Download - GR740 Plastic BGA Development - ESCIES
![Page 1: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/1.jpg)
PUBLIC 1
GR740Plastic BGA
Development
Overview PresentationDate: 2021-03-11
![Page 2: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/2.jpg)
PUBLIC 2
• Strong demand to reduce cost for space electronics including EEE components, especially for telecom constellation programs
• Done by employing methods, materials and techniques used for commercial and automotive industry, e.g. organic packages
• Development objective:• Assemble existing GR740 die in suitable organic package• Process it through an adapted test flow• Perform an evaluation demonstrating the capability to reach required
standards for telecom constellation programs.
Abstract
![Page 3: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/3.jpg)
PUBLIC 3
• About Cobham Gaisler (CG)• Introduction to GR740• Scope• Project organization• Milestones• Evaluation activities• Conclusion
Agenda
![Page 4: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/4.jpg)
PUBLIC 4
A world leader in embedded computer systems for harsh environments
Experts in fault-tolerant computing
We provide a full ecosystem to support hardware and software design for:• Standard components• Semi-custom FPGA• Full custom ASIC
Based on SPARC and RISC-V architectures
![Page 5: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/5.jpg)
PUBLIC 5
Established 2001,20-year anniversary!• Acquired by Aeroflex in 2008• Acquired by Cobham in 2014
Located in Gothenburg, Sweden
40 employees
In-house facilities• ASIC and FPGA design• Software• Component lab
![Page 6: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/6.jpg)
PUBLIC 6
NOEL Processor Family• GR7xv, NOEL-V, 16-Core, in development
LEON Processor Family• GR765, LEON5FT, in development• GR740, LEON4FT, quad-core, 250 MHz, QML-V approval exp. Q2 2021• GR740 PBGA, LEON4FT, quad-core, 250 MHz, prototypes Q2 2021• GR716A, LEON3FT, single-core, 50 MHz, ESCC 9000 screening exp. Q2 2021• GR716B, LEON3FT, single core 100 MHz, in development• GR712RC, LEON3FT, dual-core, 100 MHz, Vendor class S• UT700, LEON3FT, single-core, 166 MHz, QML-Q, QML-V• UT699E, LEON3FT, single-core, 100 MHz, QML-Q, QML-V• UT699, LEON3FT, single-core, 66 MHz, QML-Q, QML-V
Components
Interconnect• GR718B, Vendor class S
High-reliability• Radiation hardened • Space qualified • Fault-tolerant
![Page 7: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/7.jpg)
PUBLIC 7
Introduction to GR740
X
EthernetMIL-STD1553B
CANControllerSpW routerPCI
TargetPCIDMA
BootstrapGP register
TDPcontroller
SPIcontroller
Timer unit 0watchdog
GPIO port0 - 1 UARTTemperature
sensor
Clock gatingunit
Pad / PLLcontroller
AHBStatus
Timer units1 - 4
PCIMaster
L2Cache
SDRAMCTRL w.
EDAC
MemoryScrubber
PROM& IO
CTRL w.EDAC
AHB/APBBridges
AHB/AHBBridge
AHB BridgeIOMMU
AHBStatus
AHB/AHBBridge
DSU4 AHB/APBBridge
SpW RMAPDCL
AHBTRACEJTAGDCL
IRQ(A)MP LEON4STAT.UNIT
M = Master interface(s)S = Slave interface(s)X = Snoop interface
Debug bus
32-bit APB
S S SSM
MSS
32-bit APB
MSM
S
X
M M MM
S S SS SS
MSMMS
S
S
X
MM
SMMM
SSSS MXMXMXMX Processor bus
128-bit AHBMemory bus128-bit AHB
S M
X
SSSSSS
SS
Slave IO bus32-bit AHB
S
S
S
S
S
S
Statistics
SS
96-bitPC100SDRAM
PROMIO
8/16-bit
32-bit AHB
Master IO bus32-bit AHB
LEON4
FPU
MMUCaches
LEON4
FPU
MMUCaches
LEON4
FPU
MMUCaches
LEON4
FPU
MMUCaches
LEON4
FPU
MMUCaches
https://www.gaisler.com/
Radiation-hard system-on-chip quad-core fault-tolerant LEON4 SPARC V8 processor
Cobham Gaisler digital IP: LEON4FT and IO peripheralsSTMicroelectronics C65SPACE technology platformComplete software toolchain and debuggers are available
![Page 8: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/8.jpg)
PUBLIC 8
Introduction to GR740
GR740 - WFIRST Processor Board
GR740 - IPAC Computer for the Platino mission
Ref: Roland Weigand. GR740 User day presentation: “from concept to product NGMP to GR740”
Power <2.0W, Performance >1700 DMIPS
![Page 9: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/9.jpg)
PUBLIC 9
Introduction to GR740. Radiation results
• TID tolerance of 300 krad(Si)• Overall SEE rate below 1x10-5 events/device/day (GEO)• SEL > 125 MeV.cm2/mg (T>85ºC & max supply)
ALL TESTS SUCCESSFULLY COMPLETED!
![Page 10: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/10.jpg)
PUBLIC 10
Introduction to GR740
ESA’s next generation Microprocessor (NGMP) development time-line:• Ceramic
• 2009, Start of the development under a TRP contract with ESA (VHDL design and verification by simulation on FPGA).
• 2014, Implementation of NGMP into a space chip technology (C65Space).
• 2016, Engineering models of the GR740 were evaluated.• 2018, Flight Silicon manufactured and validated (including
radiation).• 2020, All QML-V related qualification tests successfully completed.• 2021-Q2, QML-V and QML-Q certification by the DLA expected
• Organic (GR740PBGA)• 2020-Q1, Start of the development under an ESA ARTES
Competitiveness & Growth contract• 2021-Q1, First electrical samples being validated
![Page 11: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/11.jpg)
PUBLIC 11
Scope of ARTES program
• Cobham Gaisler to develop the quad-core LEON-4 GR740 in plastic package
• Same wafer material used as for the ceramic package product i.e. full traceability
• Re-use lessons learnt and heritage from the ceramic package project
• Perform an evaluation demonstrating the capability to reach required standards for telecom constellation programs.
![Page 12: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/12.jpg)
PUBLIC 12
Project organisation
Prime contractor• Cobham Gaisler AB, Sweden
• Product owner
External service providers:• Synergie CAD PSC, France
• Overall responsibility for electrical testing, mechanical screening and evaluation activities
• Design and fabricate;• The test load board• The HTOL system• The THB board
• Adapt the production test program• Interface towards ST Microelectronics
• ST Microelectronics, France• Responsibility for supply of dice, substrate and package
design and assembly
![Page 13: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/13.jpg)
PUBLIC 13
Achieved Milestones
• Package drawing• Body size: 27*27mm, 625 balls• Solder ball pitch; 1 mm• Same footprint as ceramic
package and pin-compatible• BOM• Electrical & thermal simulations• Load board, THB and HTOL boards
developed• First samples have been
manufactured and electrically tested
Work Packages
![Page 14: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/14.jpg)
PUBLIC 14
GR740PBGA package
• Same footprint as ceramic package and pin-compatible
• 4-layers substrate• SACN306 balls
• Thermal and electrical simulations of the package performed by ST
Images courtesy of ST Microelectronics
![Page 15: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/15.jpg)
PUBLIC 15
GR740PBGA Load board
• Load board verified and operational• Temperature range selected for GR740PBGA:
• -40ºC to +105ºC
Images courtesy of Synergie CAD
![Page 16: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/16.jpg)
PUBLIC 16
Evaluation activities
• ECSS-Q-ST-60-13C, class 2• Constructional Analysis• Electrical characterisation• THB, 1000 hours• 500 TC• HTOL, 2000 hours
• ESD CDM• Outgassing characterisation
![Page 17: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/17.jpg)
PUBLIC 17
Conclusion
• About to supply the telecom constellation market with
• a high-rel rad-hard die developed for QML-V• that will be able to support telecom
constellation programs with a cost-effective package technology
• Great market interest for the GR740PBGA
![Page 18: GR740 Plastic BGA Development - ESCIES](https://reader034.vdocument.in/reader034/viewer/2022042721/6267be6bc494c3541778b6b0/html5/thumbnails/18.jpg)
PUBLIC 18