ISUALSprite Imager
Interface and Status Review
Stewart Harris
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 2
Outline
• Imager Overview• Interface Details• Design and Fabrication Status
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 3
Imager Objectives
• Provide high temporal and spatial resolution imaging of Sprites and other emissions related to lightning storms
• Provide imaging of aurora and airglow
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 4
Imager Optical Path
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 5
Optical Specifications
300 400 500 600 700 800 9000
20
40
60
80
100
Filt
er T
rans
mitt
ance
(%
)
1
ICCD Filter Curves
Wavelength (nm)
23 45
300 400 500 600 700 800 9000
3
6
9
12
15
Det
ecto
r Q
E (
%)
Lens transmission
S25 QE
• Filters– 1: 660 - 900 nm
• notch at 756 - 790
– 2: 762 nm
– 3: 427.8 nm
– 4: 630 nm
– 5: 557.7 nm
– 6: 400 - 900 nm• IR/thermal block
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 6
Optical Specifications, con’t.
• Lens– Focal length: 61.8 mm– Field of View: ±10º (h) (20º full angle)
– Focal ratio: f/1.56
– Image size: 21.4 mm horizontal
– Spectral band: 420 - 780 nm– Spot Diameter: on-axis: 16 m
(80% encircled energy) 7º: 22 m10º: 30 m
(Note: Input pixel size: 41.8 m)
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 7
Detector specifications
• Image Intensifier– Type: 25 mm Gen II
– Manufacturer: DEP
– Photocathode: Super S25, 6 mm quartz window
– MCP: Single, 100 ns gating
– Phosphor: P46, fiber optic window2 µs decay time constant
• Fiber Optic Taper– Input diameter 25.0 mm
– Output diameter 14.4 mm
– Ratio 1.74 : 1
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 8
Detector specifications, con’t.
• CCD– Type: 1024 x 1024, frame transfer
– Manufacturer: Dalsa, IA-D4
– Antiblooming: Vertical anti-blooming (VAB)
– Primary mode: 512 x128 (binned 2x2 and masked)
– Pixel size (unbinned): 12 µm x 12 µm
– Pixel size (binned): 24 µm x 24 µm
– # of Outputs: 2
– Pixel readout rate: 8 MHz
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 9
CCD Block Diagram
IA-D4 Image Sensor
Image Area
Storage Area
Output
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 10
CCD Active Area Masking
• Imaging Earth Limb– Narrow, 4:1 Aspect Ratio
– CCD Active Area
– Mask applied to f/o taper
– Size: 1024 x 256 (unbinned)
– Size: 512 x 128 (binned)
– FOV: 20° x 5º
Top view of Dalsa CCD with f/o window
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 11
Imager Mechanical Layout
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 12
Imager Connector Locator
J1Imager
Electrical Board
J4Phosphor
High Voltage
J3MCP High Voltage
J2Front End
Electronics
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 13
Imager Electrical Board Functions
• Connections– Thermistors
• TEC hot side
• Lens (front and rear)
• Filter Wheel
• Filter Motor
• Daylight Sensor
• Survival (spacecraft)
– Heater Circuits• Lens (front and rear)
• Filter Wheel
• Survival (spacecraft)
– Thermoelectric Cooler (TEC)• Power controlled from AEP
– Stim Source
• Active Electronics– Photocathode Power Supply
• On/off control
• Gate control from FEC
– DayLight Sensor Buffer• Analog output (left and right)
– Filter Wheel Motor Driver• Stepper motor (2 phases)
• Position indicators (2 bits)
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 14
J1 - Imager Electrical InterfaceReference Designator: J1Location: Imager Electrical Board Interface
Connector Type: SDD44F4000GMating Connector: SDD44M1000G
44 31
30 16
SDD44F4 -- Face View
Pin Signal Spec Dir Pin Signal Spec Dir Pin Signal Spec Dir1 CATHODE PS+12V SW DC* IN 16 FILTER HEAT RTN DC 31 CHASSIS GND DC2 TEC TEMP THERM** OUT 17 FILTER TEMP THERM OUT 323 THERMISTOR COM DC 18 DAY SENS +12V SW DC IN 334 TEC V- DC IN 19 RT-DAY SENS OUT ANALOG OUT 345 TEC V+ SW DC IN 20 LT-DAY SENS OUT ANALOG OUT 356 SURVIV HEAT RTN DC 21 DAY SENS RTN DC 367 SURVIV TEMP THERM OUT 22 DAY SENS TEMP THERM OUT 378 SURVIV HEAT +28V SW DC IN 23 MOTOR +12V SW DC IN 389 FR-LENS HEAT +12VSW DC IN 24 PHASE A CONTROL LOGIC IN 3910 LENS HEAT RTN DC 25 MOTOR -12V SW DC IN 4011 FR-LENS TEMP THERM OUT 26 PHASE B CONTROL LOGIC IN 4112 R-LENS HEAT +12V SW DC IN 27 MOTOR TEMP THERM OUT 4213 LENS HEAT RTN DC 28 WHEEL POS B0 LOGIC OUT 4314 R-LENS TEMP THERM OUT 29 WHEEL POS B1 LOGIC OUT 4415 FILTER HEAT +12V SW DC IN 30 WHEEL MON COM DC
* SW DC: Switched DC Power Input** THERM: Thermistor output.
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 15
Image Intensifier Interface
Imager Electrical Board
J1 - 44 pin
Photocathode Power Supply
Image Intensifier - 25 mm
MCP-Out-1kV
HV Supply
Phosphor (Anode -6kV) HV Supply
GATEFEC Connector
J4 - 9 pin J3 - 9 pin
MCP-In GND
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 16
J3 - MCP HVPS InterfaceReference Designator: J3Location: Imager, MCP (stbd) HVPS
Connector Type: SND9F5000GMating Connector: SND9M1000G
Pin Signal Spec Dir Pin Signal Spec Dir1 +12V SW DC* IN 62 VMONITOR ANALOG OUT 7 GND DC3 VCONTROL ANALOG IN 84 IMONITOR ANALOG OUT 9 TEMP THERMISTOR OUT5 TRTN DC
* SW DC: Switched DC Power Input
SND9F5 -- Face View
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 17
J4 - Phosphor HVPS InterfaceReference Designator: J4Location: Imager, Phosphor (port) HVPS
Connector Type: SND9F5000GMating Connector: SND9M1000G
Pin Signal Spec Dir Pin Signal Spec Dir1 +12V SW DC* IN 62 VMONITOR ANALOG OUT 7 GND DC3 VCONTROL ANALOG IN 84 IMONITOR ANALOG OUT 9 TEMP THERMISTOR OUT5 TRTN DC
* SW DC: Switched DC Power Input
SND9F5 -- Face View
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 18
Front End Electronics Block Diagram
Digital I/O
Timing Generator
Based on FPGA
Develops Bias & Clock Voltages
Linear Regulators
Voltage Monitor
Clock Drivers: Analog SPDT Switches
R/C waveform shaping
CCD
Preamps
Correlated Double Sample
A/D Converters
J2
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 19
Front End Electronics Interface
• Data[0..11]– 12 bits per pixel
• PixelClock (PIXCLK)
– pixel data strobe
• FrameValid (FRMV)
– indicates duration of frame
• LineValid (LINV)
– indicates duration of line
– used only during test
• Busy (BUSY)
– signals start of EXP
• Acquire (ACQ)
– signals start of exposure in Aurora mode
– signals Event in Sprite mode
• CommandData (CDI)
– serial data interface for upload of camera parameters
• VoltageMonitor (MON)
– switched analog output
• Power– dc voltages
Images are transferred to the AEP in data frames,each frame is 128 lines x 512 pixels
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 20
J2 - FEC Electronics InterfaceReference Designator: J2Location: Imager, rear panel FEC
Connector Type: SDD62F4000GMating Connector: SDD62M1000G
Pin Signal Spec Dir Pin Signal Spec Dir Pin Signal Spec Dir1 COM DC IN 22 COM DC IN 43 +12VP SW DC IN2 +5VP SW DC* IN 23 +5VP SW DC IN 44 +12VP SW DC IN3 FRMV+ RS422 OUT 24 FRMV- RS422 OUT 454 LINV+ RS422 OUT 25 LINV- RS422 OUT 465 PIXCLK+ RS422 OUT 26 PIXCLK- RS422 OUT 476 ACQ+ RS422 IN 27 ACQ- RS422 IN 48 BUSY- RS422 OUT7 D0+ RS422 OUT 28 D0- RS422 OUT 49 BUSY+ RS422 OUT8 D1+ RS422 OUT 29 D1- RS422 OUT 50 DGND DC OUT9 D2+ RS422 OUT 30 D2- RS422 OUT 51 CCLK- RS422 IN10 D3+ RS422 OUT 31 D3- RS422 OUT 52 CCLK+ RS422 IN11 D4+ RS422 OUT 32 D4- RS422 OUT 53 DGND DC IN12 D5+ RS422 OUT 33 D5- RS422 OUT 54 CDAT- RS422 IN13 D6+ RS422 OUT 34 D6- RS422 OUT 55 CDAT+ RS422 IN14 D7+ RS422 OUT 35 D7- RS422 OUT 56 DGND DC IN15 D8+ RS422 OUT 36 D8- RS422 OUT 57 CSTB- RS422 IN16 D9+ RS422 OUT 37 D9- RS422 OUT 58 CSTB+ RS422 IN17 D10+ RS422 OUT 38 D10- RS422 OUT 59 MONL DC OUT18 D11+ RS422 OUT 39 D11- RS422 OUT 60 MONH ANALOG** OUT19 40 61 CCDTEMP THERMISTOR OUT20 -12VP SW DC IN 41 -12VP SW DC IN 6221 COM DC IN 42 COM DC IN
* SW DC: Switched DC Power Input** Analog: Monitor output (MONH) is switched output, -5 to +5 VDC
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 21
Data Transfer Timing
Line Timing
Pixel Timing
Tframe = 9.6 ms
Tline = 75 s
Tpixel = 125 ns
N > 512
FRMV
LINV
PIXCLK
DATA[0..11]
LINE 1 LINE 2 LINE 128
T frame
lineT
LINV
PIXCLK
DATA[0..11] PIXEL 1 PIXEL 2 PIXEL N-1 PIXEL N
pixelT
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 22
Image Readout Order
CCD array is illustrated showing the order in which pixels are transferred from Imager to AEP
1
2
127
128
Line
1. Each cell represents one pixel
2. Since the CCD is read from two outputs, the image is split in the middle
1 3 509 511
513 515 1021 1023
24510
1024
512
65536
1022 514516
65534 65028 6502665535655336502765025
64513 64515 65021 65023 65024 65022 64516 64514
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 23
Aurora Mode Imaging
Take exposure
Shift image entire vertical register
Read out image
The time to shift and readout one image: ~15 ms
Exposure duration can be as long as ~ 1 second
N - 1
N - 1
N - 1
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 24
Frame Timing - Aurora Mode
* EXP and VSHIFT are only indicating the relative timing of the exposure period and CCD vertical shift period
Notes:
1. Images are taken while ACQ held high.
2. Exposure duration specified by parameter EXP 1 ms TExp 1 sec
3. Frame repetition period specified by parameter REPRATE(TExp + TFrame + TVshift ) TReprate 5 sec
4. Frame readout period is fixed, TFrame = 9.6 ms
5. Vertical shift duration is fixed, TVshift ~ 5 ms (Aurora Mode)
Reprate
VSHIFT*
EXP*
BUSY
T
ACQ
FRMV
Exp T
FrameT
VshiftT
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 25
Sprite Continuous Mode Clocking
N
N - 4
N - 3
N - 2
N - 1
N - 5
N
N - 4
N - 3
N - 2
N - 1
N
N - 4
N - 3
N - 2
N - 1
N + 1
N
N - 3
N - 2
N - 1
N + 1
N
N - 3
N - 2
N - 1
N + 1
N + 2
Image Area
Storage Area
Expose New Image
AND
Shift & Read image from Storage Area
Shift Image & Storage Areas
Transferanother image into Storage Area
Repeat Cycle
Note: Storage area is shifted twice as often
Tframe
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 26
Frame Timing - Sprite Continuous
Notes:
1. Imaging begins when FSW sets mode to Sprite Continuous
2. ACQ signals the Sprite Event occurrence
3. Exposure duration specified by parameter EXP 1 ms TExp 100 ms
4. Frame repetition period specified by parameter REPRATE( max(TExp , TFrame) + TVshift ) TReprate 100 ms
5. Frame readout period is fixed, TFrame = 9.6 ms
6. Vertical shift duration is fixed, TVshift = 1.3 ms (Continuous Mode)
7. No attempt is made to synchronize EXP with GDelay
FRMV
BUSY
EXP*
VSHIFT*
ACQ
ReprateTExpT
FrameT GdelayT
1 2 3 4 5 6 7
21 7 8
12 13
T Vshift
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 27
Sprite Burst Mode ClockingN
N - 1 N
N - 1
N + 1
N
N - 1
N + 1
N + 2
N
N - 1
N + 1
N + 2
N + 3N - 1
N
N - 1
N + 1
N + 2
N + 3
N
N - 1
N + 1
N + 2
N + 3
N
N + 1
N + 2
N + 3
N + 1
N + 2
N + 3
N + 2
N + 3
N + 3
Tframe
N • Tframe
Begin acquisition of N images at leading edge of Event Trigger
Image readout time ~ (N+1) • Treadout
Treadout
Acquisition Phase
Readout Phase
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 28
Frame Timing - Sprite Burst Mode
Notes:
1. Continuous fast exposures begin when FSW sets mode to Sprite Burst
2. When ACQ occurs, NPost exposures are taken, then 8 images are readout
3. Exposure duration specified by parameter EXP 1 ms TExp 100 ms
4. Frame repetition period specified by parameter REPRATE(TExp + TVshift ) Treprate 10 ms
5. Frame readout period is fixed, TFrame = 9.6 ms
6. Vertical shift duration is fixed, TVshift < 750 s (Burst Mode)
VSHIFT*
EXP*
BUSY
FRMV
ACQ
1 2 3 4 5 6 7 8
1 2 7 8
Gdelay T T Frame
T Reprate
Exp T
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 29
Principal Camera Parameters
• Gated operation enable• Photocathode gate open/close• Set Mode (Aurora, Sprite Continuous, Sprite Burst)• Set number of Post Trigger Images, NPOST
– Only used in Burst Mode (TBD)
• Set Exposure (EXP) duration• Set repetition (REPRATE) period• Set photocathode Gate Delay (GDELAY)• Note:
– Dark image acquire accomplished by disabling gated operation,force gate closed, set mode and acquire dark image.
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 30
Camera Parameters (Complete List)
Imager CDI Commands
Range of Values
Gated operation enable yes / noGate Open/Close open / closeSet Mode (Aurora, Sprite Continuous, Sprite Burst) 1, 2, or 3Set exposure duration time (EXP) 1, 2, 3 … 1000 msAdjust V12Hi voltage 0, 1, 2, 3Adjust V3Hi voltage 0, 1, 2, 3Set Gate open delay (GDELAY) 0, 100, 200 … 10000 sSet Vertical Binning on/off on / offSelect monitor voltage 0, 1, 2 … FSet repetition period (REPRATE) 0, 1, 2 … 1000 msCR1 readout clock pattern 0x000 … 0xFFFCR2 readout clock pattern 0x000 … 0xFFFCR3 readout clock pattern 0x000 … 0xFFFRST readout clock pattern 0x000 … 0xFFFADC Clock pattern 0x000 … 0xFFFSUMG readout clock pattern 0x000 … 0xFFFNumber clock periods per serial readout cycle 0, 1, 2 … A, B, CSet vertical shift period (VRATE) setting 1, 2, 3 … FNumber of Post trigger images (NPOST) {burst only} 0, 1, 2 … 7
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 31
Imager Design Status
• Breadboard fabrication and testing complete• Detailed design in progress
– FEC Electronics Design• Schematics: 6 of 7 completed
• PCB Layout: 5 of 7 completed
– Imager Electrical Board Design• In progress
– Imager Mechanical Design• In progress
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 32
FEC Breadboard
A breadboard version of the FEC electronics was built to test the design of clock drivers, preamps, correlated double sample (CDS) circuitry and 12-bit A/D conversion.
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 33
Breadboard Camera Measurements
• Measured system gain 29 e-/ADU
• Measured readout noise < 50 e- rms
• CCD full well ~ 120,000 e-
• Dynamic range > 2400:1
• Operating Parameters Master clock: 22.5MHz
Pixel clock: 7.5 MHz
Line clock: 340 kHz
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 34
Breadboard Camera Image
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 35
Imager Fabrication Status
• Assembly of ETU Imager to start 15 May– All PC boards need to be etched by this date
• FEC Board etch has already started
– All Mechanical parts to be fabricated by this date
– Electrical / Electronic (EE) Parts status• see next page
– Optics Parts status• see next page
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 36
EE Parts and Optics Status
EE Parts and Optics Ordered Delivered Ordered DeliveredMicrocircuits
CCD ü ü ü üA/D Converter ü ü ü 5/15/01Oscillator ü ü ü 5/30/01All others ü ü ü ü
Interconnection DevicesCCD pin contacts ü ü ü üHSP030M2G (pin contacts) ü 3/20/01 ü 3/20/01All others ü ü ü ü
Discrete SemiconductorsAll devices ü ü ü ü
Passive DevicesInductors/Magnetics
Tape wound core (xfmr) ü ü P PSpiradel Delay Lines ü ü ü 5/1/01All others ü ü ü ü
Capacitors ü ü ü 4/9/01Resistors ü ü ü 4/9/01
Optical ComponentsWindow, fused silica P P P PFilters (set of 6), 70 mm ü P ü PLens, 61.8 mm ü ü ü üImage Intensifier ü ü ü üFiber Optic Taper, 25 mm ü 3/2/01 ü 3/2/01Mask Application on Taper P P P PFiber Optic Window, 5 mm ü ü ü ü
Revised : 3/1/01 ü : Completed P : Pending information
Engineering Test Unit Flight Unit
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 37
The End
NCKU UCB Tohoku Sprite Imager S. Harris
IFR 5 Mar 2001 39
PCB Assembly Drawing
FEC Analog Processor PC Board: Assembly Dwg. 8747-A4AReturn