doping and oxidationlampx.tugraz.at/~hadley/memm/lectures17/apr27.pdf · 2017-05-04 · add donors...
TRANSCRIPT
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Institute of Solid State Physics
Doping and Oxidation
Technische Universität Graz
Peter Hadley
Franssila: Chapters 13,14, 15
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Add donors (n-type) or acceptors (p-type)1012 cm-3 impurity limit1021 cm-3 solubility limit
Doping
Dopants added during crystal growth (whole wafer)neutron transmutation (whole wafer)during epitaxy (layers)diffusion (local)ion implantation (local)
Institute of Solid State PhysicsTechnische Universität Graz
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Doping determines the carrier concentration
http://lamp.tu-graz.ac.at/~hadley/psd/L4/eftplot.html
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images from wikipedia
Czochralski Process
add dopants to the melt
Crystal growth
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Neutron transmutation
30Si + n 31Si + 31Si 31P +
image from wikipedia
Float zone Process
Crystal growth
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image from wikipedia
Chemical vapor deposition
Epitaxial silicon CVD SiH4 (silane) or SiH2Cl2 (dichlorosilane)PH3 (phosphine) for n-doping or B2H6 (diborane) for p-doping.
The doping can be adjusted in layers.
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http://www.microfab.de/foundry/services/diffusion/index.html
Gas phase diffusion
AsH3 (Arsine) or PH3 (phosphine) for n-doping B2H6 (diborane) for p-doping.100 - 200 wafers in a batch.
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Gas phase diffusion
C1000 C for 1 hour ~ 1 m
Fransila
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0( ) erfc2
zC z CDt
2dC D Cdt
Diffusion equation
For a constant source concentration C0 at the surface:
2
0
2erfc 1x
tx e dt
The concentration decreases about linearly
Constant Source Diffusion
2erfc 1 zz
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Limited Source Diffusion
20( ) exp
44C w zC z
DtDt
2dC D Cdt
Diffusion equation
For a limited source concentration C0 at the surface: w
C0
20( ) 1
44C w zC z
DtDt
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Diffusion is thermally activated
0 exp A
B
ED Dk T
0
04 exp A
B
EL D tk T
Diffusion length
For P diffusion, 1 h, at 1200 T = 1473 KL = 1.3 m
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Diffusion
Interstitials and vacancies diffuse quickly and assist the dopants.
BH3 diffuses faster than B.
Diffusion depends on doping concentration.
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Solid solubility limits
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Predeposition/Drive-in
Predeposition processspin-on glassion implantationconstant source diffusion
Drive-in processlimited source diffusion
Oxide diffusion mask ~ 500 nm
SiO2SiO2
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Patterned dopant regions
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Ion implantation
X-rays are generated
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Ion implantation
More accurate control of concentrationBetter lateral confinementLow temperatureComplex profiles through multiple implantationsLess sensitive to surface preparationRequires an anneal to eliminate damage and activate dopantsDopants diffuse during the annealPossible to implant above the solubility limit
http://slideplayer.com/slide/2412041/
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Photoresist, oxide, or nitride. Should be thicker than projected range. High doses burn the photoresist on and make it hard to remove.
Most dopants are at the projected range Rp.
Ion implantation
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Ion implantation
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http://www.appliedmaterials.com/products/vantage-radianceplus-rtp
Rapid thermal anneal (RTA)
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Channeling
Ions travel deep into the crystal when the beam is aligned with a crystal axis. Implantation is often done at 7 off-axis to avoid channeling. o
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http://www.ion-beam-services.com/services2.htm
Plasma immersion ion implantation
Flat panel displays and solar panels.
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Oxidation
Thin gate oxide ~ 1 nm in MOSFETsTunnel barriers in flash memoryDielectrics in capacitorsElectrical isolation of componentsPassivation layer to protect the circuitsOxide masks for diffusion and implantation
Native oxide ~ 1 nm grows in air in hours but is not good quality
Thermal oxide - grows slowly, best quality
Deposited oxide - grows quicker, less quality
The properties of SiO2 were more important than Si in making Si the dominant semiconductor material.
Institute of Solid State PhysicsTechnische Universität Graz
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Dry oxidation
1 hour at 900 C produces 30 nm of thermal oxide.
Used for gate oxide in MOSFETs and tunnel oxide flash memories.
Good layer control. Low defect density at the Si/SiO2 interface.
Si (s) + O2 (g) SiO2 (s)
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Wet oxidation
The water is steam.
1 hour at 900 C produces 130 nm of thermal oxide.
Faster growth than dry oxidation.
Si (s) + 2H2O (g) SiO2 (s) + 2H2 (g)
http://en.wikipedia.org/wiki/Thermal_oxidation
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CVD oxides
Can be deposited at lower temperature
Rougher surfaces, lower breakdown field, higher etch rate in HF
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Deal-Grove oxidation model
2 4( )2
A A Btz t
00
exp expA A
B B
E EB BB Bk T A A k T
Oxide thickness z is first linear then grows like a square root
The constants are thermally activated
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Deal-Grove oxidation model
Wet
Dry
Linear dependence: Limited by the reaction rate of Si and O2 to SiO2
Square root behavior:Limited by oxygen diffusion through the oxide.
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http://www.nanolabtechnologies.com/
SiO2 is amorphous
gate oxide
Dit 109–1011/cm2
defects at the interface
1015 atoms/cm2
Post oxidation anneal (N2 then H2) to passivate dangling bonds
Fransila
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Oxides are under compressive stress
Typical stress is 300 MPaStress will bow the wafer
densityquartz 2.65 g/cm3
oxide 2.2 g/cm3
Young's modulusquartz 107 GPaoxide 87 GPa
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Stoney's formula
2
6 (1 )s s
ff s
E hh
The stress f in the film depends on Es Young's modulus in the substratevs Poisson's ratio of the substratehs thickness of the substratehf thickness of the film curvature Only holds for uniform curvature
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Local Oxidation of Silicon (LOCOS)
thin pad oxide for stress relief
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Controlled removal of Si
1. Thermal oxidation (good control of thickness)
2. Etch Oxide with HF
Period doubling of pattern
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Controlled removal of Si
Fransila
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Complementary Metal Oxide Semiconductor (CMOS)
The dominant technology for microprocessors
Low power dissipation through the use of n-type and p-type MOSFETs
Institute of Solid State PhysicsTechnische Universität Graz