.33350.31720.33390.33360.33410.34720.33450.36540.33490.38300.34650.35300.34790.36730.34980.38630.34980.38630.35170.40530.35990.37350.36230.38820.36550.40790.36550.40790.36870.4276
0.33390.33360.33410.34720.33450.36540.31960.34510.31830.36210.34470.33470.34650.35300.34790.36730.33450.36540.33490.38300.35670.35350.35990.37350.36230.38820.34980.38630.35170.4053
1 2 3 4
M1
M2
M3
M4
M5
N1
N2
N3
N4
N5
P1
P2
P3
P4
P5
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
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InGaN wavelength is very sensitive to drive current. Operating at lower current is not recommended and may yield unpredictable performance. Current pulsing should be used for dimming purposes.
R1R2S1S2
112.5 ... 140.0140.0 ... 180.0180.0 ... 224.0224.0 ... 285.0
Brightness Group Luminous Intensity Appx. 1.1
IV (mcd)
Luminous Intensity Group at Tj=25˚C
27/11/2018 V4.06
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
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27/11/2018 V4.07
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
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Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C
Forward Voltage VF (V)Forward Current IF (mA)
Forw
ard
Cur
rent
I F (m
A)
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Relative Luminous Intensity Vs Forward CurrentIV/IV(5mA) = f(IF); Tj = 25°C
Forw
ard
Cur
rent
I F (m
A)
Temperature T(°C)
Maximum Current Vs TemperatureIF=f(T)
Forward Current IF (mA
Chromaticity Coordinate Shift Vs Forward Current∆Cx, ∆Cy = f(IF);Tj = 25°C
Relative Spectral EmissionIrel = f(λ); Tj = 25°C; IF = 5mA
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Wavelength λ (nm)
Allo
wab
le F
orw
ard
Cur
rent
I F( m
A )
Duty Ratio, %
Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs )
∆Cx,
∆C
y
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 200
5
10
15
20
2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3
Forw
ard
Curr
ent I
F(m
A)
Forward Current IF (mA)
Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C
Forward Voltage VF (V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength λ (nm)
Forw
ard
Curr
ent I
F(m
A)
Maximum Current Vs TemperatureIF = f (T)
Temperature T(°C)
Ta
0
5
10
15
20
25
0 10 20 30 40 50 60 70 80 90 100 110
Ta = Ambient Temperature
Allo
wab
le F
orw
ard
Cur
rent
I F( m
A )
Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs )
Duty Ratio, %
10
100
1000
0.1 1 10 100
Relative Luminous Intensity Vs Forward CurrentIV/IV(5mA) = f(IF); Tj = 25°C
Rela
tive
Lum
inou
s Int
ensi
ty I r
el
Rela
tive
Lum
inou
s Int
ensi
ty I r
el
Relative Spectral EmissionIrel = f(λ); Tj = 25°C; IF = 5mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 200
5
10
15
20
2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3
Forw
ard
Cur
rent
I F(m
A)
Forward Current IF (mA)
Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C
Forward Voltage VF (V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength λ (nm)
Forw
ard
Cur
rent
I F(m
A)
Maximum Current Vs TemperatureIF = f (T)
Temperature T(°C)
Ta
0
5
10
15
20
25
0 10 20 30 40 50 60 70 80 90 100 110
Ta = Ambient Temperature
Allo
wab
le F
orw
ard
Cur
rent
I F( m
A )
Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs )
Duty Ratio, %
10
100
1000
0.1 1 10 100
Relative Luminous Intensity Vs Forward CurrentIV/IV(5mA) = f(IF); Tj = 25°C
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Relative Spectral EmissionIrel = f(λ); Tj = 25°C; IF = 5mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 200
5
10
15
20
2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3
Forw
ard
Cur
rent
I F(m
A)
Forward Current IF (mA)
Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C
Forward Voltage VF (V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength λ (nm)
Forw
ard
Cur
rent
I F(m
A)
Maximum Current Vs TemperatureIF = f (T)
Temperature T(°C)
Ta
0
5
10
15
20
25
0 10 20 30 40 50 60 70 80 90 100 110
Ta = Ambient Temperature
Allo
wab
le F
orw
ard
Cur
rent
I F( m
A )
Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs )
Duty Ratio, %
10
100
1000
0.1 1 10 100
Relative Luminous Intensity Vs Forward CurrentIV/IV(5mA) = f(IF); Tj = 25°C
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Relative Spectral EmissionIrel = f(λ); Tj = 25°C; IF = 5mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 200
5
10
15
20
2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3Fo
rwar
d C
urre
nt I F
(mA)
Forward Current IF (mA)
Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C
Forward Voltage VF (V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength λ (nm)
Forw
ard
Cur
rent
I F(m
A)
Maximum Current Vs TemperatureIF = f (T)
Temperature T(°C)
Ta
0
5
10
15
20
25
0 10 20 30 40 50 60 70 80 90 100 110
Ta = Ambient Temperature
Allo
wab
le F
orw
ard
Cur
rent
I F( m
A )
Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs )
Duty Ratio, %
10
100
1000
0.1 1 10 100
Relative Luminous Intensity Vs Forward CurrentIV/IV(5mA) = f(IF); Tj = 25°C
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Relative Spectral EmissionIrel = f(λ); Tj = 25°C; IF = 5mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 200
5
10
15
20
2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3
Forw
ard
Cur
rent
I F(m
A)
Forward Current IF (mA)
Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C
Forward Voltage VF (V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength λ (nm)
Forw
ard
Cur
rent
I F(m
A)
Maximum Current Vs TemperatureIF = f (T)
Temperature T(°C)
Ta
0
5
10
15
20
25
0 10 20 30 40 50 60 70 80 90 100 110
Ta = Ambient Temperature
Allo
wab
le F
orw
ard
Cur
rent
I F( m
A )
Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs )
Duty Ratio, %
10
100
1000
0.1 1 10 100
Relative Luminous Intensity Vs Forward CurrentIV/IV(5mA) = f(IF); Tj = 25°C
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Relative Spectral EmissionIrel = f(λ); Tj = 25°C; IF = 5mA
∆Cx
∆Cy
-0.030
-0.025
-0.020
-0.015
-0.010
-0.005
0.000
0.005
0.010
0.015
0.020
0.025
0.030
0 5 10 15 20
Blue
-0.80
-0.60
-0.40
-0.20
0.00
0.20
0.40
0.60
0.80
0 10 20 30 40 50 60 70 80
Rel
ativ
e W
avel
engt
h λ r
el(n
m)
Relative Wavelength Shift Vs Forward Currentλdom = f(IF); Tj = 25°C
Forward Current IF (mA)
∆Cx,
∆C
y
Chromaticity Coordinate Shift Vs Forward Current∆Cx, ∆Cy = f(IF);Tj = 25°C
Forward Current IF (mA)
27/11/2018 V4.08
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Radiation Pattern
Junction Temperature Tj(°C)
Rel
ativ
e Fo
rwar
d Vo
ltage
∆V F (
V)
Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF =5mA
Junction Temperature Tj(°C)
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Relative Luminous Intensity Vs Junction TemperatureIV/IV(25°C) = f(Tj); IF = 5mA
Junction Temperature Tj(°C)
∆Cx
, ∆C
yChromaticity Coordinate Shift Vs Junction Temperature
∆Cx, ∆Cy = f(Tj); IF = 5mA
08/12/2016 V7.09
InGaN Warm White: DDF-LJGDOMINANTOpto TechnologiesInnovating Illumination
TM
Radiation Pattern
Junction Temperature Tj(°C)
Rel
ativ
e Fo
rwar
d Vo
ltage
∆V F (
V)
Junction Temperature Tj(°C)
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Relative Luminous Intensity Vs Junction TemperatureIV/IV(25°C) = f(Tj); IF = 20mA
Junction Temperature Tj(°C)
∆Cx
, ∆C
yChromaticity Coordinate Shift Vs Junction Temperature
∆Cx, ∆Cy = f(Tj); IF = 20mA
0.270°
90°
80°
0
60°
50°
40°
30° 20°
0.6
0.4
1.0
0.8
10° 0°
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
-50 -30 -10 10 30 50 70 90 110 1300.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -30 -10 10 30 50 70 90 110 130
Rel
ativ
e Fo
rwar
d Vo
ltage
∆V F
(V)
Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 20mA
Junction Temperature Tj(°C) Junction Temperature Tj(°C)
Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV = 20mA
Rela
tive
Lum
inou
s In
tens
ity I r
el
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
-50 -30 -10 10 30 50 70 90 110 1300.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -30 -10 10 30 50 70 90 110 130
Rel
ativ
e Fo
rwar
d Vo
ltage
∆V F
(V)
Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 20mA
Junction Temperature Tj(°C) Junction Temperature Tj(°C)
Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV = 20mA
Rela
tive
Lum
inou
s In
tens
ity I r
el
Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF =20mA
-10.0
-8.0
-6.0
-4.0
-2.0
0.0
2.0
4.0
6.0
8.0
10.0
-50 -30 -10 10 30 50 70 90 110 130
∆Cx
∆Cy
-0.030
-0.025
-0.020
-0.015
-0.010
-0.005
0.000
0.005
0.010
0.015
0.020
0.025
0.030
-50 -30 -10 10 30 50 70 90 110 130
Rel
ativ
e W
avel
engt
h ∆λ
dom
(nm
)
Relative Wavelength Vs Junction Temperature∆λdom = λdom - λdom (25°C) = f(Tj); IF = 20mA
∆Cx,
∆Cy
Chromaticity Coordinate Shift Vs Junction Temperature∆Cx, ∆Cy = f(Tj); IF = 20mA
Junction Temperature Tj(°C) Junction Temperature Tj(°C)
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
-50 -30 -10 10 30 50 70 90 1100.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -30 -10 10 30 50 70 90 110
Rel
ativ
e Fo
rwar
d Vo
ltage
∆V F
(V)
Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 5mA
Junction Temperature Tj(°C) Junction Temperature Tj(°C)
Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV =5mA
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
-50 -30 -10 10 30 50 70 90 1100.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -30 -10 10 30 50 70 90 110
Rel
ativ
e Fo
rwar
d Vo
ltage
∆V F
(V)
Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 5mA
Junction Temperature Tj(°C) Junction Temperature Tj(°C)
Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV =5mA
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
-10.0
-8.0
-6.0
-4.0
-2.0
0.0
2.0
4.0
6.0
8.0
10.0
-50 -30 -10 10 30 50 70 90 110 130
∆Cx
∆Cy
-0.05
-0.04
-0.03
-0.02
-0.01
0.00
0.01
0.02
0.03
0.04
0.05
-50 -30 -10 10 30 50 70 90 110
Rel
ativ
e W
avel
engt
h ∆λ
dom
(nm
)
Relative Wavelength Vs Junction Temperature∆λdom = λdom - λdom (25°C) = f(Tj); IF = 20mA
∆Cx,
∆C
y
Chromaticity Coordinate Shift Vs Junction Temperature∆Cx, ∆Cy = f(Tj); IF = 5mA
Junction Temperature Tj(°C) Junction Temperature Tj(°C)
27/11/2018 V4.09
Mini DomiLED • InGaN White: DNW-EJG-F1P5-I5 Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone
Sn Plating
Note : Primary thermal path is through Cathode lead of LED package
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
TM
14/06/2016 V3.08
PrimaxPlus • 180 InGaN White: MBWW-KZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone Resin
Au Plating
Note: This product is Pb free
180 InGaN White: MBWW-KZHGDOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
12/10/2016 V3.0
7
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14
PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx
Page 1 of 9
PRELIMINARY
UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to
change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.0
7
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.0
8
PrimaxPlus 100 InGaN White: PQW-SSG Package OutlinesInGaN White: PQW-SSG
DOMINANT
Opto Technologies
Innovating IlluminationTM
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13
PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx
Page 1 of 14
PRELIMINARY
UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to
change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG08/12/2016 V7.0
10
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.0
6
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.0
7
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14
PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx
Page 1 of 9
PRELIMINARY
UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to
change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.0
7
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.0
8
PrimaxPlus 100 InGaN White: PQW-SSG Package OutlinesInGaN White: PQW-SSG
DOMINANT
Opto Technologies
Innovating IlluminationTM
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13
PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx
Page 1 of 14
PRELIMINARY
UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to
change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG08/12/2016 V7.0
10
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.0
6
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
27/11/2018 V4.010
Recommended Solder Pad
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
TM
27/11/2018 V4.011
Taping and orientation
• Reels come in quantity of 3000 units.• Reel diameter is 180 mm.
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
TM
27/11/2018 V4.012
Packaging Specification
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
TM
08/12/2016 V7.013
Packaging Specification
InGaN Warm White: DDF-LJGDOMINANTOpto TechnologiesInnovating Illumination
TM
27/11/2018 V4.013
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
TM
Packaging Specification
Dimensions (mm)
190 ± 10Weight (gram)Packing Box 210 x 210 x 16
CardboardBoxDOMINANT
TM
Barcode Label
Barcode Label
Packing Sealing Label
Moisture sensitivity level
Moisture absorbent material +Moisture indicator
The reel, moisture absorbent material and moisture indicator aresealed inside the moisture proof foil bag
Reel
Barcode label
Label
(L) Lot No : lotno
(P) Part No : partno
(C) Cust No : partno
(G) Grouping : group
(Q) Quantity : quantity
(D) D/C : date code
(S) S/N : serial no
DOMINANT Opto TechnologiesML TEMP2 260˚CRoHS Compliant
Made in Malaysia
Average 1pc Mini DomiLED 1 completed bag (3000pcs)
Weight (gram) 0.007 200 ± 10
Dimensions (mm) Empty BoxWeight (kg)
Super Small
Small
Medium
Large
For Mini DomiLED
Reel / BoxCardboard BoxSize
325 x 225 x 190
325 x 225 x 280
570 x 440 x 230
570 x 440 x 460
0.38
0.54
1.46
1.92
9 reels MAX
15 reels MAX
60 reels MAX
120 reels MAX
27/11/2018 V4.014
Time (sec)0 50 100 150 200
300
250
225
200
175
150
125
100
75
50
25
275
Tem
pera
ture
(˚C
)Classification Reflow Profile (JEDEC J-STD-020C)
Ramp-up3˚C/sec max.
255-260˚C10-30s
60-150s
Ramp-down
6˚C/secmax.
Preheat 60-180s
480s max
217˚C
Recommended Pb-free Soldering Profile
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
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27/11/2018 V4.015
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
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Appendix
1) Brightness:
1.1 Luminous intensity is measured at current pulse 25 ms(typ) with an internal reproducibility of ± 8 % and an expanded
uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).
1.2 Luminous flux is measured at current pulse 25 ms(typ) with an internal reproducibility of ± 8 % and an expanded
uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).
1.3 Radiant intensity is measured at current pulse 25 ms(typ) with an internal reproducibility of ± 8 % and an expanded
uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).
1.4 Radiant flux is measured at current pulse 25 ms(typ) with an internal reproducibility of ± 8 % and an expanded uncertainty
of ± 11 % (according to GUM with a coverage factor of k=3).
2) Color:
2.1 Chromaticity coordinate groups are measured at current pulse 25 ms(typ) with an internal reproducibility of ± 0.005 and
an expanded uncertainty of ± 0.01 (accordingly to GUM with a coverage factor of k=3).
2.2 Dominant wavelength is measured at current pulse 25 ms(typ) with an internal reproducibility of ± 0.5nm and an
expanded uncertainty of ± 1nm (accordingly to GUM with a coverage factor of k=3).
3) Voltage:
3.1 Forward Voltage, Vf is measured when a current pulse of 8 ms(typ) with an internal reproducibility of ± 0.05V and an
expanded uncertainty of ± 0.1V (accordingly to GUM with a coverage factor of k=3).
4) Typical Values:
4.1 At special conditions of LED manufacturing processes, typical data or calculated correlations of technical parameters
only reflect the statistical figures. But not necessarily correspond to the actual parameters of each single product, which
could differ from the typical data or calculated correlations or the typical characteristic line. These typical data may
change whenever technical improvements happen.
5) Tolerance of Measure
5.1 Unless otherwise noted in drawing, tolerances are specified with ± 0.1 and dimension are specifiec in mm.
6) Reverse Voltage:
6.1 Not designed for reverse operation. Continuous reverse voltage can cause migration and LED damage.
Revision History
Page
-
1, 2, 15
11, 15
7, 13, 15
Subjects
Initial Release
Update FeaturesRedefine Part No from DNW-EJG-RS2-F1P5-I5 into
DNW-EJG-RS1-F1H5-I5DNW-EJG-R2S-I1L5-I5
DNW-EJG-R2S-M1P5-I5Add Appendix
Error on Taping and OrientationUpdate Appendix
Update Graph:-Relative Luminous Intensity Vs Forward Current Graph
-Forward current Vs Forward Voltage Graph-Chromaticity Coordinate Shift Vs Forward Current Graph
Update Product SpecificationUpdate Appendix
Date of Modification
22 Feb 2016
15 Aug 2016
06 Apr 2017
27 Nov 2018
27/11/2018 V4.016
NOTE
All the information contained in this document is considered to be reliable at the time of publishing. However, DOMINANT
Opto Technologies does not assume any liability arising out of the application or use of any product described herein.
DOMINANT Opto Technologies reserves the right to make changes to any products in order to improve reliability, function
or design.
DOMINANT Opto Technologies products are not authorized for use as critical components in life support devices or systems
without the express written approval from the Managing Director of DOMINANT Opto Technologies.
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
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About Us
DOMINANT Opto Technologies is a dynamic company that is amongst the world’s leading automotive LED manufac-turers. With an extensive industry experience and relentless pursuit of innovation, DOMINANT’s state-of-art manu-facturing and development capabilities have become a trusted and reliable brand across the globe. More information about DOMINANT Opto Technologies, an IATF 16949 and ISO 14001 certified company, can be found under http://www.dominant-semi.com.
Please contact us for more information:
DOMINANT Opto Technologies Sdn. BhdLot 6, Batu Berendam, FTZ Phase III, 75350 Melaka, Malaysia.Tel: +606 283 3566 Fax: +606 283 0566E-mail: [email protected]
DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination
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