(FSE: AIX, ISIN DE0005066203; NASDAQ: AIXG, ISIN: US0096061041)
Credit Suisse 10th Annual European
Technology Conference 14-15 May, London
Credit Suisse 10th Annual European
Technology Conference 14-15 May, London
Paul Hyland – President & Chief Executive OfficerPaul Hyland – President & Chief Executive Officer
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Forward-Looking StatementsForward-Looking Statements
This presentation may contain forward-looking statements about the business, financial condition, results of
operations and earnings outlook of AIXTRON within the meaning of the “safe harbor” provisions of the United
States Private Securities Litigation Reform Act of 1995. Words such as “may”, “will”, “expect”, “anticipate”,
“contemplate”, “intend”, “plan”, “believe”, “continue” and “estimate”, and variations of these words and similar
expressions, identify these forward-looking statements. The forward-looking statements reflect our current views
and assumptions and are subject to risks and uncertainties. You should not place undue reliance on the forward-
looking statements. The following factors, and others which are discussed in AIXTRON’s public filings and
submissions with the U.S. Securities and Exchange Commission, are among those that may cause actual and
future results and trends to differ materially from our forward-looking statements: actual customer orders
received by AIXTRON; the extent to which chemical vapor deposition, or CVD, technology is demanded by the
market place; the timing of final acceptance of products by customers; the financial climate and accessibility of
financing; general conditions in the thin film equipment market and in the macro-economy; cancellations,
rescheduling or delays in product shipments; manufacturing capacity constraints; lengthy sales and qualification
cycles; difficulties in the production process; changes in semiconductor industry growth; increased competition;
exchange rate fluctuations; availability of government funding; variability and availability of interest rates; delays
in developing and commercializing new products; general economic conditions being less favorable than
expected; and other factors. The forward-looking statements contained in this presentation are made as of the
date hereof and AIXTRON does not assume any obligation to update or revise any forward-looking statements,
whether as a result of new information, future events or otherwise, unless required by law.
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• Shanghai, China• Seoul, S. Korea• Tokyo, Japan• Hsinchu, Taiwan
Epigress AB,Lund
AIXTRON – Enabling Global SolutionsAIXTRON – Enabling Global Solutions
AIXTRON AG, Aachen
AIXTRON AG, Herzogenrath
AIXTRON Inc., SunnyvaleAIXTRON Ltd., Cambridge
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Gas Phase DepositionGas Phase Deposition
Material Engineering on an Atomic Scale
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AIXTRON Planetary Reactor ®AIXTRON Planetary Reactor ®
Wafer
Injector
Reactor Chamber
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Value Chain PositioningValue Chain Positioning
ProductionEquipment
Manufacturers
ElectronicDevice
Manufacturers
End User
Markets
Chip &Component
Manufacturers
� ConsumerCommunication
� Industrial
� Display
� Lighting
� Medical
� Automotive
Slide: 7
• LEDs/OLEDs for displays• LEDs/OLEDs for lighting• Optoelectronics for telecom/datacom
• Organic Electronics for flexible displays and RFID
• CD-, DVD-lasers• High frequency for wireless• High power SiC• III-V Compound and Organic solar cells
• Carbon Nanotube Structures
• Metal and oxide films for CMOS transistors
• Traditional NAND-Flash Memory
• Traditional, next generation DRAM Memory
• TFH – Thin Film Heads for data storage hard disk drives
Applications
Silicon Semiconductors AVD®, ALD, CVD
Compound SemiconductorsMOCVD, OVPD®Technology
Gas Phase DepositionNano Scale Material Engineering
Business
One Technology – Multiple SolutionsOne Technology – Multiple Solutions
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Planetary Reactor®
Close Coupled Showerhead®
Compound
Tricent® AVD®
SiliconSystem TechnologiesSystem Technologies
Hot Wall SiC CVD
Compound
OVPD®
Compound
NanoinstrumentsBlack Magic
Compound
Tricent® ALD
Silicon
Lynx CVD
Silicon
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Compound Platform SystemsCompound Platform Systems
Close CoupledShowerhead ®
CRIUS®, 31x2“
� Rapid adoption by customer base
� Established industry standard
� Production volume increased in 2007
� c.79% of Q1/08 Equipment Orders (72% in 07)
� c.66% of Q1/08 Revenues (48% in 07)
Planetary Reactor ®
AIX 2800G4, 42x2”
Integrated Concept (IC) System
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13%6%
64%17%
Source: VLSI RESEARCH Inc. 2008
14%4%
20%62%
Global MOCVD Market SharesGlobal MOCVD Market Shares
Veeco
Others
Nippon Sanso
AIXTRON
2007Total: $289m
2005Total: $156m
2006Total: $202m
10%2%
70%
18%
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� Consumer Electronics continue to drive the NAND flash and DRAM industry
� Comprehensive AIXTRON-portfolio:CVD, ALD, AVD®
� Fab ramp-up with established CVD customers
� ALD/AVD®: film qualifications for new materials in transistors & capacitors
� Combined ALD/AVD® technology (JDP with Asian Semicon leader) Lynx CVD
Reactor1 x 300mmALD/AVD ® System
Silicon Semiconductor SystemsSilicon Semiconductor Systems
Tricent ® ALD Reactor
1 x 300mm
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Global CVD Market Shares for WSi xGlobal CVD Market Shares for WSi x
based on VLSI RESEARCH Inc. 2008
2006Total: $109m
3%15%
34%
48%
2%12%
24%
62%
Tokyo Electron
Applied Materials
Others
AIXTRON
2007Total: $84m
Elpida-PSC
Qimonda
Micron Samsung
ProMos
Hynix
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15%
5%
32%
44%
2%0%
58%
13%61%
3%
22%
9%
5%
LED
Consumer/Optoelectronic
Display & Others
Silicon
2006: €143.1m2005: €113.4m Q1,2008: €62.6m
Equipment Revenues by ApplicationEquipment Revenues by Application
Diversification of Equipment Revenue Base (excl. spar es):
78%
5%
15%
0%2%
2007: €186.9m
Telecom/DatacomTelecom/Datacom
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High Brightness LED Market ForecastHigh Brightness LED Market Forecast
0
1.000
2.000
3.000
4.000
5.000
6.000
7.000
8.000
9.000
10.000
2006 2007 2008 2009 2010 2011
Mar
ket S
ize
(US
D m
illio
n)
Signs / Displays Mobile Appliances
Signals Automotive
Illumination Electronic equip. / Other
15%
48%1%
15%
5%
16%
40%
23%1%
12%
10%
14%
HB LED summary forecast by application 2006-2011 2006
2011
Source: Strategies Unlimited 2007
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AIXTRON Global PresenceAIXTRON Global Presence
Lund, Sweden
Inc.Sunnyvale, USA Aachen, D
Headquarters
AG
Seoul, South
Korea
cshsTokyo, Japan
KK
AGShanghai, P.R. China
Taiwan Co., Ltd.
Representation
Cambridge, UKLtd. ABAB
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14,3 14,321,9
6,6
2005 2006 2007 <Q1/08
Revenues by RegionRevenues by Region
22,1 22,218,8
4,1
2005 2006 2007 <Q1/08
Europe
(13%)
(7%)
(16%)(9%)
USA
(10%)
(8%)(10%)
(10%)
(€ million)
103
135,2
174,1
51,9
2005 2006 2007 <Q1/08
(81%)
(79%)
(74%)
(83%)
AsiaAsia
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Compound Semiconductors
(including Organics)Silicon Semiconductors
� €77.3m (+161% yoy)
� 90% of equip.order intake
� €8.2m (-25% yoy)
� 10% of equip.order intake
Business Development Q1/2008Business Development Q1/2008
Main drivers
� €47.8m equipment1)
revenues (+10% yoy)
� 76% of total2) revenues
� Industry preparation for LED-Backlighting applications continue
� More multiple scheduled orders received
� Current market conditions constrain capital spending
� Next-generation AIXTRON systems ready for launch in 2008
� €8.3m equipment1)
revenues (-40% yoy)
� 13% of total2) revenues
Revenues
Equipment1)
Order Intake
1) Excluding spares/services; 2) including spares/services1) Excluding spares/services; 2) including spares/services
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Q1/2008 Key FinancialsYear-on-Year Comparison (Q1/2008 vs. Q1/2007)Q1/2008 Key FinancialsYear-on-Year Comparison (Q1/2008 vs. Q1/2007)
(€ million, unaudited) Q1/2008 Q1/2007
Equipment Order Intake 85,5 40,5 111%
Equipment Order Backlog (end of period) 157,3 70,0 125%
Revenues 62,6 63,8 -2%
Gross Profit 24,5 24,2 1%
Gross Margin 39% 38% +1 pp
EBIT 8,7 8,2 6%
EBIT Margin 14% 13% +1 pp
Net Result 5,9 7,6 -22%
EPS (€) 0,07 0,09 -22%
Cash & Cash Equivalents (end of period) 68,6 43,7 57%
Free Cash Flow 12,9 (6,1)
Variance
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Q1/2008 Key FinancialsSequential Quarterly Comparison (Q1/2008 vs. Q4/2007)Q1/2008 Key FinancialsSequential Quarterly Comparison (Q1/2008 vs. Q4/2007)
(€ million, unaudited) Q1/2008 Q4/2007 Variance
Equipment Order Intake 85,5 86,9 -2%
Equipment Order Backlog (end of period) 157,3 132,0 19%
Revenues 62,6 54,1 16%
Gross Profit 24,5 22,6 8%
Gross Margin 39% 42% -3 pp
EBIT 8,7 4,3 102%
EBIT Margin 14% 8% +6 pp
Net Result 6,0 2,4 150%
EPS (€) 0,07 0,03 133%
Cash & Cash Equivalents (end of period) 68,6 71,9 -5%Free Cash Flow 12,9 22,1
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Euro/US-Dollar Exchange Rate 2007Euro/US-Dollar Exchange Rate 2007
US-Dollar vs. EURO: -12%
US-Dollar vs. EURO: -12%
Average Rate 2007: USD 1.37 per EuroAverage Rate 2007: USD 1.37 per Euro
0.66
0.68
0.70
0.72
0.74
0.76
0.78
0.80
Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
EUR/USD
US-Dollar falls by 12%
Average Rate 2007: 0.73 EUR/USD or 1.37 USD/EURFin
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81,298,3 85,1
70,0 80,3102,8
132,0157,3
81,2 98,3 85,1 70,0 80,3 102,8 132,0 157,3
Equipment (only)
Order Intake
24 - Month Business Development24 - Month Business Development(€ million)
Total Revenues(incl. equipment, service, spare parts)
49,5 52,3 44,5 40,550,3
70,086,9 85,5
35,7 40,9
63,1 63,8
45,2 51,7 54,162,6
Q2/2006 Q3/2006 Q4/2006 Q1/2007 Q2/2007 Q3/2007 Q4/2007 Q1/2008
Equipment (only)
Order Backlog
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2008 Guidance Model(€ million)2008 Guidance Model(€ million)
2008 Guidance:
� €270 - 300m Revenues
� 10-12% EBIT Margin
21
136
6350-80
2008 equipment revenue fromorder backlog (out of €157m)
Q1/2008 actual total revenue
Assumed Q2-Q4 2008 spares/non-system revenue
Equipment orders required for 2008 revenue
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Target Market OpportunitiesTarget Market Opportunities
Short -Term
� LED backlighting for next generation LCD screens
� LEDs for increasing automotive applications
� Emerging LED external/street lighting applications
Mid-Term
� Emerging Solid State Lighting device applications
� Silicon carbide (SiC) hybrid automotive & solar applications
� CVD/ALD: NAND/DRAM memory – next generation applications
� Concentrator solar cells, III-V photovoltaics
� Development of plastic electronics/flexible TFT Backplanes
Long-Term
� OLED: Promising longer term development technology
� III-V – Silicon material convergence
� Development of applications using Carbon Nanotubes CNT
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For further information please contact:
Investor Relations & Corporate CommunicationsGuido PickertAIXTRON AG � Kackertstr. 15 – 17 � 52072 Aachen, GermanyPhone: +49 241 8909-444 � Fax: +49 241 8909-445 � Email: [email protected]
� August 7, 2008 Q2/2008 Results conference in Frankfurt
� November 6, 2008 Q3/2008 Results, conference call
� March 12, 2009 Q4/2008 Results conference in Frankfurt
� May 7, 2009 Q1/2009 Results, conference call
� May 20, 2009 Annual General Meeting at Eurogress in Aachen
2008 Financial Calendar & Contact Data2008 Financial Calendar & Contact Data
Slide: 25
File:
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AIXTRON Share Price Development 2007AIXTRON Share Price Development 2007
3.00
4.00
5.00
6.00
7.00
8.00
9.00
10.00
Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
AIXTRON
TecDax indexed
2007: + 185%
Sha
re P
rice
and
Out
look
Sha
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rice
and
Out
look
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(€ million)* Q1/2008 Q1/2007
Revenues 62,6 63,8 -2%
Cost of sales 38,1 39,7 -4%
Gross profit 24,5 24,1 2%
Gross Margin 39% 38% +1pp
Selling Expenses 8,0 6,9 16%
General Admin. Expenses 4,5 4,3 5%
R&D 6,8 7,1 4%
Other operating income (expense) 3,5 2,4 46%
EBIT 8,7 8,2 6%
EBIT Margin 14% 13% +1pp
Result before tax 9,4 8,5 11%
Pre-Tax Margin 15% 13% +2pp
Net result 6,0 7,8 -23%
Net Return on Sales 10% 12% -2pp
Variance
Q1/2008 Group Income Statement (IFRS)Year-on-Year Comparison (Q1/2008 vs. Q1/2007)Q1/2008 Group Income Statement (IFRS)Year-on-Year Comparison (Q1/2008 vs. Q1/2007)
* Quarterly numbers are unaudited
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Q1/2008 Group Balance Sheet (IFRS)Balance Sheet Development (Q1/2008 vs. Q4/2007)Q1/2008 Group Balance Sheet (IFRS)Balance Sheet Development (Q1/2008 vs. Q4/2007)
* Quarterly numbers are unaudited
(€ million)* Mar.31, 2008 Dec.31, 2007
Property, plant & equipment 36,5 35,1Goodwill 55,0 59,0Other intangible assets 11,3 12,5Others 8,7 10,9
Non-current assets 111,5 117,5Inventories 67,8 60,0Trade receivables 32,5 33,5Others 32,8 13,9Cash & Cash Equivalents 68,6 71,9
Current Assets 201,7 179,3Shareholders' equity 199,5 198,4Non-current liabilities 2,3 2,4
Trade payables 25,5 23,8Advanced payments from customers 61,4 50,0Others 24,6 22,2
Current liabilities 111,5 96,0Balance Sheet total 313,3 296,8
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New Technologies – New OpportunitiesNew Technologies – New Opportunities
Depositionwith
AIXTRON Gen 3.5
tool
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Development of New Tool for Plastic Logic – Plastic Elect ronics
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Unique Properties
� Very high thermal conductivity
� Very low resistivity
� Very high mechanical stability
Application Examples
� Electronics
� Heat Sinks
� Field Emission Display
Roll-up
Carbon Nanotubestructure
Acquisition of Nanoinstruments, Ltd. – Carbon Nanotubes
New Technologies – New OpportunitiesNew Technologies – New Opportunities
Graphene sheet
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Aspect ratio
Laye
r th
ickn
ess
[Å
]
1 10 100
1
10
100
1000 CVDWord Line DRAM
Metal Control Gate NAND
ALDMetal Electrode and
High-k Dielectric DRAM
AVDMetal Electrode and
High-k Dielectric eDRAM
Atomic Level Solutions
Advanced Technology RequirementsAdvanced Technology Requirements
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FeRAM CapacitorsAVD®
Stack DRAM CapacitorsALD (Dielectric)
ALD + AVD® (Electrode)
Flash Floating GateInterpoly & Tunnel Oxide
ALD + AVD®
Metal GateAVD®
Trench DRAMALD (Dielectric)
ALD + AVD® (Electrode)
Integrated Capacitors
AVD®
Metal / Metal Silicide on Poly GateCVD
eDRAMCapacitors
AVD®
High-k GateDielectrics
AVD®
Films for Logic and Memory TransistorsFilms for Logic and Memory Transistors
Sidewall SpacersALD + AVD®
Shallow Trench IsolationALD
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Table of ContentsTable of Contents
�Financial Performance 2007
Sha
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Mee
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2008
Sha
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Mee
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2008
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Key Group Financials 2007Key Group Financials 2007
(€ million) 2007 2006
Equipment Order Intake 247.7 178.0 39%
Equipment Order Backlog (end of period) 139.8 85.1 64%
Revenues 214.8 171.7 25%
Gross Profit 85.0 63.4 34%
Gross Margin 40% 37% +3pp
EBIT 20.6 5.7 261%
EBIT Margin 10% 3% +7pp
Net Result 17.3 5.9 193%
EPS (€) 0.20 0.07 186%
Cash & Cash Equivalents (end of period) 71.9 46.8 54%
Free Cash Flow 22.3 15.6 43%
Variance
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Group Income Statement 2007 (IFRS)Group Income Statement 2007 (IFRS)
(€ million) 2007 2006 Variance
Revenues 214,8 171,7 25%Cost of sales 129,8 108,3 20%Gross profit 85,0 63,4 34%Gross Margin 40% 37% +3ppSelling Expenses 27,2 23,4 16%General & Admin. expenses 16,0 17,3 -8%R&D 26,5 23,9 11%Other operating income (expense) 5,3 6,8 -22%EBIT 20,6 5,6 268%EBIT Margin 10% 3% +7ppResult before tax 22,4 6,6 239%Pre-Tax Margin 10% 4% +6ppNet result 17,3 5,9 193%Net Return on Sales 8% 3% +5pp
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Group Cash Flow Statement (IFRS)Group Cash Flow Statement (IFRS)
(€ million) 2007 2006
Cash Flow from operating activities 32,9 20,8of which: net income (loss) after taxes 17,3 5,9
Cash Flow from investing activities (10,5) (5,1)Cash Flow from financing activities 2,9 (0,3)
[incl. exchange rate changes]Net change in Cash & Cash Equivalents 25,2 15,3Cash & Cash Equivalents at the end of period 71,9 46,8
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Group Balance Sheet 2007 (IFRS)Group Balance Sheet 2007 (IFRS)
(€ million) Dec 31, 2007 Dec 31, 2006
Property, plant & equipment 35.1 36.4Goodwill 59.0 65.1Other intangible assets 12.5 15.1Others 10.9 11.4
Non-current assets 117.5 128.0Inventories 60.0 53.1Trade receivables 33.5 27.7Others 13.9 7.9Cash & Cash Equivalents 71.9 46.8
Current Assets 179.3 135.5Shareholders' equity 198.4 183.9Non-current liabilities 2.4 3.1
Trade payables 23.8 29.9Advanced payments from customers 50.0 31.4Others 22.2 15.2
Current liabilities 96.0 76.5Balance Sheet total 296.8 263.5
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AIXTRON Group Worldwide ProductionAIXTRON Group Worldwide Production
AIXTRON AG, Aachen-Herzogenrath/Germany
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AIXTRON Group Worldwide ProductionAIXTRON Group Worldwide Production
AIXTRON AG, Aachen-Herzogenrath/Germany
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AIXTRON Group Worldwide ProductionAIXTRON Group Worldwide Production
AIXTRON Ltd., Cambridge/UK
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AIXTRON Inc., Sunnyvale/USA
AIXTRON Group Worldwide ProductionAIXTRON Group Worldwide Production
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