John Stafford, MotorolaJanuary 17, 2001
2000 Technology Roadmap2000 Technology RoadmapOptoelectronicsOptoelectronics
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OptoelectronicOptoelectronic Roadmap Agenda Roadmap Agenda
• Optoelectronics Market Overview
• Optical Communications Roadmap
• Optical Communications Technology Roadmap
• Optical Switches
• Optical Amplifiers
• Substrates for Optical systems
• Packaging for Optical Components
• Image Sensors
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Optoelectronic’sOptoelectronic’s??
Optoelectronics is aCombination of Technologiesthat Provide the Capacity to
Generate, Transport andManipulate Data at High
Rates.
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Scenario Of Optical JoiningScenario Of Optical JoiningTechnologyTechnology
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Examples Of Products Enabled By Examples Of Products Enabled ByOptoelectronics TechnologyOptoelectronics Technology
NEMI Product Sector Optoelectronics Products / Components Serving This Sector
Low Cost Optical fiber, LED lamps, laser pointers, low-speed optical data links, IRports for computers
Hand Held Night vision scope, head mounted display
Cost / Performance Laser printer, digital camera, high-speed optical data links, laser scanner,digital medical imaging, product defect sensors, camcorders
High Performance 10 Gb/s laser transmitter, optical amplifier, tunable laser, DWDMcomponents, optical switches, airborne and space: communications andradar
Harsh Environment IR camera, light-guided missile, automotive: communications, sensors andlighting; airborne data links
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World Market For Fiber Optic Products InWorld Market For Fiber Optic Products InCommunication ApplicationsCommunication Applications
Market Segment Year Sales ($B)
Test Equipment
Optical Components
Optical System Equipment
2001
20002005
19992003
1.27
50.0095.00
31.0090.00
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Predicted Annual Compound Growth of KeyPredicted Annual Compound Growth of KeyOptical ComponentsOptical Components
•
Component Annual Growth Rate in % (1999-2009)
Fibers 17
Lasers 15
LED’s 9
Detectors 15
Connectors and Couplers 16
Components for Amplifiers 21
Optical Swithching Components 67
WDM Components 34
Other Multiplexing Components 14
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Optical CommunicationsOptical CommunicationsRoadmapRoadmap
Services /Networks
1995 2000 2005 2011
Services POTS
Data
Fax
Internet
CATV
High-speed Internet
Tele-working, tele-learning
Tele-medicine
Video On Demand
Interactive entertainment
PWB interconnects
Next-Generation Internet
(1Gb/s to the desktop)
Distributed Virtual Environments(joint working, learning, andplay)
CMOS VLSI interconnects
Core 2.5Gb/s point to point
8 wavelength WDM pt. to pt.
10 Gb/s 40Gb/s
OADM, OXC
~128 wavelength DWDM
100/160Gb/s
Fully reconfigurable OXC.
>800 wavelengths DWDM
400Gb/s
Access POTS, Modem, ISDN, HFC,Cellular, Broadcast Satellite
56kb/s, 144kb/s
ATM/PON (155/622Mb/s)
Cable Modems
2.5Gb/s-10Gb/s
2.5 - 10Gb/s DWDM
Premises 100Mb/s Ethernet 1 Gb Ethernet
10 Gb/s Trunks
10 Gb Ethernet
100Gb/s to 1Tb/s trunks
40 Gb
Board toBoard
Research demos, 0.1 - 1 Gb/s
(all numbers are aggregate)
0.1 - 1 Gb/s, Commercial 1 - 10Gb/s, massively parallel 10 – 100Gb/s
Chip to Chip Research demos, 0.1 - 1 Gb/s
(all numbers are aggregate)
0.1 - 1 Gb/s 1 - 10Gb/s, massively parallel 10 – 100Gb/s
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Optical Communication Technology RoadmapOptical Communication Technology Roadmap(1 of 3)(1 of 3)
Technology / Components Commercial Availability
1998 2000 2003 2005 2011
Long Haul Bitrate: (TDM) (DWDM)
10 Gb/s 40 Gb/s 80/ 160 Gb/s 400 Gb/s Solitons 0.4 - 1.6Tb/s 3.2 Tb/s 10Tb/s Optical 3R Regenerators?
Access Bitrate (residential): 155 / 622 Mb/s 2.5 Gb/s 10 Gb/s ADSL, cable modem DWDM
1 Gb/s ethernet?
LAN (Premises) Bitrate 1Gb ethernet 10 Gb ethernet 40 Gb/s ethernet 10 Gb/s trunks 100 Gb/s trunks
Board to Board Bitrates 0.1 - 1 Gb/s 1-10 Gb/s 10-100 Gb/s (aggregrate) massively parallel
On Board/On Chip
Chip-to-Chip
100 Gb/s 1 TB/s
Node Capacity
Routing / Switching, Inc. O/E
80 Gb/s 2.4 Tb/s 5 Tb/s >100 Tb/s
No of WDM Channels
Channel Spacing
40 160 320 512 800-1024? Polarization Interleaving?
100/50GHz 25GHz (with bitrate limit!)
WDM Subsystems OADM, OXC Reconfigurable OXC All Optical Network?
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Optical Communication Technology RoadmapOptical Communication Technology Roadmap(2 of 3)(2 of 3)
Technology/Components Commercial Availability
1998 2000 2003 2005 2011
Laser Sources: edge-emitters
VCSELs
Single λ DFBs 40 Σ tunable 100 Σ tunable 1000 channels
850 nm discrete 850 nm arrays 1300/1550 nm discrete
Optical Detectors WDM detector w/ filter
Lower cost APDs
Organic Photodetectors
Transceivers packaging
LAN price
Discrete Components Hybrid Integration (with CMOS VLSI) Lower Cost, LSI OEICs
$ 25 LED datacom $15 LED datacom $75 VCSEL datacom $45 VCSEL datacom
$700 ONU $175 ONU $100 ONU?
$1 T/R for board to board links
Optical Amplifiers <80nm 100nm Ultra -wideband OAs, 80-345nm
EDFA/Raman hybrid Channel Gain Compens. Price <$1000?
Optical Switches
16 x 16 128 x 128 1024 x 1024 4096x4096
Optical Packet Switching
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DispersionCompensators
Disp. comp.fiber Bragg grating devices Slope management Dynamic dispersion compensation? Dynamic PMD compensation
WavelengthConverters
Optoelectronic all-optical (transducers)
Connectors Single mode very low cost (Access and Datacom) Array large array (for ~100 channel DWDM, Routers, Switches)Multimode & POF very low cost for premises networks
Optical Fibers Dispersion flattened large core for DWDM ultra wideband (no OH peak @1385nm) ultra low loss, low cost/ high speed plastic optical fiber
Optical Packages and Assembly
Low cost packaging and fiber coupling Automated surface mount assembly
Optical Communication Technology RoadmapOptical Communication Technology Roadmap(3 of 3)(3 of 3)
Technology/ComponentsCommercial Availability
1998 2000 2003 2005 2011
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Key Optical Switch TechnologiesKey Optical Switch Technologies
• Optomechanical Devices
• Micro-Electro-MechanicalSystems
• Liquid Crystals
• “Champagne”/Bubble Switch
• Thermo-Optical Switch
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Current Approaches to MEMS OpticalCurrent Approaches to MEMS OpticalSwitchesSwitches
Device #Optical Actuation Architecture
Elements Methods
Small < 20 Electrostatic, 2D Array
Fabric Thermal
Medium 64 - 1024 Electrostatic, 2D Array
Fabric Magnetic
Large > 256 Electrostatic, 3D Array
Fabric Magnetic
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Technology Issues for Optical PowerTechnology Issues for Optical PowerAmplifiersAmplifiers
System Level• Operational Wavelength 1490 nm – 1610 nm
• Operating Temperature 0ϒϒϒϒC – 65ϒϒϒϒC
• Output Power 26 dBmW - 30 dBmW
• Linearity ±±±± 0.1 dB
• Noise Figure 5 dB
Sub-System Level
• Pump Wavelengths 980 nm802 nm
1480 nm
• Pump Power 180 mW – 300 mW
• Pump Laser Reliability 106 Hrs.
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Technology Advancements Needed for OpticalTechnology Advancements Needed for OpticalPower AmplifiersPower Amplifiers
• Economic means for thermal management of packaged highpower amplifiers. This issue extends to other aspects of thephysical design, including the optoelectronic devices and opticalpassives, which must meet stringent alignment tolerances.
• It is expected that within two years, market demand will becentered at the 80 channel to 160 channel capacity per band.Means for controlling the gain flatness of PAs over the full rangeof S, C, and L band are needed. These solutions are likely toinvolve a combination of improved materials, circuit and softwaretechniques.
• PA noise figures need to be improved. Further development inthis area is needed.
• To serve the MAN/LAN markets, which are progressively highervolume, more cost sensitive markets, nearly an order of magnitudefurther cost reduction will be required.
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Substrates for Optical SystemsSubstrates for Optical Systems
• As system signal bandwidth requirements have increased,the printed circuit board(PCB) substrate characteristics andfeatures have become an key part of the systemspecification and performance.
• Ultimately, the signal bandwidth will exceed the capability ofcopper (<~5 Gb/s) and ‘on-board’ optical transmission willbecome a necessity.
• As systems become more complex and the number of fibersincrease, it will become necessary to integrate the opticalpathway into the high layer count PCB backplane fabricationand SMT assembly processes.
• An optical waveguide can be created by lithographicprocessing of thin polymer films and patterned on thesurface of the PWB or be buried within the substrate bysubsequent lamination.
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Rigid backplanes are expected to dominate, but flexible backplanes will have strong presencein the marketplace as optical substrates become more widely used.Source: Electronic Packaging and Production Publication, March 2000
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Packaging and Assembly Technology IssuesPackaging and Assembly Technology Issues
• Need for faster, higher performance, miniaturizedpackages.
• Need to incorporate increased levels ofoptical/electrical integration into package.
• Need to incorporate features for cost effectiveassembly technologies.
• Innovate new materials, design technologies tosupport above items.
• Thermal solutions for 1 to 2+ Watt packagedLasers.
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Image SensorsImage Sensors
• Imaging CMOS (IMOS) Technology isEmerging as a Strong Competitor forDigital Cameras.
• Low Cost Packaging is a CriticalIssue for the IMOS Technology to bedominant.
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SummarySummary
» Optoelectronics is about bandwidth.The “Copper Crunch” has come.
» Technologies are available to meetbandwidth needs up to 10Gbps. Coretechnology and component needs havebeen identified for the next decade.
» Issues:
(a)Manufacturing capacity for components(ie emitters, detectors) and fiber.
(b) Low cost assembly processes and lowcost packages for optoelectroniccomponents.
(c)Ability for standard automated board assembly of all optoelectronic parts.