1 © 2013 Andreas König & ROSIG group
Institute of Integrated Sensor Systems
Dept. of Electrical and Computer Engineering
Prozessintegriertes autonomes Überwachungssystem für die Verfahrenstechnik auf Basis vernetzter, multifunktionaler MST-Funksensoren
(PAC4PT)
Ressourcen-effiziente, robuste Sensor- und Funksignalverarbeitung für autonome vernetzte Systeme in fluiden Medien
(ROSIG, Fkz. 16SV3604 )
gefördert vom
2 © 2013 Andreas König & ROSIG group
ROSIG Project 2012/2013 Final Phase
ROSIG Project Group of ISE: Prof. Dr.–Ing. Andreas KönigM.Sc.K. Thongpull, M.Sc. A. ChandraD. Groben, M.Sc. A. Johar, N. Muntean
Contents:MotivationSensor Node Prototype and Test IssuesMagnetic Sensor LocalizationMagnetic Sensor SynchronizationLow Power and Self-x IssuesROSIG-DemonstratorConclusion and Future Research & Exploitation
3 © 2013 Andreas König & ROSIG group
Motivation
WSN becoming ubiquitous in Automation, Agriculture, AmI/AAL etc.Cyber-Physical-Systems and the Internet of things add momentumLimitation of existing implementations technologies require access to advanced packaging and MEMS technologies in addition to mainstream chiptechnologies (CMOS, BiCMOS, SOI etc.)
ISE goal (project proposal) for research & exploitation: Get training in and access to packaging/MEMS technologies for inclusion in RLP research centers, e.g., Ambient Systems, Commercial Vehicles etc. and indidual initiatives, e.g., Driver Assistance Systems (DeCaDrive) or SmartKitchen
Important issues in WSN besides the communication and technology:LocalizationSynchronizationSelf-X and Low-power
4 © 2013 Andreas König & ROSIG group
Process-Ifc.
(sim. by Matlab)
Process-Ifc.
(sim. by Matlab)
Sensor Node Prototype and Test Issues
Coarse System Architecture (adapted from 2009):
Sensor(s) Digital Core(Atxmega256A3)
Env.- RF-ChipAntenna
Energy Supply/ManagementEnergy Supply/Management
stationary,n > 4
mobile, n < 100
Digital Core(IMST/atmel)
Master/Slave-,Process-Ifc.
RF-ChipAntenna
Master (Gateway)
AnalogElectronics
5 © 2013 Andreas König & ROSIG group
Sensor Node Prototype and Test Issues
Debugging
interfaceD
ebugginginterface
Pressure sensor module(microTec)
Pressure sensor module(microTec)
Radio module(IMST)
Radio module(IMST)
LED(2x)
LED(2x)
EEPROMEEPROM
Resonator(32kHz)
Resonator(32kHz)
AMR-Sensor moduleAMR-Sensor module
MCU(AT Xmega 256A3)
MCU(AT Xmega 256A3)
T-Sensor module(UST)
T-Sensor module(UST)
Charging module(UST)
Charging module(UST)
Flipping-unit
Flipping-unit
Accu(4,2V)
Accu(4,2V)
VrefVrefVoltage
controller(3,3V)
Voltagecontroller
(3,3V)
6 © 2013 Andreas König & ROSIG group
Sensor Node Prototype and Test Issues
2009-2010 prototype
7 © 2013 Andreas König & ROSIG group
Sensor Node Prototype and Test Issues
First prototype wire-wrapped, thus ´´cranky´´ and ´´buggy´´Modular test of emerging 3D-CSP units difficultNo back-up in case of defect/problems3D-CSP complete sensor node unavailable, but needed for SW dev.
Thus SoA modular PCB-system conceived (lot size 5)
Numerous bugs found in design data base, e.g. pressure sensor, EEPROM etc.Shipped to partner (IMST) for better cooperation
8 © 2013 Andreas König & ROSIG group
Sensor Node Prototype and Test Issues
9 © 2013 Andreas König & ROSIG group
Sensor Node Prototype and Test Issues
PCB & 3D-CSP modules exchanged and testedSW development advancedMeasurement became feasibleDesigned for small volume test of 3D-CSP
Remaining problems:Connectivity of 3D-CSP to PCB-Adapters ´´cranky´´Complete and functional 3D-CSP module set never available´´Lot size one policy´´ created problems
10 © 2013 Andreas König & ROSIG group
Magnetic Localization
Sensors used for Localization (2009 survey)
Radio base Light wave
Ultra SoundMagnetic Field
Internal Source (ball magnet)
Magnetic Marker
External Source
Triple Sensor Technologies GmbH
MCS410 Crossbow - Cricket http://www.xbow.com/
AC FieldQuasi DC Field
AMR
Sensitec GmbH http://www.sensitec.com/
Ascension Technologywww.ascension-tech.com
Polhemuswww.polhemus.com
11 © 2013 Andreas König & ROSIG group
Magnetic Localization
d1d6
d2
d5
d4
d3
Coil 3
Coil 1
Coil 2
Coil 5
Coil 6
Coil 4
Triaxial Anisotropic Magnetoresistive (AMR) sensor for 3D localization
Ternary quasi-DC coil switching alleviate need for flipping of AMR
Stainless-steel container
wireless sensor nodes
Coils
12 © 2013 Andreas König & ROSIG group
Magnetic LocalizationConversion from Sensor Output to Distance Value
AMR sensor: Sensitec AFF755B
,2
p ni i
iV VV −
=
( )0.52 2 2M x y zV V V V= + +
( )0.52 2 2 MM x y z
s
VB B B BS V G
= + + =⋅ ⋅
20
2 2 3/ 22 ( )Mn I RB
R dµ ⋅ ⋅
= ⋅+
12 2
21 3202
M
n R Id RB
µ ⋅ ⋅ ⋅ ⋅ = −
where S : sensitivityVs : bridge supply voltageG : gain of amplifier
{ }, ,i x y z=
Measure the magnetic field strength of coils
Transform the measurement into distancevalue
Localization algorithms(Improvement in ongoing research !)
13 © 2013 Andreas König & ROSIG group
Magnetic LocalizationValidation Scenario
Warstein campaign (Carrella & Groben, Sept. 2011), front & backview of container in brewery ´´Technikum´´ with TUKL/ISE coil system
14 © 2013 Andreas König & ROSIG group
Magnetic LocalizationValidation Scenario
Reported measurements have not been made with the target hardware (atmel Xmega 256A3) but with analog 3D-AMR sensor & DT DAQ Field generation with both DAQ & Xmega 256A3 board
Grid of investigated container volume (left), 3D-AMR sensor & board
15 © 2013 Andreas König & ROSIG group
Magnetic LocalizationValidation Scenario
Reasons: imperfect ADC-use, inferior algorithms, missing calibration ....
First-Cut (Carrella & Groben, Sept. 2011) data acqusition & analysis30 sensor positions with about 10 repetitions measured in center cube of tankOverall result: Mean err. 40.73 cm with standard dev. 16.79 cm !
16 © 2013 Andreas König & ROSIG group
Magnetic Synchronization(a) Synchronous Starting (b) Periodic Resynchronization
17 © 2013 Andreas König & ROSIG group
Low Power and Self-x IssuesSelf-x Extension of AD8290 in 3D-AMR
Offset & gain programmable in differential ADC mode Offset read for each channel and compensated Gain set for full-scale: Zooming & self-x achieved !
Atmel Xmega 256A3
AMR
ADC
DAC
x16
InAmp AD8290, enable pin is available (for shut down), and gain is 50 V/V
18 © 2013 Andreas König & ROSIG group
Low Power and Self-x IssuesAdditional Self-x Extension
Alternative AMR sensor (reconfigurable) architectures studiedMEMS switches application for reconfiguration/self-trimmingImplicit temperature measurement and self-monitoring
Emerging µC ADC characterization for DNL/INL, SNR, ENOB:
0 500 1000 1500 2000 2500 3000 3500 4000 4500-1
-0.5
0
0.5
1
1.5
2Relative DNL of ADC
Quantization s tage
Rel
ativ
e D
NL
Val
ue
0 500 1000 1500 2000 2500 3000 3500 4000 45000
500
1000
1500
2000
2500
3000
3500
4000
4500ADC DC Characteris tics
S tep voltages
Qua
ntiz
atio
n st
eps
1350 1400 1450 1500 1550 1600
1200
1300
1400
1500
1600
1700
ADC DC Characteris tics
S tep voltages
Qua
ntiz
atio
n st
eps
19 © 2013 Andreas König & ROSIG group
ROSIG Demonstrator
Sensor node 1
Sensor node 2
Sensor node n (5)
Gateway(IMST)
PCMatlab
LocalizationVisualization
d1d6
d2
d5
d4
d3
Coil 3
Coil 1
Coil 2
Coil 5
Coil 6
Coil 4
RT-coil controlµC/DAQ
AMR-Sensors, T-Sensor, p-Sensor
wireless
(or UART)
Campaign parametersSensor data
20 © 2013 Andreas König & ROSIG group
ROSIG Demonstrator
The volume used is 1.5m x 1.5m x 1.5m (coils rearranged to cylinder !)Applying 6 (previous) coils with diameter of 13cm and 100 windingsWSN node has been tested (12 bit ADC, reduced sampling rate, triangulation)The error is in the order of 10cm (depends on-center/off-center loc.!)ADC/cal. problems and coil to sensor node angle require improvement !
Current supply
DAQ board
Relay
Relay board for switching purposeDAQ board: Data Translation 9816Current supply is 5A
21 © 2013 Andreas König & ROSIG group
Conclusions and Future Research & Exploitation
Concept & PCB-implementation of sensor node with magnetic localization and magnetic synchronizationFirst self-x features addedLarge scale scenario data acquisition (benchmark data)Efficient localization algorithms developed (synch. alg. in prep.)
First-cut demonstrator of the measurement system achieved (2013)Baseline for follow-up research & exploitation/commercialization
Miniaturized sensor node (swarm) implementation pursued by various accessible MEMS/3D printing technologies (prerequisite for cal. !)Mobile demonstrator in preparation
22 © 2013 Andreas König & ROSIG group
Vielen Dank
Wir danken dem BMBF für die Förderung und dem Projektträger VDE/VDI-IT und den Projektpartnern für die interessante Zusammenarbeit, insbesondere
Warsteiner für die Unterstützung bei Messungen in produktionsnahen Umfeld und UST und IMST für die Beiträge und Komponenten zur Erstellung des
ersten Projektdemonstrators.
gefördert vom