Download - Introduction to Packaging
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Introduction to packaging
Manjunath.M.S
MEMS Packaging
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General Packaging process
Die Attach
Wafer sawVacuum Mount
Curing
Wafer Mount
Pick and Place
Epoxy dispensing
Wirebond Process
Sealing/ Encapsulation
Testing/Calibration/Shipping
Wirebond
Ball Shear test
Wire Pull test
Mold Compound dispensing
Curing
Laser welding
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Semi Automatic Wafer Dicing Machine
Make M/s. MTI Cut
Model EC-400
Mode Semi Automatic
SPECIFICATIONSMotor : DC motor (110V) with variable speed up to 3,000 rpm.Accuracy : 0.0025 mm moving resolution and 0.01 mm position accuracy.Cutting Blades : 4" dia x 0.35 mm thick fully sintered diamond blade
Control mode : Manual control / PC control
Range 3 dimensions : X-axis: 8" Y-axis:4" Z-axis:4"
The MTI Cut Wafer Dicer is semiautomatic machine, suitable to dice wafer. Maximum size of wafer 4. Wafer material Silicon, Glass etc Blade width 0.35mm, Device pitch min 2.5mm.
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Semi Automatic Die attach & wirebondingMachine
Bond head
Microscope
Motorized Wire-Spool
Fiber Optic Illuminator
Wedge bond 17-75
Ribbon max. 25x250
Ball & bump bond 17-50
Axis control Motorized Z & Y, Manual X
Ultrasonic system PLL control 62kHz transducer
Specifications:
Heater Stage
Control - Puck
6,5 TFT Touch Panel
trason c power att output
Bond time 15 2,000 msec.
Bond force 15 150 cN
Heater stagecontroller
Built-in, 250C max
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Semi Automatic Die attach Machine
Epoxyvacuum pump1. pick-up tool
1.
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Semi Automatic Wirebonding Machine
Bond head
Control - Puck
Microscope
Motorized Wire-Spool
Fiber Optic Illuminator
Wedge bond 17-75
Ribbon max. 25x250
Ball & bump bond 17-50
Axis control Motorized Z & Y, Manual X
Ultrasonic system PLL control 62kHz transducer
Ultrasonic power 0 2 Watt output
Bond time 15 2,000 msec.
Specifications:
Heater Stage6,5 TFT Touch Panel
Bond force 15 150 cNHeater stagecontroller
Built-in, 250C max
TPT Wirebonder is semiautomatic machine to establish connectivity between die andsubstrate Wire material Au (25) & Cu, Al (33) Bonding type Ball bonding, Wedge bonding & Ball Bump Minimum bond pad size 80x80, pad pitch of 90, Distance btw 1st & 2nd Bond btw 1-5mm length Metallization thickness of min 100nm of material Au/Al with a bond pad
appropriate seed layer.
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Laser Dicing Machine
Make M/s. Miyachi Unitek
Model LW70AE
Mode Semi Automatic
Type Nd-YAG Laser
Laser Welding machine has capability of Spot and Seam welding MEMS packages madeof metals and alloys such as SS304/304L/316/321, Kovar, Invar etc
Tool Specifications:
Type Delta BDMS four (4) axis
Enclosure 40"W x 26"D x 40"HXY Table 6" x 6"
Power Supply 220VAC, 50 Hz
Work Holding 5" rotary stage with 3-
jaw chuck & Collets
Work Holding
Capacity
50mm diameter parts
Laser Specifications:
Type Nd-YAG
Coolant Water CooledPower Supply 400 VAC, 3 - phase
Max Avg Power 70W
Max Pulse Energy 70J
Pulse Duration 0.25-30ms
Wavelength 1064nm
Pulse repetition 1-200Hz
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Thermocompression Bonding:
A process which involves the use of force, time, and heat to join the two materials.
The wire (heated in some cases) is pressed against the hot surface (at 3000 C or more)at high force for a limited period of time to achieve the bond.
Wire Bonding Types
Thermosonic Bonding:A process which involves the use of force, time, ultrasonics and heat to join two materials.
The wire (heated in some cases) is pressed against the hot surface (at 150 deg. C or less)
at low force and vibrated for a limited period of time to achieve the bond.
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Pressure calibrators
Pressure Calibrator (Hydraulic and Pneumatic):Hydraulic Pressure Calibrator(0-1200bar) and Pneumatic Calibrator (-1 to100bar) with data acquisition system are available for pressure transducer
calibration and characterization.
Make DH-Budenberg
Type Hydraulic
Model DHB 42/501
Range 0 to 1200 bar
Make DH-Budenberg
Type Pneumatic
Model DHB 42/041
Range -1 to 100 bar
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Hot and Cold Chamber
Make M/s. Vtsch
Model VCL7003
Mode Automatic
Tool Specifications:
Test space volume 34 Lts
Temperature Range for
temperature tests
-700 C to +1800 C
Temperature Range for
climatic tests
+100 C to +950 C
Humidity range 10% r.h to 98% r.h
Data capture Simpati, Software Package
This Hot and Cold Enclosure / Test Chamber is used for evaluatingdevice quality, reliability and identify manufacturing flaws on MEMSdevices.