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Chip-on-Board – The Tiny Wire Bonding 101
Würth Elektronik Circuit Board Technology
11.12.2014 Seite 1 www.we-online.de
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Your speaker
www.we-online.deSeite 211.12.2014
Dipl.-Ing. (FH), MBA Philipp Conrad
At Würth Elektronik CBT since 2008
Product Manager Wire BondingTechnology
Cooperation with B&F Bonding since 2010
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Agenda
Chip / Bare Die
Gold und Aluminium Wire Bonding
PCB Design
Protection of Die and Wirebonds
www.we-online.deSeite 311.12.2014
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Agenda
Chip / Bare Die
Gold and Aluminium Wire Bonding
PCB Design
Protection of Die and Wirebonds
www.we-online.deSeite 411.12.2014
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Comparison: Housed Chip / Bare Die
11.12.2014 Seite 5 www.we-online.de
Substrate
QFP
Wire bonding on a Substrate
Substrate
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Chip / Bare Die
11.12.2014 Seite 6 www.we-online.de
Source of the Pictures: B&F Bonding
Die-Pickup from a wafer
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Chip / Bare Die
11.12.2014 Seite 7 www.we-online.de
Source of the Pictures: B&F Bonding
Die Pick-up
Pick-up froma Waffle
Pack
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Chip / Bare Die
11.12.2014 Seite 8 www.we-online.de
Source of the Pictures: B&F Bonding
Pick-up from WP
Fixation withVacuum
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Chip / Bare Die
11.12.2014 Seite 9 www.we-online.de
Source of the Pictures: B&F Bonding
Fixation withVacuum
Gluedispensing
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Chip / Bare Die
11.12.2014 Seite 10 www.we-online.de
Source of the Pictures: B&F Bonding
GlueDispensing
Positioningof the die
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Chip / Bare Die
11.12.2014 Seite 11 www.we-online.de
Source of the Pictures: B&F Bonding
Positioningof the die
Die-Bonding
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Agenda
Chip / Bare Die
Gold and Aluminium Wire Bonding
PCB Design
Protection of Die and Wirebonds
www.we-online.deSeite 1211.12.2014
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Gold Wire Bonding
� Gold wire bonding
Thermosonic
Ball-Wedge-Bonding
– LED-Applications
– Sensoric -Applications
11.12.2014 Seite 13 www.we-online.de
Source of the Pictures: B&F Bonding
Ball
Wedge
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Gold Wire Bonding
11.12.2014 Seite 14 www.we-online.de
Source of the Pictures: B&F Bonding
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Aluminum Wire Bonding
11.12.2014 Seite 15 www.we-online.de
� Aluminium wire bonding
Ultrasonic
Wedge-Wedge-Bonding
– Special-SensoricApplications
– Chip to Chip Connection
Quelle der Bilder: B&F Bonding
Wedge
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Aluminium Wire Bonding
11.12.2014 Seite 16 www.we-online.de
Source of the Pictures: B&F Bonding
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Gold Wire Bonding: Stud Bumps
11.12.2014 Seite 17 www.we-online.de
Source of the Pictures: B&F Bonding
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Common Wire Bonding Surfaces
� Gold wire bonding
– ENEPIG
• Electroless Nickel
• Electroless Palladium
• Immersion Gold
11.12.2014 Seite 18 www.we-online.de
Cu
NiPd
0,04 – 0,08 µm
0,1– 0,2 µm
4 – 7 µm
Au
Cu
NiAu 0,05 – 0,1 µm
4 – 7 µm
� Aluminium wire bonding
– ENIG
• Electroless Nickel
• Immersion Gold
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Agenda
Chip / Bare Die
Gold and Aluminium Wire Bonding
PCB Design
Protection of Die and Wirebonds
www.we-online.deSeite 1911.12.2014
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PCB Design
11.12.2014 Seite 20 www.we-online.de
Correct PCB design forCoB
SoldermaskArea
CorrectPositioning
of SMD-Parts
Gold orAluminium
- Wire
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PCB Design – Aluminium Wire
11.12.2014 Seite 21 www.we-online.de
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PCB Design – Gold Wire
11.12.2014 Seite 22 www.we-online.de
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PCB Design– Gold Wire
11.12.2014 Seite 23 www.we-online.de
Main difference: Orientation of the bond pads on the substrate!
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PCB Design
11.12.2014 Seite 24 www.we-online.de
Soldermask should be removed in one block!
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PCB Design– Placement of the SMD Parts
11.12.2014 Seite 25 www.we-online.de
PCB
Suggestion:NO SMD Parts
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PCB Design– Placement of the SMD parts
11.12.2014 Seite 26 www.we-online.de
PCB
Bond tool for fixation of the PCB
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PCB Design– Placement of the SMD parts
11.12.2014 Seite 27 www.we-online.de
PCB
Bond tool for fixation of the PCB
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PCB Design – Tools for Wirebonding
11.12.2014 Seite 28 www.we-online.de
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Agenda
Chip / Bare Die
Gold und Aluminium Wire Bonding
PCB Design
Protection of Die and Wirebonds
www.we-online.deSeite 2911.12.2014
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Substrate
Protection of Die and Wirebonds
11.12.2014 Seite 30 www.we-online.de
Substrate
Globtop
Lensholder
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Samples
11.12.2014 Seite 31 www.we-online.de
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Samples
11.12.2014 Seite 32 www.we-online.de
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Application Example
www.we-online.deSeite 3311.12.2014
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Summary
11.12.2014 Seite 34 www.we-online.de
Chip / Bare Die =
unpackedsemiconductor
Contacting thedie with glue
Electricalconnectionwith wirebonding
Two wirebonding
technologies, gold andaluminum
Special pcbdesign
Protection ofthe die andwires withglobtop or
mechanicalcomponents
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Summary
High accuracy placement compared to SMD solder process
High accuracy placement of the bare die in following sectors:
• Optoelectronics
• Sensor technology
• Medicine technology
Flexible design
Advantages of wirebonding
• Miniaturisation in X/YZ axis
• Very good electrical connection
• Good mechanical and thermal stabilty
11.12.2014 Seite 35 www.we-online.de
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11.12.2014 Seite 36 www.we-online.de
Thanks for your attention!
Philipp ConradWÜRTH ELEKTRONIK GmbH & Co. KGProcukt Management Wire bondingCircuit Board TechnologyM.:+49 175 2271 600E. [email protected]. www.we-online.de