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CHRISSY PULLARA AMERICAS DECORATIVE BUSINESS DEVELOPMENT & PRODUCT MANAGER
ACID COPPER TECHNOLOGIES FOR PLATING ON PLASTICS
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A Platform Specialty Products Company.
! Bright and level surface contributes to overall appearance of plated finish
! Buffers effect of stress created between plastic, nickel metal layers due to quick changes in temperature
! General requirements of acid copper plating - Good brightness across entire current density range - Leveling power - Good ductility of copper layer - Minimum defect rate
WHY PLATE ACID COPPER?
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CROSS SECTION REPRESENTATION
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Electroless plate ~ 0.5 µm
Cu Strike ~ 2.5 µm
Copper ~ 25 µm
Semi Bright Nickel ~ 18 µm
Bright Nickel ~ 10 µm
Microporous Nickel ~ 2.5 - 3 µm
Chrome ~0.25 µm
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MARKET DRIVERS
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• Simple part geometry
• Limited range of articles
• More simple test requirements
• Poor molding quality
• More complicated geometry
• Diverse range of articles
• Increased test requirements
• Improved molding quality
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A Platform Specialty Products Company.
• OEMs increase copper thickness requirements coupled with new specifications
INCREASED REQUIREMENTS
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• Improving thermocycle results • Reduction in plated part
stress
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– Increase thickness without reducing capacity • Longer plating times
– Significant increase of current densities
– More complex shielding to eliminate burning
SUPPLIER CHALLENGES
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• Flexibility via service tools to fulfill customer needs • Ability to adjust leveling performance virtually eliminates
• Orange peel • Over leveling • Flame patterns • Pitting
• Increased temperature • Reducing burning at HCD • Increased usage of auxiliary anodes • Fully analyzable (HPLC, bubble tensiometer, CVS)
MEETING THE DEMANDS
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A Platform Specialty Products Company.
• POP applicators struggling with complex geometries
• No HCD burning • Good throwing power into the LCD
• Struggling with pitting on parts • Attempting to cover molding
irregularities
WHO NEEDS BETTER TECHNOLOGY?
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THESOLUTION:DYE-FREEACIDCOPPER
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! Good leveling ! No over leveling
! No sludge formation
! Clean tank walls & anode bags
! Reduced risk of pitting
! Eliminates need for carbon filtration
! Excellent throwing power
! Lower risk for flame patterns
DYE-FREE ACID COPPER SYSTEM ADVANTAGES
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A Platform Specialty Products Company.
OVER-LEVELING
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Sharp edges Gives double edge appearance Happens on bright and satin finishes
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A Platform Specialty Products Company.
OVER-LEVELING
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LEVELING
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Current Acid Copper Poor leveling
NEW DYE-FREE SYSTEM No over leveling
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A Platform Specialty Products Company.
THICKNESS DISTRIBUTION
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A Platform Specialty Products Company.
PITTING
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Current Acid Copper Pitting
NEW DYE-FREE SYSTEM No pitting
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A Platform Specialty Products Company.
FLAME PATTERNS
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EDGE DEFECTS
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NEW DYE FREE SYSTEM No edge defects even after
3 hours plating
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• Intermediate layer for variety nickel-chromium layer systems " Plastic (ABS, PC-ABS) " Plastic in combination with auxiliary anodes
" Reduced concentration of breakdown products with auxiliary anodes
• No need for carbon filtration in comparison to dye solutions
• Fully analyzable additives and possible breakdown products
• High temperatures are possible (95 to 105°F)
PROCESS ADVANTAGES
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" Large POP supplier interior and exterior automotive trim " Original line configured for 15-20 µm copper thickness
" New requirements demand 25 µm
" Existing process high risk for burns when CD was increased
" Max temperature 77°F or extreme high usage of brightener
" Additive analysis not feasible
" Continuous carbon filtration required based on the need for auxiliary anodes
CASE STUDY PREVIOUS PROCESS LIMITATIONS
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HPLC SCAN – CARRIER & BREAKDOWN PRODUCTS
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Oxidized carrier component concentration increases with increased amp hours
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HPLC SCAN – BRIGHTENER
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No significant brightener consumption observed
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• Highly accurate measurement of dynamic surface tension
• Monitoring of wetting behavior of surfactant • Allows simple control of surfactant
concentration in acid copper system
BUBBLE TENSIOMETER
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CASE STUDY SUCCESS IN PRODUCTION
• Utilization of auxiliary anodes
• Capable of running at higher temperature (86°F) without extreme increase additive usage, loss of leveling, brightness
• Increase from 25 ASF to 40 ASF without burning
• No need for continuous carbon filtration
• Less maintenance with dye-free system
• Easy conversion from dye-free to dye system
• Controlled usage of additives by analyses
• Process control per HPLC for breakdown products
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• In production at >15 plating companies globally
• >500,000 liters of acid copper chemistry converted over the past 2 years
• Q3/Q4 2017: Several new installations planned globally
WORLDWIDE ACCEPTANCE
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THANK YOU!
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Chrissy Pullara Chrissy.Pullara@
macdermidenthone.com 203.278.6783