- PUBLIC - Page 1 Carl Zeiss SMT GmbH, Timo Laufer, Senior Scientist
Star European Conference March 22-23, 2011
Noordwijk
Thermal Fluid-Structure Analysis of an optical Device including Radiation and Conduction
Timo Laufer Senior Engineer Carl Zeiss SMT GmbH, Oberkochen, Germany
CFD-Simulations Aron Kneer, TinniT Technologies GmbH, Karlsruhe, Germany
Carl Zeiss SMT GmbH
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Content
1. Carl Zeiss SMT GmbH and Products
2. Basic Principles of EUVL (Extreme Ultra Violet Lithography)
3. Essential System-Components, thermal Boundary Conditions
4. Heat Transport Mechanisms in rarefied Gases
5. CFD-Model and Results of the Simulation
6. Summary and Benefits
- PUBLIC - Page 3 Carl Zeiss SMT GmbH, Timo Laufer, Senior Scientist
Content
1. Carl Zeiss SMT GmbH and Products
2. Basic Principles of EUVL (Extreme Ultra Violet Lithography)
3. Essential System-Components, thermal Boundary Conditions
4. Heat Transport Mechanisms in rarefied Gases
5. CFD-Model and Results of the Simulation
6. Summary and Benefits
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Position of Carl Zeiss SMT GmbH within the Carl Zeiss Group
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Sequence of Producing Micro Chips
cutting polishing
Material layering or alteration
Photo resist- coating
exposure (step and scan) Development
and fixture
Etching and ion implementation
Photo resist- removal (ashing)
Finished wafer separation apply connections
ASML other suppliers
exposure with lenses from
Carl Zeiss SMT GmbH
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Exposure Machine ASML TWINSCAN XT:1950i
Zeiss components reticle
wafer
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Moore’s Law The number of transistors on a chip doubles every 2 years
Des
ign
rule
/ R
esol
utio
n (m
m)
86 88 90 92 94 96 98 00 02 04 06 08
1.0
0.7
0.5
0.35
0.25
0.18
0.13
0.10
0.07
0.05
year
0.035
10
25 - 50Mhz
66-100Mhz
200 - 300 Mhz
500 - 600 Mhz
1-3 Ghz
≥ 3 Ghz
Future Processors 4-? Ghz
Processors
Incr
easi
ng P
erfo
rman
ce
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Projection Lenses of Carl Zeiss SMT AG
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Microlithography Optics enable Moore’s Law bigger Lenses for Finer Details
First stepper lens 436nm 365nm 248nm 193nm 193nm
immersion
Optics have increased pixels/field ~24.000x !
NA k
l = Res
NA k · =
1 Resolution
13.5nm
Stepper / Scanner
David Mann (GCA) 4800
ASML /40
ASML /300
ASML /1100
ASML 19X0i
ASML 3100
NA 0.28 0.4 0.57 0.75 1.35 0.25
Resolution (nm) 1400 700 250 100 38 27
No. of pixels x 10^9 0.05 0.4 10 86 594 1177
weight (kg) 2 20 250 400 1080 688
1st prototype 1975 1987 1995 2000 2007 2009
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Projection Lens Starlith® 1900i
Technical Key Data
• Wavelength 193 nm
• NA 1.35
• RMS optical performance < 0.9 nm
• Height 1290 mm
• Weight 1080
kg
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Content
1. Carl Zeiss SMT GmbH and Products
2. Basic Principles of EUVL (Extreme Ultra Violet Lithography)
3. Essential System-Components, thermal Boundary Conditions
4. Heat Transport Mechanisms in rarefied Gases
5. CFD-Model and Results of the Simulation
6. Summary and Benefits
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Projection Optics EUV – Alpha Demo Tool
Key Technical Data
• Wavelength 13.5 nm
• Height 1500 mm
• Weight 790 kg
• Resolution 50 nm (early PO) 40 nm (AD1, AD2)
• Aberrations < 3 nm (early PO) 1.4 nm (AD1, AD2)
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EUV Mirror Specs: Compared to Real World
100 mm
1000 km
peaks of 2 mm in area of Germany
2962 m
Germany
surface roughness of ~ 0.2 nm corresponds to
mirror surface roughness about 0.2 nm
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Alpha-Tool schematic Representation
ca. 1 m
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Content
1. Carl Zeiss SMT GmbH and Products
2. Basic Principles of EUVL (Extreme Ultra Violet Lithography)
3. Essential System-Components, thermal Boundary Conditions
4. Heat Transport Mechanisms in rarefied Gases
5. CFD-Model and Results of the Simulation
6. Summary and Benefits
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EUV-System
ca. 1 m
EUV source
reticle
wafer
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Thermal Boundary Conditions Heat Loads and Heat Sinks
ca. 1 m
EUV source
reticle
wafer Heat Loads • EUV source compartment, total generated heat flux within the source >> 10 kW
• EUV-light absorbed by the mirrors, max. absorbed heat flux > 500 W
• Actuators / motors, sensors, electrical components, …
Heat Sinks (Coolers) • Water cooled heat sinks and heat shields at temperature sensitive components.
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Thermal Boundary Conditions Heat Transfer
Heat Transfer
• Heat conduction in solids
• Heat transfer solid / solid
• Heat transfer in atmosphere in rarefied gases - conduction and / or convection also in small gaps - heat transfer fluid / solid – fluid / solid interaction – with consideration of the slip condition.
• IR-radiation with consideration of - the view factors of all components - the emissivities of all components
Radiation is important specially for bigger distances between heat exchanging components and in case of high temperatures; the hottest components reach a temperature >> 700 °C.
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Thermal Boundary Conditions Output to be Evaluated
Output
• Transient thermal analyses of the whole EUV system.
All components with every single heat transfer between solid/solid and fluid/solid,
emissivities, view factors, thermal conductivity, heat capacity and density are taken into account.
For the temperature sensitive components
a stability in the µK/min-range must be reached.
• Transient thermal-elastic analyses show the deformations over time.
The transient deformations in the pm/min-range are important.
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StarCCM+ Simulation Model
dummy POB to test the handling
Summary Data CFD: Number of Cells: > 4.5 million
Number of Structure Properties: > 20
Number of Fluids: 1 (atmosphere)
Number of Interfaces including thermal resistance models: > 130
Number of regions: > 50
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Content
1. Carl Zeiss SMT GmbH and Products
2. Basic Principles of EUVL (Extreme Ultra Violet Lithography)
3. Essential System-Components, thermal Boundary Conditions
4. Heat Transport Mechanisms in rarefied Gases
5. CFD-Model and Results of the Simulation
6. Summary and Benefits
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Fluid Properties
EUV atmosphere Unit
Molecular weight M = … [g/mol]
No. of energy storage modes f = … [1]
Lennard-Jones length = … [Å]
Lennard-Jones energy /k = … [K]
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Slip Boundary and Knudsen Number
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Content
1. Carl Zeiss SMT GmbH and Products
2. Basic Principles of EUVL (Extreme Ultra Violet Lithography)
3. Essential System-Components, thermal Boundary Conditions
4. Heat Transport Mechanisms in rarefied Gases
5. CFD-Model and Results of the Simulation
6. Summary and Benefits
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StarCCM+ Simulation CFD-Model
dummy POB to test the handling
Summary Data CFD: Number of Cells: > 4.5 Mio
Number of Structure Properties: > 20
Number of Fluids: 1 (atmosphere)
Number of Interfaces including thermal resistance models: > 130
Number of regions: > 50
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StarCCM+ Simulation first Result thermal Simulation
dummy POB to test the handling
This CFD-simulation shows hot spots, which are short term effects in the beginning of the heating.
In general the heat generating components have different time constants and the generated heat of these components has different heat paths to the temperature sensitive elements and/or to the heat sink.
The heat loads of some heat generating components are even transient, so that we have transient heat loads as an input for a transient CFD-simulation.
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StarCCM+ Simulation CFD-Model POB Test Facility
CFD model of the vacuum chamber
POB
schematic representation of the test facility
photo of the vacuum chamber within the test facility
vacuum chamber
Within the vacuum chamber different scenarios can be tested.
vacuum chamber
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StarCCM+ Simulation Results POB Test Facility (Vacuum Chamber)
vacuum chamber
Hot spots at the outside of the vacuum chamber can be seen according to the
heat generating POB components.
The heat transfer mechanism from the heat generating POB components
to the vacuum chamber is radiation and conduction/convection.
with POB
inside
photo of the vacuum chamber within the test facility
CFD model of the vacuum chamber
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Content
1. Carl Zeiss SMT GmbH and Products
2. Basic Principles of EUVL (Extreme Ultra Violet Lithography)
3. Essential System-Components, thermal Boundary Conditions
4. Heat Transport Mechanisms in rarefied Gases
5. CFD-Model and Results of the Simulation
6. Summary and Benefits
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Summary and Benefits
Benefits • The results of the transient CFD-simulation is an important input to quantify the thermal stability of the EUV-system. • This information is essential during the layout and detailed design phase. • The results of the transient thermal simulations help in the design of coolers to prohibit hotspots.
• Within a test facility (vacuum chamber) different scenarios can be tested.
Summary • Max. absorbed heat loads > 500 W • Temperatures > 700 °C
• Heat transport mechanisms: - heat conduction in solids - heat transfer solid/solid - heat transfer conduction/convection in rarefied gases, also in small gaps - heat transfer fluid/solid in rarefied gases with consideration of slip condition - radiation, all view factors and emissivities are taken into account
• Complex model with > 4.5 million elements, > 20 structure properties, > 130 interfaces, … • Transient thermal input for transient thermal CFD-simulations. • Thermal stability in the µK/min- and pm/min-range must be guaranteed.