CrossFlo™ Modular Interconnect System
May 6, 2004
Advantages of CrossFlo Design
• Simple configuration• Fewest number of block types required
• Single layer design w / second layer option
• No welding required
• Seal features• Captive seal
• Standard O-ring sizes
• Leak test port
• Configuration options• Skip purging possible
• 1X, 2X, 3X block spacing option
CrossFlo™
Basic CrossFlo Block
Compliant with ISA/ANSI SP76.00.02 open architecture standards.
Mounting holes for component
Pin holes
Leak Test channel
ID / OD seal capture
Inlet / Outlet Port
CrossFlo™
Conceptually Simple: In-Line Stick
• Substrate parts push together
• Components top mount
• Seals are captive
CrossFlo™
Conceptually Simple: CrossFlo
• Ports not required are simply plugged
CrossFlo™
Seal Features
• OD profile retains outer edge of seal
• ID is raised to capture seal inner edge
• Standard seal sizes used
CrossFlo™
In-Line and CrossFlo Blocks
CrossFlo™
Interconnect Elements
CrossFlo™
Typical Sampling System
CrossFlo™
Expansion to Second Level Interconnect
CrossFlo™
Second Layer Interconnect
CrossFlo™
Advantages of CrossFlo Design
• Simple configuration• Fewest number of block types required
• Single layer design w / second layer option
• No welding required
• Seal features• Captive seal
• Standard O-ring sizes
• Leak test port
• Configuration options• Skip purging possible
• 1X, 2X, 3X block spacing option
• www.celerity.net/crossflow
CrossFlo™
