IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
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© 2008 Hewlett-Packard Development Company, L.P.The information contained herein is subject to change without notice
Sustainable IT EcosystemComponents and Packaging Implications
Chandrakant PatelHP Fellow and DirectorSustainable IT Ecosystem Laboratory
Objective and OrganizationIEEE CPMT Talk, February 26, 2009
Components and Packaging Technology necessitates systemic viewpoint
Sustainable IT Ecosystem
• IT ecosystem can enable sustainable transformation• Deconstructing conventional business models through IT services
• Need based provisioning of resources
− Data centers at the core, billions of service oriented client devices at the edge• Universal accessibility will require reducing the Total Cost of Ownership
• TCO reduction will require “cradle to cradle” least energy, least material solutions
Components and Packaging design must take a system perspective
• End to End Design− Least Energy
• Examining the performance of the ensemble
− Least Material
• Through lifecycle engineering and management
2 2 March 2009, Chandrakant Patel
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
3 2 March 2009
Sustainable IT Ecosystembillions of service oriented client devices and thousands of data centers….to deliver net positive impact
Sustainable IT EcosystemApproach
• Next Generation Infrastructure - City 2.0
− Supply and Demand Side Management to meet the needs of the inhabitants
• Supply Side:
− Need to design the physical infrastructure with lifecycle engineering – energy required in extraction, manufacturing, operation and reclamation – in mind, so that the embedding of available energy into the built environment can be minimized
− Need to utilize local resources to minimize destruction of available energy in transmission, construction of transmission infrastructure, etc
• Demand Side:− Provision fundamental resources based on the needs of the user
− Can available energy from 2nd law be used to represent resources
• Use the IT Ecosystem to enable supply and demand side management based
4 2 March 2009
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
5 2 March 2009
Delivering Net Positive Impact through Supply and Demand Side Management • Deconstruct conventional business models and
replace with lower carbon IT services − Advantage of scale when billions utilize IT to
address their fundamental needs and improve quality of life
• Transformation necessitates− Reducing the cost of IT for universal accessibility
• Reducing TCO necessitates addressing sustainability with an end to end perspective
• Use the IT ecosystem to enable need based provisioning of resources across all ecosystems− Transformation necessitates
• pervasive sensing, knowledge discovery, and control
• Key Enablers:
− Tools & Unifying Metric
− Return to fundamentals of Physical Engineering in combination with Computer Science
− Human capital trained in the fundamentals –multidisciplinary curriculum
Life-Cycle Design
… Power Transport Water WastePolicy-Based Control & Operation
Knowledge Discovery, Data Mining, Visualization
Scalable & Configurable Resource Microgrids
Pervasive Sensing Infrastructure
City 2.0 Architecture
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
7 2 March 2009
extraction operationmanufacturing End of Life
Tools for Sustainable Transformationmetrics for least energy, least material ecosystems
8 2 March 2009 Chandrakant Patel, [email protected]
Approach2nd Law of Thermodynamics
• Can a measure of the total exergy or available energy destroyed across a product’s lifetime (“lifetime exergy”) be a measure of the environmental sustainability?
• Can we build a “hub” of exergy data to enable lifetime exergy analysis for a given product?
Extraction
exergy toproducematerials
exergy tofabricate and assemble components
exergy fortransportation
operationmanufacturing
exergy forinstallation
exergy to power electronics and thermal managment
exergy forwastemitigation
End of LIfe
exergy tode-install anddecommision
exergy todisassembleand/orrecondition for safe disposal or recycle
time
exergy forwastemitigation
Joules of Exergy consumed becomes the currency of the Sustainability Age
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
Sustainability HubCommunity-Owned Resource for Knowledge Sharing
• Influence, gather, and scale knowledge within the global sustainability community to enable an open-source service
Susta inability Hub and Service
• Community driven “ecopedia”
• Robust, consistent, verifiable data
Education and Outreach
Community-driven databases
Data and Context
Calculations and linkages
Information Representation
Standards
Reusable data and metrics
Scale the knowledge that we have created
Gather knowledge that we don’t have
Influence with the knowledge we create
Susta inability Hub and Service
• Community driven “ecopedia”
• Robust, consistent, verifiable data
Education and Outreach
Community-driven databases
Data and Context
Calculations and linkages
Information Representation
Standards
Reusable data and metrics
Scale the knowledge that we have created
Gather knowledge that we don’t have
Influence with the knowledge we create
310Process)by Consumed(Energy
usage)ater Indirect w and usageer Direct watin Consumed(Energy Waterindex
Exergy: Water example
Energy consumption Average per million gallons
Water Treatment 0.25MWh
Water distribution 1.3 MWh
Waste Water Treatment 2.5 MWh
Desalination 20 MWh
Total (excluding desalination)
~ 0.5 GWh to serve a city of a million per day
Average per capita usage in the USA: 100 gallons per day
Sharma et al., “Water Efficiency Management in Data Centers: Introducing a Water Usage Energy Metric”, International Conference on Water Scarcity, Global Changes and Groundwater Management Responses, Irvine, CA, December, 2008
(Ref. California Energy Comission)(ref. SANDIA/DOE)
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
11 2 March 2009
Power Micro-Grid Infrastructure
Datacenter
Ecosystem of Clients
Supply and Demand Side Management at City Scale
Sustainable IT Ecosystem Lab, HP Labs, 2008
Transport Micro-Grid InfrastructureWater Micro-Grid
InfrastructureEducation Infrastructure
• Least Lifecycle Exergy Destruction =>• Least Total Cost of Ownership
Medical&
Health Infrastructure
Role of the IT Ecosytem
12 2 March 2009
“The data center is the computer”
Power CoolingCompute
Flexible & Configurable Building Blocks
Sensing Infrastructure
Policy/SLA based Integrated Management
Data Analysis, Visualization, Knowledge Discovery
• End-to-end Management using requirements derived from service level agreements (SLAs) and a flexible infrastructure that can be closely monitored and finely controlled
Architecture for a Sustainable Data CenterEnd to end design and management
• Data Center Synthesis using end to end analysis Tools
extraction operationmanufacturing End of Life
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
Part 2Summary of Part 1
• Sustainable IT Ecosystem
• Enabling next generation of communities: City 2.0
• Role of the IT Ecosystem
• Services
• Need based Provisioning through supply and demand side management
• Introduced Unifying “Cradle to Cradle” Metric based on the 2nd Law of thermodynamics
• Supply and Demand side management centered around the core – a data center
• Physical representation of data center as a system: “data center is the computer”
Part 2: Components & Technology Implications
• Implications for components, and packaging technologies given the cradle to cradle systemic perspective of the ecosystem
− Reduce available energy consumed in operation
• Reduce available consumed by the devices during operation
• Reduce available energy consumed in supporting the operation of the devices e.g. cooling
− Reduce available energy embedded in devices• Introducing “exergo-thermovolume” metric for components
13 2 March 2009
14 2 March 2009
Ecosystem ViewImpact on Components and Technology
Wchip
Wsystem
Wpump
Wblower
Wpump Wcompressor
Wblower
Qchip
Qsystem
Qdata center + ∑W
extraction operationmanufacturing End of Life
k
ctcompm
pl
crbj
ri
devcp
dcG
WWWWWWW
QCOP
sup
Power Grid – Wensemble
Cooling Grid
Outside Air
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
15 2 March 2009
Coefficient of Performance of the Ensemble
k
ctcompm
pl
crbj
ri
devcp
dcG
WWWWWWW
QCOP
sup
Cooling Tower loop
Chiller Refrigerant loop
Chilled Water loop
Data Center CRAC units
Warm Water
Air Mixture In
QCond
Wcomp
Air Mixture In
Return Water
QEvap
Cooling tower wall are adiabatic, Q = 0
Makeup Water
Air Mixture Out
Wp
Wp
ondarypdchydronics WQCOP
sec
compW
chQ
chCOP
1
/)1(
2
3)1(
22nn
P
P
nmotor
nPrefm
compWp
ct
compdcctctct W
WQWQCOP
Patel, C.D., Sharma, R.K., Bash, C.E., Beitelmal, M, “Energy Flow in the Information Technology Stack: Introducing theCoefficient of Performance of the Ensemble”, ASME International Mechanical Engineering Congress & Exposition, November 5-10, 2006, Chicago, Illinois
Impact on Data Center Total Cost of OwnershipSustainability through end to end design and management => Least Cost
1$,12112
21,
$
depavgtotal
hardwareconsumedgridcriticaltotal ITSMRPULKLKftA
ftCost
Personnel, equipment, SW per rackBurdened power consumptionReal
Estate
J1 : capacity utilization factor, i.e. ratio of maximum design (rated) power consumption to the actual data center power consumption
K1 = F(J1): burdened power delivery factor, i.e. ratio of amortization and maintenance costs of the power delivery systems to the cost of grid power
K2 = F(J1): burdened cooling cost factor, i.e. ratio of amortization and maintenance costs of the cooling equipment to the cost of grid power
L1: cooling load factor, i.e. ratio of power consumed by cooling equipment to the power consumed by compute, storage and networking hardware (inverse of COPensemble)
Dep
reci
atio
n f
acto
rs
Patel and Shah, Cost Model for Planning, Development and Operation of a Data Centerhttp://www.hpl.hp.com/techreports/2005/HPL-2005-107R1.html
extraction operationmanufacturing End of Life
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
March 2, 2009
Chandrakant D. Patel, HP Laboratories 17
Components and PackagingComponents and Packagingstacked stacked packaging, integrated photonics, packaging, integrated photonics, high power densityhigh power density
1998 2006
10
100
1000Frequency
Device Size.
# of Devices
Voltage
Capacitance per device
per chip
2010
100
Heat Flux, W/cm2
PGAEnhanced Ball Grid Array
Flip Chip Array, Underfill
Flip Chip MCM, KGD Testing Issues
Flip Chip, Non Uniform Heat Distribution, Power Mgmt
Po
wer
, W
200
3d 3d pkgpkg
400
# of Cores
• High Power Density
• Temperature Control
2002
Optical Interconnect
18 2 March 2009 Chandrakant Patel, [email protected]
Thermal Management Challengestacked devices: chip and package scale
Heat SinkHandheld chassis or forced air finned exchanger on a server
Q + Wrequired to remove heat
High power density microprocessor with stacked devices
Q
Q
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
March 2, 2009
Chandrakant D. Patel, HP Laboratories 19
100 W, 200-300 W/cm2
Active Cooling at Package LevelDemise of Passive Only Cooling Solution
Coolant
Wcp
Work required by the chip package
Interface
• Active given the power density
Interface
System Component & Package
March 2, 2009
Chandrakant D. Patel, HP Laboratories 20
Work Required at Package LevelHigh Power Density Chips
100 W, 200-300 W/cm2
Epoxy Glass Printed Circuit Board
Forced Air Heat Exchanger
Active Micromechanical Means
chip – heat sink interface Wchip-package
34 W of Power Required by Cooling Resources to remove 100 W
Fan Work: 4 W
~.008 m3/s, P of 75 Pa; wire to air: 15%
Thermo-electric Module
30 W for a 15 oC of temperature reduction between hot and cold side
TEC Interface Chip Package Work: 30 WWchip-package ~ 30 W (COP of 3 for T of15 C)
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
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Flow Work & Thermodynamic Work
21 2 March 2009
Work required to remove heat:
• Flow & Thermodynamic Work
− Flow Work
− Volume flow and pressure drop
• volume flow, m3/s
• pressure drop, Pa
− Thermodynamic Work
• Temperature, °C Tinlet
22 2 March 2009 Chandrakant Patel, [email protected]
Available Energy Consumed in Heat RemovalWork required to remove heat from chip and system enclosure
Heat Sink
Epoxy Glass Printed Circuit Board
Tin, Tout
Operation
idevcpsysoutsysinsyspa
devcp
devcp
sys
syssys WWTTCm
WW
W
QCOP sup,,,
sup
sup
)(
)(
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
Chandrakant D. Patel, HP Laboratories 23
Work Required at Rack Level
r
isys
isysr WWQCOP
Rack level blowers
Pblade Pa
Fig 5d. Volume Resistance
Thrblade, ºC/W
, m3/s
Fig 5c. Thermal Resistance
, m3/s
Fig 5e. Blower Characteristic Curve
Pstatic, Pa ζb,sys
ζb,sys
, m3/s
Blower Curve
Blade Volume Resistance Curve
Operating Point
System Flow Work determined from volume flow and pressure drop
System active cooling device e.g. blower
March 2, 2009
Chandrakant D. Patel, HP Laboratories 24
Computer Room Air Conditioning Unit (CRAC)
CRAC – AH 2: 92.2%
CRAC - AH 1: 94.2%
CRAC – AH 6: 27.7%
CRAC- AH 5: 36.7%
CRAC - AH 4: 38.8 %
CRAC- AH 3: 80.3%
crahbcrlcr WQCOP
Blower Characteristic Curve
Pstatic, Pa ζb,sys
ζb,sys
, m3/s
Example shown has a Chilled Water Air Handling Unit in the room – so we will refer to it as CRAC – AH (Contains Air Mover and a Chilled Water Coil)
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
March 2, 2009
Chandrakant D. Patel, HP Laboratories 25
k
ctcompm
pl
crbj
ri
devcp
dcG
WWWWWWW
QCOP
sup
COP of Ensemble
depavgtotalhardwareconsumedgrid
GG
criticaltotal ITSMRaPwrUCOP
KCOP
KmAm
Cost ,$,21
2
2
111,
$
• Representing L1 as inverse of COPG
Reducing the Cost of the Data CenterMaximizing COPG
26 2 March 2009
Wchip
Wsystem
Qsystem
Outside Air
References:1.Reducing Data Center Cost with an Air Economizer, IT@Intel Brief, August 20082.Best Practices in Energy Efficiency in Microsoft Data Centers, Feb 2008
System Consideration: Using outside air i.e. eliminating the chiller in the ensemble• Component design drives this upstream consideration• Need to revisit environmental specifications with lifecycle in mind• In face of challenges: high power density, optical interconnects, stacked die
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
Revisiting Environmental SpecificationsComponents need a “Damage Boundary” specification with respect to temperature
27 2 March 2009
Errors recoverable with retries
Amplitude, g’s
Change in Velocity, m/s
Short duration mechanical shock pulse used to establish vertical boundary
• pulse width established based on chassis fundamental frequency
Long duration mechanical shock pulse used to establish horizontal boundary
[3] Hedtke, L and Patel C.D., Damage Boundary Assessment of Hard Disc Drives, ASME WAM 1990
Drawing the analogy from late 1980s - “damage boundary” technique used to assess fragility of a disc drive to mechanical shock [3][4].
Hard Errors
1. Is there an analogous approach to establish temperature “damage boundary” for components?
2. What is the lifecycle impact?
[4] Newton, R.E., “Damage Boundary Revisited”, Technical Report 89-WA/EEP-24
28 2 March 2009 Chandrakant Patel, [email protected]
Thermo-mechanical Models to assess Damageend of life prediction
Tin, °CTdrive,in
Tdrive core
Tdrive core,°C
Qdrive spindle
extraction operationmanufacturing End of Life
• Given inlet temperature, what is the core temperature of the spindle?
• Develop thermo-mechanical models to determine core temperatures of various electro-mech systems e.g.
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
29 2 March 2009 Chandrakant Patel, [email protected]
Design ApproachLifecycle Based Engineering and Management
Extraction operationmanufacturing End of LIfe time
Cradle to Gate
Sensors for roadbeds: Performance requirement not changing with time, no need to upgrade for a long period • resistant to wide environmental requirements• ideally passive or low power requirement
Data Center, system chassis e.g. rack
Focus on embedded exergy
Gate to Grave
Focus on operational exergy
Servers for core data centers:Performance improvements allow more users per processors e.g. three year upgrade cycle for a microprocessor• Library of hybrid active-passive solutions
• scalable power and cooling solutions
Grave to Cradle
• appropriate material choices to enable reclamation• appropriate material choices to enable operation at elevated temperatures
Focus on embedded exergy
• Need for a systemic viewpoint in Components and Packaging− Computing is at the crossroads
• Early days of computing saw vertically integrated organizations building computing solutions
• Commoditization of compute hardware created an ecosystem of suppliers of hardware and software
− Computing solutions were integrated in place
− Data Center became the Computer
• Now there is an emergence of computing services – Cloud Computing
• Purveyed from data centers− Growth will come from billions who want to use services to improve the quality of life
− Growth will come from IT becoming seamless with physical infrastructures such as cities
− Component designs are affected by upstream and downstream considerations
30 2 March 2009
Key MessageIEEE CPMT Talk, February 26, 2009
IEEE Santa Clara Valley Chapter, CPMT SocietyFebruary 26, 2009
www.cpmt.org/scv
31 2 March 2009
Enabled by a Sustainable IT Ecosystem
Joules: Currency of the Sustainability Ageecosystem: billions of handhelds and printers, thousands of data centers and print factories
City 2.0