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2013 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.3 9/14/16
AN-9080
Motion SPM 5 Series Version 2 Users Guide
Table of Contents
1. Introduction ........................................................ 2
1.1. About this Application Note .......................... 2
1.2. Design Concept ............................................. 2
1.3. Features ........................................................ 2
2. Product Selections .............................................. 3
2.1. Ordering Information .................................... 3
2.2. Product Line-up ............................................. 3
2.3. SPM 5 Version Comparison ........................... 3
3. Package ............................................................... 4
3.1. Internal Circuit Diagram ................................ 4
3.2. Pin Description .............................................. 4
3.3. Package Structure ......................................... 5
3.4. Packages ........................................................ 6
3.5. Marking Specifications .................................. 7
4. Integrated Functions and Protection Circuit .... 11
4.1. Internal Structure of HVIC ........................... 11
4.2. Circuit of Input Signal (VIN(H), VIN(L)) .............. 11
4.3. Functions vs. Control Supply Voltage.......... 11
4.4. Under-Voltage Lockout (UVLO) .................. 12
5. New Parameter Design Guidance .................... 13
5.1. Thermal Sensing Unit (TSU) ........................ 13
5.2. Bootstrap Circuit Design ............................. 14
5.3. Minimum Pulse Width ................................ 17
5.4. Short-Circuit SOA ........................................ 17
6. Application Example ......................................... 18
6.1. Recommended Wiring of Shunt Resistor ... 19
6.2. Snubber Capacitor ...................................... 19
6.3. PCB Layout Guidance .................................. 19
6.4. Heat Sink Mounting .................................... 20
6.5. System Performance .................................. 21
7. Handling Guide and Packing Information ........ 22
7.1. Handling Precautions.................................. 22
7.2. Packing Specifications ................................ 23
8. Related Resources ............................................ 28
AN-9080 APPLICATION NOTE
2013 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.3 9/14/16 2
1. Introduction
1.1. About this Application Note
This application note is about Motion SPM 5 Series
Version 2 products. It should be used in conjunction with
the datasheet, reference designs, and related application
notes listed in . This note focuses on the difference between
Version 2 and the previous versions of SPM parts, with
emphasis on new IC functions
1.2. Design Concept
The key design objective of the SPM 5 series is to provide a
compact and reliable inverter solution for small power
motor drive applications. Ongoing efforts have improved
the performance, quality, and power rating of SPM 5 series
products and the Version 2 products are the latest results of
these enhancements. The new features include temperature-
sensing capability, built-in bootstrap diodes, and upgraded
ruggedness. Two higher power rating devices based on
super-junction MOSFET technology are added to cover
higher power rating applications without significantly
increasing cost.
The MOSFETs in SPM 5 series are specially processed to
reduce the amount of body-diode reverse recovery charge to
minimize the switching loss and enable fast switching
operations. Softness of the reverse-recovery characteristics
is managed through advanced MOSFET design with
optimized gate resistor selections to contain Electromagnetic
Interference (EMI) noise within a reasonable range.
SPM 5 series has six fast-recovery MOSFETs (FRFET
)
and three high-voltage half-bridge gate drive ICs. These
MOSFETs and HVICs are not available as discrete parts.
An FRFET-based power module has much better
ruggedness and a larger safe operation area (SOA) than
IGBT-based module or Silicon-On-Insulator modules.
The FRFET-based power module has a big advantage in
light-load efficiency over IGBT-based because the voltage
drop across the transistor decreases linearly as current
decrease, whereas IGBT Vce saturation voltage stays at the
threshold level. Some applications require continuous
operation at light load except short transients and improving
the efficiency in the light-load condition is the key to saving
energy. Refrigerators, water circulation pumps, and some
fans are good examples.
The temperature-sensing function of version 2 products is
implemented in the HVIC to enhance system reliability. An
analog voltage proportional to the temperature of the HVIC
is provided for monitoring the module temperature and
necessary protections against over-temperature situations.
Three internal bootstrap diodes with resistive characteristics
reduce the number of external components and make the
PCB design more compact, beneficial when designing an
inverter built inside the motor.
1.3. Features
The detailed features and integrated functions are:
Variety of products with different voltage and power ratings: 250/500/600 V 3-phase FRFET
inverter ,including HVICs
Three divided negative DC-link terminals for leg current sensing
HVIC for gate driving of FRFET, under-voltage protection, and thermal sensing functions
3.3/5 V Schmitt trigger input with active HIGH logic
Built-in bootstrap diodes
Single-grounded power supply and optocoupler-less interface due to built-in HVIC
Minimized standby current of HVIC for energy regulation
Packages; DIP, SMD, Double-DIP, Zigzag-DIP
Isolation voltage rating of 1500 VRMS for 1 minute
Moisture Sensitive Level 3 (MSL3) for SMD package
AN-9080 APPLICATION NOTE
2013 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.3 9/14/16 3
2. Product Selections
2.1. Ordering Information
F S B 5 0 2 5 0 X X ( D )
S : SMD T : Double DIP
blank : DIP
Version
Motion SPM 5 Series
Comparative Current Rating ( Not in Amps )
Voltage Rating ( x 10 )
blank : Ver.1
U : Ver.1.5
A : Ver.2
SF : Ver.2 with SuperFET2
Package
BSD in Ver.1 & 1.5blank : W/O BSD
D : With BSD
B : Zigzag DIP
Figure 1. Ordering Information
2.2. Product Line-up
Tab