dominant tm opto technologies mini domiled innovating

17
27/11/2018 V4.0 1 Features: > High brightness surface mount LED. > Based on InGaN technology. > 120° viewing angle. > Small package outline (LxWxH) of 2.0 x 1.4 x 1.3mm. > Qualified according to JEDEC moisture sensitivity Level 2. > Compatible to both IR reflow soldering. > Environmental friendly; RoHS compliance. > Compliance to automotive standard; AEC-Q101. > Passed Corrosion Resistant Test. Appx. 4.1 Mini DomiLED With the intense colors that seem to glow with energy and its significant brightness, Mini DomiLED white LED is a highly reliable design device. Its dynamic nature makes it perfect choice for lighthing applications, office and home applications and standard industrial applications. DATA SHEET: Mini DomiLED InGaN White : DNW-EJG-F1P5-I5 © 2005 DomiLED is a trademark of DOMINANT Opto Technologies. All rights reserved. Product specifications are subject to change without notice. Applications: > Automotive: interior applications, eg: switches, telematics, climate control system, dashboard, etc. > Communication: indicator and backlight in mobilephone. > Display: full color display video notice board. > Industry: white goods (eg: Oven, microwave, etc.). DOMINANT Opto Technologies Innovating Illumination TM

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Page 1: DOMINANT TM Opto Technologies Mini DomiLED Innovating

27/11/2018 V4.01

Features:> High brightness surface mount LED.> Based on InGaN technology.> 120° viewing angle.> Small package outline (LxWxH) of 2.0 x 1.4 x 1.3mm.> Qualified according to JEDEC moisture sensitivity Level 2.> Compatible to both IR reflow soldering.> Environmental friendly; RoHS compliance.> Compliance to automotive standard; AEC-Q101.> Passed Corrosion Resistant Test. Appx. 4.1

Mini DomiLEDWith the intense colors that seem to glow with energy and its significant brightness, Mini DomiLED white LED is a highly reliable design device. Its dynamic nature makes it perfect choice for lighthing applications, office and home applications and standard industrial applications.

DATA SHEET:

Mini DomiLEDInGaN White : DNW-EJG-F1P5-I5

© 2005 DomiLED is a trademark of DOMINANT Opto Technologies.All rights reserved. Product specifications are subject to change without notice.

Applications:> Automotive: interior applications, eg: switches, telematics, climate control system, dashboard, etc.> Communication: indicator and backlight in mobilephone.> Display: full color display video notice board.> Industry: white goods (eg: Oven, microwave, etc.).

DOMINANTOpto TechnologiesInnovating Illumination

TM

Page 2: DOMINANT TM Opto Technologies Mini DomiLED Innovating

27/11/2018 V4.02

Part OrderingNumber

Color ViewingAngle˚

Luminous Intensity @ 5mA (mcd) Appx. 1.1

DNW-EJG-RS1-F1H5-I5

DNW-EJG-R2S-I1L5-I5

DNW-EJG-R2S-M1P5-I5

White

White

White

120

120

120

112.5

140.0

140.0

Electrical Characteristics at Tj=250CVf @ If = 5 mA Appx. 3.1

2.9

Part NumberMin. (V) Typ. (V) Max. (V)

DNW-EJG 2.6 3.2

Optical Characteristics at Tj=250C

Min. Typ. Max.

180.0

224.0

224.0

224.0

285.0

285.0

Unit

Absolute Maximum RatingsMaximum Value

DC forward current

Peak pulse current; (tp ≤ 10µs, Duty cycle = 0.005)

Reverse voltage Appx. 6.1

ESD threshold (HBM)

LED junction temperature

Operating temperature

Storage temperature

Power dissipation (at room temperature)

Real Thermal resistance- Junction / ambient, Rth JA real- Junction / solder point, Rth JS real(Mounting on FR4 PCB, pad size >= 5 mm2 per pad)

20

100

5

2000

110

-40 … +100

-40 … +100

70

530230

mA

mA

V

V

˚C

˚C

˚C

mW

K/WK/W

Vr @ Ir = 10 µA Appx. 6.1

5.0

Min. (V)

DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination

TM

Page 3: DOMINANT TM Opto Technologies Mini DomiLED Innovating

27/11/2018 V4.03

DNW, Color Grouping Appx. 2.1

Color Bin Structure

Bin0.24980.20530.24020.21080.22690.21850.21360.22620.20030.23390.25970.22040.25090.22640.23880.23480.22670.24320.21460.2516

CxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCy

0.25890.20000.24980.20530.23880.23480.22670.24320.21460.25160.26820.21460.25970.22040.25090.22640.24160.26230.23120.2719

0.26820.21460.25970.22040.25090.22640.23880.23480.22670.24320.27750.22920.27000.23610.26240.24310.25200.25270.24160.2623

0.25970.22040.25090.22640.24020.21080.22690.21850.21360.22620.27000.23610.26240.24310.25200.25270.23880.23480.22670.2432

1 2 3 4

F1

F2

F3

F4

F5

G1

G2

G3

G4

G5

DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination

TM

0.18

0.20

0.22

0.24

0.26

0.28

0.30

0.32

0.34

0.36

0.38

0.40

0.42

0.44

0.46

0.18 0.20 0.22 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38

L

1

5

2

K

J

H

N

M

3

P

F

I

4

G

Page 4: DOMINANT TM Opto Technologies Mini DomiLED Innovating

27/11/2018 V4.04

Bin0.27000.23610.26240.24310.25200.25270.24160.26230.23120.27190.27970.25090.27330.25900.26460.27000.25590.28100.24720.29200.28980.26640.28480.27570.27800.28830.27120.30090.26440.31350.30070.28300.29710.29350.29220.30770.28730.32190.28240.33610.31130.29920.30900.31080.30600.32660.30300.34240.30000.3582

CxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCy

0.27750.22920.27000.23610.26240.24310.25590.28100.24720.29200.28610.24270.27970.25090.27330.25900.27120.30090.26440.31350.29500.25680.28980.26640.28480.27570.28730.32190.28240.33610.30450.27170.30070.28300.29710.29350.30300.34240.30000.35820.31380.28620.31130.29920.30900.31080.31830.36210.31700.3791

0.28610.24270.27970.25090.27330.25900.26460.27000.25590.28100.29500.25680.28980.26640.28480.27570.27800.28830.27120.30090.30450.27170.30070.28300.29710.29350.29220.30770.28730.32190.31380.28620.31130.29920.30900.31080.30600.32660.30300.34240.32310.30080.32190.31540.32090.32810.31960.34510.31830.3621

0.27970.25090.27330.25900.26460.27000.25200.25270.24160.26230.28980.26640.28480.27570.27800.28830.26460.27000.25590.28100.30070.28300.29710.29350.29220.30770.27800.28830.27120.30090.31130.29920.30900.31080.30600.32660.29220.30770.28730.32190.32190.31540.32090.32810.31960.34510.30600.32660.30300.3424

1 2 3 4

H1

H2

H3

H4

H5

I1

I2

I3

I4

I5

J1

J2

J3

J4

J5

K1

K2

K3

K4

K5

L1

L2

L3

L4

L5

DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination

TM

Page 5: DOMINANT TM Opto Technologies Mini DomiLED Innovating

27/11/2018 V4.05

Bin0.32190.31540.32090.32810.31960.34510.31830.36210.31700.37910.33350.31720.33390.33360.33410.34720.33490.38300.33530.40060.34470.33470.34650.35300.34790.36730.35170.40530.35360.4243

CxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCy

0.32310.30080.32190.31540.32090.32810.33490.38300.33530.40060.33390.33360.33410.34720.33450.36540.35170.40530.35360.42430.34650.35300.34790.36730.34980.38630.36870.42760.37190.4473

0.33350.31720.33390.33360.33410.34720.33450.36540.33490.38300.34650.35300.34790.36730.34980.38630.34980.38630.35170.40530.35990.37350.36230.38820.36550.40790.36550.40790.36870.4276

0.33390.33360.33410.34720.33450.36540.31960.34510.31830.36210.34470.33470.34650.35300.34790.36730.33450.36540.33490.38300.35670.35350.35990.37350.36230.38820.34980.38630.35170.4053

1 2 3 4

M1

M2

M3

M4

M5

N1

N2

N3

N4

N5

P1

P2

P3

P4

P5

DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination

TM

InGaN wavelength is very sensitive to drive current. Operating at lower current is not recommended and may yield unpredictable performance. Current pulsing should be used for dimming purposes.

Page 6: DOMINANT TM Opto Technologies Mini DomiLED Innovating

R1R2S1S2

112.5 ... 140.0140.0 ... 180.0180.0 ... 224.0224.0 ... 285.0

Brightness Group Luminous Intensity Appx. 1.1

IV (mcd)

Luminous Intensity Group at Tj=25˚C

27/11/2018 V4.06

DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination

TM

Page 7: DOMINANT TM Opto Technologies Mini DomiLED Innovating

27/11/2018 V4.07

DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination

TM

Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C

Forward Voltage VF (V)Forward Current IF (mA)

Forw

ard

Cur

rent

I F (m

A)

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

Relative Luminous Intensity Vs Forward CurrentIV/IV(5mA) = f(IF); Tj = 25°C

Forw

ard

Cur

rent

I F (m

A)

Temperature T(°C)

Maximum Current Vs TemperatureIF=f(T)

Forward Current IF (mA

Chromaticity Coordinate Shift Vs Forward Current∆Cx, ∆Cy = f(IF);Tj = 25°C

Relative Spectral EmissionIrel = f(λ); Tj = 25°C; IF = 5mA

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

Wavelength λ (nm)

Allo

wab

le F

orw

ard

Cur

rent

I F( m

A )

Duty Ratio, %

Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs )

∆Cx,

∆C

y

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0 5 10 15 200

5

10

15

20

2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3

Forw

ard

Curr

ent I

F(m

A)

Forward Current IF (mA)

Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C

Forward Voltage VF (V)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

350 400 450 500 550 600 650 700 750 800 850

Wavelength λ (nm)

Forw

ard

Curr

ent I

F(m

A)

Maximum Current Vs TemperatureIF = f (T)

Temperature T(°C)

Ta

0

5

10

15

20

25

0 10 20 30 40 50 60 70 80 90 100 110

Ta = Ambient Temperature

Allo

wab

le F

orw

ard

Cur

rent

I F( m

A )

Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs )

Duty Ratio, %

10

100

1000

0.1 1 10 100

Relative Luminous Intensity Vs Forward CurrentIV/IV(5mA) = f(IF); Tj = 25°C

Rela

tive

Lum

inou

s Int

ensi

ty I r

el

Rela

tive

Lum

inou

s Int

ensi

ty I r

el

Relative Spectral EmissionIrel = f(λ); Tj = 25°C; IF = 5mA

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0 5 10 15 200

5

10

15

20

2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3

Forw

ard

Cur

rent

I F(m

A)

Forward Current IF (mA)

Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C

Forward Voltage VF (V)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

350 400 450 500 550 600 650 700 750 800 850

Wavelength λ (nm)

Forw

ard

Cur

rent

I F(m

A)

Maximum Current Vs TemperatureIF = f (T)

Temperature T(°C)

Ta

0

5

10

15

20

25

0 10 20 30 40 50 60 70 80 90 100 110

Ta = Ambient Temperature

Allo

wab

le F

orw

ard

Cur

rent

I F( m

A )

Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs )

Duty Ratio, %

10

100

1000

0.1 1 10 100

Relative Luminous Intensity Vs Forward CurrentIV/IV(5mA) = f(IF); Tj = 25°C

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

Relative Spectral EmissionIrel = f(λ); Tj = 25°C; IF = 5mA

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0 5 10 15 200

5

10

15

20

2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3

Forw

ard

Cur

rent

I F(m

A)

Forward Current IF (mA)

Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C

Forward Voltage VF (V)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

350 400 450 500 550 600 650 700 750 800 850

Wavelength λ (nm)

Forw

ard

Cur

rent

I F(m

A)

Maximum Current Vs TemperatureIF = f (T)

Temperature T(°C)

Ta

0

5

10

15

20

25

0 10 20 30 40 50 60 70 80 90 100 110

Ta = Ambient Temperature

Allo

wab

le F

orw

ard

Cur

rent

I F( m

A )

Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs )

Duty Ratio, %

10

100

1000

0.1 1 10 100

Relative Luminous Intensity Vs Forward CurrentIV/IV(5mA) = f(IF); Tj = 25°C

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

Relative Spectral EmissionIrel = f(λ); Tj = 25°C; IF = 5mA

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0 5 10 15 200

5

10

15

20

2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3Fo

rwar

d C

urre

nt I F

(mA)

Forward Current IF (mA)

Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C

Forward Voltage VF (V)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

350 400 450 500 550 600 650 700 750 800 850

Wavelength λ (nm)

Forw

ard

Cur

rent

I F(m

A)

Maximum Current Vs TemperatureIF = f (T)

Temperature T(°C)

Ta

0

5

10

15

20

25

0 10 20 30 40 50 60 70 80 90 100 110

Ta = Ambient Temperature

Allo

wab

le F

orw

ard

Cur

rent

I F( m

A )

Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs )

Duty Ratio, %

10

100

1000

0.1 1 10 100

Relative Luminous Intensity Vs Forward CurrentIV/IV(5mA) = f(IF); Tj = 25°C

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

Relative Spectral EmissionIrel = f(λ); Tj = 25°C; IF = 5mA

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0 5 10 15 200

5

10

15

20

2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3

Forw

ard

Cur

rent

I F(m

A)

Forward Current IF (mA)

Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C

Forward Voltage VF (V)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

350 400 450 500 550 600 650 700 750 800 850

Wavelength λ (nm)

Forw

ard

Cur

rent

I F(m

A)

Maximum Current Vs TemperatureIF = f (T)

Temperature T(°C)

Ta

0

5

10

15

20

25

0 10 20 30 40 50 60 70 80 90 100 110

Ta = Ambient Temperature

Allo

wab

le F

orw

ard

Cur

rent

I F( m

A )

Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs )

Duty Ratio, %

10

100

1000

0.1 1 10 100

Relative Luminous Intensity Vs Forward CurrentIV/IV(5mA) = f(IF); Tj = 25°C

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

Relative Spectral EmissionIrel = f(λ); Tj = 25°C; IF = 5mA

∆Cx

∆Cy

-0.030

-0.025

-0.020

-0.015

-0.010

-0.005

0.000

0.005

0.010

0.015

0.020

0.025

0.030

0 5 10 15 20

Blue

-0.80

-0.60

-0.40

-0.20

0.00

0.20

0.40

0.60

0.80

0 10 20 30 40 50 60 70 80

Rel

ativ

e W

avel

engt

h λ r

el(n

m)

Relative Wavelength Shift Vs Forward Currentλdom = f(IF); Tj = 25°C

Forward Current IF (mA)

∆Cx,

∆C

y

Chromaticity Coordinate Shift Vs Forward Current∆Cx, ∆Cy = f(IF);Tj = 25°C

Forward Current IF (mA)

Page 8: DOMINANT TM Opto Technologies Mini DomiLED Innovating

27/11/2018 V4.08

DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination

TM

Radiation Pattern

Junction Temperature Tj(°C)

Rel

ativ

e Fo

rwar

d Vo

ltage

∆V F (

V)

Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF =5mA

Junction Temperature Tj(°C)

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

Relative Luminous Intensity Vs Junction TemperatureIV/IV(25°C) = f(Tj); IF = 5mA

Junction Temperature Tj(°C)

∆Cx

, ∆C

yChromaticity Coordinate Shift Vs Junction Temperature

∆Cx, ∆Cy = f(Tj); IF = 5mA

08/12/2016 V7.09

InGaN Warm White: DDF-LJGDOMINANTOpto TechnologiesInnovating Illumination

TM

Radiation Pattern

Junction Temperature Tj(°C)

Rel

ativ

e Fo

rwar

d Vo

ltage

∆V F (

V)

Junction Temperature Tj(°C)

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

Relative Luminous Intensity Vs Junction TemperatureIV/IV(25°C) = f(Tj); IF = 20mA

Junction Temperature Tj(°C)

∆Cx

, ∆C

yChromaticity Coordinate Shift Vs Junction Temperature

∆Cx, ∆Cy = f(Tj); IF = 20mA

0.270°

90°

80°

0

60°

50°

40°

30° 20°

0.6

0.4

1.0

0.8

10° 0°

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

-50 -30 -10 10 30 50 70 90 110 1300.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

-50 -30 -10 10 30 50 70 90 110 130

Rel

ativ

e Fo

rwar

d Vo

ltage

∆V F

(V)

Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 20mA

Junction Temperature Tj(°C) Junction Temperature Tj(°C)

Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV = 20mA

Rela

tive

Lum

inou

s In

tens

ity I r

el

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

-50 -30 -10 10 30 50 70 90 110 1300.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

-50 -30 -10 10 30 50 70 90 110 130

Rel

ativ

e Fo

rwar

d Vo

ltage

∆V F

(V)

Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 20mA

Junction Temperature Tj(°C) Junction Temperature Tj(°C)

Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV = 20mA

Rela

tive

Lum

inou

s In

tens

ity I r

el

Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF =20mA

-10.0

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

10.0

-50 -30 -10 10 30 50 70 90 110 130

∆Cx

∆Cy

-0.030

-0.025

-0.020

-0.015

-0.010

-0.005

0.000

0.005

0.010

0.015

0.020

0.025

0.030

-50 -30 -10 10 30 50 70 90 110 130

Rel

ativ

e W

avel

engt

h ∆λ

dom

(nm

)

Relative Wavelength Vs Junction Temperature∆λdom = λdom - λdom (25°C) = f(Tj); IF = 20mA

∆Cx,

∆Cy

Chromaticity Coordinate Shift Vs Junction Temperature∆Cx, ∆Cy = f(Tj); IF = 20mA

Junction Temperature Tj(°C) Junction Temperature Tj(°C)

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

-50 -30 -10 10 30 50 70 90 1100.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

-50 -30 -10 10 30 50 70 90 110

Rel

ativ

e Fo

rwar

d Vo

ltage

∆V F

(V)

Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 5mA

Junction Temperature Tj(°C) Junction Temperature Tj(°C)

Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV =5mA

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

-50 -30 -10 10 30 50 70 90 1100.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

-50 -30 -10 10 30 50 70 90 110

Rel

ativ

e Fo

rwar

d Vo

ltage

∆V F

(V)

Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 5mA

Junction Temperature Tj(°C) Junction Temperature Tj(°C)

Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV =5mA

Rel

ativ

e Lu

min

ous

Inte

nsity

I rel

-10.0

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

10.0

-50 -30 -10 10 30 50 70 90 110 130

∆Cx

∆Cy

-0.05

-0.04

-0.03

-0.02

-0.01

0.00

0.01

0.02

0.03

0.04

0.05

-50 -30 -10 10 30 50 70 90 110

Rel

ativ

e W

avel

engt

h ∆λ

dom

(nm

)

Relative Wavelength Vs Junction Temperature∆λdom = λdom - λdom (25°C) = f(Tj); IF = 20mA

∆Cx,

∆C

y

Chromaticity Coordinate Shift Vs Junction Temperature∆Cx, ∆Cy = f(Tj); IF = 5mA

Junction Temperature Tj(°C) Junction Temperature Tj(°C)

Page 9: DOMINANT TM Opto Technologies Mini DomiLED Innovating

27/11/2018 V4.09

Mini DomiLED • InGaN White: DNW-EJG-F1P5-I5 Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone

Sn Plating

Note : Primary thermal path is through Cathode lead of LED package

DNW-EJG-F1P5-I5DOMINANTOpto TechnologiesInnovating Illumination

TM

14/06/2016 V3.08

PrimaxPlus • 180 InGaN White: MBWW-KZHG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Au Plating

High Temperature Resistant Plastic

Silicone Resin

Au Plating

Note: This product is Pb free

180 InGaN White: MBWW-KZHGDOMINANTOpto TechnologiesInnovating Illumination

TM

Note : Primary thermal path is through Cathode lead of LED package.

12/10/2016 V3.0

7

PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads

Cu Alloy With Au Plating

High Temperature Resistant Plastic

Silicone

Au Plating

DOMINANT

Opto Technologies

Innovating IlluminationTM

Note: This product is Pb free

350 InGaN Yellow: MAZY-YZHG

Note : Primary thermal path is through Cathode lead of LED package.

DOMINANT Opto Technologies

09/05/14

PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx

Page 1 of 9

PRELIMINARY

UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to

change without notice.

Super high brightness surface mount LED for automotive applications.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance;

Superior corrosion robustness.

Compatible to IR reflow soldering.

PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.0

7

Primax • 175 InGaN White: MBWW-FSC Package Outlines

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Ag Plating

DOMINANT

Opto Technologies

Innovating IlluminationTM

Note: This product is Pb free

175 InGaN White: MBWW-FSC

18/04/2016 V1.0

8

PrimaxPlus 100 InGaN White: PQW-SSG Package OutlinesInGaN White: PQW-SSG

DOMINANT

Opto Technologies

Innovating IlluminationTM

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Sn Plating

Note: This product is Pb free

DOMINANT Opto Technologies

24/09/13

PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx

Page 1 of 14

PRELIMINARY

UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to

change without notice.

Super high brightness surface mount LED.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance.

Compatible to IR reflow soldering.

PrimaxPlus 100mA Warm White: MAF-PSC

Note : Primary thermal path is through Cathode lead of LED package

InGaN Warm White: DDF-LJG08/12/2016 V7.0

10

DomiLED • InGaN Warm White: DDF-LJG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANT

Opto Technologies

Innovating IlluminationTM

Note : Primary thermal path is through Cathode lead of LED package.

07/07/2011 V4.0

6

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANT

Opto Technologies

Innovating IlluminationTM

07/07/2011 V4.06

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

12/10/2016 V3.07

PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Au Plating

High Temperature Resistant Plastic

Silicone

Au Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note: This product is Pb free

350 InGaN Yellow: MAZY-YZHG

Note : Primary thermal path is through Cathode lead of LED package.

DOMINANT Opto Technologies

09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9

PRELIMINARY UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to change without notice.

Super high brightness surface mount LED for automotive applications.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance;

Superior corrosion robustness.

Compatible to IR reflow soldering.

PrimaxPlus 350mA White: MAW-YZHG

31/05/2013 V1.07

Primax • 175 InGaN White: MBWW-FSC Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Ag Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note: This product is Pb free

175 InGaN White: MBWW-FSC

18/04/2016 V1.08

PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines

InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination

TM

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Sn Plating

Note: This product is Pb free

DOMINANT Opto Technologies

24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14

PRELIMINARY UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to change without notice.

Super high brightness surface mount LED.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance.

Compatible to IR reflow soldering.

PrimaxPlus 100mA Warm White: MAF-PSC

Note : Primary thermal path is through Cathode lead of LED package

InGaN Warm White: DDF-LJG

08/12/2016 V7.010

DomiLED • InGaN Warm White: DDF-LJG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note : Primary thermal path is through Cathode lead of LED package.

07/07/2011 V4.06

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

07/07/2011 V4.06

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

12/10/2016 V3.07

PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Au Plating

High Temperature Resistant Plastic

Silicone

Au Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note: This product is Pb free

350 InGaN Yellow: MAZY-YZHG

Note : Primary thermal path is through Cathode lead of LED package.

DOMINANT Opto Technologies

09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9

PRELIMINARY UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to change without notice.

Super high brightness surface mount LED for automotive applications.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance;

Superior corrosion robustness.

Compatible to IR reflow soldering.

PrimaxPlus 350mA White: MAW-YZHG

31/05/2013 V1.07

Primax • 175 InGaN White: MBWW-FSC Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Ag Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note: This product is Pb free

175 InGaN White: MBWW-FSC

18/04/2016 V1.08

PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines

InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination

TM

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Sn Plating

Note: This product is Pb free

DOMINANT Opto Technologies

24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14

PRELIMINARY UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to change without notice.

Super high brightness surface mount LED.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance.

Compatible to IR reflow soldering.

PrimaxPlus 100mA Warm White: MAF-PSC

Note : Primary thermal path is through Cathode lead of LED package

InGaN Warm White: DDF-LJG

08/12/2016 V7.010

DomiLED • InGaN Warm White: DDF-LJG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note : Primary thermal path is through Cathode lead of LED package.

07/07/2011 V4.06

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

07/07/2011 V4.06

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

12/10/2016 V3.07

PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Au Plating

High Temperature Resistant Plastic

Silicone

Au Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note: This product is Pb free

350 InGaN Yellow: MAZY-YZHG

Note : Primary thermal path is through Cathode lead of LED package.

DOMINANT Opto Technologies

09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9

PRELIMINARY UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to change without notice.

Super high brightness surface mount LED for automotive applications.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance;

Superior corrosion robustness.

Compatible to IR reflow soldering.

PrimaxPlus 350mA White: MAW-YZHG

31/05/2013 V1.07

Primax • 175 InGaN White: MBWW-FSC Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Ag Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note: This product is Pb free

175 InGaN White: MBWW-FSC

18/04/2016 V1.08

PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines

InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination

TM

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Sn Plating

Note: This product is Pb free

DOMINANT Opto Technologies

24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14

PRELIMINARY UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to change without notice.

Super high brightness surface mount LED.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance.

Compatible to IR reflow soldering.

PrimaxPlus 100mA Warm White: MAF-PSC

Note : Primary thermal path is through Cathode lead of LED package

InGaN Warm White: DDF-LJG

08/12/2016 V7.010

DomiLED • InGaN Warm White: DDF-LJG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note : Primary thermal path is through Cathode lead of LED package.

07/07/2011 V4.06

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

07/07/2011 V4.06

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

12/10/2016 V3.0

7

PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads

Cu Alloy With Au Plating

High Temperature Resistant Plastic

Silicone

Au Plating

DOMINANT

Opto Technologies

Innovating IlluminationTM

Note: This product is Pb free

350 InGaN Yellow: MAZY-YZHG

Note : Primary thermal path is through Cathode lead of LED package.

DOMINANT Opto Technologies

09/05/14

PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx

Page 1 of 9

PRELIMINARY

UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to

change without notice.

Super high brightness surface mount LED for automotive applications.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance;

Superior corrosion robustness.

Compatible to IR reflow soldering.

PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.0

7

Primax • 175 InGaN White: MBWW-FSC Package Outlines

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Ag Plating

DOMINANT

Opto Technologies

Innovating IlluminationTM

Note: This product is Pb free

175 InGaN White: MBWW-FSC

18/04/2016 V1.0

8

PrimaxPlus 100 InGaN White: PQW-SSG Package OutlinesInGaN White: PQW-SSG

DOMINANT

Opto Technologies

Innovating IlluminationTM

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Sn Plating

Note: This product is Pb free

DOMINANT Opto Technologies

24/09/13

PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx

Page 1 of 14

PRELIMINARY

UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to

change without notice.

Super high brightness surface mount LED.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance.

Compatible to IR reflow soldering.

PrimaxPlus 100mA Warm White: MAF-PSC

Note : Primary thermal path is through Cathode lead of LED package

InGaN Warm White: DDF-LJG08/12/2016 V7.0

10

DomiLED • InGaN Warm White: DDF-LJG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANT

Opto Technologies

Innovating IlluminationTM

Note : Primary thermal path is through Cathode lead of LED package.

07/07/2011 V4.0

6

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANT

Opto Technologies

Innovating IlluminationTM

07/07/2011 V4.06

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

12/10/2016 V3.07

PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Au Plating

High Temperature Resistant Plastic

Silicone

Au Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note: This product is Pb free

350 InGaN Yellow: MAZY-YZHG

Note : Primary thermal path is through Cathode lead of LED package.

DOMINANT Opto Technologies

09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9

PRELIMINARY UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to change without notice.

Super high brightness surface mount LED for automotive applications.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance;

Superior corrosion robustness.

Compatible to IR reflow soldering.

PrimaxPlus 350mA White: MAW-YZHG

31/05/2013 V1.07

Primax • 175 InGaN White: MBWW-FSC Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Ag Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note: This product is Pb free

175 InGaN White: MBWW-FSC

18/04/2016 V1.08

PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines

InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination

TM

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Sn Plating

Note: This product is Pb free

DOMINANT Opto Technologies

24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14

PRELIMINARY UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to change without notice.

Super high brightness surface mount LED.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance.

Compatible to IR reflow soldering.

PrimaxPlus 100mA Warm White: MAF-PSC

Note : Primary thermal path is through Cathode lead of LED package

InGaN Warm White: DDF-LJG

08/12/2016 V7.010

DomiLED • InGaN Warm White: DDF-LJG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note : Primary thermal path is through Cathode lead of LED package.

07/07/2011 V4.06

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

07/07/2011 V4.06

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

12/10/2016 V3.07

PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Au Plating

High Temperature Resistant Plastic

Silicone

Au Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note: This product is Pb free

350 InGaN Yellow: MAZY-YZHG

Note : Primary thermal path is through Cathode lead of LED package.

DOMINANT Opto Technologies

09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9

PRELIMINARY UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to change without notice.

Super high brightness surface mount LED for automotive applications.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance;

Superior corrosion robustness.

Compatible to IR reflow soldering.

PrimaxPlus 350mA White: MAW-YZHG

31/05/2013 V1.07

Primax • 175 InGaN White: MBWW-FSC Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Ag Plating

DOMINANTOpto TechnologiesInnovating Illumination

TM

Note: This product is Pb free

175 InGaN White: MBWW-FSC

18/04/2016 V1.08

PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines

InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination

TM

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic

Silicone Resin

Sn Plating

Note: This product is Pb free

DOMINANT Opto Technologies

24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14

PRELIMINARY UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to change without notice.

Super high brightness surface mount LED.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance.

Compatible to IR reflow soldering.

PrimaxPlus 100mA Warm White: MAF-PSC

Note : Primary thermal path is through Cathode lead of LED package

InGaN Warm White: DDF-LJG

08/12/2016 V7.010

DomiLED • InGaN Warm White: DDF-LJG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

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Note : Primary thermal path is through Cathode lead of LED package.

07/07/2011 V4.06

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

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07/07/2011 V4.06

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Ag Plating

High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

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27/11/2018 V4.010

Recommended Solder Pad

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Taping and orientation

• Reels come in quantity of 3000 units.• Reel diameter is 180 mm.

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Packaging Specification

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08/12/2016 V7.013

Packaging Specification

InGaN Warm White: DDF-LJGDOMINANTOpto TechnologiesInnovating Illumination

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Packaging Specification

Dimensions (mm)

190 ± 10Weight (gram)Packing Box 210 x 210 x 16

CardboardBoxDOMINANT

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Barcode Label

Barcode Label

Packing Sealing Label

Moisture sensitivity level

Moisture absorbent material +Moisture indicator

The reel, moisture absorbent material and moisture indicator aresealed inside the moisture proof foil bag

Reel

Barcode label

Label

(L) Lot No : lotno

(P) Part No : partno

(C) Cust No : partno

(G) Grouping : group

(Q) Quantity : quantity

(D) D/C : date code

(S) S/N : serial no

DOMINANT Opto TechnologiesML TEMP2 260˚CRoHS Compliant

Made in Malaysia

Average 1pc Mini DomiLED 1 completed bag (3000pcs)

Weight (gram) 0.007 200 ± 10

Dimensions (mm) Empty BoxWeight (kg)

Super Small

Small

Medium

Large

For Mini DomiLED

Reel / BoxCardboard BoxSize

325 x 225 x 190

325 x 225 x 280

570 x 440 x 230

570 x 440 x 460

0.38

0.54

1.46

1.92

9 reels MAX

15 reels MAX

60 reels MAX

120 reels MAX

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Time (sec)0 50 100 150 200

300

250

225

200

175

150

125

100

75

50

25

275

Tem

pera

ture

(˚C

)Classification Reflow Profile (JEDEC J-STD-020C)

Ramp-up3˚C/sec max.

255-260˚C10-30s

60-150s

Ramp-down

6˚C/secmax.

Preheat 60-180s

480s max

217˚C

Recommended Pb-free Soldering Profile

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Appendix

1) Brightness:

1.1 Luminous intensity is measured at current pulse 25 ms(typ) with an internal reproducibility of ± 8 % and an expanded

uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).

1.2 Luminous flux is measured at current pulse 25 ms(typ) with an internal reproducibility of ± 8 % and an expanded

uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).

1.3 Radiant intensity is measured at current pulse 25 ms(typ) with an internal reproducibility of ± 8 % and an expanded

uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).

1.4 Radiant flux is measured at current pulse 25 ms(typ) with an internal reproducibility of ± 8 % and an expanded uncertainty

of ± 11 % (according to GUM with a coverage factor of k=3).

2) Color:

2.1 Chromaticity coordinate groups are measured at current pulse 25 ms(typ) with an internal reproducibility of ± 0.005 and

an expanded uncertainty of ± 0.01 (accordingly to GUM with a coverage factor of k=3).

2.2 Dominant wavelength is measured at current pulse 25 ms(typ) with an internal reproducibility of ± 0.5nm and an

expanded uncertainty of ± 1nm (accordingly to GUM with a coverage factor of k=3).

3) Voltage:

3.1 Forward Voltage, Vf is measured when a current pulse of 8 ms(typ) with an internal reproducibility of ± 0.05V and an

expanded uncertainty of ± 0.1V (accordingly to GUM with a coverage factor of k=3).

4) Typical Values:

4.1 At special conditions of LED manufacturing processes, typical data or calculated correlations of technical parameters

only reflect the statistical figures. But not necessarily correspond to the actual parameters of each single product, which

could differ from the typical data or calculated correlations or the typical characteristic line. These typical data may

change whenever technical improvements happen.

5) Tolerance of Measure

5.1 Unless otherwise noted in drawing, tolerances are specified with ± 0.1 and dimension are specifiec in mm.

6) Reverse Voltage:

6.1 Not designed for reverse operation. Continuous reverse voltage can cause migration and LED damage.

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Revision History

Page

-

1, 2, 15

11, 15

7, 13, 15

Subjects

Initial Release

Update FeaturesRedefine Part No from DNW-EJG-RS2-F1P5-I5 into

DNW-EJG-RS1-F1H5-I5DNW-EJG-R2S-I1L5-I5

DNW-EJG-R2S-M1P5-I5Add Appendix

Error on Taping and OrientationUpdate Appendix

Update Graph:-Relative Luminous Intensity Vs Forward Current Graph

-Forward current Vs Forward Voltage Graph-Chromaticity Coordinate Shift Vs Forward Current Graph

Update Product SpecificationUpdate Appendix

Date of Modification

22 Feb 2016

15 Aug 2016

06 Apr 2017

27 Nov 2018

27/11/2018 V4.016

NOTE

All the information contained in this document is considered to be reliable at the time of publishing. However, DOMINANT

Opto Technologies does not assume any liability arising out of the application or use of any product described herein.

DOMINANT Opto Technologies reserves the right to make changes to any products in order to improve reliability, function

or design.

DOMINANT Opto Technologies products are not authorized for use as critical components in life support devices or systems

without the express written approval from the Managing Director of DOMINANT Opto Technologies.

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About Us

DOMINANT Opto Technologies is a dynamic company that is amongst the world’s leading automotive LED manufac-turers. With an extensive industry experience and relentless pursuit of innovation, DOMINANT’s state-of-art manu-facturing and development capabilities have become a trusted and reliable brand across the globe. More information about DOMINANT Opto Technologies, an IATF 16949 and ISO 14001 certified company, can be found under http://www.dominant-semi.com.

Please contact us for more information:

DOMINANT Opto Technologies Sdn. BhdLot 6, Batu Berendam, FTZ Phase III, 75350 Melaka, Malaysia.Tel: +606 283 3566 Fax: +606 283 0566E-mail: [email protected]

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