the art of metrologyTM
3D IC?3D Metrology !
Presentation at SEMICON Europa 2015 TechLOUNGEWednesday, 07. October 2015, 16:15
FRT, Fries Research & Technology GmbHDr. Bastian Marheinekewww.frt-gmbh.com
Visit us at booth 1241
the art of metrologyTMvisit us at booth 1241
Distributors:approx. 20 in 18 countries
Founded 1995 by Dr. Thomas FriesPresidents: Dr. Thomas Fries, Dr. Bastian MarheinekeSubsidiaries in US and ChinaDistribution and service partners in Asia and EuropeDelivered more than 600 metrology tools world wide
Company Introduction
the art of metrologyTMvisit us at booth 1241
Distributors:approx. 20 in 18 countries
Development of optical 3D surface metrology systems:
� Measurement of topography, film thickness etc.� Multi sensor tools� Sensor development� Development of control and analysis software� Integration and automation� Contract measurements
� Global distribution and service network� Member in professional associations� Member in committees for standardization
Company Introduction
the art of metrologyTMvisit us at booth 1241
Multi Sensor Metrology Modular Software Set Up
Modular Hardware Set UpMeasurement Solutions Variety
Company Introduction
the art of metrologyTMvisit us at booth 1241
Multi sensor technology for flexible metrology syst ems
� FRT offers various sensors giving 4 basic combinati on options:
FRT Multi Sensor Technology
the art of metrologyTMvisit us at booth 1241
Fully Integrated Production Tool
Tabletop Unit
FRT ProductsFRT standard systems for various industries
the art of metrologyTMvisit us at booth 1241
MicroProf ® 100100 mm x 150 mm
MicroProf ® 300305 mm x 415 mm
MicroProf ® 200200 mm x 250 mm
Identical technology – different sizes!
MicroProf ® Series – 3D IC ApplicationCompact Multi-Sensor Systems for R&D, Production a nd QA
the art of metrologyTMvisit us at booth 1241
MicroProf ® Series – 3D IC ApplicationFully Automated Wafer Metrology Tool
MicroProf ® 200 MHUMulti Sensor metrology tool with 200 mm stage and material handling unit
MicroProf ® 300 TTV MHUMulti Sensor metrology tool with 300 mm stage, sensor setup for wafer thickness measurement (TTV), fully automated
SEMI CompliantTTV Measurement
FRT MFE - Metrology for FrontendFully automated Multi Sensor metrology tool with 300 mm stage, bridge tool, class 1 EFEM, SECS/GEM interface, thin wafer handling optional
Identical technology – fully automated!
the art of metrologyTMvisit us at booth 1241
MicroProf ® Series – 3D IC ApplicationWafer Metrology Tool
Bow Warp TTV SBID Sori SFQR Sag ProfileRoughness 3D map LTV Thickness TIR
FPD Stress ROA Film Thickness Step Height …
One Metrology Tool for All Wafer Tasks !!!
GaAs / InP / Sapphire / GaN / SiC / Si / …
saw/grinding
epitaxy
pre/post polishing
device fabrication
pre/post PSS
thinning
the art of metrologyTMvisit us at booth 1241
MicroProf ® Series – 3D IC ApplicationWafer Metrology Tool in 3D IC
Application in 3D IC
Picture courtesy:High performance interposer for network processingG. Kimmich, Jan. 2015, European 3D TSV 2015
TSV
Interposer
Backgrinding
Trenches
Bumps / µ-Bumps
Thin film measurement
Step height / width
TSV / trench depth / width
Bump analysis
Bulk thickness
Stress
T-dependent topography
Metal Contacts
Photo Resist
BGA
RDL / UBM
Reflow soldering
Multiple measurement methods in one tool
the art of metrologyTMvisit us at booth 1241ASMC2015: Optical step height and trench depth measurement , F.Heider et al. Infineon/FRT
standard deviation for 12 weeksdynamic repeatability test = 9 nm (0.17 %)
step height = 5.2 µmstep width = 12 µm
FRT CWL point sensors
� chromatic white light sensor� optical measurement � fast and non contact� down to 6 nm vertical resolution� 2 µm lateral resolution� 4 kHz measuring frequency
also determines roughness according to international standards
MicroProf ® Series – 3D IC ApplicationAnalysis of step height / width
the art of metrologyTMvisit us at booth 1241
standard deviation for 12 weeksdynamic repeatability test = 63 nm (0.03 %)
trench depth = 225.9 µmtrench width = 24.8 µm
ASMC2015: Optical step height and trench depth measurement , F.Heider et al. Infineon/FRT
FRT WLI PL field of view sensors
� white light interferometer� field of view sensor� non-contact and non-destructive� very fast 3D topography measurement with
one-shot technology� deep surface measurement without shadowing
effects due to coaxial illumination� field of view 1 x 1 mm² to 85 x 85 mm²� lateral resolution 1 µm ~ 150 µm� vertical resolution 10 ~ 30 nm
MicroProf ® Series – 3D IC ApplicationAnalysis of trenches
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Via Arrays 5 µm – 100 µm
Single Via 40 µm / 250 µm
Multiple Vias 15 µm – 80 µm Multiple Vias 5 µm / 70 µm
MicroProf ® Series – 3D IC ApplicationAnalysis of TSV
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FRT WLI FL field of view sensors
� white light interferometer� field of view sensor� non-contact and non-destructive� very fast 3D topography measurement
with one-shot technology� sub-nanometer vertical resolution,
sub-micrometer lateral resolution� field of view 0.26 x 0.35 mm²
to 1.3 x 1.74 mm²� lateral resolution 0.6 µm ~ 2.3 µm� vertical resolution 0.1 ~ 1.0 nm
Analysis of Trench and TSV structures < 1µm!
MicroProf ® Series – 3D IC ApplicationAnalysis of Trenches and TSV
the art of metrologyTMvisit us at booth 1241
FRT CFM field of view sensors
� confocal microscope� field of view sensor� non-contact and non-destructive� very fast 3D topography measurement
with one-shot technology� nanometer vertical resolution,
sub-micrometer lateral resolution� field of view 0.14 x 0.19 mm²
to 0.72 x 0.96 mm²� lateral resolution 0.37 ~ 1.23 µm� vertical resolution 1 ~ 3 nm
Fully automated bump field analysis:Statistics on bump height, diameter, co-planarity, etc.
MicroProf ® Series – 3D IC ApplicationAnalysis of Bumps / Micro Bumps
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No. T[nm] (n,k)
1 3079 SiO2.nk2 456 Si3N4$.nk3 750000 Si.nk
Fit results from centre measurement
FRT FTR film thickness sensor
� UV/VIS/NIR interferometric sensor� optical measurement – non contact� fit algorithm (up to 10 layers)� iterative FFT / fit analysis� 20 nm ~ 230 µm range� better 1% (1 nm) thickness resolution � 100 ~ 400 µm lateral resolution� ~ 5 µm high resolution with optics
SiO2 / Si3N4 on Si substrate
MicroProf ® Series – 3D IC ApplicationAnalysis of single and multilayer film thickness
the art of metrologyTMvisit us at booth 1241
FRT IRT film thickness sensor
� IR interferometric sensor� optical measurement – non contact� FFT analysis� 4 ~ 4,700 µm range (n = 1)� 15 ~ 105 nm thickness resolution� 6 ~ 25 µm lateral resolution� 4 kHz measuring frequency
Controlled thinning process from full wafer thickness (~ 724 µm) to < 5 µm
MicroProf ® Series – 3D IC ApplicationAnalysis of wafer thickness / back grinding
the art of metrologyTMvisit us at booth 1241
Total thicknessmeasurementin TTV set-up
(2x CWL)Film ThicknessSi-Waferwith FRT IRT
Film ThicknessResistwith FRT IRT
+ 2 x
MicroProf ® Series – 3D IC ApplicationAnalysis of back grinding: wafer and resist thickne ss
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2 x
Fully automated analysis of global and local wafer parameters
- also for glass wafers -
MicroProf ® Series – 3D IC ApplicationAnalysis of wafer parameters: TTV, bow, warp, …
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Topographypre treatment
Topography post treatment
MicroProf ® Series – 3D IC ApplicationAnalysis of bow of Si IC stack
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Stress: σ = -7,65 MPa
Topography priorto film deposition
Topography afterfilm deposition
Thickness mapping
+
Stoney equation
MicroProf ® Series – 3D IC ApplicationAnalysis of wafer stress
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T = 25°C T = 175°C
Fully automated topography measurement at different temperatures
MicroProf ® Series – 3D IC ApplicationThermo Unit
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3D IC? – 3 D Metrology!
MicroProf ® Series:• Combination of multiple sensors
• Semi automated to fully automated wafer metrology
• Top- / backside topography
• Multiple parameter analysis
• TSV and Trench measurement
• Bump and µ-bump analysis
• Global and local wafer parameter analysis
• Film thickness measurement
• Stress analysis
• Measurement under thermal load
One Metrology Tool for All Wafer Tasks !!!
the art of metrologyTMvisit us at booth 1241
HeadquartersFRT, Fries Research & Technology GmbHFriedrich-Ebert-StrasseD-51429 Bergisch GladbachTel.: +49 (0) 2204 - 84 2430Fax: +49 (0) 2204 - 84 2431
Internetwww.frt-gmbh.com
FRT, Fries Research & Technology GmbH
Thank you for your attention!
Visit us at booth 1241!