SEMICONDUCTORS
Copyright 2015, Toshiba Corporation.
Bridges for Building an ARA Module
Presentation Date: January 2015
Presented by: Eugene Chang
AP Bridge - GP Bridge
2Copyright 2015, Toshiba Corporation.
Agenda
1. Bridge IC specifications Overview– AP Bridge– GP Bridge
2. Switch ASIC3. Configuration4. Contactless Interface5. Bridge IC Revisions6. Starter Kit
3Copyright 2015, Toshiba Corporation.
Bridge IC specifications Overview
• Application Processor• Display• Camera• Mic/Speaker• 2nd Display/Camera• etc
<Applicable modules>
• Wifi, Bluetooth®, GPS• SIM• Modem• Memory Card• Mic/Speaker• etc
<Applicable modules>
CSI/DSI
CSI/DSIHost Bus Interface
I2C, I2S, GPIOs
CSI/DSI Tx0 4LaneD-PHYCSI/DSI Rx0
CSI/DSI Tx1 4LaneD-PHYCSI/DSI Rx1
HOST BUS I/F
Toshiba is developing 2 types of Bridge ICs.
I2S masterI2C master
GPIOs
HSIC(HOST)SDIO(MASTER)
UART, I2C, I2S, EPM, GPIOs
HSIC 1.0HOST
HSIC PHY
SDIO v2 master
UARTI2S masterI2C master
GPIOsEPM
GP Bridge- T6WT2XBG
AP Bridge- T6WT1XBG
Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license.
M-P
HY
UniP
ro
M-P
ORTDual Tx, Rx
5.8Gbps/lane
M-P
HY
UniP
ro
M-P
ORTDual Tx, Rx
5.8Gbps/lane
4Copyright 2015, Toshiba Corporation.
“T6WR5XBG” ARA AP Bridge
• Bridges the UniproSM network with ARA modules featuring the Application Processor or Display or Camera
• Supports CSI-2, DSI, HSIC (USB), I2C, I2S and GPIO• Based on an ARM Cortex M3 for fast handling of protocol
conversions• Main features include:
• MIPI® UniPro ver 1.6 UniPort with 2 lane bidirectional capable of 5.8Gbps/lane, -Up to 32 C-ports
• CSI-2 Interface – 2 links with each link having 4 lanes@1Gbps/lane
• DSI Interface – 2 links with each link having 4 lanes @1Gbps/lane
• HSIC Device• SPI Master• I2C Master• Audio I2S Interface• 15 GPIOs• Package;
107pin 5.0x5.0x1.0 0.4mm ball pitch BGA
5Copyright 2015, Toshiba Corporation.
Module
Endoskeleton
4 Lane CSI-2 for CameraOR
4 Lane DSI for Display
Unipro BusTo Switch IC
ROM
Audio Codec
AP Bridge
AP Bridge showing two possible uses – Display or Camera
6Copyright 2015, Toshiba Corporation.
“T6WR6XBG” ARA GP Bridge
• A general purpose bridge that connects the UniproSM
network with ARA modules featuring application that uses HSIC, SDIO, UART, SPI, I2C, I2S
• Based on an ARM Cortex M3 for fast handling of protocol conversions
Main features include:• MIPI® UniPro ver 1.6 UniPort with
2 lane bidirectional capable of 5.8Gbps/lane -Up to 16 C-ports
• HSIC Host• SDIO Host• SPI Master• I2C Master• Audio I2S Interface• 15 GPIOs• Package;
107pin 5.0x5.0x1.0 0.4mm ball pitch BGA
7Copyright 2015, Toshiba Corporation.
ModuleEndoskeleton
Unipro BusTo Switch IC
ROM
Audio Codec
Wi-Fi / BluetoothModule
Example of GP Bridge w/ Wi-Fi®/ Bluetooth® Module
GP Bridge
Wi-Fi is a registered trademark of Wi-Fi Alliance. Bluetooth® word mark is a registered trademark owned by Bluetooth SIG, Inc. and any use of such mark by Toshiba Corporation is under license.
8Copyright 2015, Toshiba Corporation.
“T6WM8BGX” ARA Switch LSI
• Unipro based switch device that resides only on the Endoskeleton and handles data transfer between UniPorts at the L3 level.
• The Switch has 14 UniPorts with each UniPort consists of 2 lane TX and 2 Lane RX M-PORT supporting 5.8Gbps/lane
• A supervisory microcontroller controls and configures the Switch LSI via I2C slave address.
• Other features include:– Data routing from every UniPort to any other UniPort– Configuration through UniPro– Traffic class 0 and 1 with routing and arbitration support for
both traffic classes
9Copyright 2015, Toshiba Corporation.
Supervisory ControllerBlock Diagram of Switch ASIC
Switch ASIC
Endopoint
M-PH
Y
M-PO
RT
UniPro Module 8
Endopoint
M-PH
Y
M-PO
RT
UniPro Module 9
Endopoint
M-PH
Y
M-PO
RT
UniPro Module 10
Endopoint
M-PH
Y
M-PO
RT
UniPro Module 11
Endopoint
M-PH
Y
M-PO
RT
UniPro Module 12
Endopoint
M-PH
Y
M-PO
RT
UniPro Module 13
Endopoint
M-PH
Y
M-PO
RT
UniPro Module 14
ModulesEndopoint
M-P
HY
M-P
OR
T
Uni
Pro
Module 1
Endopoint
M-P
HY
M-P
OR
T
Uni
Pro
Module 2
Endopoint
M-P
HY
M-P
OR
T
Uni
Pro
Module 3
Endopoint
M-P
HY
M-P
OR
T
Uni
Pro
Module 4
Endopoint
M-P
HY
M-P
OR
T
Uni
Pro
Module 5
Endopoint
M-P
HY
M-P
OR
T
Uni
Pro
Module 6
Endopoint
M-P
HY
M-P
OR
T
Uni
Pro
Module 7
Modules
Routing
* M-PHY, MIPI, UniPro are registered trademarks or service mark of MIPI Alliance, Inc.
10Copyright 2015, Toshiba Corporation.
Configuration
• Two Bridge LSIs (residing in modules)
– AP Bridge:AP/Camera/Display Bridge
– GP Bridge:General-Purpose Bridge
• Switch LSI (residing in Endo)
Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license. / LTE is a trade mark of ETSI.
11Copyright 2015, Toshiba Corporation.
Contactless inductive interface
Prototype Engineering Sample Commercial Sample
Endo Version Spiral-2 Spiral-3 Spiral-3
M-PHY Coupling DC (contact req’d.) DC / AC Contactless* DC / AC Contactless*
Supported mode ~ HS-G3 (~6Gbps) ~ HS-G3 / PWM1(3~9Mbps), HS-G1,G2,G3
~ HS-G3 / PWM1(3~9Mbps), HS-G1,G2,G3
[Key Features]
• M-PHY protocol over contactless inductor
• Wide band data transmission from Mbps to Gbps over channel with limited band width
• Low power operation in low speed mode
12Copyright 2015, Toshiba Corporation.
Bridge IC Revisions– Key Features Summary
Prototype Engineering Sample Commercial Sample
Availability Sep. 2014(limited qty)
Feb. 2015(limited qty) Jul. 2015
Endo Version Spiral-2 Spiral-3 Spiral-3
Part No. AP Bridge: T6WR5XBGGP Bridge: T6WR6XBG
AP Bridge: T6WT1XBGGP Bridge: T6WT2XBG
AP Bridge: TBDGP Bridge: TBD
M-PHY Coupling DC(contact req’d.)
DC / AC Contactless*
DC / AC Contactless*
Package AP Bridge: 5x5 107 BGAGP Bridge: 5x5 107 BGA
AP Bridge: 5x5 109 BGAGP Bridge: 5x5 109 BGA
AP Bridge: TBDGP Bridge: TBD
CPORTs AP Bridge: 32GP Bridge: 16
AP Bridge: 44GP Bridge: 16
AP Bridge: 44GP Bridge: 16
* DC / AC Contactless set prior to shipment
13Copyright 2015, Toshiba Corporation.
Starter Kit for ARA
• Starter Kit– A simple board with Bridge Chip and USB socket for the 1x2
module form factor – This Starter Kit enables module developers to try their idea or
solution easily.
microUSBsocket
GPBridge PHY
14Copyright 2015, Toshiba Corporation.
Key Features for Starter Kit
• Module to support USB - Type A/B micro receptacle for Data• PCB to support access test points for the following signals that
connect to GP Bridge:– SDIO, UART, SPI, I2S, I2C, PWM, GPIO
Developer’s Application Board
ARA Platform w/ Starter kit ARA Platform w/ Starter kit
Existing USB dongle
Schematics and Layout data will be available upon request
15Copyright 2015, Toshiba Corporation.
Project Ara site in Toshiba Homepage
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Contents
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Bridge ICs Brochure
18
TOSHIBA CONFIDENTIAL
Copyright 2015, Toshiba Corporation.