Download - ALCT and TMB Status
Martin von der Mey, EMU at CMU, October 2003 1
ALCT and TMB Status
Martin von der MeyMartin von der Mey
University of California Los AngelesUniversity of California Los Angeles
• ALCT production statusALCT production status
• TMB statusTMB status
• TMB radiation testTMB radiation test
• RAT statusRAT status
Martin von der Mey, EMU at CMU, October 2003 2
ALCT384 Boards
Analog section: Analog section: test pulse generator, test pulse generator, AFEB power, AFEB power, ADCs, DACs ADCs, DACs (other side)(other side)
24 Input signal 24 Input signal connectorsconnectors
Delay/ buffer ASICs,Delay/ buffer ASICs,2:1 bus 2:1 bus multiplexors (other multiplexors (other side)side)
80 MHz SCSI outputs80 MHz SCSI outputs(to Trigger Motherboard(to Trigger Motherboard)
Power, computer Power, computer connectorsconnectors Xilinx Mezz. boardXilinx Mezz. board
Spartan Spartan XLXL
Martin von der Mey, EMU at CMU, October 2003 3
Yangheng
Martin von der Mey, EMU at CMU, October 2003 4
ALCT Shipments By Destination (06-Oct-2003)
0
20
40
60
80
100
120
UC-FAST UF-FAST PNPI-FAST IHEP-FAST-384 IHEP-FAST-288 DUBNA-FAST SPARES-ALLTYPES
Number Left
Number Shipped
ALCT ProductionALCT Production
Martin von der Mey, EMU at CMU, October 2003 5
ALCT ProductionALCT Shipments by Type (06-Oct-2003)
0
50
100
150
200
250
ALCT-384 ALCT-672 ALCT-288
Number Left
Number Shipped
Martin von der Mey, EMU at CMU, October 2003 6
ALCT Production
ALCT Deliveries (2003)
0
100
200
300
400
500
12/3
1/02
1/14
/03
1/28
/03
2/11
/03
2/25
/03
3/11
/03
3/25
/03
4/8/
03
4/22
/03
5/6/
03
5/20
/03
6/3/
03
6/17
/03
7/1/
03
7/15
/03
7/29
/03
8/12
/03
8/26
/03
9/9/
03
9/23
/03
10/7
/03
10/2
1/03
Bo
ard
s
ALCT288
ALCT384
ALCT672
Total Boards
# Chambers (468)
Plus 10% spares (516)
Martin von der Mey, EMU at CMU, October 2003 7
ALCT Production Testing
Done.Done.All ALCT base boards All ALCT base boards
repaired. Also spares.repaired. Also spares.Prepare mezz. Cards Prepare mezz. Cards
sparesspares
Martin von der Mey, EMU at CMU, October 2003 8
Problems Encountered in testing at UCLA
• Most frequent problem Most frequent problem • On base boards: On base boards:
• Intermittent problem due to buffer (Clock Intermittent problem due to buffer (Clock fanout). Buffers replacedfanout). Buffers replaced
• Still solder bridges (50%)Still solder bridges (50%)
• Shorts inside the PCB board.Shorts inside the PCB board.
• On mezz. Cards:On mezz. Cards:
• Bad Eproms (replaced)Bad Eproms (replaced)
• Bad ball grid connections between FPGA and Bad ball grid connections between FPGA and PCB board.PCB board.
Martin von der Mey, EMU at CMU, October 2003 9
Production of spare Mezz. Boards
• Want >10 % spares.Want >10 % spares.
• Need 25 XCV600E type and 15 XCV1000E type.Need 25 XCV600E type and 15 XCV1000E type.
• Have 3 good XCV600E and 1 good XVC1000EHave 3 good XCV600E and 1 good XVC1000E
• Have 24 bad XCV600E and 10 bad XCV1000EHave 24 bad XCV600E and 10 bad XCV1000E• Already reballed about 100 mezz. Cards and remounted Already reballed about 100 mezz. Cards and remounted
on same boards (success rate 70%).on same boards (success rate 70%).
• Plan :Plan :• Remove FPGAs from non working boards and put on new Remove FPGAs from non working boards and put on new
mezz. card.mezz. card.
• Buy 5-10 XCV1000EsBuy 5-10 XCV1000Es
Martin von der Mey, EMU at CMU, October 2003 10
Problems Encountered
• Broken AFEB connectors.• Connectors are very fragile
• Shipping companies handle packages roughly
• We recently started packing very carefully
• We found a company that successfully replaces the broken connectors ($30/connector)
• Everybody should handle boards with care
Martin von der Mey, EMU at CMU, October 2003 11
Problems found (FAST)
• In shipping, connector shells got damaged (boxes handled roughly by FedEx)
• Very difficult to repair, found a company to do it
• Bottom line:• First 100 chambers tested at
ISR: 5 broken connector shells, 1 blown fuse, 1 bad channel…
• 1/38400 channels
Martin von der Mey, EMU at CMU, October 2003 12
RAT: Rpc Alct Transition module
• Inputs from ALCT and RPC sources
• Outputs through backplane to TMB.
• The RPC crate locations is now fixed and cabling can be discussed in detail
• The layout is done and submitted for board production.
• We expect to do a data interchange test with RPC in Spring.
Martin von der Mey, EMU at CMU, October 2003 13
RAT2003 LayoutVME Backplane VME Backplane
RP
C c
on
ne
cto
rsR
PC
co
nn
ec
tors
To TMB To TMB
ALCT Input connectorALCT Input connector
Spartan FPGASpartan FPGA
Martin von der Mey, EMU at CMU, October 2003 14
Trigger Motherboard (TMB)
Input Input connectorsconnectorsFrom ALCTFrom ALCT
Main FPGA Main FPGA (on back)(on back)
XILINX XCV1000EXILINX XCV1000E
Mezzanine boardMezzanine board
Input Input connectorsconnectors
From 5 CFEB’sFrom 5 CFEB’s
Generates Cathode LCT trigger with input from CFEB (comparator)Generates Cathode LCT trigger with input from CFEB (comparator)
Matches ALCT and CLCT; sends trigger primitive info via MPC to Matches ALCT and CLCT; sends trigger primitive info via MPC to Lev-1 muon trigger, sends anode and cathode hits to DMB.Lev-1 muon trigger, sends anode and cathode hits to DMB.
Martin von der Mey, EMU at CMU, October 2003 15
New TMB2003A
•New TMB2003A New TMB2003A under testunder test
Martin von der Mey, EMU at CMU, October 2003 16
TMB 2003A Status
4 TMB2003A boards assembled4 TMB2003A boards assembled2 Virtex-II Mezzanine boards assembled (Xilinx 2 Virtex-II Mezzanine boards assembled (Xilinx
XC2V4000)XC2V4000)2 Board (mostly) debugged 2 Board (mostly) debugged Board-test firmware ported from TMB2001 Board-test firmware ported from TMB2001
version.version.Beam-test firmware was modified for radiation Beam-test firmware was modified for radiation
test.test.Radiation test done.Radiation test done.
Martin von der Mey, EMU at CMU, October 2003 17
Changes TMB2001/TMB2003A
• Changes from TMB2001 to TMB2003A• 2 PHOS4 delay ASICs replaced with 3 DataDelay
Devices 3D3444(10 channels with 1-ns steps replaced with 12 channels of 2ns steps)
• Power supply regulators replaced with OSU-approved rad tolerant devices
• New signals for XC2V4000 FPGA• Virtex E mezz. Card replaced by Virtex II for faster speed• New RPC signals to the RAT2003 transition module• New voltage regulator for RAT2003 FPGA core (+1.8V)• New signals to/from DMB. Accommodate backplane
changes.• New power plane layout• Front-panel LEDs are now socketed, for faster assembly
Martin von der Mey, EMU at CMU, October 2003 18
Beam Test of TMB 2001
See Jay’s talk
Martin von der Mey, EMU at CMU, October 2003 19
TMB 2003A Hardware
What works: JTAG chain sees Mezzanine FPGA + 4 PROMs, + 2 user PROMs
Boot register passes walking 1Address register passes walking 1JTAG load command works (didn’t on TMB2001)Front panel cylon display runsVME registers read back ID, slot address, etcADC reads back voltages and currents
What doesn’t work:Some tri-state buffer outputs clamp to ~1V instead of pulling to 3.3VTest code can drive out +3.3V....it just won’t tri-stateTried Foundation and ISE compilers
Martin von der Mey, EMU at CMU, October 2003 20
TMB2003A
Board Test FirmwareAssembled 2nd TMB2003FPGA failed to load from EPROMs....fixed....bad solder on mez
ICDelay ICs 3D3444 now working...firmware fixTrying to run full-auto tests
Passes: ID register (includes VME slot address readback)VME data walking 1VME address walking 1Hard reset from VMEUser PROM JTAG ID codesUser PROM data busADC voltage & current
Fails: Digital serial numbers (both TMB and mez)SMB temperature ICAll Loop-backs
Martin von der Mey, EMU at CMU, October 2003 21
TMB Firmware
Firmware tested in 3 beam tests No big problems found Found and fixed problems with “Winner bits” New I/Os added (RPC,DMB) Added global clocks Replaced PHOS4 logic with 3D3444 (State
machine clocks data at 20MHz instead of 625 kHz)
Radiation test and beam test firmware ported to Virtex II.
Martin von der Mey, EMU at CMU, October 2003 22
New radiation Test
Martin von der Mey, EMU at CMU, October 2003 23
TMB2003A Test
Radiation TestNew state machine fires internal CLCT pattern injectorInjects 1 muon: 6 hits, non-bendingTrigger rate: 100KHz or ~10HzIncrements CFEB number each triggerChecks for correct CLCT dataChecks for any CLCT data between triggers (spurious muon)Check power-monitor IC for +5V,+3.3V,+1.5V, +1.8V errorsFlashes “running” LED at constant rate
Test board:
Connects to DMB TTL backplane driversBiColor LEDs display test resultsReset button forces FPGA reload (uses power-up IC on TMB)
Martin von der Mey, EMU at CMU, October 2003 24
Old ALCT radiation results Xilinx vs Altera
• Radiation results shows small improvements to before…
• Mean lies at 65.24 Rad compared to 59.2 Rad before…
• The main improvement (factor 5) comes due to combination of 5 chips
• (1 concentrator and 4 LCT chips into 1).
Martin von der Mey, EMU at CMU, October 2003 25
Radiation Test results
• Irradiated XC2V4000 Xilinx FPGA
• New radiation test gives 141 Rad for proton beam. Compared to 65 Rad before. (~2.5 better)
• SEU proton fluence 79.8*10 7
cm-2 (M.Huhtinen (1-4)*10 10 cm-2 for 10 LHC years)
• Also tested 6 GTLP chips up
to 5 kRads no problems.
Martin von der Mey, EMU at CMU, October 2003 26
Conclusions
• ALCT production in excellent shape ALCT production in excellent shape and mainly done. Doing spares now.and mainly done. Doing spares now.
• TMB firmware in good shape. Tested TMB firmware in good shape. Tested several times. Improvements on the several times. Improvements on the way.way.
• Received and testing TMB 2003A.Received and testing TMB 2003A.
• Done TMB radiation test. Excellent.Done TMB radiation test. Excellent.
• RAT2003 layout finished.RAT2003 layout finished.