3D Will Revolutionize Mobile Industry
BYOUNGJOO LEE NAND Product Planning Office
SK hynix
Sep. 2015
Qualcomm 3G/LTE Summit 2015 Hong Kong
Contents
1. Corporate Overview
2. IoT & Mobile Trends
3. 3D NAND
4. Mobile Storage Solutions
5. Summary
1
Qualcomm 3G/LTE Summit 2015 Hong Kong
Corporate Overview
2
Qualcomm 3G/LTE Summit 2015 Hong Kong
Global Networks
277 Affiliates/Branches
Global Assets
U$ 85 Billion
Global Talents
81,667 Talents (As of 2014)
57th Global Fortune 500 (2015)
2nd 3rd 15th 53th 57th 1st 82th
3
SK World Wide
The continued growth of SK through the various business success stories
2015
Qualcomm 3G/LTE Summit 2015 Hong Kong
4
M14 introduction & Product Portfolio
The size of seven football fields, 200K of 300mm wafers per month
Product Portfolio
Applications Products
DRAM
NAND
CIS
M14 (New Fab.)
PC / Server
Graphics
Consumer
Mobile
Consumer
Mobile
SSD
Mobile
N/B / PC
Camera
DDR4, DDR3
GDDR5, DDR4, DDR3
DDR4, DDR3, DDR2, DDR
LPDDR4/3/2 (MCP, PoP)
TLC, MLC, SLC
eMMC (eMCP), UFS
SATA, PCIe
VGA/2M/3M/5M/8M
Gross Area 53,000 m2
Wafer size 300 mm
Start up Q3 ’15
Products DRAM / NAND
Technology -
Qualcomm 3G/LTE Summit 2015 Hong Kong
IoT & Mobile Trend
5
Qualcomm 3G/LTE Summit 2015 Hong Kong
Source : SK hynix
NAND Demand Forecast
2014 2015 2016 2017 2018 2019
77
240
The Explosion of Connected Devices
B/GB
B/GB
6
IoT Trend & NAND Forecast
40
60
0
20
50B+ Devices 35ZB Data
‘03 ‘08 ‘10 ‘15 ‘20
World Population
More connected Devices than people
7.6B
0.08 1.84 3.47 6.58 Connected
Devices per Person
(Billion)
Source : Cisco, IDC
By 2020, 50B+ things will be connected… and they will all need NAND Flash
Qualcomm 3G/LTE Summit 2015 Hong Kong
Mobile Industry will require the better & cheaper storage solution
7
Mobile Trends & Technical Requirement
Higher Performance
Higher Density
Low Power
Better Reliability
Small Package
More & Richer apps, High Resolution photos, 3D graphics
Fast boot up, Web browsing, Downloads, etc.
Longer battery life
More contents, Small & Slim Form Factor
Data Retention, Endurance
LTE
5G
3G
WQHD
UHD
FHD
eMMC
eMMC
LP2 LP3
LP4
8Mpx
16Mpx
20Mpx
12x12 10x10 8x9
UFS
Qualcomm 3G/LTE Summit 2015 Hong Kong
3D NAND
8
Qualcomm 3G/LTE Summit 2015 Hong Kong
Reliability
2D NAND 3D NAND
x2 Reliability
Bit Growth
2D NAND 3D NAND
> 30% Net die
Performance
2D NAND 3D NAND
> x1.5 thru tPROG
Much Better
9
Benefits of SK hynix 3D Technology
Qualcomm 3G/LTE Summit 2015 Hong Kong
1znm
2D
3D
2016 Year
Cost / GB
2006
10
Supporting industry demand through reasonable bit growth with 3D technology
Better Bit Growth
Qualcomm 3G/LTE Summit 2015 Hong Kong
Bit Line Interference Free & Word Line Interference almost Free
How to Overcome Cell Interference?
Small Cell Interference
due to lower capacitive coupling
between neighboring cells
DSL
BL
CSL SSL
Nitride
Cha
nnel
N
N+1
2ynm
1ynm
Sub-1znm
Need Breakthrough!
Scaling
down
Reduced Number of Stored Electrons
11
Better Reliability
Qualcomm 3G/LTE Summit 2015 Hong Kong
140
Performance @ Mobile Application 3D tPROG
tPR
OG
2D TLC ~ 2.0ms
2D MLC ~ 1.2ms
3D MLC < 0.6ms
3D TLC < 1.0ms
QDP Configuration / Data transfer size : 512KB / OS Level test
≒ 50%↑ (vs 2D MLC)
Reliability
Seq. Write 200 MB/s
MB/s
3D MLC
2D MLC
12
Small cell interference & narrow cell distribution enabling one-shot program
Better Performance
Qualcomm 3G/LTE Summit 2015 Hong Kong
2D
3D V3 3D V2 3D V1
Q4. 2015
Q3. 2015
Q4. 2014
13
Continue to Advance thru 3D technology
Qualcomm 3G/LTE Summit 2015 Hong Kong
Raw Nand
Client SSD
Enterprise SSD Mobile
2015
2015
2015
2016
Retention S/W
Others
P/E QoS
Others
14
SK hynix 3D NAND Everywhere
Qualcomm 3G/LTE Summit 2015 Hong Kong
Mobile Storage Solutions
15
Qualcomm 3G/LTE Summit 2015 Hong Kong
16
NAND Flash portfolio
echnology T
olutions S
3DV1 3DV3
3DV2
3DV4 3DV5
3DV6
eMMC5.0 eMMC5.1 UFS2.0
UFS2.1 UFS3.0
SATA SSD NVMe SSD SATA SSD NVMe SSD
SATA SSD NVMe SSD
2016 2015 2014 Year Future
Qualcomm 3G/LTE Summit 2015 Hong Kong
2.5X 3X
> 750MB/s
> 30KIOPS
SK hynix UFS solution – AVAILABLE TODAY
17
UFS
H28U64222
World’s Best performance Mobile storage solutions
Qualcomm 3G/LTE Summit 2015 Hong Kong
18
World’s First 3D NAND based Mobile storage
solution
2015 (Q1)
3D V1 eMMC5.0 (Prototype)
2015
3D V2 eMMC5.1
2016
3D V3 UFS2.1
Qualcomm 3G/LTE Summit 2015 Hong Kong
19
Qualcomm & SK hynix Alignment
SK hynix Mobile storage solution is well aligned with Qualcomm
2013 2014 2015 2016 2017
MSM8974 MSM8994 MSM8936/39
MSM8996 MSM8952/56/76
Post MSM8996 Post MSM8956
eMMC4.5 eMMC5.0 1st UFS eMMC5.1
2nd UFS eMMC5.x TBD
Qualcomm 3G/LTE Summit 2015 Hong Kong
20
Mobile storage solution with mobile DRAM, LPDDR
SK hynix can provide mobile DRAM having high-performance, low power, various types of pkgs
2015
Flagship
Mid
Low
2016 2017
High
Entry
PoP PoP PoP
PoP eMCP PoP eMCP uMCP PoP eMCP
uMCP
eMCP
MCP(SLC NAND) eMCP MCP
eMCP
DRAM AP
PoP
eMCP DRAM eMMC
uMCP DRAM UFS
Package Type
• Share 3D Benefits with all industry partners
• World 1st 3D Mobile Storage Solutions
• “Working Together” with Qualcomm
Summary
Thank You